PCB support stand

The substrate support stand addresses the challenge of supporting high-density circuit boards by using pins and end supports to securely load them into automatic mounting machines, ensuring stable transport and preventing damage during soldering.

JP7888104B2Active Publication Date: 2026-07-13MURATA MASCH LTD
View PDF 7 Cites 0 Cited by

Patent Information

Application Number
JP2023052772
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-03-29
Publication Date
2026-07-13
Estimated Expiration
2043-03-29

AI Technical Summary

Technical Problem

Existing printed circuit boards with high component density face issues when loaded into automatic mounting machines due to lack of free space, leading to stress and potential damage during sacrificial plate separation.

Method used

A substrate support stand with support pins and end supports that securely hold the circuit board from above, below, and at the ends, allowing it to be loaded into an automatic mounting machine without a waste board portion, using pins with lengths matching the board thickness and elastic deformation for secure fit.

Benefits of technology

Enables reliable support and stable transport of high-density circuit boards without sacrificial portions, preventing damage and ensuring proper solder paste application and component mounting.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007888104000001
    Figure 0007888104000001
  • Figure 0007888104000002
    Figure 0007888104000002
  • Figure 0007888104000003
    Figure 0007888104000003
Patent Text Reader

Abstract

To provide a circuit board receiving stand that enables a printed circuit board having a high density of electronic components to be carried into an automatic mounting machine without providing a waste board portion.SOLUTION: A circuit board receiving stand (1) according to the present invention that supports a printed circuit board (10) to be carried into an automatic electronic component mounting machine includes a circuit board receiving stand main body (2) including a supported portion (2a) supported by the automatic mounting machine, a board support portion (2b) having a plurality of pin insertion holes (2c) and supporting the printed circuit board above, and a support pin (4) including a receiving base insertion portion (4a) that can be inserted into the pin insertion hole of the circuit board receiving stand main body, the support pin includes a board insertion portion (4b), the board insertion portion is insertable into a support hole provided in the printed circuit board and having a length equal to or less than the thickness of the printed circuit board.SELECTED DRAWING: Figure 1
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • JP1979062063U

  • Method of positioning porous substrate in screen printing process

    JP1983071691A

  • Substrate support device

    JP1994052197U

  • Device for positioning printed circuit board

    JP1996097600A

  • Backup device and surface mounting machine

    JP2004228249A