Gel plating system and gel plating method

The gel plating system addresses gel peeling and void issues by using a controlled current pulse system to form a sound plating layer without defects.

JP7888446B2Active Publication Date: 2026-07-13HITACHI LTD
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Patent Information

Application Number
JP2022201445
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-12-16
Publication Date
2026-07-13
Estimated Expiration
2042-12-16

AI Technical Summary

Technical Problem

Conventional gel plating techniques face issues such as peeling of the gel from the object to be plated and voids forming between the object and the gel, leading to incomplete or defective plating layers.

Method used

A gel plating system that includes a cathode terminal, an anode, a constant current pulse application device, and a control device with a database to manage conditions, preventing hydrogen gas generation by adjusting current pulses based on material data to form a sound plating layer.

Benefits of technology

The system effectively forms a sound plating layer without defects by controlling current pulses to prevent hydrogen generation, ensuring uniform and efficient plating.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a gel plating system and a gel plating method capable of forming a healthy plating layer.SOLUTION: A gel plating system 1 according to the present invention includes: a cathode terminal 3 to be brought into contact with a plating object 10; an anode 2 to be brought into contact with a surface of the plating object 10 and to be brought into contact with a gel plating composition 11 containing a metal or metal ions to form a plating layer 12 on the surface of the plating object 10; a constant current pulse-applying device 4 for applying a constant pulse current between the anode 2 and the cathode terminal 3; and a control apparatus 5 equipped with a database DB in which gel plating data concerning the gel plating composition 11 are stored, the control apparatus setting the conditions of the pulse current so that hydrogen gas is not generated based on the gel plating data and controlling the constant current pulse-applying device 4 according to the conditions.SELECTED DRAWING: Figure 1
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Citation Information

Patent Citations

  • Manufacture of amorphous plating alloy

    JP1989031991A

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  • Copper-zinc alloy electroplating method, steel wire using the same, steel wire-rubber bonded composite and tire

    JP2009215590A

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    JP2011026692A

  • Gel plating method

    JP2018145502A