Sensor devices and monitoring devices

By employing stretchable wiring with higher volume resistivity than the strain sensor, the issue of wiring breakage in deforming substrates is resolved, enabling stable force measurement and improved durability in elastic strain sensor devices.

JP7888244B2Inactive Publication Date: 2026-07-13SUMITOMO BAKELITE CO LTD
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Patent Information

Application Number
JP2020213886
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2020-12-23
Publication Date
2026-07-13
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Existing elastic strain sensor devices face issues with deformation durability due to the breakage of non-stretchable metal wiring when the substrate deforms or is repeatedly deformed.

Method used

The use of stretchable wiring connected to stretchable strain sensors, where the volume resistivity of the strain sensor is higher than that of the wiring, ensuring a ratio that stabilizes electrical signal detection during deformation.

Benefits of technology

This configuration suppresses wiring breakage and enables stable measurement of external forces, enhancing deformation durability and flexibility in sensor devices.

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Patent Text Reader

Abstract

To provide a sensor device with an excellent resistance to deformation.SOLUTION: A sensor device 100 includes: an elastic substrate 120; an at least one elastic strain sensor 110 provided on the elastic substrate 120; and an elastic wire 130 on the elastic substrate, the elastic wire being electrically connected to the elastic strain sensor 110. The relation of 1<VR1 / VR2 is satisfied when the VR1 (Ω / cm) denotes the volume resistivity of the elastic strain sensor 110 when sensor is not extended at the temperature of 25°C and the VR2 (Ω / cm) denotes the volume resistivity of the elastic strain sensor 130 when sensor is not extended at the temperature of 25°C.SELECTED DRAWING: Figure 1
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Citation Information

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