A method for obtaining cost-effective shape composite parts.

Abstract

To provide a manufacturing method of metal-containing shape composite component and / or parts.SOLUTION: Provided is a manufacturing method of composite-shape and further large, high-performance metal-containing elements in a cost-effective way. The method also indicates assembly of elements with an internal feature and void. The method is also beneficial for light assembly. The method allows the reproduction of bio-mimetic structures and other advanced structures for topological performance optimization.SELECTED DRAWING: None

Description

[Technical Field]

[0001] This invention relates to a method for manufacturing shape composite components and / or parts containing metal. The method particularly applies to high-performance elements. The method also applies to extremely large elements. The method also applies to the assembly of elements with internal properties and cavities. The method is also useful for light assembly. This method enables the optimization of topological performance for the replication of biomimetic structures and other advanced structures. The present invention also relates to heated forging techniques such as heated forming dies or molds, where sheet-like or tubular elements are formed into a single element (tool, die, mold, etc.). In particular, it refers to a method for cooling sheet-like or tubular elements formed in heated forging dies or molds. In some applications, the elements may be provided with internal cooling channels. [Background technology]

[0002] Technological advancements are greatly influenced by the available materials, and designs can be implemented to fully utilize their properties for a given application. Throughout the history of human technological innovation, considerable effort has been devoted to advancements in materials with improved properties and to new designs that implement manufacturing and implementation methods, as evidenced by the vast number of patent applications related to these two areas. Achievable designs depend not only on the ingenuity of inventors and designers, but also on the production capacity necessary to enable the implementation of the conceived designs. In recent years, advances in sophisticated manufacturing methodologies, such as additive manufacturing (AM) techniques, which enable highly flexible designs, have led to significant progress in topologically optimized designs, even at the microscale, particularly in the study of the remarkable microstructures of nature. Aside from biomimetic structures, further optimization has continued to bring about greater property optimization and compromises for various applications. Regarding metals and metal-containing materials, progress in materials has lagged somewhat, and finding materials that surpass currently used forged materials in all relevant properties remains a challenge. Furthermore, most additive manufacturing methods for metals have several additional challenges, including inherent anisotropic tendencies. Aside from performance, metals for additive manufacturing are orders of magnitude more expensive than those forged, and existing additive manufacturing methods for metals are extremely costly. Currently, assembling large, high-performance additively manufactured metal elements presents both technical and economic challenges. When attempting to obtain large, complex shapes, many existing additive manufacturing techniques exhibit excessive residual stress and even cracking. [Overview of the project]

[0003] This invention helps overcome many challenges in both performance and cost in metal additive manufacturing while maintaining extremely advantageous design freedom. Therefore, this invention is particularly applicable to the manufacture of high-performance elements with complex shapes, large elements with complex shapes, and any element in general where high design freedom can yield benefits at low cost and high performance. While this invention is particularly well suited to metallic or at least metal-containing elements, other types of materials can similarly benefit. Many inventions have been made regarding the acquisition of composite shapes of metals, particularly since the rise of additive manufacturing technology. In most of these technologies, especially when the elements are large, it is nearly impossible to obtain isotropic, crack-free composite elements. Furthermore, the vast majority of existing additive manufacturing methods are extremely expensive and lack the capacity to produce elements of large dimensions. In other technologies for obtaining composite shapes other than additive manufacturing, it is extremely difficult to obtain elements with specific internal properties without cracking. Regarding the cooling of dies, sheets, and other molds, it is not uncommon to use spraying for external cooling of aluminum injection molds, where cooling is achieved by the evaporation of the sprayed liquid. Cooling is sometimes carried out in combination with lubricants to improve the formability of the sheet and corrosion inhibitors to protect the die. On the other hand, in some applications, water is sprayed directly onto the manufactured part or sheet. In some systems, water circulates through channels or holes between the die and the sheet after the die is closed. During this process, water is used to cool the die, and the die is cooled when the sheet is placed, but in no case is water retained in the die to cool the sheet. [Brief explanation of the drawing]

[0004] [Figure 1] Figure 1 shows an elastomer coating used in the manufacture of additively fabricated molds and metal elements with internal cavity properties. Figure 1 also shows extension tubes, perforated openings, and sealing polymer films. [Figure 2] Figure 2 shows different cooling rates during a heated forging process using the method disclosed in this document. [Figure 3] Figure 3 shows the melting temperature of the ternary copolymer. [Modes for carrying out the invention]

[0005] Current additive manufacturing methods for metal elements are anisotropic, extremely slow, and costly. While design flexibility often compensates for this, obtaining all the characteristics of large-volume materials remains a challenge. Furthermore, these methods tend to introduce high levels of residual stress due to the highly localized energy application, which makes manufacturing large elements extremely difficult. For small, highly complex elements, residual stress is addressed with support structures, but this increases costs and has limitations. On the other hand, when the mechanical performance of the manufactured element is not the primary concern, additive manufacturing of plastic materials is extremely fast and cost-effective, especially when dimensional tolerances are not very strict. Additive manufacturing techniques, classified as direct energy deposition (DeD), are usually cost-effective and enable the manufacture of large elements, but they are typically used as a base material deposit. When assembling from elements with some thickness and abrasion, residual stress becomes uncontrollable, and the spectrum of materials that can somewhat resemble the performance of forged materials is very limited in almost all implementations. Other manufacturing methods for composite shaped elements using metallic materials are listed below. - Metal injection molding (MIM): This method enables high dimensional accuracy at a reasonable cost. While not exceptionally superior in performance, it is often well within acceptable limits. This method is limited by high-tech elements. - Hot isostatic pressing (HIP) of canned powder: Enables the manufacture of large elements, but only for simple shapes without internal properties. The cost is reasonable, but high for most applications. - Cold isostatic pressing (CIP) in rubber molds: While significantly lower in cost, dimensional accuracy is poor, and internal cracking problems often occur in complex shapes, becoming more pronounced in large elements. Achieving high performance is extremely difficult in many industries interested in alloying systems. Internal properties are only possible for very simple shapes using special cores, but this is significantly more expensive. The inventors have discovered that obtaining composite shaped elements that need to be assembled from high-performance, metal-containing materials can be achieved by the following method. a) Provide a type, b) Fill the mold with powder, c) Seal the mold, d) Apply high pressure to the mold, e) While maintaining a high pressure level, raise the temperature of the mold. f) Release at least some of the pressurized molds while maintaining a sufficiently high temperature. Several special implementations are also discussed. In some cases, steps e) and f) can be avoided if the mixed powder used to fill the mold in step b) and the material used to manufacture the mold in step a) are selected very precisely. In some special implementations, step c) can be greatly simplified and reduced, and the mold containing the powder can be closed. Many additional method steps could be included in this method, some of which are discussed in the previous paragraphs, but due to the limitations of this document, only a few will be mentioned here. First and foremost, it should be noted that this method works remarkably well, functioning without cracking on complex geometric elements (even those with complex internal properties) with excellent dimensional accuracy and high levels of performance. This is especially true considering the limitations of hot isostatic compression molding, cold isostatic pressing, and metal injection molding. Step a) of the method is crucial for some applications. For some applications, it is crucial to manufacture the mold using this technique. In some applications, the mold may be manufactured using any available technique, including any prior art for manufacturing polymers. In one embodiment, the technique used to provide the mold is polymer injection molding (PIM). In one embodiment, the technique used to provide the mold is additive manufacturing (AM) technique. In one embodiment, the technique used to provide the mold is casting, dipping, brushing or spraying the mold material on a template made by additive manufacturing technique. In one embodiment, the technique used to provide the mold provided in step a) includes additive manufacturing technique. In one embodiment, the technique used to provide the mold is additive manufacturing (AM) technique. In one embodiment, the technique used to provide the mold includes casting, dipping, brushing or spraying the mold material on a template made by additive manufacturing technique. In one embodiment, the technique used to provide the mold includes casting the mold material on a template made by additive manufacturing technique. In one embodiment, the technique used to provide the mold includes dipping the mold material on a template made by additive manufacturing technique. In one embodiment, the technique used to provide the mold includes brushing the mold material on a template made by additive manufacturing technology. In another embodiment, the technique used to provide the mold includes spraying the mold material on a template made by additive manufacturing technology. In yet another embodiment, the technique used to provide the mold is additive manufacturing technology (AM technology). In yet another embodiment, the technique used to provide the mold is casting, dipping, brushing, or spraying the mold material on a template made by additive manufacturing technology. In yet another embodiment, the technique used to provide the mold is casting the mold material on a template made by additive manufacturing technology. In yet another embodiment, the technique used to provide the mold is dipping the mold material on a template made by additive manufacturing technology. In yet another embodiment, the technique used to provide the mold is brushing the mold material on a template made by additive manufacturing technology.In another embodiment, the technique used to provide the mold is spraying mold material onto a template made by additive manufacturing technology. In another embodiment, the technique used to provide the mold is additive manufacturing technology based on material extrusion (Fused Deposition Modeling: FDM). In another embodiment, the technique used to provide the mold is additive manufacturing technology based on vat photopolymerization (stereolithography [SLA], DLP [digital light processing], continuous digital light processing [CDLP], etc.). In another embodiment, the technique used to provide the mold is stereolithography. In another embodiment, the technique used to provide the mold is DLP. In another embodiment, the technique used to provide the mold is continuous DLP. In another embodiment, the technique used to provide the mold is additive manufacturing technology based on material jetting (material jetting [MJ], drop on demand [DOD], etc.). In another embodiment, the technique used to provide the mold is material jetting. In another embodiment, the technique used to provide the mold is drop on demand. In another embodiment, the technique used to provide the mold is binder jetting (BJ). In another embodiment, the technique used to provide the mold is additive manufacturing technology based on powder bed fusion (selective laser sintering [SLS], multi-jet fusion [MJF], etc.). In another embodiment, the technique used to provide the mold is powder bed fusion additive manufacturing. In another embodiment, the technique used to provide the mold is multi-jet fusion. In another embodiment, the technique used to provide the mold is selected from vat photopolymerization and powder bed fusion. In another embodiment, the technique used to provide the mold is similar to vat photopolymerization but has thermal curing.In another embodiment, the technique used to provide the mold is an additive manufacturing technique based on redox reactions. In another embodiment, the technique used to provide the mold is selected from stereolithography, DLP, continuous DLP, material jetting, multi-jet fusion, binder jetting, drop-on-demand, and powder sintering additive manufacturing, or techniques of a similar concept. In another embodiment, the technique used to provide the mold is selected from any additive manufacturing technique that does not require the use of supports to manufacture the composite shape. In another embodiment, the technique used to provide the mold is selected from material jetting, binder jetting, multi-jet fusion, and powder sintering additive manufacturing. In another embodiment, the technique used to provide the mold is selected from material jetting, multi-jet fusion, and powder sintering additive manufacturing. In another embodiment, the technique used to provide the mold is selected from multi-jet fusion and powder sintering additive manufacturing. In another embodiment, the technique used to provide the mold is selected from any technique that can print properties on an assembled layer that does not come into contact with already assembled parts. In one embodiment, the additive manufacturing system employed provides a support for floating properties using the same assembled material that has not yet solidified. In another embodiment, the additive manufacturing system employed provides a floating support using a particulate material that is not fully solidified. In another embodiment, the additive manufacturing system employed provides a floating support using different materials relative to the assembly material. In another embodiment, the additive manufacturing system employed provides a floating support using different materials relative to the assembly material, and once the parts are assembled, the support material is removed without damaging the assembled parts. For some applications, the manufacturing technique used to provide the mold is not important. For some applications, the material used to make the mold is very important. In some applications, the mold may be manufactured from a polymer-free material. In one embodiment, the material used to manufacture the mold is polymer-free. In another embodiment, the material used to manufacture the mold is a material that has relevant differences in viscosity at temperatures of 20°C and 250°C.In another embodiment, the material used to manufacture the mold is a material having different viscosities at 20°C and 250°C. In another embodiment, the material used to manufacture the mold is a material having half or a fraction of the viscosity at 250°C compared to its viscosity at 20°C. In another embodiment, it is one-tenth. In another embodiment, it is one-hundredth. In one embodiment, the mold provided in step a) is made of a material containing a polymer material. In one embodiment, the mold provided in step a) is made of a material composed of a polymer material. In one embodiment, the polymer material is a polymer. In some embodiments, the polymer material contains at least two different polymers. Some applications benefit from the dimensional stability of thermosetting polymers. In one embodiment, the mold provided in method step a) is made of a thermosetting polymer. In another embodiment, the mold provided in method step a) is made of phenolic resin (PF). In another embodiment, the mold provided in method step a) is made of urea resin (UF). In another embodiment, the mold provided in method step a) is made of melamine resin (MF). In another embodiment, the mold provided in method step a) is made of polyester resin (UP). In another embodiment, the mold provided in method step a) is made of epoxy resin (EP). In another embodiment, the mold provided in method step a) is made of a thermosetting polymer and is manufactured by additive manufacturing technology based on vat photopolymerization. In another embodiment, the mold provided in method step a) comprises a thermosetting polymer. In another embodiment, the mold provided in method step a) comprises a phenolic resin (PF). In one embodiment, the mold provided in method step a) comprises a urea resin (UF). In one embodiment, the mold provided in method step a) comprises a melamine resin (MF). In one embodiment, the mold provided in method step a) comprises a polyester resin (UP). In one embodiment, the mold provided in method step a) comprises an epoxy resin (EP). In one embodiment, the mold provided in method step a) comprises a thermosetting polymer and is manufactured by additive manufacturing technology based on vat photopolymerization. Many applications can benefit from the reshaping properties of thermoplastic polymers.In one embodiment, the mold provided in method step a) is made of a thermoplastic polymer. In another embodiment, the mold provided in method step a) is made of a thermoplastic polymer and is manufactured by additive manufacturing technology based on material jetting. In another embodiment, the mold provided in method step a) is made of a thermoplastic polymer and is manufactured by additive manufacturing technology based on powder bed fusion bonding. Several applications can benefit from the excellent dimensional accuracy of amorphous polymers (both thermosetting and thermoplastic). Several applications can benefit from the excellent dimensional accuracy combined with the reshaping properties of amorphous thermoplastic materials. In one embodiment, the mold provided in method step a) is made of an amorphous polymer. In one embodiment, the mold provided in method step a) is made of an amorphous thermoplastic polymer. In another embodiment, the mold provided in method step a) is made of polystyrene (PS). In another embodiment, the mold provided in method step a) is made of a polystyrene copolymer. Unless otherwise expressly stated herein, polymer includes its copolymer. In another embodiment, the mold provided in method step a) is made of polymethyl methacrylate. In another embodiment, the mold provided in method step a) is made of an acrylonitrile copolymer. In another embodiment, the mold provided in step a) is made of a copolymer containing styrene. In another embodiment, the mold provided in step a) is made of acrylonitrile-butadiene-styrene (ABS). In another embodiment, the mold provided in step a) is made of styrene-acrylonitrile (SAN). In another embodiment, the mold provided in step a) is made of polycarbonate (PC). In another embodiment, the mold provided in step a) is made of polyphenylene oxide (PPO). In another embodiment, the mold provided in step a) is made of a vinyl polymer (vinyl and related polymers).In another embodiment, the mold provided in method step a) is made of polyvinyl chloride (PVC). In another embodiment, the mold provided in method step a) is made of an acrylic polymer. In another embodiment, the mold provided in method step a) is made of polymethyl methacrylate (PMMA). In another embodiment, the mold provided in method step a) comprises a thermoplastic polymer. In one embodiment, the mold provided in method step a) comprises a thermoplastic polymer and is manufactured by additive manufacturing technology based on material injection. In one embodiment, the mold provided in method step a) comprises a thermoplastic polymer and is manufactured by additive manufacturing technology based on powder bed fusion bonding. Several applications can benefit from the excellent dimensional accuracy of amorphous polymers (both thermosetting and thermoplastic). Several applications can benefit from the excellent dimensional accuracy combined with the reshaping properties of amorphous thermoplastic materials. In one embodiment, the mold provided in method step a) comprises an amorphous polymer. In one embodiment, the mold provided in step a) includes an amorphous thermoplastic polymer. In one embodiment, the mold provided in step a) includes polystyrene (PS). In one embodiment, the mold provided in step a) includes a polystyrene copolymer. In one embodiment, the mold provided in step a) includes polycaprolactone (PCL). In one embodiment, the mold provided in step a) includes porous polycaprolactone (porous PCL). In one embodiment, the mold provided in step a) includes polyvinyl acetate (PVA). In one embodiment, the mold provided in step a) includes Kollidon VA64. In one embodiment, the mold provided in step a) includes Kollidon 12PF. Unless otherwise explicitly stated herein, polymer includes its copolymer. In one embodiment, the mold provided in step a) includes a polymer containing aromatic groups. In one embodiment, the mold provided in step a) includes polymethyl methacrylate. In one embodiment, the mold provided in step a) comprises a copolymer containing acrylonitrile. In one embodiment, the mold provided in step a) comprises a copolymer containing styrene. In one embodiment, the mold provided in step a) comprises acrylonitrile butadiene styrene (ABS). In one embodiment, the mold provided in step a) comprises styrene acrylonitrile (SAN). In one embodiment, the mold provided in step a) comprises polycarbonate (PC). In one embodiment, the mold provided in step a) comprises polyphenylene oxide (PPO). In one embodiment, the mold provided in step a) comprises a vinyl polymer (vinyl and related polymers). In one embodiment, the mold provided in step a) comprises polyvinyl chloride (PVC). In one embodiment, the mold provided in step a) comprises an acrylic polymer. In one embodiment, the mold provided in step a) comprises polymethyl methacrylate (PMMA).In one embodiment, the mold provided in step a) comprises amorphous polypropylene (PP). In one embodiment, the mold provided in step a) is made of polycaprolactone (PCL). In one embodiment, the mold provided in step a) is made of porous polycaprolactone (porous PCL). In another embodiment, the mold provided in step a) is made of polyvinyl acetate (PVA). In another embodiment, the mold provided in step a) is made of Coridon VA64. In another embodiment, the mold provided in step a) is made of Coridon 12PF. Several applications can benefit from the excellent elongation of certain semicrystalline thermoplastics. In another embodiment, the mold provided in step a) is made of a semicrystalline thermoplastic. In another embodiment, the mold provided in step a) is made of polybutylene terephthalate (PBT). In another embodiment, the mold provided in step a) is made of polyoxymethylene (POM). In another embodiment, the mold provided in step a) is made of polyethylene terephthalate (PET). In another embodiment, the mold provided in step a) comprises a semi-crystalline thermoplastic material. In another embodiment, the mold provided in step a) comprises polybutylene terephthalate (PBT). In one embodiment, the mold provided in step a) comprises polyoxymethylene (POM). In one embodiment, the mold provided in step a) comprises polyethylene terephthalate (PET). In one embodiment, the mold provided in step a) comprises a thermoplastic polymer resin derived from the polyester group. Some applications can benefit from the more distinct melting point of semi-crystalline thermoplastic materials. In one embodiment, the mold provided in step a) is made of a polyolefin polymer. In one embodiment, the mold provided in step a) is made of a polymer containing ethylene monomer.In one embodiment, the mold provided in step a) is made of polyethylene (PE). In another embodiment, the mold provided in step a) is made of high-density polyethylene (HDPE). In another embodiment, the mold provided in step a) is made of low-density polyethylene (LDPE). In another embodiment, the mold provided in step a) is made of a polymer containing propylene monomer. In another embodiment, the mold provided in step a) is made of polypropylene (PP). In another embodiment, the mold provided in step a) is made of a polymer containing monomers linked by amide bonds. In another embodiment, the mold provided in step a) is made of polyamide (PA). In another embodiment, the mold provided in step a) is made of a material from polyamide group 11. In another embodiment, the mold provided in step a) is made of a material from polyamide group 12 (PA12 family material). In another embodiment, the mold provided in step a) is made of polyamide 12 (PA12). In another embodiment, the mold provided in step a) is made of polyamide 6 (PA6). In another embodiment, the mold provided in step a) is made of a material from the polyamide 6 group. In one embodiment, the mold provided in step a) comprises a polyolefin polymer. In one embodiment, the mold provided in step a) comprises a polymer containing ethylene monomer. In one embodiment, the mold provided in step a) comprises polyethylene (PE). In one embodiment, the mold provided in step a) comprises high-density polyethylene (HDPE). In one embodiment, the mold provided in step a) comprises low-density polyethylene (LDPE). In one embodiment, the mold provided in step a) comprises a polymer containing propylene monomer. In one embodiment, the mold provided in step a) comprises polypropylene (PP).In one embodiment, the mold provided in method step a) comprises a polymer containing monomers linked by amide bonds. In one embodiment, the mold provided in method step a) comprises polyamide (PA). In one embodiment, the mold provided in method step a) comprises aliphatic polyamide. In one embodiment, the mold provided in method step a) comprises nylon. In one embodiment, the mold provided in method step a) comprises materials from polyamide group 11. In one embodiment, the mold provided in method step a) comprises materials from polyamide group 12. In one embodiment, the mold provided in method step a) comprises polyamide 12. In one embodiment, the mold provided in method step a) comprises polyamide 6. In one embodiment, the mold provided in method step a) comprises materials from polyamide group 6. In one embodiment, the mold provided in method step a) comprises a semicrystalline thermoplastic polymer and is manufactured by additive manufacturing technology based on material spraying, binder spraying, and / or powder bed fusion bonding. In one embodiment, the mold provided in method step a) comprises a semicrystalline thermoplastic polymer and is manufactured by additive manufacturing technology based on powder bed fusion additive manufacturing. In one embodiment, the mold provided in step a) comprises a polymer based on polyolefin and is manufactured by additive manufacturing technology based on powder sintering additive manufacturing. In one embodiment, the mold provided in step a) comprises a polymer based on polyamide and is manufactured by additive manufacturing technology based on powder sintering additive manufacturing. In one embodiment, the mold provided in step a) comprises a polymer based on polyamide type 12 and is manufactured by additive manufacturing technology based on powder sintering additive manufacturing. In one embodiment, the mold provided in step a) comprises a polymer based on polypropylene and is manufactured by additive manufacturing technology based on powder sintering additive manufacturing. In one embodiment, the mold provided in step a) comprises a polymer based on polyolefin and is manufactured by additive manufacturing technology based on multiple jet fusion. In one embodiment, the mold provided in step a) comprises a polymer based on polyamide and is manufactured by additive manufacturing technology based on multiple jet fusion.In one embodiment, the mold provided in method step a) comprises a polymer based on polyamide 12 type and is manufactured by additive manufacturing technology based on multi-injection fusion. In one embodiment, the mold provided in method step a) comprises a polymer based on polypropylene and is manufactured by additive manufacturing technology based on multi-injection fusion. In one embodiment, the mold provided in method step a) comprises a biodegradable polymer. In one embodiment, the mold provided in method step a) comprises an agricultural polymer (biomass derived from agricultural resources). In one embodiment, the mold provided in method step a) comprises a biodegradable polymer derived from microorganisms (polyhydroxyalkanoate, polyhydroxybutyrate, etc.). In one embodiment, the mold provided in method step a) comprises a biodegradable polymer derived from biotechnology (polylactic acid, etc.). In one embodiment, the mold provided in method step a) comprises a biodegradable polymer derived from petrochemical products (polycaprolactone, polyethylene adipate, aromatic polyester, etc.). In one embodiment, when it is stated in this paragraph (above and below this line) that the mold of method step a) comprises a certain type of polymer, it means that the relevant amount of polymer material of that mold is made of the material mentioned. In one embodiment, when this paragraph states that the type of method step a) contains a certain type of polymer, it means that the relevant amount of polymer material of that type is made of the material or related material mentioned. In one embodiment, the relevant amount means 6% or more. In another embodiment, the relevant amount means 26% or more. In another embodiment, the relevant amount means 56% or more. In another embodiment, the relevant amount means 76% or more. In another embodiment, the relevant amount means 96% or more. In another embodiment, the relevant amount is the total amount. In one embodiment, these percentages are by volume. In alternative embodiments, these percentages are by weight. In some applications, in addition to the fact that the type provided in method step a) contains a semicrystalline thermoplastic material, it is important that the semicrystalline thermoplastic material is selected to have the correct melting temperature (Tm).Naturally, the same applies to the structure, as will happen in the rest of this document unless otherwise specified, where the type of material mentioned (in this case, a semicrystalline thermoplastic) is the main material of the mold, or in other cases the entire mold is constructed of such material. In one embodiment, a semicrystalline thermoplastic having a melting temperature of less than 290°C is used. In another embodiment, a semicrystalline thermoplastic having a melting temperature of less than 190°C is used. In another embodiment, a semicrystalline thermoplastic having a melting temperature of less than 168°C is used. In another embodiment, a semicrystalline thermoplastic having a melting temperature of less than 144°C is used. In another embodiment, a semicrystalline thermoplastic having a melting temperature of less than 119°C is used. In another embodiment, a semicrystalline thermoplastic having a melting temperature of less than 98°C is used. For some applications, a melting point that is too low cannot be carried out without the risk of distortion. In one embodiment, a semicrystalline thermoplastic having a melting temperature higher than 28°C is used. In another embodiment, a semicrystalline thermoplastic having a melting temperature higher than 55°C is used. In another embodiment, a semicrystalline thermoplastic material having a melting temperature higher than 105°C is used. In another embodiment, a semicrystalline thermoplastic material having a melting temperature higher than 122°C is used. In another embodiment, a semicrystalline thermoplastic material having a melting temperature higher than 155°C is used. Another embodiment. In this, a semicrystalline thermoplastic having a melting temperature higher than 175°C is used. In one embodiment, the melting temperature is measured according to ISO 11357-1 / -3:2016. In one embodiment, the melting temperature is measured using a heating rate of 20°C / min. In one embodiment, the melting temperature of any polymer in this document is measured according to ISO 11357-1 / -3:2016. In one embodiment, the melting temperature of any polymer in this document is measured using a heating rate of 20°C / min. In one embodiment, the type provided in method step a) is made of a nonpolar polymer. In some applications, in addition to the fact that the type provided in method step a) includes a semicrystalline thermoplastic, it is important that the semicrystalline thermoplastic is selected to have the correct level of crystallinity. In one embodiment, a semicrystalline thermoplastic having a crystallinity higher than 12% is used. In another embodiment, a semicrystalline thermoplastic having a crystallinity higher than 32% is used. In yet another embodiment, a semicrystalline thermoplastic having a crystallinity higher than 52% is used. In another embodiment, a semicrystalline thermoplastic having a crystallinity of more than 76% is used. In another embodiment, a semicrystalline thermoplastic having a crystallinity of more than 82% is used. In another embodiment, a semicrystalline thermoplastic having a crystallinity of more than 96% is used. In one embodiment, the crystallinity values ​​disclosed above are measured using X-ray diffraction (XRD) techniques. In an alternative embodiment, the crystallinity values ​​disclosed above are obtained by differential scanning calorimetry (DSC). In one embodiment, the crystallinity is measured using a heating rate of 10°C / min. In some applications, in addition to the fact that the type provided in method step a) includes a polymer, it is important that the polymer is selected to have the correct molecular weight. In one embodiment, the type provided in method step a) includes a polymer material and its relevant portion having a sufficient molecular weight. In one embodiment, the relevant portion is 16% or more. In another embodiment, the relevant portion is 36% or more.In another embodiment, the relevant portion is 56% or more. In another embodiment, the relevant portion is 16% or more. In another embodiment, the relevant portion is 76% or more. In another embodiment, the relevant portion is 86% or more. In another embodiment, the relevant portion is 96% or more. In another embodiment, the relevant portion is the whole. In one embodiment, these percentages are by volume. In an alternative embodiment, these percentages are by weight. In one embodiment, a sufficient molecular weight is 8500 or more. In another embodiment, a sufficient molecular weight is 12000 or more. In another embodiment, a sufficient molecular weight is 45000 or more. In another embodiment, a sufficient molecular weight is 65000 or more. In another embodiment, a sufficient molecular weight is 85000 or more. In another embodiment, a sufficient molecular weight is 105000 or more. In another embodiment, a sufficient molecular weight is 285000 or more. Some applications do not benefit from high molecular weight contrary to the results that would be intuitively expected. In one set of embodiments, the majority of the polymer phase of the type of material provided in method step a) is retained at a sufficiently low molecular weight. In one embodiment, the majority refers to 55% or more. In another embodiment, the majority refers to 66% or more. In another embodiment, the majority refers to 78% or more. In another embodiment, the majority refers to 86% or more. In another embodiment, the majority refers to 96% or more. In another embodiment, the majority refers to all. In one embodiment, these percentages are by volume. In an alternative embodiment, these percentages are by weight. In one embodiment, a sufficiently low molecular weight is 4,900,000 or less. In another embodiment, a sufficiently low molecular weight is 900,000 or less. In another embodiment, a sufficiently low molecular weight is 190,000 or less. In another embodiment, a sufficiently low molecular weight is 90,000 or less. In another embodiment, a sufficiently low molecular weight is 74,000 or less. In some applications, in addition to the fact that the type provided in step a) contains a polymer, it is important that the polymer is selected to have the correct heat deflection temperature (HDT).In one embodiment, the material of the type provided in step a) comprises a polymer material and a related portion (in the terms above) having a sufficiently low heat distortion temperature of 1.82 MPa (heat distortion temperature measured under a load of 1.82 MPa). In one embodiment, sufficiently low means 380°C or less. In another embodiment, sufficiently low means 280°C or less. In another embodiment, sufficiently low means 190°C or less. In another embodiment, sufficiently low means 148°C or less. In another embodiment, sufficiently low means 118°C or less. In another embodiment, sufficiently low means 98°C or less. In another embodiment, sufficiently low means 58°C or less. In another embodiment, the material of the type provided in step a) comprises a polymer material and a related portion (in the terms above) having a sufficiently low heat distortion temperature of 0.455 MPa (heat distortion temperature measured under a load of 0.455 MPa). In one embodiment, sufficiently low means 440°C or less. In another embodiment, sufficiently low means 340°C or less. In another embodiment, sufficiently low means 240°C or less. In another embodiment, sufficiently low means 190°C or lower. In another embodiment, sufficiently low means 159°C or lower. In another embodiment, sufficiently low means 119°C or lower. In another embodiment, sufficiently low means 98°C or lower. For many applications, excessively low heat distortion temperatures are not suitable. In one embodiment, the type of material provided in method step a) comprises a polymer material and its relevant portion (in the terms described above) having a sufficiently high heat distortion temperature of 1.82 MPa. In one embodiment, sufficiently high means 32°C or higher. In another embodiment, sufficiently high means 52°C or higher. In another embodiment, sufficiently high means 72°C or higher. In another embodiment, sufficiently high means 106°C or higher. In another embodiment, sufficiently high means 132°C or higher. In another embodiment, sufficiently high means 152°C or higher. In another embodiment, sufficiently high means 204°C or higher. In another embodiment, sufficiently high means 250°C or higher.In one embodiment, the material of the mold provided in step a) comprises a polymer material and a corresponding portion thereof having a sufficiently high (in the terms above) heat distortion temperature of 0.455 MPa (heat distortion temperature measured under a load of 0.455 MPa). In one embodiment, the heat distortion temperature is specified according to the ISO 75-1:2013 standard. In an alternative embodiment, the value of the heat distortion temperature is specified according to the American Society for Testing and Materials standard test method D648-07. In one embodiment, the heat distortion temperature is specified by a heating rate of 50°C / hour. In another alternative embodiment, the heat distortion temperature of the closest-packed material reported in the UL IDES Prospector plastics materials database dated January 29, 2018, is used. As with all other embodiments of the present invention, and unless otherwise expressly stated, there are several applications that do not depend on the heat distortion temperature of the material used to make the mold provided in step a). In some applications, in addition to the fact that the mold provided in step a) contains a polymer, it is important that the polymer is selected to have the correct Vicat softening point. In one embodiment, the Vicker softening point is 314°C or lower. In another embodiment, the Vicker softening point is 248°C or lower. In another embodiment, the Vicker softening point is 166°C or lower. In another embodiment, the Vicker softening point is 123°C or lower. In another embodiment, the Vicker softening point is 106°C or lower. In another embodiment, the Vicker softening point is 74°C or lower. In another embodiment, the Vicker softening point is 56°C or lower. In one embodiment, the Vicker softening point is 36°C or higher. In another embodiment, the Vicker softening point is 56°C or higher. In another embodiment, the Vicker softening point is 76°C or higher. In another embodiment, the Vicker softening point is 86°C or higher. In another embodiment, the Vicker softening point is 106°C or higher. In another embodiment, the Vicker softening point is 126°C or higher. In another embodiment, the Vicker softening point is 156°C or higher. In another embodiment, the Vicker softening point is 216°C or higher. In one embodiment, the Vicker softening point is specified according to the ISO 306 standard. In one embodiment, the Vicker softening point is determined by a heating rate of 50°C / hour.In one embodiment, the Vicker softening point is determined by a load of 50 N. In one embodiment, the Vicker softening point is determined according to the D1525 standard of the American Society for Testing and Materials. In one embodiment, the Vicker softening point is determined by the B50 method. In another embodiment, the Vicker softening point is determined by the A120 method and 18°C ​​is subtracted from the measured value. In another embodiment, the Vicker softening point is determined in accordance with the ISO 10350-1 standard using the B50 method. In another alternative embodiment, the Vicker hardness of the densest materials reported in the UL IDES Prospector plastics material database dated January 29, 2018, is used. In some applications, in addition to the fact that the mold provided in method step a) contains a polymer, it is important that the polymer is selected in order to have the correct classification in the Ensinger Manual for Industrial Plastics. In one embodiment, the latest version available as of January 21, 2018, is used. In another embodiment, the 10 / 12 E9911075A011GB version is used. In one embodiment, a polymer classified as a high-performance plastic is used. In another embodiment, a polymer classified as an industrial plastic is used. In another embodiment, a polymer classified as a standard plastic is used. It has been found that using a material with a particularly low softening point for at least a portion of the mold is particularly advantageous for some applications. In one embodiment, a material having a melting temperature (Tm) of less than 190°C is used. In another embodiment, a material having a melting temperature of less than 130°C is used. In another embodiment, a material having a melting temperature of less than 98°C is used. In another embodiment, a material having a melting temperature of less than 79°C is used. In another embodiment, a material having a melting temperature of less than 69°C is used. In another embodiment, a material having a melting temperature of less than 49°C is used. In some applications, a mold containing a material having the lowest melting temperature (Tm) is preferred. In one embodiment, a material having a melting temperature higher than -20°C is used. In another embodiment, a material having a melting temperature higher than 28°C is used. In another embodiment, a material having a melting temperature higher than 42°C is used.In another embodiment, a material having a melting temperature higher than 52°C is used. In another embodiment, a material having a melting temperature higher than 62°C is used. In one embodiment, the material is a polymer. In one embodiment, the melting temperature values ​​disclosed above are measured according to ISO 11357-1 / -3:2016. In one embodiment, the melting temperature values ​​disclosed above are measured using a heating rate of 20°C / min. In one embodiment, a material having a glass transition temperature (Tg) of less than 169°C is used. In one embodiment, a material having a glass transition temperature (Tg) of less than 109°C is used. In another embodiment, a material having a glass transition temperature (Tg) of less than 69°C is used. In another embodiment, a material having a glass transition temperature (Tg) of less than 49°C is used. In another embodiment, a material having a glass transition temperature (Tg) of less than 9°C is used. In another embodiment, a material having a glass transition temperature (Tg) of less than -11°C is used. In another embodiment, a material having a glass transition temperature (Tg) of less than -32°C is used. In another embodiment, a material having a glass transition temperature (Tg) below -51°C is used. In some applications, the lowest glass transition temperature is available. A mold containing the following material is preferred. In one embodiment, a material having a glass transition temperature higher than -260°C is used. In another embodiment, a material having a glass transition temperature higher than -230°C is used. In yet another embodiment, a material having a glass transition temperature higher than -190°C is used. In yet another embodiment, a material having a glass transition temperature higher than -90°C is used. In one embodiment, the glass transition temperature (Tg) of any polymer in this document is measured by differential scanning calorimetry (DSC) in accordance with D3418-12 of the American Society for Testing and Materials. In one embodiment, the mold provided in step a) comprises a material having a low glass transition point as described in the previous paragraph, and the filled and sealed mold is supercooled in several steps after step c) (after sealing the filled mold) and before step d). In one embodiment, the material is a polymer. In one embodiment, supercooling is performed by holding the mold at a low temperature for longer than 10 minutes. In another embodiment, supercooling is performed by holding the mold at a low temperature for longer than 30 minutes. In another embodiment, supercooling is performed by holding the mold at a low temperature for longer than 2 hours. In another embodiment, supercooling is performed by holding the mold at a low temperature for longer than 10 hours. In one embodiment, the low temperature for supercooling is 19°C or lower. In another embodiment, the low temperature for supercooling is 9°C or lower. In another embodiment, the low temperature for supercooling is -1°C or lower. In another embodiment, the low temperature for supercooling is -11°C or lower. In another embodiment, the low temperature for supercooling is -20°C or lower. In some applications, it is more convenient to adjust the supercooling low temperature to the softening point of the mold material with a low softening point. In one embodiment, the low temperature for supercooling is below a glass transition temperature of 60°C. In another embodiment, the low temperature for supercooling is below a glass transition temperature of 50°C. In another embodiment, the low temperature for supercooling is below a glass transition temperature of 40°C. In another embodiment, the low temperature for supercooling is below a glass transition temperature of 20°C. In another embodiment, the low temperature for supercooling is below a glass transition temperature of 10°C. In some applications, it has been found that excessive supercooling can also lead to defects that result in different defects in different applications (e.g., fine mold breakage during method steps d), e), and f). In one embodiment, supercooling should be limited to a maximum temperature of -273°C. In another embodiment, supercooling should be limited to a maximum temperature of -140°C. In another embodiment, supercooling should be limited to a maximum temperature of -90°C. In another embodiment, supercooling should be limited to a maximum temperature of -50°C. In another embodiment, supercooling should be limited to a maximum Tg of -50°C. In another embodiment, supercooling should be limited to a maximum temperature of Tg of -20°C.In another embodiment, supercooling should be limited to a maximum temperature of Tg-10°C. In another embodiment, supercooling should be limited to a maximum temperature of Tg. In another embodiment, supercooling should be limited to a maximum temperature of Tg+20°C. For some applications, the relevant maximum temperature obtained in method step e) is more appropriate. In one embodiment, the relevant maximum temperature obtained in method step e) is 190°C or less. In another embodiment, the relevant maximum temperature obtained in method step e) is 140°C or less. In another embodiment, the relevant maximum temperature obtained in method step e) is 120°C or less. In another embodiment, the relevant maximum temperature obtained in method step e) is 90°C or less. In one embodiment, the relevant maximum temperature obtained in method step e) is Tm+50°C or less. In another embodiment, the relevant maximum temperature obtained in method step e) is Tm+30°C or less. In another embodiment, the relevant maximum temperature obtained in method step e) is the melting temperature of +10°C. In another embodiment, the relevant maximum temperature obtained in method step e) is Tm+10°C or less. In another embodiment, the relevant maximum temperature obtained in method step e) is less than or equal to Tm. In another embodiment, the relevant maximum temperature obtained in method step e) is less than or equal to Tm-20°C. For some applications, the relevant maximum temperature obtained in method step f) is more appropriate. In one embodiment, the relevant maximum temperature obtained in method step f) is less than or equal to 190°C. In another embodiment, the relevant maximum temperature obtained in method step f) is less than or equal to 140°C. In another embodiment, the relevant maximum temperature obtained in method step f) is less than or equal to 120°C. In another embodiment, the relevant maximum temperature obtained in method step f) is less than or equal to 90°C. In one embodiment, the relevant maximum temperature obtained in method step f) is less than or equal to Tm+50°C. In another embodiment, the relevant maximum temperature obtained in method step f) is less than or equal to Tm+30°C. In another embodiment, the relevant maximum temperature obtained in method step f) is the melting temperature of +10°C. In another embodiment, the relevant maximum temperature obtained in method step f) is less than or equal to Tm+10°C.In another embodiment, the relevant maximum temperature obtained in method step f) is less than or equal to Tm. In another embodiment, the relevant maximum temperature obtained in method step f) is less than or equal to Tm-20°C. For some applications, the relevant maximum temperature obtained in method steps e) and / or f) is more appropriate. In one embodiment, the relevant maximum temperature obtained in method steps e) and / or f) is less than or equal to 190°C. In another embodiment, the relevant maximum temperature obtained in method steps e) and / or f) is less than or equal to 140°C. In another embodiment, the relevant maximum temperature obtained in method steps e) and / or f) is less than or equal to 120°C. In another embodiment, the relevant maximum temperature obtained in method steps e) and / or f) is less than or equal to 90°C. In one embodiment, the relevant maximum temperature obtained in method steps e) and / or f) is less than or equal to Tm+50°C. In another embodiment, the relevant maximum temperature obtained in method steps e) and / or f) is less than or equal to Tm+30°C. In another embodiment, the relevant maximum temperature obtained in method steps e) and / or f) is the melting temperature of +10°C. In another embodiment, the relevant maximum temperature obtained in method steps e) and / or f) is Tm+10°C or less. In another embodiment, the relevant maximum temperature obtained in method steps e) and / or f) is Tm or less. In another embodiment, the relevant maximum temperature obtained in method steps e) and / or f) is Tm-20°C or less. In one embodiment, the melting temperature is the melting temperature of the material contained in the mold. In an alternative embodiment, the melting temperature is the melting temperature of the relevant part of the mold (the relevant part, as described elsewhere in this document). In one embodiment, the melting temperature is the melting temperature of the mold. For some applications, the minimum value of the relevant maximum temperature obtained in the method steps should also be controlled. In some applications, it has been unexpectedly found that when supercooling is used, the relevant maximum temperature applied in method steps e) and / or f) should be somewhat lower.In one embodiment, when supercooling is used between steps e) and / or f) of the method, the relevant maximum temperature value mentioned in this paragraph should be reduced by 10°C. In another embodiment, the relevant maximum temperature value mentioned in this paragraph should be reduced by 18°C. In another embodiment, the relevant maximum temperature value mentioned in this paragraph should be reduced by 8°C. In one embodiment, the relevant temperature refers to a temperature lasting longer than 1 second. In another embodiment, the relevant temperature refers to a temperature lasting longer than 20 seconds. In another embodiment, the relevant temperature refers to a temperature lasting longer than 2 minutes. In another embodiment, the relevant temperature refers to a temperature lasting longer than 11 minutes. In another embodiment, the relevant temperature refers to a temperature lasting longer than 1 hour and 10 minutes. In some embodiments, the relevant maximum temperature applied in step e) is the same as the maximum temperature applied in step e). In some embodiments, the relevant maximum temperature applied in step f) is the same as the maximum temperature applied in step f). In some embodiments, the prior disclosure regarding supercooling is particularly useful when the material used to manufacture the mold contains polycaprolactone. In another embodiment, the prior disclosure regarding supercooling is particularly useful when the material used to manufacture the mold contains porous polycaprolactone. In another embodiment, the prior disclosure regarding supercooling is particularly useful when the material used to manufacture the mold contains polyvinyl acetate. In another embodiment, the prior disclosure regarding supercooling is particularly useful when the material used to manufacture the mold contains Coridon VA64, and furthermore, in some embodiments, the prior disclosure regarding supercooling is particularly useful when the material used to manufacture the mold contains Coridon 12PF. When obtaining molds using powder sintering additive manufacturing technology, it has been found to be beneficial to use new types of polymer powders based on ternary or superpolymer polyamides with low melting points. Other additional manufacturing methods based on polymer powders may also be used. In one embodiment, a powder having a polyamide ternary copolymer is used. In one embodiment, a powder having a polyamide quaternary copolymer is used. In one embodiment, a powder having a superpolymer polyamide is used. In one embodiment, a polyamide ternary copolymer of polyamide 12 (PA12), polyamide 66 (PA66), and polyamide 6 (PA6) having a melting temperature of less than 169°C is used. In one embodiment, a polyamide ternary copolymer of polyamide 12, polyamide 66, and polyamide 6 having a melting temperature of less than 159°C is used. In one embodiment, a polyamide ternary copolymer of polyamide 12, polyamide 66, and polyamide 6 having a melting temperature of less than 149°C is used. In one embodiment, a polyamide ternary copolymer of polyamide 12, polyamide 66, and polyamide 6 having a melting temperature of less than 144°C is used. In one embodiment, a polyamide terpolymer of polyamide 12, polyamide 66, and polyamide 6 having a melting temperature of less than 139°C is used. In one embodiment, a polyamide terpolymer of polyamide 12, polyamide 66, and polyamide 6 having a melting temperature of less than 129°C is used. In one embodiment, a polyamide terpolymer of polyamide 12, polyamide 66, and polyamide 6 having a melting temperature of less than 109°C is used. In one embodiment, a polyamide terpolymer of polyamide 12, polyamide 66, and polyamide 6 having a melting temperature higher than 82°C is used. In one embodiment, a polyamide terpolymer of polyamide 12, polyamide 66, and polyamide 6 having a melting temperature higher than 92°C is used. In one embodiment, a polyamide terpolymer of polyamide 12, polyamide 66, and polyamide 6 having a melting temperature higher than 102°C is used. In one embodiment, a polyamide terpolymer of polyamide 12, polyamide 66, and polyamide 6 having a melting temperature higher than 122°C is used.Figure 3 shows how the melting temperature of the ternary copolymer of polyamide 12, polyamide 66, and polyamide 6 is determined. In one embodiment, the polyamide copolymer has 42% or more polyamide 12. In one embodiment, the polyamide copolymer has 52% or more polyamide 12. In one embodiment, the polyamide copolymer has 62% or more polyamide 12. In one embodiment, the polyamide copolymer has 66% or more polyamide 12. In one embodiment, the copolymer polyamide contains a dark color pigment. In one embodiment, the copolymer polyamide contains a black color pigment. In one embodiment, the polyamide copolymer powder is obtained directly by precipitation. In one embodiment, the polyamide copolymer powder has a D50 of 12 microns or more. In one embodiment, the polyamide copolymer powder has a D50 of 22 microns or more. In one embodiment, the polyamide copolymer powder has a D50 of 32 microns or more. In one embodiment, the polyamide copolymer powder has a D50 of 52 microns or more. In one embodiment, the polyamide copolymer powder has a D50 of 118 microns or less. In one embodiment, the polyamide copolymer powder has a D50 of 98 microns or less. In one embodiment, the polyamide copolymer powder has a D50 of 88 microns or less. In another embodiment, the polyamide copolymer powder has a D50 of 68 microns or less. For some applications, it is beneficial to have reinforcing in at least some of the polymer materials contained in the mold provided in step a) of method. In one embodiment, at least one relevant portion (as described above) of the polymer materials contained in the mold provided in step a) of method contains a sufficient amount of reinforcing. In one embodiment, a sufficient amount of reinforcing is 2.2% or more. In another embodiment, a sufficient amount of reinforcing is 6% or more. In another embodiment, a sufficient amount of reinforcing is 12% or more. In another embodiment, a sufficient amount of reinforcing is 22% or more. In another embodiment, a sufficient amount of reinforcing is 42% or more. In another embodiment, a sufficient amount of reinforcing is 52% or more. In another embodiment, a sufficient amount of reinforcing is 62% or more. In one embodiment, a sufficient amount of reinforcing is 78% or less. In another embodiment, a sufficient amount of reinforcing is 68% or less. In another embodiment, a sufficient amount of reinforcing is 48% or less. In another embodiment, a sufficient amount of reinforcing is 28% or less. In another embodiment, a sufficient amount of reinforcing is 18% or less. In one embodiment, these percentages are by volume. In alternative embodiments, these percentages are by weight. In one embodiment, the reinforcing material includes inorganic fibers. In one embodiment, the reinforcing material present in sufficient quantities (or, if multiple are used, one of the reinforcing materials) is inorganic fiber. In one embodiment, the reinforcing material includes glass fibers. In one embodiment, the reinforcing material present in sufficient quantities (or, if multiple are used, one of the reinforcing materials) is glass fiber. In one embodiment, the reinforcing material includes carbon fibers. In one embodiment, the reinforcing material present in sufficient quantities (or, if multiple are used, one of the reinforcing materials) is carbon fiber. In one embodiment, the reinforcing material includes basalt fibers. In one embodiment, the reinforcing material present in sufficient quantities (or, if multiple are used, one of the reinforcing materials) is basalt fiber. In one embodiment, the reinforcing material includes asbestos. In one embodiment, the reinforcing material present in sufficient quantities (or, if multiple are used, one of the reinforcing materials) is asbestos fiber. In one embodiment, the reinforcing material includes ceramic fibers.In one embodiment, the reinforcing material present in sufficient quantity (or, if multiple are used, one of the reinforcing materials) is ceramic fiber. In one embodiment, the ceramic fiber is at least 50% oxide. In one embodiment, the ceramic fiber is at least 50% carbide. In one embodiment, the ceramic fiber is at least 50% boride. In one embodiment, the ceramic fiber is at least 50% nitride. In one embodiment, these proportions are by volume. In alternative embodiments, these proportions are by weight. In one embodiment, the ceramic fiber contains silicon carbide. In one embodiment, the reinforcing material contains inorganic filler. In one embodiment, the reinforcing material present in sufficient quantity (or, if multiple are used, one of the reinforcing materials) is inorganic filler. In one embodiment, the reinforcing material contains mineral filler. In one embodiment, the reinforcing material present in sufficient quantity (or, if multiple are used, one of the reinforcing materials) is mineral filler. In one embodiment, the reinforcing material contains organic fiber. In one embodiment, the reinforcing material present in sufficient quantity (or, if multiple are used, one of the reinforcing materials) is organic fiber. In one embodiment, the reinforcing material contains natural fiber. In one embodiment, the reinforcing material present in sufficient quantity (or, if multiple are used, one of the reinforcing materials) is a natural fiber. For some applications, having reinforcing material in any relevant portion of the polymer material contained in the mold provided in step a) is highly detrimental. In one embodiment, no reinforcing material is present in any relevant portion (as described above) of the polymer material contained in the mold provided in step a). In one embodiment, all reinforcing material is retained at less than 48%. In another embodiment, all reinforcing material is retained at less than 28%. In another embodiment, all reinforcing material is retained at less than 18%. In another embodiment, all reinforcing material is retained at less than 8%. In another embodiment, all reinforcing material is retained at less than 2%. In another embodiment, all reinforcing material is retained at 0%. In one embodiment, these percentages are by volume. In an alternative embodiment, these percentages are by weight.In some applications, in addition to the fact that the mold provided in step a) contains a polymer, it is important that the polymer is selected to have the correct tensile strength at room temperature (23°C) when characterized by an appropriate strain rate. In one embodiment, the mold provided in step a) contains a polymer that has the correct tensile strength at room temperature (23°C) when characterized by an appropriate strain rate. In one embodiment, the correct tensile strength is 2 MPa or more. In another embodiment, the correct tensile strength is 6 MPa or more. In another embodiment, the correct tensile strength is 12 MPa or more. In another embodiment, the correct tensile strength is 26 MPa or more. In another embodiment, the correct tensile strength is 52 MPa or more. In another embodiment, the correct tensile strength is 82 MPa or more. In some applications, the tensile strength should not be too high. In one embodiment, the correct tensile strength is 288 MPa or less. In another embodiment, the correct tensile strength is 248 MPa or less. In another embodiment, the correct tensile strength is 188 MPa or less. In another embodiment, the correct tensile strength is 148 MPa or less. In one embodiment, the appropriate strain rate is 2500 s. ‐1 In another embodiment, the appropriate strain rate is 500 s ‐1 In another embodiment, the appropriate strain rate is 50s. ‐1 In another embodiment, the appropriate strain rate is 1.0 s. ‐1 In another embodiment, the appropriate strain rate is 1.10 ‐2 s ‐1 In another embodiment, the appropriate strain rate is 1.10 ‐3 s ‐1Therefore, in some applications, steps e) and f) of method are omitted or greatly simplified, and with particular mention of some applications, it is possible to unexpectedly benefit from materials that intentionally use inferior properties. In one embodiment, the correct tensile strength is 99 MPa or less. In another embodiment, the correct tensile strength is 69 MPa or less. In another embodiment, the correct tensile strength is 49 MPa or less. In another embodiment, the correct tensile strength is 29 MPa or less. In another embodiment, the correct tensile strength is 19 MPa or less. In another embodiment, the correct tensile strength is 9 MPa or less. In one embodiment, the tensile strength values ​​disclosed above are measured according to D638-14 of the American Society for Testing and Materials. In an alternative embodiment, the tensile strength values ​​disclosed above are measured according to D3039 / D3039M-17 of the American Society for Testing and Materials. In some embodiments, the use of American Society for Testing and Materials (ASMS) D3039 / D3039M-17 is preferred for highly oriented and / or high tensile modulus reinforced polymers, while ASMS D638-14 is preferred for low-volume reinforcements or unreinforced, randomly oriented, or discontinuous polymers having a low tensile modulus. In one embodiment, room temperature is 23°C. The tensile modulus of a polymer is important in some applications. In one embodiment, the mold provided in step a) comprises a polymer having the correct tensile modulus at room temperature (23°C) when characterized by an appropriate strain rate (an appropriate strain rate as described above). In one embodiment, the correct tensile modulus is 105 MPa or higher. In another embodiment, the correct tensile modulus is 505 MPa or higher. In another embodiment, the correct tensile modulus is 1005 MPa or higher. In another embodiment, the correct tensile modulus is 1200 MPa or higher. In another embodiment, the correct tensile modulus is 1850 MPa or higher. In another embodiment, the correct tensile modulus is 2505 MPa or higher. In some applications, the tensile modulus should not be excessive. In one embodiment, the correct tensile modulus is 5900 MPa or lower. In another embodiment, the correct tensile modulus is 3900 MPa or lower. In another embodiment, the correct tensile modulus is 2900 MPa or lower. In another embodiment, the correct tensile modulus is 2400 MPa or lower. In another embodiment, the correct tensile modulus is 1900 MPa or lower. In another embodiment, the correct tensile modulus is 900 MPa or less. In one embodiment, the tensile modulus values ​​disclosed above are measured according to American Society for Testing and Materials (ASS) D638-14. In an alternative embodiment, the tensile modulus values ​​disclosed above are measured according to ASS D3039 / D3039M-17. In some embodiments, the use of ASS D3039 / D3039M-17 is preferred for highly oriented and / or high tensile modulus reinforced polymers, while ASS D638-14 is preferred for low-volume reinforcements or unreinforced, randomly oriented, or discontinuous polymers having a low tensile modulus. In one embodiment, room temperature is 23°C. In some applications, having a low flexural modulus can be beneficial without requiring excessive dimensional accuracy in internal properties, or without any dimensional accuracy at all. In one embodiment, the mold provided in step a) comprises a polymer having the correct flexural modulus at room temperature (23°C) when characterized by an appropriate strain rate (an appropriate strain rate as described above).In one embodiment, the correct flexural modulus is 3900 MPa or less. In another embodiment, the correct flexural modulus is 1900 MPa or less. In another embodiment, the correct flexural modulus is 1400 MPa or less. In another embodiment, the correct flexural modulus is 990 MPa or less. In another embodiment, the correct flexural modulus is 490 MPa or less. In some applications, the flexural modulus should not be too low. In another embodiment, the correct flexural modulus is 120 MPa or more. In another embodiment, the correct flexural modulus is 320 MPa or more. In another embodiment, the correct flexural modulus is 520 MPa or more. In one embodiment, the values ​​of flexural modulus disclosed above are measured according to D790-17 of the American Society for Testing and Materials. In one embodiment, room temperature is 23°C. The inventors found it very interesting to discover that in some applications, a significant factor affecting the quality of the manufactured element is the vulnerability of the material used in the mold provided in method step a) to the strain rate, particularly with respect to internal microcracks. In one embodiment, the mold provided in step a) comprises a material that exhibits a decrease of at least 6% in actual compressive strength when measured at a low strain rate compared to when measured at a high strain rate. In another embodiment, the decrease in actual compressive strength is 16% or more. In another embodiment, the decrease in actual compressive strength is 26% or more. In another embodiment, the decrease in actual compressive strength is 56% or more. In another embodiment, the decrease in actual compressive strength is 76% or more. In one embodiment, the decrease in actual compressive strength is at least 2 MPa. In another embodiment, the decrease in actual compressive strength is at least 6 MPa. In another embodiment, the decrease in actual compressive strength is at least 12 MPa. In another embodiment, the decrease in actual compressive strength is at least 22 MPa. In another embodiment, the decrease in actual compressive strength is at least 52 MPa. In some applications, particularly where excessive precision is not required in internal properties, it is beneficial to use a material with very low sensitivity to strain rate for the material in step a).In one embodiment, the mold provided in method step a) includes a material that exhibits a decrease of less than 89% in actual compressive strength when measured at a low strain rate compared to when measured at a high strain rate. In another embodiment, the decrease is 48% or less. In another embodiment, the decrease is 18% or less. In yet another embodiment, the decrease is 9% or less. In one embodiment, actual compressive strength refers to compressive strength. In one embodiment, the actual compressive strength at high and low strain rates is measured according to American Society for Testing and Materials D695-15. In an alternative embodiment, the actual compressive strength at high and low strain rates is measured according to American Society for Testing and Materials D3410 / D3410M-16. In one embodiment, the values ​​of actual compressive strength are at room temperature (23°C). In some applications, tensile modulus strain sensitivity is important. In one embodiment, the mold provided in method step a) includes a material that exhibits a decrease of at least 6% in tensile modulus when measured at a low strain rate compared to when measured at a high strain rate. In another embodiment, the decline is 12% or more. In another embodiment, the decline is 16% or more. In another embodiment, the decline is 22% or more. In another embodiment, the decline is 42% or more. For applications where internal property accuracy is very important, it is often important to have a material that is somewhat more strain-rate insensitive to the mold provided in method step a). In one embodiment, the mold provided in method step a) includes a material that exhibits a decline of less than 72% in tensile modulus when measured at a low strain rate compared to when measured at a high strain rate. In another embodiment, the decline is 49% or less. In another embodiment, the decline is 19% or less. In another embodiment, the decline is 9% or less. In one embodiment, the tensile modulus at high and low strain rates is measured according to D638-14 of the American Society for Testing and Materials. In one embodiment, the tensile modulus at high and low strain rates is measured according to D3039 / D3039M-17 of the American Society for Testing and Materials.In some embodiments, the use of ASTM D3039 / D3039M-17 is preferred for highly oriented and / or high tensile modulus reinforcing polymers, and ASTM D638-14 is preferred for unreinforced or randomly oriented or discontinuous polymers having a low volume of reinforcement or a low tensile modulus. In one embodiment, a high strain rate is 6 s. ‐1 or greater. In another embodiment, a high strain rate is 55 s ‐1 or greater. In another embodiment, a high strain rate is 550 s ‐1 or greater. In another embodiment, a high strain rate is 1050 s ‐1 or greater. In another embodiment, a high strain rate is 2050 s ‐1 or greater. In another embodiment, a high strain rate is 2550 s ‐1 or greater. In one embodiment, a low strain rate is 9 s ‐1 or less. In another embodiment, a low strain rate is 0.9 s ‐1 or less. In another embodiment, a low strain rate is 0.9·10 ‐2 s ‐1 or less. In another embodiment, a low strain rate is 0.9·10 ‐3 s ‐1 or less. In another embodiment, a low strain rate is 0.9·10 ‐4 s ‐1The following applies to some applications, which may seem quite unexpected, but are advantageous in that the mold provided in method step a) is made of different parts assembled together. In one embodiment, the mold provided in method step a) is made of different parts assembled together. In one embodiment, the mold provided in method step a) is made of a substantial amount of different parts assembled together. In one embodiment, a substantial amount is 3 or more. In another embodiment, a substantial amount is 4 or more. In another embodiment, a substantial amount is 6 or more. In another embodiment, a substantial amount is 8 or more. In another embodiment, a substantial amount is 12 or more. In another embodiment, a substantial amount is 18 or more. In another embodiment, a substantial amount is 22 or more. In one embodiment, at least one of the parts assembled to make the mold provided in method step a) is provided with a guide mechanism that fixes the orientation to at least one of the parts being assembled. In one embodiment, a substantial amount (in the terms described above) of the parts assembled to make the mold provided in method step a) includes a guide mechanism that fixes the orientation to at least one of the parts being assembled (a reference part which may be fixed in a different orientation considering each part). In one embodiment, a substantial amount of the parts assembled to make the mold provided in method step a) includes a guide mechanism for fixing orientation to at least one part of the mold referred to as a reference part. In one embodiment, a substantial amount of the parts assembled to make the mold provided in method step a) includes a fixing mechanism for holding an attachment to at least one of the parts being assembled. In one embodiment, a substantial amount of the parts assembled to make the mold provided in method step a) includes a fixing mechanism for holding an attachment to at least one of the parts being assembled in a conforming anisotropic method, in which the conforming difference for different load directions is significant when the mold is assembled. In one embodiment, a significant conforming difference is 6% or more. In another embodiment, a significant conforming difference is 16% or more. In another embodiment, a significant conforming difference is 36% or more. In another embodiment, a significant conforming difference is 56% or more.In another embodiment, a significant conformance difference is 86% or more. In another embodiment, a significant conformance difference is 128% or more. In another embodiment, a significant conformance difference is 302% or more. In one embodiment, the conformance difference is expressed as a percentage by dividing the measured maximum value by the measured minimum value, the applied load is the same, and the difference arises from the direction of the applied load. In one embodiment, the load used is 10 N. In another embodiment, the load used is 100 N. In another embodiment, the load used is 1000 N. In another embodiment, the load used is 10000 N. In one embodiment, the load used is a load that generates a maximum stress of 1 MPa in the direction of maximum stiffness. In another embodiment, the load used is a load that generates a maximum stress of 10 MPa in the direction of maximum stiffness. In another embodiment, the load used is a load that generates a maximum stress of 30 MPa in the direction of maximum stiffness. In one embodiment, fixing and guiding are performed in a single mechanism for a substantial amount (in the terms above) of the parts assembled to make the mold provided in step a) of method. In one embodiment, the mold provided in method step a) is made of a substantial amount of different parts assembled together. In a different embodiment, the substantial amount is 3 or more, 4 or more, 6 or more, 8 or more, 12 or more, 18 or more, and even 22 or more. In one embodiment, at least two of the parts assembled to make the mold provided in method step a) are manufactured by different methods. In one embodiment, at least two of the parts assembled to make the mold provided in method step a) are manufactured by different methods, one of which is powder bed fusion. In one embodiment, at least two of the parts assembled to make the mold provided in method step a) are manufactured by different methods, one of which is multiple jet fusion. In one embodiment, at least three different manufacturing methods are used to assemble the mold provided in method step a). A component is manufactured. In some applications, how the internal properties are manufactured in the mold provided in step a) of the method is of great importance. In one embodiment, the provided mold includes solid internal properties and internal properties that are hollow and connected to the outside, or connected to other hollow internal properties that have external connections. In one embodiment, the provided mold includes internal properties that are hollow and connected to the outside, or connected to other hollow internal properties that have external connections. As seen in the previous paragraph, in many cases the material in step a) of method is flexible and has low rigidity due to its polymeric properties, and therefore it is quite surprising that this method works and functions without cracking and with excellent dimensional accuracy for composite geometric elements (even those with composite internal properties). Intuitively, it is expected that polymeric materials will collapse under the effect of pressure, and this does indeed happen if the instructions of the present invention are not strictly followed. Unfortunately, since different sets of instructions are required for different material systems and shapes, providing a comprehensive set of instructions is difficult considering the wide range of potential applications from which the present invention can benefit. Step b) of the method is critical for some applications. For some applications, the powder used to fill the mold provided in step a) is very important. For some applications, the form of the powder used to fill the mold provided in step a) is very important. For some applications, the properties of the powder used to fill the mold provided in step a) are very important. For some applications, the packing density of the powder used to fill the mold provided in step a) is very important, regardless of the method by which this packing or apparent density was obtained, while for some applications, the method used to obtain a particular packing density is of paramount importance. In one embodiment, the mold provided in step a) is filled to equilibrium apparent density at least partially. In one embodiment, the mold provided in step a) is filled to equilibrium apparent density. For some applications, it has been found that excessively low apparent density poses a significant challenge when it is possible to obtain a composite shape without internal defects, and even more so when the shape includes internal properties. For some applications, it has been found that excessively high apparent density poses a significant challenge when it is possible to obtain composite shape elements, especially large elements. In one embodiment, the equilibrium apparent density is 52% or more. In another embodiment, the equilibrium apparent density is 62% or more. In another embodiment, the equilibrium apparent density is 66% or more. In another embodiment, the equilibrium apparent density is 72% or more. In another embodiment, the equilibrium apparent density is 74% or more. In another embodiment, the equilibrium apparent density is 76% or more. In another embodiment, the equilibrium apparent density is 78% or more. In another embodiment, the equilibrium apparent density is 81% or more. In one embodiment, the equilibrium apparent density is 94% or less. In another embodiment, the equilibrium apparent density is 89% or less. In another embodiment, the equilibrium apparent density is 87% or less. In another embodiment, the equilibrium apparent density is 84% ​​or less. In another embodiment, the equilibrium apparent density is 82% or less.In another embodiment, the equilibrium apparent density is 79.5% or less. In one embodiment, the equilibrium apparent density is the apparent packing density. In an alternative embodiment, the apparent packing density is the percentage of the mold volume filled with powder. In one embodiment, the above apparent density values ​​are at room temperature (23°C). In one embodiment, the apparent density is measured according to American Society for Testing and Materials B329-06 (at 20°C and 1 atm). In some applications, it has been found that the packing apparent density should be applied well at the maximum pressure applied to the mold in method steps d), e) and / or f). In one embodiment,

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Claims

1. A method for cooling a sheet formed in a hot stamping die or mold, the method being: a) A step of providing a hot stamp die or mold containing a liquid on its surface in units of g / dm² in an amount between 0.02*ST and 9.8*ST, where ST is the sheet thickness in units of mm, and b) A step of arranging the sheet, wherein the sheet is an iron alloy sheet, and the sheet is heated in the hot stamp die or mold, c) The step of forming the sheet, d) After the molding step, the sheet is cooled to a temperature not exceeding 650°C at an extremely fast cooling rate of 27K / s or more, and at a low temperature of 90°C or less at a slow cooling rate of 24K / s or less. A method having

2. The method according to claim 1, wherein the step of extremely rapid cooling comprises the step of cooling the sheet using the latent heat of vaporization of the fluid.

3. The method according to claim 1 or 2, wherein the extremely fast cooling rate is 57 K / s or more.

4. The method according to claim 1 or 2, wherein the extremely fast cooling rate is 84 K / s or more.

5. The method according to claim 1 or 2, wherein the extremely fast cooling rate is 107 K / s or more.

6. The method according to claim 1 or 2, wherein the extremely fast cooling rate is 207 K / s or more.

7. The method according to any one of claims 1 to 6, wherein the slow cooling rate is 14 K / s or less.

8. The method according to any one of claims 1 to 7, wherein the slow cooling rate is 9 K / s or less.

9. The method according to any one of claims 1 to 8, wherein the slow cooling rate is 4K / s or less.

10. The method according to any one of claims 1 to 8, wherein the low temperature is 240°C or lower.

11. The method according to any one of claims 1 to 8, wherein the low temperature is 190°C or lower.

12. The method according to any one of claims 1 to 8, wherein the low temperature is 140°C or lower.

13. The method according to any one of claims 1 to 8, wherein the step of cooling the sheet very rapidly is carried out until the temperature no longer exceeds 310°C.

14. The method according to any one of claims 1 to 13, wherein the step of cooling the sheet very rapidly is carried out until the temperature no longer exceeds 450°C.

15. The method according to any one of claims 1 to 14, wherein the step of cooling the sheet very rapidly is carried out until the temperature no longer exceeds 550°C.

16. The method according to any one of claims 1 to 15, wherein in step b), the sheet is arranged to be in direct contact with the liquid.

17. The method according to claim 16, wherein at least 51 volume percent of the liquid is distributed in the form of droplets on the surface of the hot stamp die or mold.

18. The method according to claim 16 or 17, wherein the weight of the droplet is between 1.5 and 190 mg.

19. The hot stamping die or mold has a surface that is g / dm 2 The method according to any one of claims 1 to 18, wherein the liquid has a volume between 0.12*ST and 4.8*ST in units, where ST is the thickness of the sheet in mm.

20. The method according to claim 19, wherein the liquid is projected onto the surface of the hot stamp die or mold before the start of each hot stamp cycle.

21. The method according to any one of claims 16 to 20, wherein at least a portion of the droplets of the liquid is electrostatically charged.

22. The method according to any one of claims 16 to 21, wherein the contact angle between the droplet and the surface of the hot stamp die or mold is greater than 65 degrees and less than 169 degrees.

23. The method according to any one of claims 16 to 22, wherein the contact angle hysteresis between the droplet and the surface of the hot stamp die or mold is greater than 2 degrees and less than 163 degrees.

24. The method according to any one of claims 1 to 23, wherein the sheet is a tube or tubular component formed in the die.

25. The method according to any one of claims 1 to 24, wherein at least a portion of the surface of the die or mold is maintained at a temperature lower than the solidification temperature of the fluid.

26. The method according to any one of claims 1 to 25, wherein the extremely fast cooling rate is obtained through a phase change of the cooling medium.

27. The method according to claim 26, wherein the phase change is sublimation, melting, vaporization, or evaporation.

28. The method according to any one of claims 1 to 27, wherein the cooling medium is a fluid, a liquid, or a frozen fluid.

29. The aforementioned phase change is vaporization, and the initial contact occurs between the droplet and the extremely hot sheet. The method according to any one of claims 26 to 28, wherein in the region having a liquid cooling medium, a pressure of 0.2 MPa or more is applied between at least a portion of the sheet surface and the tool surface.

30. The method according to any one of claims 1 to 29, wherein the low cooling rate is maintained for 3 seconds or more.

31. In finished seat components, 7.2% or more of A 50 The method according to any one of claims 1 to 30, wherein an extension value can be obtained.

32. The method according to any one of claims 1 to 31, applicable to an indirect hot stamping method.

33. The method according to any one of claims 1 to 32, which enables extremely rapid production of hot-stamped parts at a rate of 11 spm (strokes / minute) or higher.

34. The method according to any one of claims 1 to 33, applicable to a production line that is a mechanical compression line, a transfer compression line, or a progressive line.

35. The method is applicable to a production line having several additional steps for trimming or perforating the sheet at high temperatures. The method according to any one of claims 1 to 34, wherein the high temperature state of the sheet means that the average temperature along the cutting or trimming line is 420°C or higher.

36. The method is applicable to a production line having several additional steps for trimming or perforating the sheet while it is warm. The method according to any one of claims 1 to 35, wherein the warm state of the sheet means that the average temperature along the cutting or trimming line is between 150°C and 400°C.

37. The method is applicable to a production line having several additional steps for trimming or perforating the sheet while it is cold. The method according to any one of claims 1 to 36, wherein the cooled state of the sheet means that the average temperature along the cutting or trimming line is 290°C or less.

38. The hot stamping die or mold has a region that is not cooled by the distribution liquid leading to a soft zone with higher elongation. Alternatively, the hot stamping die or mold has a heated region leading to a soft zone with higher elongation. The method according to any one of claims 1 to 37, wherein the heating is the average surface temperature of the die or mold, which is between 210°C and 690°C.

39. The method according to any one of claims 16 to 38, wherein the droplet forms a film on at least a portion of the surface of the die or mold.

40. The method according to any one of claims 16 to 39, wherein when the sheet comes into contact with the droplet on the surface of the die or mold, 51% to 98% of the droplet is evaporated.

41. At least a portion of the water droplets projected onto the die are electrostatically charged, The method according to any one of claims 16 to 40, wherein at least a portion of the die or mold is maintained at a different potential throughout at least a portion of the production cycle.

42. The method according to any one of claims 16 to 41, wherein at least a portion of the water droplets projected onto the die is electrostatically charged by a corona method, and at least a portion of the die or mold is maintained at a different potential.

43. At least a portion of the water droplets projected onto the die or mold are electrostatically charged, and / or The method according to any one of claims 16 to 41, wherein at least a portion of the water droplets projected onto the die or mold are electrostatically charged, and at least a portion of the die or mold is maintained at a potential different from that of the charged water droplets.

44. The method according to any one of claims 21 to 43, wherein the potential difference between the electrode that charges the droplet and the die is 600V or more and 390kV or less.

45. The method according to any one of claims 21 to 44, wherein the current is 1.5 μA or more and 90 mA or less.

46. The method according to any one of claims 1 to 45, wherein at least a portion of the die or mold is held at a potential opposite to that of the charged droplet, thereby generating an attractive force.

47. The method according to any one of claims 1 to 46, wherein the die or mold has a hole on its surface, the hole is at the end of a flow path, and the diameter of the flow path is greater than 0.08 mm and less than 1.4 mm.

48. The number of holes on the surface of the die or mold is in cm. 2 The method according to claim 47, wherein there are more than 0.5 holes per unit.

49. The method according to any one of claims 16 to 48, wherein the surface tension of the liquid vaporizing on the surface of the die or mold is greater than 22 mN / m and less than 75 mN / m.

50. The method according to any one of claims 16 to 49, wherein the dispersed liquid is projected onto at least a portion of the surface of the die or mold.

51. The method according to any one of claims 16 to 50, wherein the projection of the dispersion is carried out using a nozzle including a curtain nozzle, a diffusion nozzle, a uniform distribution nozzle, etc., or using an aerosol, or by spraying, or using a pulverizer, or a system using an accelerating liquid, or a system using a pressurized liquid, or a system using a pressurized liquid flowing through a fixed orifice.

52. The method according to any one of claims 1 to 51, wherein at least a portion of the material of the die or mold is a tool material containing primary carbides in a volume fraction of 0.1% or more and 89% or less.

53. At least a portion of the material of the die or mold is tool material, The tool material contains primary carbides and has a mechanically polished surface. and / or containing primary carbides, and having a chemically polished surface, The method according to any one of claims 1 to 52, comprising and / or a primary carbide, wherein the surface is polished.

54. The method according to any one of claims 1 to 53, wherein at least a portion of the material of the die or mold is a tool material, the tool material comprises and is coated with a primary carbide.

55. The method according to any one of claims 1 to 54, further comprising the step of maintaining the sheet at a high temperature or reheating it before carrying out the step of rapidly cooling it.

56. The method according to any one of claims 1 to 55, wherein the sheet is maintained at a temperature above 510°C for a sufficiently long period of time, from 2 seconds to 14 minutes, before the sheet comes into contact with the water droplets.

57. The method according to any one of claims 16 to 56, wherein the sheet is reheated to raise its temperature by at least 10°C between the initial austenitizing treatment and the first contact with the water droplets.

58. A set of three or more dies or molds is used. The method according to any one of claims 1 to 57, wherein at least one set of dies or molds is present between the first set of cooling dies or molds and the last set of cooling dies or molds, and the cutting operation is performed in the set of dies or molds.

59. The region where the cutting is performed has a temperature higher than the average temperature of the sheet. The method according to claim 58, wherein the temperature at the moment of cutting is 26°C or higher, which is higher than the average temperature of the sheet.

60. The method according to any one of claims 58 to 59, wherein the average temperature of the zone in which the cutting is performed is greater than Ms-100°C when the sheet leaves the first cooling die or mold set.

61. The method according to any one of claims 1 to 60, wherein at least a portion of the surface of the die or mold is maintained at a temperature lower than the melting point of the fluid.

62. The method according to any one of claims 1 to 61, wherein at least a portion of the surface of the die or mold is maintained at a temperature greater than -196°C and less than 0°C.

63. The method according to any one of claims 1 to 62, wherein the droplets of the fluid can collapse and a continuous film is formed on at least a portion of the surface.

64. The method according to any one of claims 1 to 63, wherein a film of the freezing fluid is formed on at least a portion of the surface of the die or mold.

65. The method according to any one of claims 1 to 64, wherein the tempering of the surface of the die or mold is performed by circulating a supercooled fluid through a cooling channel.

66. The mold or the temperature of the mold is maintained at a constant temperature above the threshold temperature for a long period of time. Maintaining the aforementioned temperature constant means that the fluctuation is less than 68°C, and the aforementioned long period is between 3 seconds and 2 hours. The method according to any one of claims 1 to 65, wherein the threshold temperature is greater than 480°C and less than 880°C.

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