Transparent display device

Abstract

To provide a transparent display device that can be manufactured in various types (or various sizes).SOLUTION: A transparent display device according to one exemplary embodiment comprises: a substrate having a display area with a plurality of pixels having a transmissive portion and a plurality of sub-pixels, and a non-display area adjacent to the display area; and a plurality of dam areas extending from the non-display area to the display area on the substrate to form a closed loop.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] This specification relates to a transparent display device.

Background Art

[0002] As the information society develops, the requirements for display devices for displaying images are increasing in various forms. Thus, recently, various display devices such as liquid crystal display (LCD), plasma display panel (PDP), organic light emitting display (OLED), and quantum dot light emitting display (QLED) have been utilized.

[0003] In recent years, research on transparent display devices that allow users to see objects or backgrounds located on the opposite side through the display device has been actively conducted.

[0004] Such transparent display devices have high potential for utilization in various fields in that images and backgrounds can be viewed together. However, since the fields and applications to which they are applied are diverse, they must be manufactured in multiple varieties (or various sizes). However, when manufacturing transparent display devices in multiple varieties (or various sizes), there is a problem that the manufacturing cost and production energy increase due to an increase in the number of processes.

Summary of the Invention

Problems to be Solved by the Invention

[0005] This specification aims to provide a technical solution to provide a transparent display device that can be manufactured in multiple varieties (or various sizes).

[0006] Also, this specification aims to provide a technical solution to provide a transparent display device that can reduce production energy or manufacturing cost.

[0007] Furthermore, this specification aims to provide a transparent display device that can reduce or prevent moisture permeability even when manufactured in a wide variety of types (or sizes). [Means for solving the problem]

[0008] A transparent display device according to one embodiment of this specification includes a substrate provided with a display area having a plurality of pixels, each having a transparent portion and a plurality of subpixels, and a non-display area adjacent to the display area, and a plurality of dam areas on the substrate that extend from the non-display area to the display area and form a closed loop. [Effects of the Invention]

[0009] This specification allows for the manufacture of a wide variety (or wide range of sizes) of display panels by providing multiple dam areas so that the display panels can be cut to various sizes.

[0010] Furthermore, since this specification allows for the manufacture of multiple varieties (or various sizes) without additional masking processes, it is possible to reduce production energy compared to transparent display devices that are produced in multiple varieties through various production processes.

[0011] Furthermore, this specification allows for the reduction or prevention of moisture permeability even when manufacturing in a wide variety of types (or sizes) by configuring the product so that the moisture permeability pathway in the cut portion is severed.

[0012] The effects described herein are not limited to those mentioned above, and other effects not mentioned herein can be clearly understood by a person with ordinary skill in the art to which this specification pertains from the following description. [Brief explanation of the drawing]

[0013] [Figure 1] This is a schematic plan view of a transparent display device according to one embodiment of this specification. [Figure 2] This is a plan view showing an enlarged view of section A shown in Figure 1. [Figure 3]It is a schematic cross-sectional view of line I-I' shown in FIG. 2. [Figure 4] It is a schematic cross-sectional view showing another example of part C shown in FIG. 3. [Figure 5] It is a schematic cross-sectional view showing yet another example of part C shown in FIG. 3. [Figure 6] It is a schematic cross-sectional view of line II-II' shown in FIG. 2. [Figure 7] FIG. 7 is a schematic plan view showing another example of FIG. 2. [Figure 8] It is a schematic plan view showing yet another example of FIG. 2. [Figure 9] It is a schematic cross-sectional view of line III-III' shown in FIG. 8. [Figure 10] It is a plan view showing an enlarged view of part B shown in FIG. 1. [Figure 11] It is a schematic cross-sectional view of line IV-IV' shown in FIG. 10. [Figure 12] It is a schematic cross-sectional view of a transparent display device according to the second embodiment of the present specification. [Figure 13] It is a schematic cross-sectional view of a transparent display device according to the third embodiment of the present specification. [Figure 14] It is a schematic cross-sectional view of a transparent display device according to the fourth embodiment of the present specification. [Figure 15] It is a cross-sectional view briefly showing FIG. 14. [Figure 16] It is a schematic cross-sectional view showing a part of a transparent display device according to the fifth embodiment of the present specification. [[ID=4I]] [Figure 17] It is a schematic cross-sectional view of line V-V' shown in FIG. 16. (

Mode for Carrying Out the Invention

[0014] The advantages and features of this specification, as well as the methods for achieving them, will become clear by referring to the embodiments described in detail hereinafter together with the accompanying drawings. However, this specification is not limited to the embodiments disclosed below, but is composed of various different forms, and merely these embodiments are provided to make the disclosure of this specification complete and to fully inform those with ordinary knowledge in the technical field to which this specification belongs of the scope of the invention.

[0015] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of this specification are exemplary, and this specification is not limited to the matters shown in the drawings. Throughout the specification, the same drawing numbers refer to the same components. In addition, in the description of this specification, when it is determined that a specific description of related known technologies may unnecessarily obscure the gist of this specification, the detailed description thereof is omitted.

[0016] When terms such as "comprising", "having", "consisting of", etc. mentioned in this specification are used, other parts can be added unless "only" is used. When a component is expressed in the singular, it includes the case of including a plurality unless there are specific descriptions.

[0017] In interpreting a component, even if there is no separate explicit description regarding the error range, it is interpreted as including the error range.

[0018] In the case of an explanation of the positional relationship, for example, when the positional relationship between two parts is explained by "on", "above", "below", "beside", etc., unless the expressions "immediately" or "directly" are used, one or more other parts can also be located between the two parts.

[0019] In the case of an explanation of the time relationship, for example, when the time sequence relationship is explained by "after", "subsequent to", "next", "before", etc., unless the expressions "immediately" or "directly" are used, it can also include the case of not being continuous.

[0020] The terms "first," "second," etc., are used to describe various components, but these components are not limited by these terms. These terms are simply used to distinguish one component from another. Therefore, the first component referred to below may also be the second component within the technical concept of this specification.

[0021] The terms "X-axis direction," "Y-axis direction," and "Z-axis direction" should not be interpreted as referring only to geometric relationships where the relationship between them is perpendicular, but rather can mean that there are broader directions within the scope in which the configuration specified herein can function.

[0022] The term "at least one" should be understood to include all possible combinations of one or more related items. For example, "at least one of item 1, item 2, and item 3" could mean each of item 1, item 2, or item 3, as well as all possible combinations of items that can be presented from two or more of items 1, item 2, and item 3.

[0023] The features of each of the embodiments described herein can be combined or combined with one another, either partially or as a whole, allowing for a variety of technically diverse interdependencies and drives, and each embodiment can be implemented independently of one another or together in a related manner.

[0024] Preferred embodiments of this specification will be described in detail below with reference to the attached figures.

[0025] Figure 1 is a schematic plan view of a transparent display device according to one embodiment of this specification, Figure 2 is an enlarged plan view of portion A shown in Figure 1, and Figure 3 is a schematic cross-sectional view of the line I-I' shown in Figure 2.

[0026] In the following, the Y-axis direction represents the direction parallel to the first line (SL1) (e.g., the data line) (first direction), the X-axis direction represents the direction parallel to the second line (SL2) (e.g., the gate line) (second direction), and the Z-axis direction represents the thickness direction of the transparent display device 100 (third direction).

[0027] Referring to Figures 1 to 3, a transparent display device 100 according to one embodiment of this specification may include a substrate 110 having a display area (DA) in which a transparent area (TA) and a plurality of pixels (P) having a plurality of subpixels (SP) are arranged, and a non-display area (NDA) (or bezel area) surrounding the display area (DA), and a plurality of dam areas (DMA) configured on the substrate 110 and extending from the non-display area (NDA) (or bezel area) to the display area (DA) and forming a closed loop. In this example, each of the plurality of dam areas (DMA) may be configured as a closed loop.

[0028] Here, the statement that each of the multiple dam regions (DMAs) is composed of a closed loop means that the display region (DA) is partially surrounded by the dam regions (DMAs), as shown in Figure 1. Therefore, the display region (DA) can have a structure that is divided by multiple dam regions (DMAs) having a closed structure. For example, as shown in Figure 1, the transparent display device 100 according to one embodiment of this specification may include two dam regions (DMAs), and each dam region (DMA) may include two display regions (DAs) having different areas (or sizes) from each other. Therefore, the transparent display device 100 according to one embodiment of this specification can be divided into two transparent display devices having different areas (or sizes) from each other if the space between the two dam regions (DMAs) is cut. For example, the transparent display device 100 according to one embodiment of this specification can be divided into a first transparent display device 101 having a first area, and a second transparent display device 102 having a second area larger than the first area.

[0029] Therefore, the transparent display device 100 according to one embodiment of this specification can be manufactured in a variety of types (or sizes) by providing multiple dam regions (DMAs) so that the display panel can be cut to various sizes. However, the transparent display device 100 according to one embodiment of this specification can also be configured as a single transparent display device if it cannot be separated by a cutting device. Therefore, as shown in Figure 1, when it includes two dam regions (DMAs), the transparent display device 100 according to one embodiment of this specification can be configured as a first transparent display device 101 having a first area, a second transparent display device 102 having a second area larger than the first area, and a third transparent display device 103 having a third area smaller than the second area. The display panel may include a substrate 110 and a counter substrate 200 bonded to the substrate 110.

[0030] Therefore, the transparent display device 100 according to one embodiment of this specification can reduce production energy compared to transparent display devices produced in a wide variety (or wide range of sizes) through a wide range of production processes (or manufacturing processes).

[0031] On the other hand, even if the transparent display device 100 according to one embodiment of this specification is divided into first and second transparent display devices 101 and 102, the dam region (DMA) covers the edges of each of the first and second transparent display devices 101 and 102 with a closed-loop structure (or closed structure), thus reducing or preventing moisture permeability. Therefore, even if the transparent display device 100 according to one embodiment of this specification is cut (or divided) into multiple transparent display devices, the reliability of moisture permeability for each of the multiple transparent display devices can be improved.

[0032] The transparent display device 100 according to one embodiment of this specification will be described in more detail below with reference to Figures 1 to 3.

[0033] Referring to Figure 1, a transparent display device 100 according to one embodiment of this specification may include a display panel including a substrate 110 having a plurality of gate drive units (GDs), a source drive integrated circuit (IC) 120, a flexible film 130, and a plurality of circuit boards 140. Although not shown in the figure, the plurality of circuit boards 140 can be connected to a timing control unit via cables.

[0034] The display panel may include a substrate 110 and a counter substrate 200 (shown in Figure 3) that are bonded together.

[0035] The substrate 110 contains thin-film transistors and may be a transistor array substrate, a lower substrate, a base substrate, or a first substrate. The substrate 110 may be a transparent glass substrate or a transparent plastic substrate. For example, the substrate 110 may be a transparent glass substrate. Hereinafter, the substrate 110 will be defined as the first substrate.

[0036] The opposing substrate 200 can be bonded to the first substrate 110 facing it via a connecting member (RD, shown in Figure 3) and a filling member (RF, shown in Figure 3). For example, the opposing substrate 200 may be smaller in size than the first substrate 110 and can be bonded to the remaining portion of the first substrate 110 excluding the pad portion. The opposing substrate 200 may be an upper substrate, a second substrate, or a sealing substrate. The opposing substrate 200 can be bonded to the first surface of the first substrate 110 by a substrate bonding process mediated by an adhesive member. Hereinafter, the opposing substrate 200 will be defined as the second substrate.

[0037] A transparent display device 100 according to one embodiment of this specification may further include a connecting member (RD) and a filling member (RF).

[0038] In one embodiment, the dam region (DMA) may include a connecting member (RD). The connecting member (RD) may be placed between the first substrate 110 and the second substrate 200. This allows the first substrate 110 and the second substrate 200 to be bonded to each other facing each other via the connecting member (RD). For example, the connecting member (RD) may include a thermosetting transparent adhesive or a photocurable transparent adhesive. The connecting member (RD) may include an absorbent material (not shown) for absorbing external moisture or humidity that penetrates towards the display region (DA).

[0039] In one example, the connecting member (RD) of the dam region (DMA) can be positioned to extend from the non-display area (NDA) to the display area (DA). As shown in Figure 3, the connecting member (RD) can be positioned in the dam region (DMA) to fill the gap (GAP) between the first substrate 110 and the second substrate 200. This prevents moisture and other substances from entering the display area (DA) through the gap between the first substrate 110 and the second substrate 200.

[0040] The filler member (RF) can be positioned adjacent to the connecting member (RD). The filler member (RF) can support the first substrate 110 and the second substrate 200 by positioning it to fill the gap (GAP) between them. Therefore, the filler member (RF) can prevent the first substrate 110 and the second substrate 200 from being easily deformed by external forces.

[0041] On the other hand, the filler member (RF) or connecting member (RD) is configured to be placed between the organic light-emitting layer 116 formed on the first substrate 110 and the second substrate 200, thereby preventing external moisture or humidity penetrating through the second substrate 200 from reaching the organic light-emitting layer 116. In other words, each of the filler member (RF) and connecting member (RD) can have a barrier function to prevent moisture penetration. Each of the filler member (RF) and connecting member (RD) may further contain an absorbent substance to absorb moisture or humidity in order to enhance the moisture-preventing effect. For example, the absorbent substance may be a getter.

[0042] On the other hand, the filler member (RF) may include a thermosetting transparent adhesive or a photocuring transparent adhesive. In this case, the filler member (RF) can be used together with the connecting member (RD) to bond the first substrate 110 and the second substrate 200. Thus, the adhesive strength between the first substrate 110 and the second substrate 200 can be further improved. Since each of the multiple dam regions (DMA) partially encloses the display region (DA), the filler member (RF) can be positioned so as to be surrounded by the connecting member (RD). By being positioned partially within the display region (DA), the connecting member (RD) can be superimposed on multiple pixels (P).

[0043] An example of a connecting member (RD) can be made of an opaque material, but is not necessarily limited to that, and can also be made of a transparent material. An example of a filling member (RF) can be made of a transparent material to improve the transmittance of the emitted light, as it is placed in the display area (DA).

[0044] Referring again to Figure 1, the gate drive unit (GD) can supply gate signals to the gate line by gate control signals input from the timing control unit. When the source drive IC 120 is manufactured as a drive chip, the source drive IC 120 can be mounted on the flexible film 130 using the COF (chip on film) or COP (chip on panel) method.

[0045] Pads such as power pads and data pads can be formed in the non-display area (NDA) of the display panel. Wiring connecting the pads to the source drive IC 120 and wiring connecting the pads to the circuit board 140 can be formed on the flexible film 130. The flexible film 130 is attached to the pads using an anisotropic conducting film, thereby enabling connection between the pads and the wiring on the flexible film 130.

[0046] An example first substrate 110 may include a display area (DA) and a non-display area (NDA).

[0047] The display area (DA) is the area where an image is displayed, and may be a pixel array area, an active area, a pixel array section, a display section, or a screen. For example, the display area (DA) can be located in the central part of the display panel (or first substrate 110).

[0048] An example display area (DA) may include gate lines, data lines, pixel drive power lines, and multiple pixels (P). Each of the multiple pixels (P) may include multiple subpixels (SP) that may be defined by the gate line and data line, and a transparent area (TA, shown in Figure 2) arranged adjacent to the multiple subpixels (SP). The transparent area (TA) is an area configured to allow light to pass through the front and back of the display panel. Therefore, a user positioned on the front side of the display panel can see the image or background located on the back side of the display panel through the transparent area (TA).

[0049] Referring to Figure 2, each of the multiple subpixels (SPs) can be defined as the smallest unit region from which actual light is emitted.

[0050] For example, at least four adjacent subpixels (SP) and one translucent area (TA) constitute a unit pixel (P). A unit pixel may, but is not limited to, a red subpixel, a green subpixel, a blue subpixel, a white subpixel, and a translucent area (TA). For example, a unit pixel may consist of at least one red subpixel, at least one green subpixel, at least one blue subpixel, at least one white subpixel, and at least one translucent area (TA).

[0051] In other examples, three adjacent subpixels (SPs) and one translucent area (TA) constitute a single unit pixel. A single unit pixel may, but is not limited to, at least one red subpixel, at least one green subpixel, at least one blue subpixel, and one translucent area (TA).

[0052] Each of the multiple subpixels (SPs) may include a thin-film transistor and a light-emitting element connected to the thin-film transistor. The light-emitting element may include a light-emitting element layer (or organic light-emitting layer) interposed between the anode electrode (or first electrode) and the cathode electrode (or second electrode).

[0053] Each of the light-emitting layers arranged in a plurality of subpixels (SPs) can individually emit light of different colors or emit white light in common. For example, when each of the light-emitting layers of a plurality of subpixels (SPs) emits white light in common, each of the red subpixel, green subpixel, and blue subpixel can include a color filter (or wavelength conversion member) that converts the white light into light of a different color. In this case, the white subpixel in this example does not need to have a color filter. In the transparent display device 100 according to one embodiment of this specification, the red subpixel may be the first subpixel (SP1), the white subpixel may be the second subpixel (SP2), the green subpixel may be the third subpixel (SP3), and the blue subpixel may be the fourth subpixel (SP4).

[0054] Each subpixel (SP) uses a thin-film transistor to supply a predetermined current to the organic light-emitting element based on the data voltage of the data line when a gate signal is input from the gate line. This allows the light-emitting portion of each subpixel to emit light at a predetermined brightness based on the predetermined current. A detailed explanation of the structure of each subpixel (SP) will follow later with reference to Figure 3.

[0055] A non-display area (NDA) is an area where no image is displayed, and may be a peripheral circuit area, a signal supply area, an inactive area, or a bezel area. The NDA can be configured to surround the display area (DA). That is, the NDA can be positioned to enclose the display area (DA).

[0056] A transparent display device 100 according to one embodiment of this specification may include a plurality of gate drive units (GDs) arranged in a non-display area (NDA). As shown in Figure 1, the plurality of gate drive units (GDs) can be arranged in a first direction (Y-axis direction) in the non-display area (NDA). The plurality of gate drive units (GDs) can be arranged parallel to each other across the display area (DA), but are not necessarily limited to this arrangement.

[0057] Each of the multiple gate drive units (GDs) supplies a gate signal to the gate line according to a gate control signal input from a timing control unit connected to multiple circuit boards 140. Each of the multiple gate drive units (GDs) can be formed in the non-display areas (NDAs) on both sides of the display area (DA) using a GIP (gate driver in panel) method, as shown in Figure 1. Alternatively, the multiple gate drive units (GDs) can be manufactured on a drive chip, mounted on a flexible film, and attached to the non-display areas (NDAs) on both sides of the display area (DA) of the display panel using a TAB (tape automated bonding) method. An example gate drive unit (GD) may include multiple gate drive circuits (or GIP circuits) and multiple GIP wirings. An example GIP wiring may include multiple signal wirings and multiple power supply wirings.

[0058] Multiple gate drivers (GDs) can be arranged separately on the left side of the display area (DA), i.e., the second non-display area (NDA2), and on the right side of the display area (DA), i.e., the third non-display area (NDA3). In one example, multiple gate drivers (GDs) can be connected to multiple pixels (P) and multiple wirings (or multiple second lines (SL2)) for supplying power and / or signals to each of the multiple pixels (P). As shown in Figure 1, the transparent display device 100 according to one embodiment of this specification may further include multiple first lines (SL1) that intersect with the multiple second lines (SL2).

[0059] Multiple second lines (SL2) can extend in the second direction (X-axis direction). Each of the multiple second lines (SL2) can contain at least one gate line (GL) (or scan line (GL)). The second direction (X-axis direction) can mean the direction parallel to the gate line (GL).

[0060] In the following, if a second line (SL2) contains multiple lines, one second line (SL2) can represent a signal line group consisting of multiple lines. For example, if a second line (SL2) contains two scan lines, one second line (SL2) can represent a signal line group consisting of two scan lines.

[0061] Multiple first lines (SL1) can extend in a first direction (Y-axis direction). Multiple first lines (SL1) can intersect with multiple second lines (SL2). Each of the multiple first lines (SL1) can be connected to at least one of multiple pads, pixel power short bars or pixel power lines (EVDD), and common power short bars (EVSS) in a first non-display area (NDA1). Pixel power short bars (EVDD) and common power short bars (EVSS) can be located in a first non-display area (NDA1) provided between pad areas (PA) and display areas (DA) with respect to the display area (DA), and in a fourth non-display area (NDA4) positioned opposite the pad areas (PA). The first direction (X-axis direction) may be parallel to the data lines.

[0062] The pixel power short bar (EVDD) may include a first pixel power short bar (EVDD1) located in the first non-display area (NDA1) and a second pixel power short bar (EVDD2) located in the fourth non-display area (NDA4). The first pixel power short bar (EVDD1) and the second pixel power short bar (EVDD2) can be arranged parallel to each other in the second direction (X-axis direction) with the display area (DA) in between.

[0063] The common power short bar (EVSS) may include a first common power short bar (EVSS1) located in the first non-display area (NDA1) and a second common power short bar (EVSS2) located in the fourth non-display area (NDA4). The first common power short bar (EVSS1) and the second common power short bar (EVSS2) can be arranged parallel to each other in the second direction (X-axis direction) with the display area (DA) in between. In one example, the first common power short bar (EVSS1) and the second common power short bar (EVSS2) can be arranged closer to the outer casing of the first substrate 110 than the first pixel power short bar (EVDD1) and the second pixel power short bar (EVDD2).

[0064] Multiple first lines (SL1) may include pixel power lines connected to a pixel power short bar (EVDD) and common power lines connected to a common power short bar (EVSS). In one embodiment, multiple first lines (SL1) may further include multiple data lines and reference lines.

[0065] In the following, if a first line (SL1) includes multiple lines, one first line (SL1) can represent a signal line group consisting of multiple lines. For example, if a first line (SL1) includes two data lines, a pixel power line, a common power line, and a reference line, one first line (SL1) can represent a signal line group consisting of two data lines, a pixel power line, a common power line, and a reference line.

[0066] A pixel (P) is configured to superimpose on at least one of a first line (SL1) and a second line (SL2), and emits a predetermined amount of light to display an image. The light-emitting region (EA) may correspond to the region in the pixel (P) that emits light.

[0067] Referring to Figure 2, each pixel (P) can contain a first subpixel (SP1), a second subpixel (SP2), a third subpixel (SP3), and a fourth subpixel (SP4). The first subpixel (SP1) can be configured to include a first light-emitting region (EA) that emits red light, the second subpixel (SP2) can include a second light-emitting region that emits white light, the third subpixel (SP3) can include a third light-emitting region that emits green light, and the fourth subpixel (SP4) can include a fourth light-emitting region that emits blue light. In Figure 2, the first to fourth subpixels (SP1, SP2, SP3, SP4) contained in a single pixel (P) are shown to be arranged in the first direction (Y-axis direction), but the arrangement order of each subpixel (SP1, SP2, SP3, SP4) can be changed in various ways.

[0068] In one embodiment of this specification, the transparent display device 100 is configured such that the organic light-emitting element emits white light. Therefore, as shown in Figure 2, the second subpixel (SP2), which is a white subpixel, does not need to have a color filter. On the other hand, the first subpixel (SP1) may be equipped with a red color filter 210 so as to emit red light, the third subpixel (SP3) may be equipped with a green color filter so as to emit green light, and the fourth subpixel (SP4) may be equipped with a blue color filter so as to emit blue light.

[0069] The pixels (P) of the transparent display device 100 according to one embodiment of this specification will be described below with reference to Figures 2 and 3.

[0070] Referring to Figures 2 and 3, each of the multiple pixels (P) configured in the display area (DA) can include multiple subpixels (SP) and transparent areas (TA). The transparent areas (TA) can be arranged adjacent to each of the multiple subpixels (SP), as shown in Figure 2. In Figure 3, a subpixel (SP) with a connecting member (RD) is shown, but a filler member (RF) can be placed in a subpixel (SP) located in the display area (DA) rather than the dam area (DMA). However, as shown in Figure 3, it is possible not to place both the filler member (RF) and the connecting member (RD) in the area where the cut area (CP) is located. This is because not forming both the filler member (RF) and the connecting member (RD) in the cut area (CP) not only reduces manufacturing costs by saving material, but also makes cutting easier by cutting the area where the filler member (RF) and connecting member (RD) are not located, thereby reducing the defect rate.

[0071] On the other hand, the structure of a subpixel (SP) with a filler member (RF) is the same as the structure of a subpixel (SP) with a connecting member (RD), as shown in Figure 3. Therefore, the explanation for this subpixel (SP) will be replaced by the explanation for the subpixel (SP) with a connecting member (RD).

[0072] Referring again to Figure 3, each of the multiple subpixels (SPs) is configured on the first substrate 110 and may include a buffer layer (BL) to prevent moisture penetration into the thin-film transistor 112.

[0073] Furthermore, each subpixel (SP) according to one embodiment of this specification may be configured on the upper surface of the buffer layer (BL) and may include a gate insulating film 111a (shown in Figure 12), an interlayer insulating film 111b, an inorganic film layer 111 including a first passivation layer 111c and a second passivation layer 111d, a planarization layer 113 configured on the inorganic film layer 111, an anode electrode 114 (or first electrode 114) configured on the planarization layer 113, a bank 115, an organic light-emitting layer 116, a cathode electrode 117 (or second electrode 117), and a sealing layer 118.

[0074] Thin-film transistors 112 for driving subpixels (SPs) can be placed in the inorganic film layer 111. The inorganic film layer 111 can also be referred to in terms of a circuit element layer. A buffer layer (BL) can be included in the inorganic film layer 111 together with a gate insulating film 111a, an interlayer insulating film 111b, a first passivation layer 111c, and a second passivation layer 111d. The anode electrode 114, organic light-emitting layer 116, and cathode electrode 117 can be included in the light-emitting element.

[0075] The buffer layer (BL) can be formed between the first substrate 110 and the gate insulating film 111a to protect the thin-film transistor 112. A pixel power line (EVDD) or wiring electrically connected to the pixel power line (EVDD) can be placed between the buffer layer (BL) and the first substrate 110. The buffer layer (BL) can be placed over the entire surface (or front surface) of the first substrate 110. The buffer layer (BL) can also serve to block the diffusion of materials contained in the first substrate 110 into the transistor layer during high-temperature processes in the manufacturing process of the thin-film transistor. Selectively, the buffer layer (BL) may be omitted in some cases.

[0076] An example thin-film transistor 112 may include an active layer 112a, a gate electrode 112b, a source electrode 112c, and a drain electrode 112d.

[0077] The active layer 112a may include a channel region, a drain region, and a source region formed in the thin-film transistor region of the circuit region of the pixel (P). The drain region and the source region can be spaced apart so as to be parallel to each other with the channel region in between.

[0078] The active layer 112a can be composed of a semiconductor material based on one of the following: amorphous silicon, polycrystalline silicon, oxide, or organic material.

[0079] The gate insulating film 111a can be formed on the channel region of the active layer 112a. For example, the gate insulating film 111a can be formed in an island configuration only on the channel region of the active layer 112a, or it can be formed on the entire front surface of the first substrate 110 containing the active layer 112a or the buffer layer (BL).

[0080] The gate electrode 112b can be formed on the gate insulating film 111a so as to overlap with the channel region of the active layer 112a.

[0081] The interlayer insulating film 111b can be formed on the gate electrode 112b and on the drain and source regions of the active layer 112a. The interlayer insulating film 111b can be formed over the entire circuit region and the light-emitting region where light is emitted to the pixel (P). For example, the interlayer insulating film 111b may be made of an inorganic material, but is not necessarily limited to that.

[0082] The source electrode 112c can be electrically connected to the source region of the active layer 112a through a source contact hole provided in the interlayer insulating film 111b that overlaps with the source region of the active layer 112a. The source electrode 112c can also be connected to wiring (LS) electrically connected to the pixel power line (EVDD) through contact holes provided in the interlayer insulating film 111b that does not overlap with the source region of the active layer 112a and in the buffer layer (BL). The source electrode 112c can also be connected to the anode electrode 114 via a connecting electrode (CE) that penetrates the first passivation layer 111c.

[0083] The drain electrode 112d can be electrically connected to the drain region of the active layer 112a through a drain contact hole provided in the interlayer insulating film 111b that overlaps with the drain region of the active layer 112a.

[0084] The drain electrode 112d and the source electrode 112c may each be made of the same metallic material. For example, the drain electrode 112d and the source electrode 112c may each consist of a single metallic layer, a single alloy layer, or two or more layers, which may be the same as or different from the gate electrode.

[0085] Furthermore, the circuit region may further include first and second switching thin-film transistors arranged together with the thin-film transistor 112, and a capacitor. Since each of the first and second switching thin-film transistors is provided on the circuit region of the pixel (P) having the same structure as the thin-film transistor 112, a description of them will be omitted. The capacitor can be provided in the superimposed region between the gate electrode 112b and source electrode 112c of the thin-film transistors 112, which are superimposed on each other with the interlayer insulating film 111b in between.

[0086] Furthermore, thin-film transistors provided in the pixel region may have a characteristic where the threshold voltage shifts due to light. To prevent this, the display panel or the first substrate 110 may further include a light-shielding layer (not shown) provided beneath at least one active layer 112a of the thin-film transistor 112, the first switching thin-film transistor, and the second switching thin-film transistor. The light-shielding layer is provided between the first substrate 110 and the active layer 112a and reduces the threshold voltage change of the transistor due to external light by blocking light incident on the active layer 112a through the first substrate 110.

[0087] The first passivation layer 111c can be placed between the first substrate 110 and the planarization layer 113. In one example, the first passivation layer 111c covers the drain electrode 112d and source electrode 112c and the interlayer insulating film 111b of the thin-film transistor 112. The first passivation layer 111c can be formed over the entire circuit region and the light-emitting region.

[0088] The second passivation layer 111d can be provided on the first substrate 110 so as to cover the pixel region. For example, the second passivation layer 111d can be configured to cover the connecting electrode (CE) between the first passivation layer 111c and the planarization layer 113. The second passivation layer 111d can be formed over the entire circuit region and the light-emitting region.

[0089] The planarization layer 113 can be provided on the first substrate 110 so as to cover the second passivation layer 111d. When the second passivation layer 111d is omitted, the planarization layer 113 can be provided on the first substrate 110 so as to cover the circuit region. The planarization layer 113 can be formed over the entire circuit region and the light-emitting region. The planarization layer 113 can also be formed over the remaining area of ​​the non-display area (NDA) excluding the pad region (PA) and the entire display region (DA). For example, the planarization layer 113 may include an extended portion (or extended portion) that extends or expands from the display region (DA) into the remaining non-display area (NDA) excluding the pad region (PA). Therefore, the planarization layer 113 can have a size that is relatively larger than the display region (DA).

[0090] In one embodiment, the planarization layer 113 is formed to have a relatively thick thickness and can provide a flat surface on the display area (DA) and non-display area (NDA). For example, the planarization layer 113 can be made of an organic material such as photoacrylic, benzocyclobutene, polyimide, and fluororesin.

[0091] The anode electrode 114 of the subpixel (SP) can be formed on the planarization layer 113. The anode electrode 114 is connected to the source or drain electrode of the thin-film transistor 112 by connecting to a connecting electrode (CE) through a contact hole that penetrates the planarization layer 113 and the second passivation layer 111d.

[0092] The anode electrode 114 can consist of at least one of a transparent metallic material, a semi-transparent metallic material, and a highly reflective metallic material.

[0093] When the transparent display device 100 is formed using an upper light-emitting method, the anode electrode 114 can consist of a highly reflective metallic material or a laminated structure of a highly reflective metallic material and a transparent metallic material. For example, the anode electrode 114 can be formed of a highly reflective metallic material such as a laminated structure of aluminum and titanium (Ti / Al / Ti), a laminated structure of aluminum and ITO (ITO / Al / ITO), an Ag alloy, and a laminated structure of Ag alloy and ITO (ITO / Ag alloy / ITO). The Ag alloy may be an alloy of silver (Ag), palladium (Pd), copper (Cu), etc.

[0094] If the transparent display device 100 is configured as a bottom-emitting type, the anode electrode 114 can be formed from a transparent conductive material (TCO) such as ITO or IZO that can transmit light, or from a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag).

[0095] On the other hand, the material constituting the anode electrode 114 may include MoTi. Such an anode electrode 114 may be a first electrode or a pixel electrode.

[0096] Bank 115 is a non-emitting region that does not emit light and can be configured to surround each of the light-emitting regions (EAs) that each of the multiple subpixels (SPs) possesses. In other words, Bank 115 can partition (or define) each of the light-emitting regions (EAs).

[0097] The bank 115 is formed on the planarization layer 113 so as to cover the edge of the anode electrode 114, thereby partitioning (or defining) the light-emitting region (EA) (or light-emitting part) of each of the multiple subpixels (SPs).

[0098] The bank 115 can be formed to cover each end of the anode electrode 114 of each subpixel (SP), so that a portion of each anode electrode 114 is exposed. This prevents the bank 115 from short-circuiting the anode electrode 114 and the cathode electrode 117 by covering each end of the anode electrode 114. The exposed portion of the anode electrode 114 that is not obstructed by the bank 115 may be an emitting region (EA) (or emitting part).

[0099] Bank 115 can be formed from organic films such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. However, it is not limited to these.

[0100] An organic light-emitting layer 116 is formed on the anode electrode 114 and the bank 115. When a voltage is applied to the anode electrode 114 and the cathode electrode 117, holes and electrons move to the organic light-emitting layer 116, where they combine and emit light.

[0101] The organic light-emitting layer 116 can be formed from multiple subpixels (SPs) and a common layer configured on the bank 115. In this case, the organic light-emitting layer 116 can be composed of a tendem structure in which multiple light-emitting layers, for example, a yellow-green light-emitting layer and a blue light-emitting layer are stacked, and when an electric field is formed between the anode electrode 114 and the cathode electrode 117, it can emit white light.

[0102] A color filter 210 corresponding to the color of the corresponding subpixel (SP) can be formed on the second substrate 200. For example, a red subpixel (SP1) may be provided with a red color filter, a green subpixel with a green color filter, and a blue subpixel with a blue color filter. Since the organic light-emitting layer 116 emits white light, a color filter is not required for the white subpixel.

[0103] The cathode electrode 117 is formed on the organic light-emitting layer 116. The cathode electrode 117 may be a common layer formed in common for subpixels (SPs). Such a cathode electrode 117 can be made of a transparent metallic material, a semi-transparent metallic material, or a highly reflective metallic material.

[0104] If the transparent display device 100 is an upper light-emitting type, the cathode electrode 117 can be formed from a transparent conductive material (TCO) such as ITO or IZO that can transmit light, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag).

[0105] If the transparent display device 100 is a bottom-emitting type, the cathode electrode 117 can be formed from a highly reflective metallic material such as a laminated structure of aluminum and titanium (Ti / Al / Ti), a laminated structure of aluminum and ITO (ITO / Al / ITO), an Ag alloy, or a laminated structure of Ag alloy and ITO (ITO / Ag alloy / ITO). The Ag alloy may be an alloy of silver (Ag), palladium (Pd), copper (Cu), etc. Such a cathode electrode 117 may be a second electrode or a counter electrode.

[0106] A sealing layer 118 is formed on the cathode electrode 117. The sealing layer 118 serves to prevent oxygen and moisture from penetrating the organic light-emitting layer 116 and the cathode electrode 117. For this purpose, the sealing layer 118 may include at least one organic film and at least one inorganic film.

[0107] In one embodiment of the transparent display device 100 described herein, the sealing layer 118 can be placed not only in the display area (DA) but also in the non-display area (NDA). In one example, the sealing layer 118 can be placed between the cathode electrode 117 (and / or buffer layer (BL)) and the second substrate 200.

[0108] Since the sealing layer 118 is positioned in the display area (DA) and extends to the non-display area (NDA), it can contact the dam area (DMA) in the non-display area (NDA) (or outer casing) of the display panel. Furthermore, in the transparent display device 100 according to one embodiment of this specification, since the dam area (DMA) is positioned up to a part of the display area (DA), the sealing layer 118 can also contact the dam area (DMA) (or the connecting member (RD) included in the dam area (DMA)) in the display area (DA).

[0109] Therefore, the transparent display device 100 according to one embodiment of this specification can prevent moisture from penetrating into the display area (DA), and can effectively prevent moisture from penetrating into the display area (DA) even when it is divided into multiple sections via cut sections (CP).

[0110] Referring again to Figure 3, a color filter 210 and a black matrix 220 can be placed between the sealing layer 118 and the second substrate 200. In one example, the color filter 210 can be placed on the second substrate 200 (or the opposing substrate) corresponding to each of the multiple subpixels (SP) (or multiple light-emitting regions (EA)).

[0111] As described above, the white subpixel, i.e., the second subpixel (SP2), does not need a color filter because the organic light-emitting layer 116 emits white light. On the other hand, the red subpixel, the first subpixel (SP1), may have a color filter 210 between the sealing layer 118 and the second substrate 200.

[0112] As shown in Figure 3, the black matrix 220 can be positioned at the edge of the color filter 210. Therefore, the black matrix 220 can prevent color mixing between subpixels (SPs). The black matrix 220 is composed of a black material and can be positioned in the non-emissive area (NEA). In one example, the black matrix 220 is formed on the second substrate 200 so as to overlap at least a portion with the bank 115, thereby reducing the cell gap between the organic light-emitting layer 116 and the second substrate 200 and preventing color mixing between subpixels.

[0113] On the other hand, the transparent display device 100 according to one embodiment of this specification may further include a plurality of upper organic films 230 that cover the color filter 210. As shown in Figure 3, each of the plurality of upper organic films 230 can be configured to cover not only the color filter 210 but also the black matrix 220.

[0114] In one example, multiple upper organic films 230 can be arranged spaced apart from each other with a permeable portion (TA) in between. Since the upper organic films 230 are organic films, they can serve as moisture permeability pathways from the outside to the display area (DA). However, in the transparent display device 100 according to one embodiment of this specification, the moisture permeability pathway to the display area (DA) can be blocked by arranging the multiple upper organic films 230 spaced apart from each other.

[0115] Furthermore, since the transparent display device 100 according to one embodiment of this specification is configured so that the multiple upper organic films 230 are not placed in the transparent portion (TA), the transmittance can be improved compared to the case where the organic films are placed in the transparent portion (TA).

[0116] On the other hand, by arranging multiple upper organic films 230 spaced apart from each other with a permeable portion (TA) in between, connecting members (RD) (shown in Figure 3) can be placed between the multiple upper organic films 230. That is, the connecting members (RD) can be partially placed between the multiple upper organic films 230. In one example, the connecting members (RD) can be placed entirely between the multiple upper organic films 230, or partially between the multiple upper organic films 230, as shown in Figure 3. This describes the arrangement structure in the dam region (DMA), and in the display region (DA) where the dam region (DMA) is not arranged, the filling members (RF) can be partially placed between the multiple upper organic films 230.

[0117] In one embodiment of this specification, the transparent display device 100 can be composed of N dam regions (DMAs) (where N is an integer greater than 1) on the first substrate 110. For example, as shown in Figure 1, the transparent display device 100 in one embodiment of this specification may include two dam regions (DMAs). Each of the two dam regions (DMAs) may be configured in a closed-loop configuration (or closed configuration) surrounding display regions (DAs) of different areas. However, it is not limited to this, and the two dam regions (DMAs) may also be configured in a closed-loop configuration (or closed configuration) surrounding display regions (DAs) of the same area.

[0118] Each of the multiple dam regions (DMAs) may include a first dam located in a non-display region (NDA) and a second dam extending from the NDA into the display region (DA). As shown in Figure 1, the first and second dams are connected to each other and can be configured as a single closed dam region (DMA). As shown in Figure 1, the second dam can be positioned across the display region (DA). Thus, the transparent display device 100 according to one embodiment of this specification may have a structural feature in which the dam regions (DMAs) overlap with pixels (P) (or subpixels (SP)) located in the display region (DA) in a third direction (Z-axis direction).

[0119] Referring to Figures 1 and 2, the transparent display device 100 according to one embodiment of this specification may further include cut sections (CPs) configured between N dam regions (DMAs). In one example, the cut sections (CPs) may be portions that are cut by a cutting device such as a laser or a wheel. Thus, when the cutting device cuts the cut sections (CPs), the transparent display device 100 according to one embodiment of this specification can be divided into a first transparent display device 101 and a second transparent display device 102. Figure 1 shows that the transparent display device 100 according to one embodiment of this specification is configured to be divided into two transparent display devices having different areas (or sizes), but is not limited to this, and can be configured to be divided into two transparent display devices having the same area (or size).

[0120] Taking Figure 1 as an example, the transparent display device 100 according to one embodiment of this specification can be configured to be divided into a first transparent display device 101 having a first area via a cut section (CP), and a second transparent display device 102 having a second area larger than the first area. The third transparent display device 103, located between the first transparent display device 101 and the second transparent display device 102, cannot be used as a transparent display device because it lacks a gate drive unit (GD) capable of driving the display area (DA). However, it is not limited to this, and if a gate drive unit (GD) can be connected to the third transparent display device 103, it can also function as the third transparent display device 103.

[0121] On the other hand, if the third transparent display device 103 cannot be used as a transparent display device, the filler member (RF) and connecting member (RD) can be omitted from the region of the third transparent display device 103 located between the first transparent display device 101 and the second transparent display device 102. As a result, the transparent display device 100 according to one embodiment of this specification can reduce manufacturing costs because the filler member (RF) and connecting member (RD) are not formed in the region that cannot be used as a transparent display device, and the region where the filler member (RF) and connecting member (RD) are not placed can be cut out, making cutting easier and reducing the defect rate.

[0122] As a result, the transparent display device 100 according to one embodiment of this specification can be configured with a number of dam regions (DMAs) corresponding to the number of gate drive units (GDs). This allows the transparent display device 100 according to one embodiment of this specification to be configured to be divided into multiple transparent display devices equal to the number of gate drive units (GDs) (or the number of dam regions (DMAs)).

[0123] Referring again to Figure 1, in the transparent display device 100 according to one embodiment of this specification, each of the multiple gate drive units (GD) can be arranged in a first direction (Y-axis direction) in the non-display area (NDA). Here, the cut unit (CP) can be arranged parallel to the gate drive unit (GD). If the cut unit (CP) is arranged in a direction intersecting the gate drive unit (GD), the gate drive unit (GD) will be damaged by the cutting device, and the transparent display device will not be able to operate. Therefore, in the transparent display device 100 according to one embodiment of this specification, the cut unit (CP) can be arranged parallel to the gate drive unit (GD). For example, as shown in Figure 1, the cut unit (CP) can be arranged in a first direction (Y-axis direction) between two gate drive units (GD1, GD2). Therefore, the transparent display device 100 according to one embodiment of this specification can be cut in a first direction (Y-axis direction) by a cutting device, thereby being configured to be divided into a first transparent display device 101 and a second transparent display device 102 with different areas (or sizes).

[0124] As shown in Figure 1, the cut section (CP) is arranged vertically, so it can be described using the term "vertical cut line." Alternatively, since the cut section (CP) is the part where the transparent display device 100 is cut in one direction, it can be described using the term "one-way cut line."

[0125] On the other hand, while the transparent display device 100 according to one embodiment of this specification can consist of only one cut section (CP), it is not limited to this, and can consist of two cut sections (CP), as shown in Figure 1. For example, the cut section (CP) may include a first cut section (CP1) positioned between the first transparent display device 101 and the third transparent display device 103, and a second cut section (CP2) positioned between the third transparent display device 103 and the second transparent display device 102.

[0126] When the cutting device cuts a first cut section (CP1) and a second cut section (CP2), one transparent display device can be divided into three transparent display devices. The first transparent display device 101, which includes a first gate drive unit (GD1), and the second transparent display device 102, which includes a second gate drive unit (GD2), can be used as separate transparent display devices with different areas (or sizes). The third transparent display device 103, positioned between the first cut section (CP1) and the second cut section (CP2), cannot function as a transparent display device because it lacks a gate drive unit. However, as described above, if a gate drive unit can be connected to the third transparent display device 103, it can also function as a transparent display device.

[0127] Referring to Figure 1, in a transparent display device 100 according to one embodiment of this specification, the circuit board 140 may include a first circuit board 141, a second circuit board 142, a third circuit board 143, and a fourth circuit board 144. For example, the first circuit board 141 can be connected to the first transparent display device 101. The first circuit board 141 can be connected to a timing control unit via a cable. The second circuit board 142 can be connected to the third transparent display device 103. As described above, if the third transparent display device 103 cannot function as a transparent display device, the second circuit board 142 may not be connected to the timing control unit. The third circuit board 143 and the fourth circuit board 144 can be connected to the second transparent display device 102. The third circuit board 143 and the fourth circuit board 144 can be connected to a timing control unit via a cable. Therefore, if the transparent display device 100 according to one embodiment of this specification is separated (or divided) by a cutting device, the first transparent display device 101 and the second transparent display device 102 can function as separate transparent display devices having different areas (or sizes) from each other.

[0128] A transparent display device 100 according to one embodiment of this specification may include a planarization layer 113 disposed on a first substrate 110, and a plurality of inorganic film layers 111 disposed between the first substrate 110 and the planarization layer 113. For example, the plurality of inorganic film layers 111 may be a gate insulating film 111a, an interlayer insulating film 111b, a first passivation layer 111c, and a second passivation layer 111d, all configured on the upper surface of a buffer layer (BL).

[0129] A transparent display device 100 according to one embodiment of this specification may include undercut portions (UC) in which the planarization layer 113 and a plurality of inorganic film layers 111 are partially removed.

[0130] An undercut portion (UC) can be formed by partially removing each of the interlayer insulating film 111b, the first passivation layer 111c, and the second passivation layer 111d. As shown in Figure 3, the undercut portion (UC) can be formed in the transmissive portion (TA). That is, the transmissive portion (TA) can include the undercut portion (UC).

[0131] The undercut portion (UC) is intended to interrupt the organic light-emitting layer 116 that constitutes the transparent portion (TA). In the transparent display device 100 according to one embodiment of this specification, the organic light-emitting layer 116, cathode electrode 117, and sealing layer 118 are formed after the undercut portion (UC) is formed, so the organic light-emitting layer 116 can be interrupted by the undercut portion (UC). Therefore, the transparent display device 100 according to one embodiment of this specification can prevent moisture permeation through the organic light-emitting layer 116.

[0132] In one example, an undercut portion (UC) can be formed in the transparent portion (TA) in an M number (where M is an integer greater than 0). Since the undercut portion (UC) is a region where the organic light-emitting layer 116 is interrupted, even if the undercut portion (UC) is cut by a cutting device, moisture permeation to the display area (DA) can be prevented. Therefore, in the transparent display device 100 according to one embodiment of this specification, the cut portion (CP) can be any one of the M undercut portions (UC). For example, as shown in Figure 3, the undercut portions (UC) can be formed on both sides of the planarization layer 113' arranged in the transparent portion (TA). Since the planarization layer 113' arranged in the transparent portion (TA) is arranged in an island form separated from the planarization layer 113 arranged in the light-emitting area (EA), it can be expressed in terms of island OC or first planarization layer. In contrast, the planarization layer 113, which is superimposed on the light-emitting region (EA) (and / or non-light-emitting region (NEA)), is positioned to cover the thin-film transistor 112, and can therefore be referred to as a capping OC or a second planarization layer.

[0133] For example, as shown in Figure 2, the planarization layer 113' (or first planarization layer 113') placed in the permeable portion (TA) can be arranged parallel to the first direction (Y-axis direction) in two permeable portions (TA). In this case, four undercut portions (UC) can be arranged in one permeable portion (TA), as shown in Figure 3. Any one of these four undercut portions (UC) may be a cut portion (CP). However, it is not necessarily limited to this, and a cut portion (CP) can be formed in an luminescent region (EA) or permeable portion (TA) that is not an undercut portion (UC). Also, a cut portion (CP) can be located in a region that is not a dam region (DMA), and cannot be located in a region where a filler material (RF) is placed. This is because if a cut portion (CP) is located in a region where a filler material (RF) is placed, moisture may permeate through organic layers such as the organic luminescent layer when it is cut by a cutting device. Therefore, in the transparent display device 100 according to one embodiment of this specification, the cut portion (CP) can be placed in at least one of the following: the undercut portion (UC) in the region where the filler member (RF) is not placed, the light-emitting region (EA) in the region where the filler member (RF) is not placed, and the transparent portion (TA) in the region where the filler member (RF) is not placed. In the following description, the case in which the undercut portion (UC) is the cut portion (CP) will be explained as an example.

[0134] In one embodiment of this specification, the transparent display device 100 can be configured as a plurality of transparent display devices having different or equal areas when any one of the M undercut portions (UC) is cut by a cutting device. Since the organic light-emitting layer 116 is interrupted in the undercut portions (UC), moisture permeation through the organic light-emitting layer 116 can be prevented even when cut by a cutting device. Furthermore, since the cut portions (CP) are arranged between a plurality of dam regions (DMA), even when cut by a cutting device, the ends of each transparent display device (for example, the first transparent display device 101 and the second transparent display device 102) can be configured with a structure in which the dam regions (DMA) surround the display area (DA). In addition, since the getter contained in the connecting member (RD) located at the end of each transparent display device (for example, the first transparent display device 101 and the second transparent display device 102) can absorb moisture and oxygen, moisture permeation to the display area (DA) can be further enhanced.

[0135] Referring to Figure 3, in the transparent display device 100 according to one embodiment of this specification, the organic light-emitting layer 116 can be interrupted at the undercut portion (UC). Similarly, the cathode electrode 117 and the sealing layer 118 can also be interrupted at the undercut portion (UC). Therefore, as shown in Figure 3, the first planarization layer 113', the organic light-emitting layer 116, the cathode electrode 117, and the sealing layer 118 arranged on the first planarization layer 113' can be arranged in an Irish configuration. Thus, connecting members (RD) can be arranged on both sides of the first planarization layer 113' up to the undercut portion (UC). In the transparent display device 100 according to one embodiment of this specification, since the connecting members (RD) including getters are arranged up to the undercut portion (UC), moisture permeability can be further prevented. However, this is not necessarily the only option, and the connecting members (RD) can also be partially formed on only one side of the first planarization layer 113'.

[0136] On the other hand, the transparent display device 100 according to one embodiment of this specification can be configured to manufacture a wide variety (or a wide range of sizes) of transparent display devices without additional masking steps, through a process of forming an undercut portion (UC) that interrupts the organic light-emitting layer 116. Therefore, compared to manufacturing a wide variety (or a wide range of sizes) of transparent display devices through a wide range of processes, production energy can be reduced.

[0137] Figure 4 is a schematic cross-sectional view showing another example of section C shown in Figure 3.

[0138] Referring to Figure 4, in the transparent display device 100 according to one embodiment of this specification, the organic light-emitting layer 116 is interrupted by an undercut portion (UC), and the cathode electrode 117 and the sealing layer 118 can be connected by the undercut portion (UC). This can be achieved by forming the undercut portion (UC) with a narrower width compared to that of Figure 3. Here, the width of the undercut portion (UC) can mean the length in the second direction (X-axis direction) of the upper surface of the buffer layer (BL) adjacent to the undercut portion (UC) with reference to Figure 4. Thus, the transparent display device 100 according to Figure 4 can be configured with a structure in which the organic light-emitting layer 116 is interrupted by an undercut portion (UC), and the cathode electrode 117 and the sealing layer 118 are connected.

[0139] On the other hand, after forming the undercut portion (UC), the organic light-emitting layer 116, the cathode electrode 117, and the sealing layer 118 are sequentially deposited in a vacuum state, so the undercut portion (UC) can partially include a vacuum region (VA). As shown in Figure 4, the vacuum region (VA) can be sealed by the buffer layer (BL), the cathode electrode 117, and the first planarization layer 113'.

[0140] Figure 5 is a schematic cross-sectional view showing yet another example of section C shown in Figure 3.

[0141] Referring to Figure 5, in the transparent display device 100 according to one embodiment of this specification, the organic light-emitting layer 116 and the cathode electrode 117 are separated by an undercut portion (UC), and the sealing layer 118 can be connected by the undercut portion (UC). This can be achieved by forming the undercut portion (UC) to be narrower than that of Figure 3 and wider than that of Figure 4. Here, the width of the undercut portion (UC) can mean the length in the second direction (X-axis direction) of the upper surface of the buffer layer (BL) adjacent to the undercut portion (UC) with reference to Figure 5. Thus, the transparent display device 100 according to Figure 5 can be configured with a structure in which the organic light-emitting layer 116 and the cathode electrode 117 are separated by an undercut portion (UC), and the sealing layer 118 is connected.

[0142] On the other hand, after forming the undercut portion (UC), the organic light-emitting layer 116, the cathode electrode 117, and the sealing layer 118 are sequentially deposited in a vacuum state, so the undercut portion (UC) can partially include a vacuum region (VA). As shown in Figure 5, the vacuum region (VA) can be sealed by the buffer layer (BL) and the sealing layer 118.

[0143] Figure 6 is a schematic cross-sectional view of the line II-II' shown in Figure 2.

[0144] Referring to Figures 2 and 6, in a transparent display device 100 according to one embodiment of this specification, the undercut portion (UC) may include a block portion (BKP) that partially overlaps the planarization layer 113' (or first planarization layer 113') between the first passivation layer 111c and the second passivation layer 111d. For example, the block portion (BKP) can be formed in the portion where the first planarization layer 113' and the second line (SL2) (or gate line (GL)) intersect, as shown in Figure 2.

[0145] The block portion (BKP) is intended to prevent the entire inorganic film layer located above the wiring (e.g., the second line (SL2) (or gate line (GL))) from being etched by the etching solution used when the undercut portion (UC) is formed. Therefore, as shown in Figure 6, the block portion (BKP) can be placed on the inorganic film layer (or the interlayer insulating film 111b and the first passivation layer 111c) on the second line (SL2) (or gate line (GL)) to protect the inorganic film layer (or the interlayer insulating film 111b and the first passivation layer 111c) from the etching solution. This prevents the second line (SL2) (or gate line (GL)) and the cathode electrode 117 from coming into contact during the deposition of the cathode electrode 117. An example block portion (BKP) may include a metallic material with high resistance to etching solutions. The block portion (BKP) can be formed in the same layer as the connecting electrode (CE).

[0146] Referring to Figure 6, the block portion (BKP) can be configured to have a wider width than the undercut portion (UC) in the second direction (X-axis direction). Thus, the edges of the block portion (BKP) can be covered by the second passivation layer 111d. The organic light-emitting layer 116, cathode electrode 117, and sealing layer 118, each separated by the undercut portion (UC), can be in contact with the upper surface of the block portion (BKP).

[0147] On the other hand, as shown in Figure 6, a filler (RF) used for bonding the first substrate 110 and the second substrate 200 can be placed on the upper side of the sealing layer 118 and the block portion (BKP).

[0148] Figure 7 is a schematic plan view showing another example from Figure 2.

[0149] In the transparent display device 100 shown in Figure 2, two first planarization layers 113' are arranged elongated in the first direction (Y-axis direction) within the transparent portion (TA). Therefore, the transparent display device 100 shown in Figure 2 may have four undercut portions (UC) arranged elongated in the first direction (Y-axis direction) along each end of the two first planarization layers 113'. Thus, the transparent display device 100 shown in Figure 2 can be configured to easily manufacture transparent display devices with areas (or sizes) that meet the diverse needs of users, as undercut portions (UC) (or cut portions (CP)) that can be cut by a cutting device are arranged in various positions.

[0150] In contrast, the transparent display device 100 shown in Figure 7 has one first planarization layer 113' that is elongated in the first direction (Y-axis direction) in the transparent portion (TA). Therefore, the transparent display device 100 shown in Figure 7 has two undercut portions (UC) arranged in the first direction (Y-axis direction) along each end of one first planarization layer 113'. Because the transparent display device 100 shown in Figure 7 has fewer undercut portions (UC) in the transparent portion (TA), its durability against external impacts can be further improved. In Figure 7, one first planarization layer 113' is arranged per pixel (P), but it is not limited to this, and one first planarization layer 113' can be arranged for every two pixels (P).

[0151] Figure 8 is a schematic plan view showing yet another example of Figure 2, and Figure 9 is a schematic cross-sectional view of the line III-III' shown in Figure 8.

[0152] In the transparent display device 100 shown in Figure 8, one first planarization layer 113' is positioned elongated in the first direction (Y-axis direction) within the transparent portion (TA). However, unlike the transparent display device 100 shown in Figure 2, the transparent display device 100 shown in Figure 8 has a first planarization layer 113' that is wider in the second direction (X-axis direction). Therefore, as shown in Figure 9, the transparent display device 100 shown in Figure 8 has one first planarization layer 113' positioned widely in the second direction (X-axis direction) within the transparent portion (TA), thus increasing its durability against external impacts.

[0153] Figure 10 is a plan view showing an enlarged view of section B shown in Figure 1, and Figure 11 is a schematic cross-sectional view of the line IV-IV' shown in Figure 10.

[0154] Referring to Figure 10, in a transparent display device 100 according to one embodiment of this specification, the first substrate 110 may include pixel power short bars (EVDD) arranged in a second direction (X-axis direction) in the non-display area (NDA).

[0155] For example, a pixel power short bar (EVDD) may include a first pixel power short bar (EVDD1) located in a first non-display area (NDA1), and the first pixel power short bar (EVDD1) may include a first sub-pixel power short bar (EVDD1-1) which is elongated in a second direction (X-axis direction), and a second sub-pixel power short bar (EVDD1-2) located on the first sub-pixel power short bar (EVDD1-1) and smaller in size than the first sub-pixel power short bar (EVDD1-1). As shown in Figure 10, each of the first sub-pixel power short bar (EVDD1-1) and the second sub-pixel power short bar (EVDD1-2) may intersect with the first planarization layer 113' in the first non-display area (NDA1).

[0156] Referring to Figure 11, the first sub-pixel power short bar (EVDD1-1) can be placed between the first substrate 110 and the buffer layer (BL). The second sub-pixel power short bar (EVDD1-2) can be placed between the interlayer insulating film 111b and the first passivation layer 111c and connected to the first sub-pixel power short bar (EVDD1-1) through a contact hole (CNT).

[0157] The block portion (BKP) can be placed on the pixel power short bar (EVDD). Therefore, the block portion (BKP) can protect the pixel power short bar (EVDD) (or the second sub-pixel power short bar EVDD1-2) from the etching solution used when forming the undercut portion (UC). An example block portion (BKP) may contain a metallic material with high resistance to etching and may be formed in the same layer as the connecting electrode (CE).

[0158] The block portion (BKP) can be configured to have a wider width than the undercut portion (UC) in the second direction (X-axis direction). Therefore, the end of the block portion (BKP) can be covered by the second passivation layer 111d. The organic light-emitting layer 116, cathode electrode 117, and sealing layer 118, which are separated by the undercut portion (UC), can each be in contact with the upper surface of the block portion (BKP). On the other hand, since Figure 11 is a cross-sectional view of the first non-display area (NDA1), unlike Figure 6, the bank 115 can be placed on the planarization layer 113 (or second planarization layer 113).

[0159] Figure 12 is a schematic cross-sectional view of a transparent display device according to a second embodiment of this specification.

[0160] Referring to Figure 12, the transparent display device 100 according to the second embodiment of this specification is the same as the transparent display device according to Figure 1 described above, except that it further includes an upper inorganic film 240 on a second substrate 200 (or opposing substrate) that covers a plurality of upper organic films 230. Therefore, the same components are given the same drawing numbers, and only the different components will be described below.

[0161] In the transparent display device shown in Figure 1 above, since multiple upper organic films 230 are arranged on the second substrate 200 at a distance from each other, moisture permeation through the upper organic films 230 can be prevented. Furthermore, the multiple upper organic films 230 arranged at a distance from each other on the second substrate 200 can reduce or prevent overflow of the connecting member (RD) in the direction toward the filling member (RF) (D1) and / or the opposite direction (D2) (or in the direction where there are no filling members (RF) or connecting members (RD) (D2)) when the first substrate 110 and the second substrate 200 are bonded together. For example, the direction where there are no filling members (RF) or connecting members (RD) (D2) may be the direction in which the cut section (CP) is located. For example, the region where there are no filling members (RF) or connecting members (RD) may be the region of the third transparent display device 103 where the cut section (CP) is located in Figure 1.

[0162] In contrast, in the case of the transparent display device shown in Figure 12, the upper inorganic film 240 can be arranged to cover a plurality of upper organic films 230 that are spaced apart from each other. Therefore, the upper inorganic film 240 can come into contact with the second substrate 200 between the plurality of upper organic films 230. Since the upper inorganic film 240 comes into contact with the second substrate 200 between the plurality of upper organic films 230, the prevention of moisture permeability through the plurality of upper organic films 230 can be enhanced.

[0163] Furthermore, in the case of the transparent display device shown in Figure 12, the upper inorganic film 240 contacts the second substrate 200 between the multiple upper organic films 230, so the upper inorganic film 240 can be arranged in the form of grooves (or trenches) between the multiple upper organic films 230. Here, a groove (or trench) can mean a recessed shape in the direction from the first substrate 110 toward the second substrate 200. Therefore, in the transparent display device 100 shown in Figure 12, the upper inorganic film 240 arranged in a groove shape can reduce or prevent the connecting member (RD) from flowing toward the filler member (RF) (D1) and / or in the opposite direction (D2) (or in the direction where there is no filler member (RF) or connecting member (RD)) when the first substrate 110 and the second substrate 200 are bonded together.

[0164] On the other hand, since Figure 12 is a cross-sectional view in the second direction (X-axis direction) in Figure 2, subpixels (SP) (or first subpixels (SP1)) that emit the same color can be arranged adjacent to each other in the second direction (X-axis direction).

[0165] Figure 13 is a schematic cross-sectional view of a transparent display device according to a third embodiment of this specification.

[0166] Referring to Figure 13, the transparent display device 100 according to the third embodiment of this specification is the same as the transparent display device shown in Figure 1, except that the structure of each of the multiple upper organic films 230 formed on the second substrate 200 (or opposing substrate) has been changed. Therefore, the same components are given the same drawing numbers, and only the different components will be described below.

[0167] In the transparent display device shown in Figure 1 above, since multiple upper organic films 230 are arranged on the second substrate 200 at a distance from each other, moisture permeation through the upper organic films can be prevented. Furthermore, the multiple upper organic films 230 arranged at a distance from each other on the second substrate 200 can reduce or prevent the connecting member (RD) from flowing in the direction toward the filling member (RF) (D1) and / or the opposite direction (D2) (or in the direction where there is neither the filling member (RF) nor the connecting member (RD)) when the first substrate 110 and the second substrate 200 are bonded together.

[0168] In contrast, the transparent display device shown in Figure 13 may include a main organic film 231 in which each of the multiple upper organic films 230 is arranged to correspond to each of the multiple subpixels (SP) (or multiple light-emitting regions (EA)), and multiple sub-organic films 232, 233 arranged separately from the main organic film 231. Therefore, the connecting member (RD) can be placed between the main organic film 231 and the multiple sub-organic films 232, 233. Also, as shown in Figure 13, the connecting member (RD) can be placed between the sub-organic films of two adjacent subpixels. Therefore, the transparent display device 100 shown in Figure 13 can have more grooves (or trenches) formed between the main organic film 231 and the multiple sub-organic films 232, 233 compared to the transparent display device shown in Figure 1. This further reduces or prevents the connecting member (RD) from flowing toward the filler member (RF) (D1) and / or in the opposite direction (D2) (or in a direction where there is no filler member (RF) or connecting member (RD)) when the first substrate 110 and the second substrate 200 are bonded together.

[0169] On the other hand, the transparent display device 100 shown in Figure 13 can have multiple sub-organic films 232 and 233 superimposed on the transparent portion (TA) in a third direction (Z-axis direction). For example, each of the multiple sub-organic films 232 and 233 can be arranged to correspond to each of the multiple planarization layers 113' (or first planarization layer 113') arranged in the transparent portion (TA). Therefore, compared to the transparent display device shown in Figure 1, the transparent display device 100 shown in Figure 13 has a smaller cell gap in the transparent portion (TA) (or the distance between the multiple sub-organic films 232 and 233 and the multiple first planarization layers 113'), which enhances the effect of preventing the flow of the connecting member (RD) to the filler member (RF) (or the empty space between the filler member (RF) and the connecting member (RD)) when bonding the first substrate 110 and the second substrate 200.

[0170] Figure 14 is a schematic cross-sectional view of a transparent display device according to the fourth embodiment of this specification, and Figure 15 is a simplified cross-sectional view of Figure 14.

[0171] Referring to Figures 14 and 15, the transparent display device 100 according to the fourth embodiment of this specification is the same as the transparent display device shown in Figure 1, except that the configurations of the multiple upper organic films 230 formed on the second substrate 200 (or opposing substrate) are changed. Therefore, the same components are given the same drawing numbers, and only the different components will be described below.

[0172] In the transparent display device shown in Figure 1 described above, a plurality of upper organic films 230 are arranged on the second substrate 200 at intervals from each other, and each of the plurality of upper organic films 230 is configured in a rectangular shape. As a result, the transparent display device shown in Figure 1 can reduce or prevent the flow of the connecting member (RD) towards the filler member (RF) (D1) and / or in the opposite direction (D2) (or in a direction where there is neither filler member (RF) nor connecting member (RD)) when the first substrate 110 and the second substrate 200 are bonded together, due to the plurality of upper organic films 230 having a rectangular shape.

[0173] In contrast, in the transparent display device shown in Figure 14, each of the multiple upper organic films 230 can be formed with a narrower width as it moves from the second substrate 200 toward the first substrate 110. For example, each of the multiple upper organic films 230 can be configured to have a convex lens shape (or parabolic shape) or a round shape in the direction from the second substrate 200 toward the first substrate 110. Therefore, the transparent display device 100 shown in Figure 14 can reduce or prevent the flow of the connecting member (RD) toward the filler member (RF) (D1) and / or the opposite direction (D2) (or the direction where there is no filler member (RF) or connecting member (RD)) when the first substrate 110 and the second substrate 200 are bonded together, thanks to the multiple upper organic films 230 having lens shapes.

[0174] On the other hand, in the transparent display device 100 according to the fourth embodiment of the present application, each of the multiple upper organic films 230 is formed to be narrower in width from the second substrate 200 toward the first substrate 110. As a result, the spacer (SPC) placed between the second substrate 200 and the first substrate 110 cannot be positioned to overlap the light-emitting region (EA) when the first substrate 110 and the second substrate 200 are bonded together, but can be positioned between the multiple upper organic films 230. For example, when the first substrate 110 and the second substrate 200 are bonded together, the rounded upper organic films 230 can push the spacer (SPC) between the upper organic films 230. Therefore, in the transparent display device 100 according to the fourth embodiment of the present application, since the spacer (SPC) is positioned between the multiple upper organic films 230 (or in the transparent portion (TA)), the cell gap is smaller compared to when the spacer is positioned to overlap the light-emitting region (EA), and the optical viewing angle characteristics can be improved.

[0175] Furthermore, in the transparent display device 100 according to the fourth embodiment of the present invention, since the spacer (SPC) is arranged between a plurality of upper organic films 230, the cell gap is smaller compared to the case in which the spacer is arranged superimposed on the light-emitting region (EA), and color mixing between a plurality of subpixels (SP) can be prevented.

[0176] Figure 16 is a schematic cross-sectional view showing a part of a transparent display device according to the fifth embodiment of this specification, and Figure 17 is a schematic cross-sectional view along the line V-V' shown in Figure 16.

[0177] The transparent display device 100 according to the fifth embodiment of this specification is the same as the transparent display device shown in Figure 1 described above, except that the arrangement structure of the multiple subpixels (SP) contained in the pixel (P) has been changed. Therefore, the same configurations are given the same drawing numbers, and only the different configurations will be described below.

[0178] In the transparent display device shown in Figure 1 above, the multiple subpixels (SP) contained within each of the multiple pixels (P) are arranged in a long stripe pattern in the first direction (Y-axis direction). For example, the first subpixel (SP1) that emits red light, the second subpixel (SP2) that emits white light, the third subpixel (SP3) that emits green light, and the fourth subpixel (SP4) that emits blue light are arranged in a long stripe in the first direction (Y-axis direction), and each of the first to fourth subpixels (SP1, SP2, SP3, SP4) has a structure in which they are arranged adjacent to the transparent portion (TA) in the second direction (X-axis direction).

[0179] In contrast, in the transparent display device shown in Figure 16, the first subpixel (SP1) that emits red light, the second subpixel (SP2) that emits white light, the third subpixel (SP3) that emits green light, and the fourth subpixel (SP4) that emits blue light can be configured in a 2x2 structure. For example, the fourth subpixel (SP4) that emits blue light and the first subpixel (SP1) that emits red light can be placed adjacent to each other in the second direction (X-axis direction), and the third subpixel (SP3) that emits green light and the second subpixel (SP2) that emits white light can be placed adjacent to each other in the second direction (X-axis direction). Here, the third subpixel (SP3) and the second subpixel (SP2) can be placed below the fourth subpixel (SP4) and the first subpixel (SP1), that is, adjacent to each other in the first direction (Y-axis direction). Furthermore, a transmissive portion (TA) can be placed adjacent to the right side of the first subpixel (SP1) and the second subpixel (SP2). However, the arrangement structure of the first to fourth subpixels (SP1, SP2, SP3, SP4) can be changed by the design of the first substrate 110 (or the second substrate 200).

[0180] Therefore, as shown in Figure 17, the transparent display device 100 according to the fifth embodiment of this specification can be configured in which the respective color filters 210, 211 of two different subpixels (SPs) are covered by a single upper organic film 230.

[0181] Although embodiments of this specification have been described in more detail above with reference to the attached figures, this specification is not necessarily limited to such embodiments, and can be modified and implemented in various ways without departing from the technical concept of this specification. Therefore, the embodiments disclosed herein are for illustrative purposes only, not to limit the technical concept of this specification, and such embodiments do not limit the scope of the technical concept of this specification. Accordingly, the embodiments described above should be understood in all respects to be illustrative and not limiting. All technical concepts within the scope of protection of this specification should be construed as being included within the scope of rights of this specification. [Explanation of symbols]

[0182] 100: Transparent display device 110: First board P: Pixel 111: Inorganic membrane layer 112: Thin-film transistor 113: Flattening layer 114: Anode electrode 115: Bank 116: Organic light-emitting layer 117: Cathode electrode 118: Sealing layer 200: Second board 210: Color Filter 220: Black Matrix 230: Upper organic film 240: Upper inorganic film DMA: Dam Area CP: Cut section BKP: Block section SL1: Line 1 SL2: Second line RD: Connecting member RF: Filling material SPC: Spacer

Claims

1. A substrate having a display area in which a transparent portion and a plurality of pixels, each having a plurality of subpixels, are arranged, and a non-display area adjacent to the display area, A transparent display device comprising a plurality of dam regions extending from the non-display region across the display region on the substrate, each of which is configured as a closed loop.

2. The transparent display device according to claim 1, wherein the plurality of dam regions are configured on the substrate in N units (where N is an integer greater than 1).

3. The transparent display device according to claim 2, further comprising cut sections provided between the N dam regions.

4. The substrate further includes a plurality of gate drive units arranged in a first direction in the non-display region, The transparent display device according to claim 3, wherein the cutting section is arranged in parallel with the plurality of gate drive sections.

5. A planar layer disposed on the substrate, The substrate and the planarization layer are disposed between a plurality of inorganic film layers, The transparent display device according to claim 1, wherein the transparent portion includes an undercut portion in which the planarization layer and the plurality of inorganic film layers are partially removed.

6. The transparent display device according to claim 5, wherein the undercut portion is configured in M ​​units (where M is an integer greater than 0) in the transparent portion.

7. Including cut sections provided between the aforementioned multiple dam areas, The transparent display device according to claim 6, wherein the cut portion is one of the M undercut portions.

8. The plurality of inorganic film layers include a first passivation layer disposed between the substrate and the planarization layer, and a second passivation layer disposed between the first passivation layer and the planarization layer. The transparent display device according to claim 5, wherein the undercut portion includes a block portion partially superimposed with the planarization layer between the first passivation layer and the second passivation layer.

9. The substrate further includes gate lines extending in a second direction within the display area, The transparent display device according to claim 8, wherein the block portion is arranged on the gate line.

10. The substrate further includes a pixel power supply short bar arranged in a second direction in the non-display area, The transparent display device according to claim 8, wherein the block portion is arranged on the pixel power supply short bar.

11. A counter substrate is positioned facing the aforementioned substrate, The above includes a plurality of upper organic films covering a color filter arranged on the opposing substrate so as to correspond to each of the plurality of subpixels, The transparent display device according to claim 1, wherein the plurality of upper organic films are arranged spaced apart from each other with the permeable portion in between.

12. Each of the plurality of dam regions includes a connecting member disposed between the substrate and the opposing substrate, The transparent display device according to claim 11, wherein the connecting member is partially disposed between the plurality of upper organic films.

13. The opposing substrate includes an upper inorganic film arranged to cover the plurality of upper organic films, The transparent display device according to claim 11, wherein the upper inorganic film is in contact with the opposing substrate between the plurality of upper organic films.

14. Each of the above-mentioned plurality of upper organic films is A main organic film arranged in relation to each of the plurality of subpixels, and It includes a plurality of sub-organic films arranged at a distance from the main organic film, The transparent display device according to claim 12, wherein the connecting member is disposed between the main organic film and a plurality of sub-organic films.

15. The transparent display device according to claim 14, wherein the plurality of sub-organic films are arranged superimposed on the permeable portion.

16. The transparent display device according to claim 11, wherein each of the plurality of upper organic films is formed to become narrower in width from the opposing substrate towards the substrate.

17. Includes a spacer disposed between the opposing substrate and the substrate, The transparent display device according to claim 16, wherein the spacer is disposed between the plurality of upper organic films.

18. Each of the aforementioned plurality of pixels is an anode electrode disposed on the planarization layer, An organic light-emitting layer disposed on the anode electrode, A cathode electrode disposed on the organic light-emitting layer, The cathode electrode includes a sealing layer disposed on the cathode electrode, The transparent display device according to claim 5, wherein the organic light-emitting layer is interrupted at the undercut portion.

19. The transparent display device according to claim 18, wherein the cathode electrode and the sealing layer are continuous at the undercut portion.

20. The cathode electrode is disconnected at the undercut portion, The transparent display device according to claim 18, wherein the sealing layer is continuous with the undercut portion.

21. The material further includes a filling member positioned adjacent to the connecting member, The transparent display device according to claim 12, wherein the filling member is arranged to fill the gap between the substrate and the opposing substrate and to support the substrate and the opposing substrate.

22. The transparent display device according to claim 21, wherein the filling member, together with the connecting member, joins the substrate and the opposing substrate, and the filling member is arranged surrounded by the connecting member.

23. The plurality of dam regions further include cut sections, The transparent display device according to claim 21, wherein the cut portion is arranged in at least one of the following: the undercut portion of the region where the filling member is not arranged, the region where the pixels emit light in the region where the filling member is not arranged, and the transparent portion of the region where the filling member is not arranged.

24. The transparent display device according to claim 8, wherein the block portion is configured to have a width even wider in the second direction than the undercut portion.

25. Block portions located on the plurality of inorganic film layers, The transparent display device according to claim 18, further comprising a filling member disposed above the sealing layer and above the block portion.

26. The transparent display device according to claim 12, further comprising a filling member partially disposed between the plurality of upper organic films in the display area where the dam region is not located.

27. The transparent display device according to claim 14, wherein the connecting member is further disposed between the respective sub-organic films of two adjacent sub-pixels.

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