Powder and method for producing the same, and method for producing a resin composition

Hollow particles with controlled porosity and fine particle content address the need for lower dielectric constant and loss tangent in semiconductor insulating materials, enhancing transmission speeds and resin product quality.

JP7888532B2Active Publication Date: 2026-07-13JGC CATALYSTS & CHEMICALS LTD
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Patent Information

Application Number
JP2023511499
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-03-31
Filing Date
2022-03-30
Publication Date
2026-07-13
Estimated Expiration
2042-03-30

AI Technical Summary

Technical Problem

Existing filler materials for insulating materials in semiconductor devices fail to meet the increasing demands for lower dielectric constant and dielectric loss tangent due to the rapid advancement in data capacity and processing speed.

Method used

The use of hollow particles with specific size and porosity characteristics, combined with controlled amounts of fine particles and suspended particles, to reduce dielectric constant and dielectric loss tangent in insulating materials.

Benefits of technology

The solution achieves a significant reduction in dielectric constant and dielectric loss tangent, improving transmission speeds and reducing transmission losses in semiconductors while enhancing the filterability, injectability, and surface smoothness of resin products.

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Abstract

The present invention relates to a powder including hollow particles, each having a cavity inside a non-porous outer shell. The powder has an average particle size (D50) of 2.0-10.0 μm, and contains microparticles of a particle size under 2.0 μm in the amount of 20 vol% or less. When the powder is suspended in water, the proportions of floating particles, suspended particles, and settled particles are 7.0-25.0 mass%, 0-4.0 mass%, and 71.0-93.0 mass%, respectively.
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Citation Information

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