Arrival determination device and arrival determination method

Abstract

To disclose an arrival determination device and an arrival determination method, capable of reducing a requirement time required for lowering a lifting part.SOLUTION: An arrival determination device comprises a lifting part, a tip end part, an energization part, a detection part, and a determination part. The lifting part is provided at a head main part so as to be capable of lifting up and down. The tip end part is held at the lifting part so as to be relatively movable in a vertical direction. The energization part energizes the tip end part downward against the lifting part. The detection part detects that the lifting part and the tip end part are relatively moved by contact of the tip end part or a component held by the tip end part with an object by lowering of the lifting part. The determination part determines an arrival of the tip end part or the component held by the tip end part at the object in the case where the contact is detected by the detection part at the timing when the lifting part is lowered down to an object position previously calculated so that the tip end part or the component held by the tip end part comes into contact with the object, and determines an unarrival of the tip end part or the component held by the tip end part at the object in the case where the contact is not detected by the detection part.SELECTED DRAWING: Figure 5

Description

Technical Field

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[0001] This specification discloses a technology related to an arrival determination device and an arrival determination method.

Background Art

[0002] The electronic component mounting device described in Patent Document 1 includes contact detection means for detecting relative movement between a suction head and a nozzle body when an electronic component contacts a substrate due to the descent of a lifting member. The electronic component mounting device described in Patent Document 1 controls the descent speed of the lifting member based on the detection signal of the contact detection means.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, when the lifting member is lowered while checking the detection signal of the contact detection means, the required time for the descent of the lifting member may increase.

[0005] In view of such circumstances, this specification discloses an arrival determination device and an arrival determination method capable of shortening the required time for the descent of a lifting part.

Means for Solving the Problems

[0006] This specification discloses a reach determination device comprising a lifting unit, a tip, a biasing unit, a detection unit, and a determination unit. The lifting unit is provided on the head body so as to be vertically movable. The tip is held so as to be vertically movable relative to the lifting unit. The biasing unit biases the tip downward relative to the lifting unit. The detection unit detects that the lifting unit and the tip have moved relative to each other when the lifting unit descends and the tip or the part held by the tip comes into contact with a target object. The determination unit determines that the tip or the part held by the tip has reached the target object if the detection unit detects the contact when the lifting unit has descended to a target position calculated in advance so that the tip or the part held by the tip comes into contact with the target object, and determines that the tip or the part held by the tip has not reached the target object if the detection unit does not detect the contact.

[0007] Furthermore, this specification discloses a method for determining arrival, which is applicable to a head comprising a lifting unit, a tip, a biasing unit, and a detection unit, and includes a determination step. The lifting unit is provided on the head body so as to be able to move up and down. The tip is held so as to be able to move relative to the lifting unit in a vertical direction. The biasing unit biases the tip downward relative to the lifting unit. The detection unit detects that the lifting unit and the tip have moved relative to each other when the lifting unit descends and the tip or the part held by the tip comes into contact with a target object. The determination step determines whether the tip or the part held by the tip has reached the target object if the detection unit detects the contact at the timing when the lifting unit has descended to a target position calculated in advance so that the tip or the part held by the tip comes into contact with the target object, and determines whether the tip or the part held by the tip has not reached the target object if the detection unit does not detect the contact.

[0008] Furthermore, this specification discloses a technical concept in which, in claim 6 of the claims initially attached to the application (hereinafter referred to as the "original claims"), "the arrival determination device described in claim 1" is changed to "the arrival determination device described in any one of claims 1 to 5". In addition, this specification discloses a technical concept in which, in claim 7 of the original claims, "the arrival determination device described in claim 1" is changed to "the arrival determination device described in any one of claims 1 to 6". Furthermore, this specification discloses a technical concept in which, in claim 8 of the original claims, "the arrival determination device described in claim 1" is changed to "the arrival determination device described in any one of claims 1 to 7". [Effects of the Invention]

[0009] According to the above-described arrival determination device, the lifting unit first descends to the target position. Then, at the moment the lifting unit has descended to the target position, the arrival determination device determines whether the tip or the part held by the tip has reached the target object, based on the detection result from the detection unit. Therefore, the arrival determination device can shorten the time required for the lifting unit to descend compared to the case where the lifting unit is lowered while checking the detection result from the detection unit. The same can be said for the arrival determination method as well as the arrival determination device. [Brief explanation of the drawing]

[0010] [Figure 1] This is a plan view showing an example configuration of a parts mounting machine. [Figure 2] This is an explanatory diagram illustrating the positional relationship between the head and the coating agent supply unit. [Figure 3] This is a front view showing an example of the head state when contact is not detected by the detection unit. [Figure 4] This is a front view showing an example of the head state when contact is detected by the detection unit. [Figure 5] This is a block diagram showing an example of a control block for a destination determination device. [Figure 6]This flowchart shows an example of control using a destination determination device. [Figure 7] This is an explanatory diagram illustrating the dipping process, in which the lower end of a pin component is dipped with a coating agent. [Figure 8] This is an explanatory diagram illustrating the transfer process of transferring the coating agent, which has been dipped into the lower end of the pin component, to the substrate. [Figure 9] This is a front view showing an example of substrate warping. [Figure 10] This is an explanatory diagram illustrating the holding process for securing a component at the tip. [Figure 11] This is an explanatory diagram illustrating the process of attaching a component held by the tip to a circuit board. [Modes for carrying out the invention]

[0011] 1. Embodiment 1-1. Example configuration of component mounting machine 10 The component mounting machine 10 mounts multiple components 80 onto the substrate 90. As shown in Figure 1, the component mounting machine 10 of this embodiment includes a substrate transport device 11, a component supply device 12, a component transfer device 13, a component camera 14, a substrate camera 15, and a control device 16.

[0012] The substrate transport device 11 is composed of, for example, a belt conveyor and transports the substrate 90 in the transport direction (X-axis direction). The substrate 90 is a circuit board on which various circuits such as electronic circuits, electrical circuits, and magnetic circuits are formed. The substrate transport device 11 carries the substrate 90 into the component mounting machine 10, positions the substrate 90 at a predetermined position inside the machine, and clamps it. After the component mounting machine 10 has finished mounting multiple components 80, the substrate transport device 11 unclams the substrate 90 and transports the substrate 90 out of the component mounting machine 10.

[0013] The component supply device 12 supplies a plurality of components 80 to be mounted on the substrate 90. The component supply device 12 includes a plurality of feeders 12a provided along the conveyance direction (X-axis direction) of the substrate 90. Each of the plurality of feeders 12a pitch-feeds a carrier tape in which a plurality of components 80 are stored, and supplies the components 80 so that they can be picked up at a supply position located on the front end side of the feeder 12a. Further, the component supply device 12 may include a tray feeder that supplies the plurality of components 80 in a state where they are arranged on a tray. The plurality of feeders 12a and the tray feeder are detachably (exchangeably) provided on the pallet member DP0. Further, the component supply device 12 may use a tray unit that supplies the components 80 by a relatively large tray instead of the pallet member DP0.

[0014] The component transfer device 13 includes a head drive device 13a and a moving stage 13b. The head drive device 13a is configured to be able to move the moving stage 13b in the X-axis direction and the Y-axis direction (a direction orthogonal to the X-axis direction in a horizontal plane) by a linear motion mechanism. The head 20 is detachably (exchangeably) provided on the moving stage 13b by a clamp member. For example, the head 20 picks up and holds the component 80 supplied by the component supply device 12 using at least one holding member 30, and mounts the component 80 on the substrate 90 positioned by the substrate conveyance device 11. The holding member 30 can use, for example, a suction nozzle, a chuck, or the like.

[0015] The component camera 14 and the substrate camera 15 can use known imaging devices. The component camera 14 is fixed to the base of the component mounting machine 10 so that the optical axis is upward in the vertical direction (Z-axis direction orthogonal to the X-axis direction and the Y-axis direction). The component camera 14 can image the component 80 held by the holding member 30 from below. The substrate camera 15 is provided on the moving stage 13b of the component transfer device 13 so that the optical axis is downward in the vertical direction (Z-axis direction). The substrate camera 15 can image the substrate 90 from above.

[0016] The component camera 14 and the board camera 15 perform imaging based on a control signal sent from the control device 16. The image data of the images captured by the component camera 14 and the board camera 15 is transmitted to the control device 16. The control device 16 includes a known arithmetic device and a storage device, and is configured with a control circuit. Information output from various sensors provided in the component mounter 10, image data, etc. are input to the control device 16. The control device 16 sends a control signal to each device based on a control program and predetermined mounting conditions set in advance.

[0017] For example, the control device 16 causes the board camera 15 to image the board 90 positioned by the board transfer device 11. The control device 16 performs image processing on the image captured by the board camera 15 to recognize the positioning state of the board 90. Also, the control device 16 drives and controls the head 20 to cause the holding member 30 to pick up and hold the component 80 supplied by the component supply device 12 (corresponding to the holding operation described later), and causes the component 80 held by the holding member 30 to be imaged by the component camera 14. The control device 16 performs image processing on the image captured by the component camera 14 to recognize the holding posture of the component 80.

[0018] The control device 16 drives and controls the head 20 to move the holding member 30 upward toward the planned mounting position preset by a control program or the like. Also, the control device 16 corrects the planned mounting position based on the positioning state of the board 90, the holding posture of the component 80, etc., and sets the mounting position where the component 80 is actually mounted. The planned mounting position and the mounting position include a rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate).

[0019] The control device 16 corrects the target position (X-axis coordinates and Y-axis coordinates) and rotation angle of the holding member 30 to match the mounting position. The control device 16 drives and controls the head 20 to lower the holding member 30 at the corrected target position and corrected rotation angle, thereby mounting the component 80 onto the substrate 90 (corresponding to the mounting operation described later). The control device 16 repeats the above pick-and-place cycle to perform a mounting process in which multiple components 80 are mounted onto the substrate 90.

[0020] 1-2. Dip and transfer of coating agent 40p In this embodiment, the component mounting machine 10 is equipped with a coating agent supply unit 40 on the component supply device 12, which allows the component 80 held by the holding member 30 to be dipped in the coating agent 40p before being mounted on the substrate 90. In addition, the component mounting machine 10 in this embodiment is equipped with a pin member 50 on the head 20, and by dipping the tip of the pin member 50 into the coating agent 40p, the coating agent 40p can be transferred to the substrate 90.

[0021] The coating agent supply unit 40 supplies a coating agent 40p, such as solder paste, in the form of a thin film. Specifically, as shown in Figures 1 and 2, the coating agent supply unit 40 comprises a container 41 and a storage tank 42. The container 41 contains the coating agent 40p. In this embodiment, the container 41 is formed in the shape of a bottomed cylinder. The coating agent supply unit 40 periodically rotates the container 41 to prevent localized depletion of the coating agent 40p. The coating agent supply unit 40 also detects the remaining amount of coating agent 40p while the container 41 is rotating. When the remaining amount of coating agent 40p falls below a predetermined amount, the coating agent supply unit 40 replenishes the coating agent 40p from the storage tank 42 into the container 41. The coating agent supply unit 40 can also adjust the film thickness 40h of the coating agent 40p.

[0022] The coating agent supply unit 40 is detachably (replaceable) provided on the pallet member DP0. As shown in Figure 1, the pallet member DP0 can be equipped with multiple feeders 12a and the coating agent supply unit 40 simultaneously. The pallet member DP0 can also be equipped with a tray feeder and the coating agent supply unit 40 simultaneously. Furthermore, the coating agent supply unit 40 can be equipped on a tray unit used instead of the pallet member DP0. Thus, in this embodiment, the coating agent supply unit 40, which includes a container 41, is provided interchangeably with the parts supply device 12 that supplies the parts 80. Therefore, it is easier to miniaturize the parts mounting machine 10 compared to the case where a separate space is provided for the coating agent supply unit 40. In addition, maintenance of the coating agent supply unit 40 is easy.

[0023] As shown in Figure 2, the head 20 is provided with at least one holding member 30 that is detachably (replaceable) with at least one pin member 50. The pin member 50 only needs to be able to hold the coating agent 40p and transfer it to the substrate 90, and can take various forms. The pin member 50 provided on the head 20 is moved horizontally (in the X-axis and Y-axis directions) and raised and lowered vertically (in the Z-axis direction) by the head 20, similar to the holding member 30. As previously described, the substrate 90 is positioned by the substrate transport device 11. The pin member 50 provided on the head 20 is moved horizontally (in the X-axis and Y-axis directions) and raised and lowered vertically (in the Z-axis direction) between the housing 41 and the positioned substrate 90.

[0024] The control device 16 drives and controls the head 20 to dip the pin member 50 provided on the head 20 into the coating agent 40p contained in the container 41 (corresponding to the dipping operation described later). Specifically, the control device 16 drives and controls the head 20 to move the pin member 50 above the container 41, then lowers the pin member 50 to dip the lower end of the pin member 50 into the coating agent 40p. Next, the control device 16 drives and controls the head 20 to move the pin member 50 to a predetermined location on the substrate 90 (for example, the mounting location of the component 80).

[0025] The control device 16 then drives and controls the head 20 to transfer the coating agent 40p dipped on the lower end of the pin member 50 to a predetermined location on the substrate 90 (corresponding to the transfer operation described later). By repeating the above-described drive control of the head 20, the control device 16 can apply the coating agent 40p to multiple predetermined locations on the substrate 90 (for example, multiple mounting locations of the component 80). The dipping and transfer operations may be performed in the same component mounting machine 10 that performs the component holding and mounting operations for the component 80, as in the embodiment, or in a different component mounting machine 10 from the component holding and mounting operations for the component 80.

[0026] 1-3. Example configuration of head 20 The head 20 only needs to be able to move at least one of the holding member 30 and the pin member 50 horizontally (in the X-axis and Y-axis directions) and vertically (in the Z-axis direction), and can take various forms. The head 20 of this embodiment includes a head body 21, a lifting / lowering part 22, a tip part 23, a biasing part 24, and a detection part 25. As shown in Figure 1, the head body 21 is mounted on a movable table 13b, and the head 20 can move horizontally (in the X-axis and Y-axis directions).

[0027] The lifting section 22 is provided on the head body 21 so as to be able to move up and down. The lifting section 22 only needs to be able to move up and down relative to the head body 21 and can take various forms. For example, the lifting section 22 can be provided on the head body 21 so as to be able to move up and down by a known lifting mechanism such as a ball screw mechanism. The ball screw mechanism is driven by, for example, a servo motor to move the lifting section 22 up and down in the vertical direction (Z-axis direction). The tip section 23 is held so as to be able to move relative to the lifting section 22 in the vertical direction (Z-axis direction). In addition, the biasing section 24 biases the tip section 23 downward relative to the lifting section 22.

[0028] The tip portion 23 can be any part that is held as described above, and can take various forms. The biasing portion 24 can be any part that biases the tip portion 23 downward relative to the lifting portion 22, and can take various forms. As shown in Figures 2 to 4, for example, the tip portion 23 includes the lower end of the pin member 50. The tip portion 23 also includes the lower end of the holding member 30. As shown in Figures 3 and 4, for example, the pin member 50 is biased downward in the vertical direction (Z-axis direction) by the biasing portion 24, which is an elastic member (for example, a spring member).

[0029] The pin member 50 moves vertically (in the Z-axis direction) in conjunction with the movement of the lifting unit 22 until its lower end contacts the target object 70. As the lifting unit 22 descends, the lower end of the pin member 50 contacts the target object 70, and as the lifting unit 22 descends further, the pin member 50 moves relative to the lifting unit 22 against the elastic force of the elastic member. Figure 3 shows the state of the pin member 50 before it moves relative to the lifting unit 22, and Figure 4 shows the state of the pin member 50 after it has moved relative to the lifting unit 22.

[0030] The head 20 shown in Figures 3 and 4 is equipped with a plurality of pin members 50. Specifically, the head 20 is equipped with a tip unit 23u. A pin member module 23m, which is equipped with a plurality of pin members 50, is detachably provided on the tip unit 23u. The tip unit 23u moves up and down in the same way as the pin members 50 described above, and moves relative to the lifting unit 22 in the same way as the pin members 50 described above. The tip unit 23u of this embodiment is equipped with a module fixing part 23a and a light-shielding part 23b.

[0031] The module fixing part 23a detachably fixes the pin member module 23m. The module fixing part 23a can fix the pin member module 23m from the side, for example, by screwing it in. The light shielding part 23b shields the detection light of the detection part 25 when the pin member 50 moves relative to the lifting part 22. The same applies to the relative movement of the holding member 30 as described above regarding the relative movement of the pin member 50. Furthermore, the same applies to the relative movement of the part 80 held by the tip part 23 (the lower end of the holding member 30) as described above regarding the relative movement of the pin member 50.

[0032] The detection unit 25 detects that the lifting unit 22 and the tip 23 have moved relative to each other when the tip 23 or the part 80 held by the tip 23 comes into contact with the target object 70 due to the lowering of the lifting unit 22. The detection unit 25 only needs to be able to detect the above relative movement and can take various forms. For example, the detection unit 25 can use an optical sensor 25s that transmits or blocks detection light depending on whether or not there is relative movement of the tip 23 with respect to the lifting unit 22.

[0033] As shown in Figures 3 and 4, the optical sensor 25s comprises a light emitter 25a and a light receiver 25b. The light emitter 25a has a light emitter 25a1, and the light receiver 25b has a light receiving port 25b1. As shown in Figure 3, when the tip 23 is not moving relative to the lifting unit 22, the detection light emitted from the light emitter 25a1 (indicated by the solid arrow in the figure) is blocked by the light shielding unit 23b. In this case, as indicated by the dashed arrow in the figure, the detection light does not reach the light receiving port 25b1, so the detection unit 25 detects that the tip 23 or the part 80 held by the tip 23 is not in contact with the target object 70, and that the lifting unit 22 and the tip 23 are not moving relative to each other.

[0034] As shown in Figure 4, when the tip 23 moves relative to the lifting section 22, the detection light emitted from the light-emitting port 25a1 (indicated by the solid arrow in the figure) passes through the tip unit 23u without being blocked by the light-shielding section 23b and reaches the light-receiving port 25b1. In this case, the detection unit 25 detects that the tip 23 or the component 80 held by the tip 23 has come into contact with the target object 70, and that the lifting section 22 and the tip 23 have moved relative to each other. The optical sensor 25s can be applied to any of the following configurations of the arrival determination device 60. In addition to the above-described transmissive optical sensor 25s, the detection unit 25 can use various known detectors such as reflective optical sensors.

[0035] 1-4. Example of the configuration of the arrival determination device 60 Let's consider a scenario where the lifting unit 22 is lowered while checking the detection signal from the detection unit 25. In this case, the control device 16 may, for example, lower the lifting unit 22 to a predetermined height position at a first speed, and then lower the lifting unit 22 from the predetermined height position at a second speed that is slower than the first speed. In this case, the time required for the lifting unit 22 to lower may increase. Therefore, in this embodiment, a arrival determination device 60 is provided.

[0036] According to the arrival determination device 60, the lifting unit 22 first descends to the target position 71. Then, at the moment the lifting unit 22 has descended to the target position 71, the arrival determination device 60 determines whether the tip 23 or the part 80 held by the tip 23 has reached or not reached the target object 70, according to the detection result from the detection unit 25. Therefore, the arrival determination device 60 can shorten the time required for the lifting unit 22 to descend compared to the case where the lifting unit 22 is lowered while checking the detection result from the detection unit 25.

[0037] Specifically, the arrival determination device 60 comprises a lifting unit 22, a tip unit 23, a biasing unit 24, a detection unit 25, and a determination unit 61. The arrival determination device 60 may also include a control unit 62. As previously described, the lifting unit 22, tip unit 23, biasing unit 24, and detection unit 25 can be provided on the head 20. The determination unit 61 and control unit 62 can be provided on various control devices.

[0038] For example, at least one of the determination unit 61 and the control unit 62 can be provided in the control device 16 of the component mounting machine 10. At least one of the determination unit 61 and the control unit 62 can also be provided in a higher-level control device, management device, etc. of the component mounting machine 10. At least one of the determination unit 61 and the control unit 62 can also be formed on the cloud. As shown in Figure 5, the arrival determination device 60 of the embodiment includes both the determination unit 61 and the control unit 62. Furthermore, the determination unit 61 and the control unit 62 are provided in the control device 16 of the component mounting machine 10.

[0039] Furthermore, the arrival determination device 60 of the embodiment performs control according to the flowchart shown in Figure 6. The determination unit 61 performs the determination and processing shown in steps S12 to S14. The control unit 62 performs the processing shown in step S15. The control device 16 performs the processing shown in step S11.

[0040] 1-4-1. Judgment section 61 The control device 16 drives and controls the head 20 to lower the lifting unit 22 to the target position 71 (step S11 shown in Figure 6). Then, at the moment the lifting unit 22 has lowered to the target position 71, the determination unit 61 determines whether the tip 23 or the part 80 held by the tip 23 has reached the target object 70 or not, according to the detection result by the detection unit 25 (steps S12 to S14 shown in Figure 6).

[0041] Specifically, the determination unit 61 determines that the tip 23 or the part 80 held by the tip 23 has reached the target object 70 if the detection unit 25 detects contact when the lifting unit 22 has descended to a pre-calculated target position 71 such that the tip 23 or the part 80 held by the tip 23 contacts the target object 70. Furthermore, the determination unit 61 determines that the tip 23 or the part 80 held by the tip 23 has not reached the target object 70 if the detection unit 25 does not detect contact when the lifting unit 22 has descended to a pre-calculated target position 71 such that the tip 23 or the part 80 held by the tip 23 contacts the target object 70.

[0042] For example, consider a case where the tip portion 23 is the lower end of the pin member 50, and the target object 70 is a coating agent supply unit 40 that supplies a coating agent 40p in the form of a thin film. In this case, the head 20, which includes a lifting portion 22, a tip portion 23, a biasing portion 24, and a detection portion 25, can perform a dipping operation in which it dips the lower end of the pin member 50 with the coating agent 40p.

[0043] As shown in Figure 7, the distance from the lower end of the pin member 50 to the bottom surface of the container 41 is defined as distance L11. As previously described, as the lifting unit 22 descends, the lower end of the pin member 50 comes into contact with the target object 70 (in this case, the coating agent supply unit 40, and more specifically, the bottom surface of the container 41). As the lifting unit 22 descends further, the pin member 50 moves relative to the lifting unit 22 against the elastic force of the elastic member. The distance that the tip portion 23 moves relative to the lifting unit 22 in this way is defined as distance L20 (the same applies hereafter). In this case, the target position 71 is at a position (height) obtained by adding distance L20 to distance L11. The lifting unit 22 is also provided with a known position detector such as an encoder, and the control device 16 can recognize the position (height) of the lifting unit 22.

[0044] The determination unit 61 determines that the tip 23 has reached the target object 70 if the detection unit 25 detects contact between the tip 23 (lower end of pin member 50) and the target object 70 (coating agent supply unit 40) at the time the lifting unit 22 has descended to the target position 71. The determination unit 61 also determines that the tip 23 has not reached the target object 70 if the detection unit 25 does not detect the contact at the time the lifting unit 22 has descended to the target position 71.

[0045] Next, let's consider the case where the tip portion 23 is the lower end of the pin member 50, and the target object 70 is the substrate 90 to which the coating agent 40p is transferred. In this case, the head 20, which is equipped with a lifting unit 22, a tip portion 23, a biasing unit 24, and a detection unit 25, can perform a transfer operation to transfer the coating agent 40p dipped on the lower end of the pin member 50 to the substrate 90. As shown in Figure 8, the distance from the lower end of the pin member 50 to the substrate 90 is denoted as distance L12. The distance the tip portion 23 moves relative to is distance L20, so in this case, the target position 71 will be the position (height) obtained by adding distance L20 to distance L12.

[0046] The determination unit 61 determines that the tip 23 has reached the target object 70 if the detection unit 25 detects contact between the tip 23 (lower end of the pin member 50) and the target object 70 (substrate 90) at the time the lifting unit 22 has descended to the target position 71. The determination unit 61 also determines that the tip 23 has not reached the target object 70 if the detection unit 25 does not detect the contact at the time the lifting unit 22 has descended to the target position 71.

[0047] The head 20, which includes a lifting unit 22, a tip 23, a biasing unit 24, and a detection unit 25, can perform both dipping and transfer operations. In this case, the determination unit 61 can similarly determine whether the tip 23 (lower end of the pin member 50) has reached the target object 70 (coating supply unit 40) or not, and can also determine whether the tip 23 (lower end of the pin member 50) has reached the target object 70 (substrate 90) or not. Thus, the head 20, which includes a lifting unit 22, a tip 23, a biasing unit 24, and a detection unit 25, can perform at least one of the dipping and transfer operations.

[0048] Furthermore, as shown in Figure 9, the substrate 90 may warp. In the same figure, the substrate 90 is warped so that it protrudes downward in the vertical direction (Z-axis direction). In this case, the determination unit 61 may continue to determine that the tip portion 23 (lower end of the pin member 50) has not reached the target object 70 (substrate 90) as the warp of the substrate 90 increases.

[0049] Therefore, the arrival determination device 60 is preferably equipped with a known distance measuring sensor 60s capable of detecting the warping state of the substrate 90. As shown in Figure 9, the distance measuring sensor 60s can, for example, irradiate a laser beam from above the substrate 90 to multiple positions on the upper surface of the substrate 90, measure the relative distance to each position, and detect the warping state of the substrate 90 based on the measurement results. In the same figure, the dashed lines of the distance measuring sensor 60s show how the solid lines of the distance measuring sensor 60s move horizontally above the substrate 90 and sequentially measure the relative distance to the substrate 90. It should be noted that at least one distance measuring sensor 60s can also measure the relative distance to the substrate 90 at multiple positions on the upper surface of the substrate 90 without moving horizontally during measurement. The above description of the distance measuring sensor 60s also applies to the distance measuring sensor 60s shown in Figure 11.

[0050] The arrival determination device 60 increases or decreases the distance L12, which is the distance from the lower end of the pin member 50 to the substrate 90, according to the detection result of the distance measuring sensor 60s. Specifically, as shown in the figure, if the substrate 90 is warped so as to protrude downward in the vertical direction (Z-axis direction), the arrival determination device 60 sets the distance L12 to the design value distance L12 plus the amount of warping of the substrate 90. Also, if the substrate 90 is warped so as to protrude upward in the vertical direction (Z-axis direction), the arrival determination device 60 sets the distance L12 to the design value distance L12 minus the amount of warping of the substrate 90.

[0051] If the arrival determination device 60 does not have a distance measuring sensor 60s, for example, an operator can pre-measure the amount of warping of the substrate 90 and input the amount of warping of the substrate 90 into the arrival determination device 60. In this case, the arrival determination device 60 can increase or decrease the distance L12 according to the amount of warping of the substrate 90 input by the operator.

[0052] Next, let's consider the case where the tip portion 23 is the lower end of the holding member 30, and the target object 70 is a part 80 to be held by the tip portion 23. In this case, the head 20, which includes the lifting unit 22, the tip portion 23, the biasing unit 24, and the detection unit 25, can perform the holding operation of having the tip portion 23 hold the part 80. As shown in Figure 10, the distance from the lower end of the holding member 30 to the part 80 is denoted as distance L13. The distance the tip portion 23 moves relative to is distance L20, so in this case, the target position 71 will be the position (height) obtained by adding distance L20 to distance L13.

[0053] The determination unit 61 determines that the tip 23 has reached the target object 70 if the detection unit 25 detects contact between the tip 23 (lower end of the holding member 30) and the target object 70 (part 80) at the time the lifting unit 22 has descended to the target position 71. The determination unit 61 also determines that the tip 23 has not reached the target object 70 if the detection unit 25 does not detect the contact at the time the lifting unit 22 has descended to the target position 71.

[0054] Next, let's consider the case where the tip 23 (the lower end of the holding member 30) holds the part 80, and the target object 70 is the substrate 90 (more specifically, the substrate 90 on which the part 80 held by the tip 23 is mounted). In this case, the head 20, which includes the lifting unit 22, the tip 23, the biasing unit 24, and the detection unit 25, can perform the mounting operation of mounting the part 80 held by the tip 23 onto the substrate 90. As shown in Figure 11, the distance from the lower end of the part 80 held by the tip 23 (the lower end of the holding member 30) to the substrate 90 is denoted as distance L14. The distance the tip 23 moves relative to is distance L20, so in this case, the target position 71 will be the position (height) obtained by adding distance L20 to distance L14.

[0055] The determination unit 61 determines that the part 80 held by the tip 23 has reached the target object 70 if the detection unit 25 detects contact between the part 80 held by the tip 23 (lower end of the holding member 30) and the target object 70 (substrate 90) at the time the lifting unit 22 has descended to the target position 71. The determination unit 61 also determines that the part 80 held by the tip 23 has not reached the target object 70 if the detection unit 25 does not detect the contact at the time the lifting unit 22 has descended to the target position 71.

[0056] Furthermore, the same applies to the case where the head 20 performs the mounting operation, as previously described regarding the warping of the substrate 90. In other words, the arrival determination device 60 can be equipped with a known distance measuring sensor 60s capable of detecting the state of warping of the substrate 90. In this case, the arrival determination device 60 can increase or decrease the distance L14, which is the distance from the lower end of the component 80 held by the tip portion 23 (lower end of the holding member 30) to the substrate 90, according to the detection result of the distance measuring sensor 60s. Alternatively, if the arrival determination device 60 is not equipped with a distance measuring sensor 60s, for example, an operator can pre-measure the amount of warping of the substrate 90 and input the amount of warping of the substrate 90 into the arrival determination device 60. In this case, the arrival determination device 60 can increase or decrease the distance L14 according to the amount of warping of the substrate 90 input by the operator.

[0057] The head 20, which includes a lifting unit 22, a tip 23, a biasing unit 24, and a detection unit 25, can perform both holding and mounting operations. In this case, the determination unit 61 can similarly determine whether the tip 23 (lower end of the holding member 30) has reached the target object 70 (part 80) or not, and can determine whether the part 80 held by the tip 23 (lower end of the holding member 30) has reached the target object 70 (substrate 90) or not. Thus, the head 20, which includes a lifting unit 22, a tip 23, a biasing unit 24, and a detection unit 25, can perform at least one of the holding and mounting operations. Furthermore, the head 20, which includes a lifting unit 22, a tip 23, a biasing unit 24, and a detection unit 25, can also perform at least one of the dipping, transfer, holding, and mounting operations.

[0058] The determination unit 61 can determine whether the tip 23 or the part 80 held by the tip 23 has reached or not reached the target object 70 during any operation of the head 20. However, for example, the detection unit 25 requires a predetermined amount of time to detect whether or not the tip 23 has moved relative to the lifting unit 22, resulting in a slight delay in the cycle time. Therefore, the determination unit 61 can also make the above determination during operations of the head 20 where the quality of the substrate product is important (the operations are not limited to this, but for example, transfer operations). The matters described above regarding the operations performed by the determination unit 61 and the head 20 can also be appropriately applied to the control unit 62 shown below.

[0059] 1-4-2. Control Unit 62 If the determination unit 61 determines that the tip 23 or the part 80 held by the tip 23 has reached its destination, the parts mounting machine 10 can continue production using the head 20. On the other hand, if the determination unit 61 determines that the tip 23 or the part 80 held by the tip 23 has not reached its destination, it is undesirable for the parts mounting machine 10 to continue production using the head 20 without addressing the malfunction.

[0060] Therefore, if the determination unit 61 determines that the tip 23 or the part 80 held by the tip 23 has not reached the target, the control unit 62 stops production using the head 20, which is equipped with the lifting unit 22, the tip 23, the biasing unit 24, and the detection unit 25 (step S15 shown in Figure 6). In this case, the control unit 62 can inform the operator, for example, that production using the head 20 has been stopped due to the above-mentioned failure to reach the target. For example, the control unit 62 provides the above information to the display device provided on the part mounting machine 10. This allows the operator to confirm the status of the malfunction and take action to address the malfunction.

[0061] For example, if the determination unit 61 determines that the tip portion 23 or the component 80 held by the tip portion 23 has not reached the target due to warping of the substrate 90 as shown in Figure 9 (when the substrate 90 is warped so that it protrudes downward in the vertical direction (Z-axis direction)), the operator can provide support members to support the substrate 90 on the component mounting machine 10. Also, if the determination unit 61 determines that the tip portion 23 or the component 80 held by the tip portion 23 has not reached the target due to the above-mentioned warping of the substrate 90, the operator can increase the number of support members supporting the substrate 90 or change the arrangement of the support members.

[0062] The control unit 62 can also lower the lifting unit 22 further relative to the target position 71 if the determination unit 61 determines that the tip 23 or the part 80 held by the tip 23 has not reached the target position (step S15 shown in Figure 6). This makes it possible to improve the malfunction without stopping production using the head 20. Specifically, the control unit 62 can lower the lifting unit 22 further relative to the target position 71 by a predetermined amount or until the determination unit 61 determines that the tip 23 or the part 80 held by the tip 23 has reached the target position 71.

[0063] The specified amounts described above can be obtained in advance, for example, through simulation or verification using an actual machine. The specified amounts described above can also be increased or decreased depending on the type of substrate 90 (how easily the substrate 90 bends). Furthermore, the control to further lower the lifting unit 22 relative to the target position 71 can be applied when the head 20 is performing any of the following operations: dipping, transfer, holding, or mounting. If the malfunction is caused by the warping of the substrate 90 as previously described (when the substrate 90 is warped so that it protrudes downward in the vertical direction (Z-axis direction)), the control to further lower the lifting unit 22 relative to the target position 71 should be applied when the head 20 is performing at least one of the operations: transfer or mounting.

[0064] Furthermore, if the substrate 90 is curved so as to protrude upward in the vertical direction (Z-axis direction), the load applied to the component 80 may increase when the head 20 performs the mounting operation. Therefore, the control unit 62 can also lower the lifting unit 22 further relative to the target position 71 for certain components that allow for an expected increase in load when the lifting unit 22 is lowered further relative to the target position 71. In this case, the target object 70 is the substrate 90 on which the component 80 is mounted, and more specifically, the substrate 90 on which the component 80 held by the tip portion 23 (lower end of the holding member 30) is mounted.

[0065] For example, an operator can obtain the amount of load increase applied to component 80 in advance through simulations, verification using actual equipment, etc., and select component 80 for which the load increase is acceptable as one of the specified components. For example, BGA (Ball Grid Array) components tend to have higher load capacities than wafer components and are therefore more likely to be included as specified components. Also, the larger the external dimensions of component 80, the higher the load capacities tend to be, and therefore more likely to be included as specified components.

[0066] 2.Achievement determination method The same can be said for the arrival determination method as for the arrival determination device 60. Specifically, the arrival determination method is applied to a head 20 which includes a lifting unit 22, a tip unit 23, a biasing unit 24, and a detection unit 25, and includes a determination step. The determination step corresponds to the control performed by the determination unit 61. The arrival determination method may also include a control step. The control step corresponds to the control performed by the control unit 62.

[0067] 3. An example of the effects of the embodiment According to the arrival determination device 60, first the lifting unit 22 descends to the target position 71. Then, at the moment the lifting unit 22 has descended to the target position 71, the arrival determination device 60 determines whether the tip 23 or the part 80 held by the tip 23 has reached or not reached the target object 70, according to the detection result from the detection unit 25. Therefore, the arrival determination device 60 can shorten the time required for the lifting unit 22 to descend compared to the case where the lifting unit 22 is descended while checking the detection result from the detection unit 25. The same applies to the arrival determination method as described above for the arrival determination device 60. [Explanation of symbols]

[0068] 20: Head, 21: Head body, 22: Lifting mechanism, 23: Tip, 24: Biasing mechanism 25: Detection unit, 25s: Optical sensor, 40: Coating agent supply unit, 40p: Coating agent, 50: Pin member, 60: Arrival determination device, 61: Determination unit, 62: Control unit, 70: Target object, 71: Target position, 80: Component, 90: Circuit board.

Claims

1. A lifting mechanism is provided on the head body so as to be able to move up and down, A tip portion is held so as to be able to move relative to the lifting portion in the vertical direction, A biasing unit that biases the tip portion downward relative to the lifting unit, A detection unit detects that the lifting unit and the tip have moved relative to each other when the tip or a part held by the tip comes into contact with a target object due to the lowering of the lifting unit. A determination unit determines whether the tip or the part held by the tip has reached the target object if the detection unit detects contact when the lifting unit has descended from a height at which the tip or the part held by the tip moves horizontally by the part transfer device to a target position calculated in advance so as to contact the target object, and determines whether the tip or the part held by the tip has reached the target object if the detection unit does not detect contact, A device for determining arrival, equipped with the following features.

2. The arrival determination device according to claim 1, further comprising a control unit that stops production using the head comprising the lifting unit, the tip, the biasing unit, and the detection unit when the determination unit determines that the tip or the part held by the tip has not yet reached the destination.

3. The arrival determination device according to claim 1, further comprising a control unit that lowers the lifting unit relative to the target position when the determination unit determines that the tip or the part held by the tip has not yet reached the target position.

4. The reach determination device according to claim 3, wherein the control unit further lowers the lifting unit relative to the target position until the reach of the tip or the part held by the tip is determined by a predetermined amount or by the determination unit.

5. The aforementioned target object is a substrate on which the aforementioned component is mounted. The reach determination device according to claim 3 or 4, wherein the control unit further lowers the lifting unit relative to the target position with respect to a predetermined component that allows for an expected increase in load when the lifting unit further lowers relative to the target position.

6. The arrival determination device according to claim 1, wherein the detection unit is an optical sensor that transmits or blocks detection light depending on whether or not there is relative movement of the tip with respect to the lifting unit.

7. The aforementioned tip is the lower end of the pin member, The target object is a coating agent supply unit that supplies a coating agent in the form of a thin film, or a substrate onto which the coating agent is transferred. The reach determination device according to claim 1, wherein the head comprising the lifting unit, the tip unit, the biasing unit, and the detection unit performs at least one of the following operations: a dipping operation in which the lower end of the pin member is dipped with the coating agent, and a transfer operation in which the coating agent dipped in the lower end of the pin member is transferred to the substrate.

8. The target object is the component to be held at the tip or the substrate on which the component held by the tip is mounted. The reach determination device according to claim 1, wherein the head comprising the lifting unit, the tip unit, the biasing unit, and the detection unit performs at least one of the following operations: a holding operation in which the tip unit holds the component, and a mounting operation in which the component held by the tip unit is mounted on the substrate.

9. A lifting mechanism is provided on the head body so as to be able to move up and down, A tip portion is held so as to be able to move relative to the lifting portion in the vertical direction, A biasing unit that biases the tip portion downward relative to the lifting unit, A detection unit detects that the lifting unit and the tip have moved relative to each other when the tip or a part held by the tip comes into contact with a target object due to the lowering of the lifting unit. Applicable to a head equipped with, A method for determining whether a tip or the part held by the tip has reached the target object if the detection unit detects contact when the lifting unit has descended from a height at which the tip or the part held by the tip moves horizontally by a part transfer device to a target position calculated in advance so as to contact the target object, and if the detection unit does not detect contact, a determination step is made to determine whether the tip or the part held by the tip has not reached the target object.

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