Camera module

Abstract

The camera module includes a first body including a lens, a second body coupled to the first body, and a printed circuit board disposed between the first body and the second body, the first body including a first guide protruding downward and including a first protrusion, the printed circuit board including a first guide hole to which the first protrusion is coupled, and the first guide being soldered to the first guide hole.

Description

Technical Field

[0001] This embodiment relates to a camera module.

Background Art

[0002] In recent years, ultra-small camera modules have been developed and are widely used in small electronic products such as smartphones, notebooks, and game consoles.

[0003] With the popularization of automobiles, ultra-small cameras are not only used in small electronic products but also widely used in vehicles. For example, a black box camera for vehicle protection or objective materials for traffic accidents, a rear monitoring camera that allows a driver to monitor a blind spot area at the rear of the vehicle through a screen to ensure safety when the vehicle is reversing, a peripheral sensing camera that can monitor the periphery of the vehicle, etc.

[0004] A camera can include a lens, a lens holder that houses the lens, an image sensor that converts an image of a subject gathered by the lens into an electrical signal, and a printed circuit board on which the image sensor is mounted. The housing that constitutes the outer shape of the camera is configured with a structure in which the entire area is sealed to prevent internal components from being contaminated by moisture-containing foreign substances.

Summary of the Invention

Problems to be Solved by the Invention

[0005] This embodiment is to provide a camera module that can improve the structure, reduce the manufacturing cost by reducing the number of components, and protect the components inside the module from external impacts.

Means for Solving the Problems

[0006] The camera module according to this embodiment includes a first body including a lens, a second body coupled to the first body, and a printed circuit board disposed between the first body and the second body, wherein the first body protrudes downward and includes a first guide including a first projection, the printed circuit board includes a first guide hole into which the first projection is coupled, and the first guide is soldered to the first guide hole.

[0007] The first projection includes a first region having a first diameter and a second region having a second diameter smaller than the first diameter, and the region between the first region and the second region may be located inside the first guide hole.

[0008] An inclined region can be placed between the first region and the second region.

[0009] Multiple first guides and first guide holes are provided and can be arranged in the corner regions of the first body and the printed circuit board.

[0010] The first body may include a second projection that protrudes downward and contacts the upper surface of the printed circuit board.

[0011] A relief groove, which is recessed compared to other areas, can be placed between the second protrusion and the first guide.

[0012] The first body may include a second guide that protrudes downward and has a coupling groove formed in its center, and the second body may include a third guide that protrudes upward and is coupled to the second guide.

[0013] A second guide hole, into which the second guide or the third guide is connected, can be provided on the printed circuit board facing the second guide and the third guide.

[0014] Epoxy can be placed between the lower surface of the first body and the upper surface of the second body.

[0015] A camera module according to another embodiment includes a first body including a top plate and a first side plate projecting downward from the periphery of the top plate, a second body including a bottom plate and a second side plate projecting upward from the periphery of the bottom plate, and a printed circuit board disposed in the space within the second body, wherein the first body includes a first guide projecting downward from the lower surface of the top plate, the printed circuit board includes a first guide hole for ground power to which the first guide is coupled, and the first guide is soldered to the first guide hole. [Effects of the Invention]

[0016] In this embodiment, the first body, the second body, and the printed circuit board are electrically connected to form a ground region. This prevents electromagnetic waves generated in the circuit region of the printed circuit board from being radiated to the outside, affecting adjacent electronic components, and prevents electromagnetic waves generated externally from flowing into the printed circuit board. As a result, the electrical characteristics of the camera module can be further improved, noise can be prevented from being included in the electrical signal, and images of excellent quality can be obtained.

[0017] Furthermore, the bonding structure, which involves soldering the printed circuit board and the first body, has the advantage of reducing the number of components and thus lowering the manufacturing cost. [Brief explanation of the drawing]

[0018] [Figure 1] This is a perspective view showing the external appearance of a camera module according to an embodiment of the present invention. [Figure 2] This is a cross-sectional view of a camera module according to an embodiment of the present invention. [Figure 3] This is an exploded perspective view of a camera module according to an embodiment of the present invention. [Figure 4]It is a view showing FIG. 3 from another angle. [Figure 5] It is a cross-sectional view showing the coupling structure of the first body, the second body, and the printed circuit board according to an embodiment of the present invention. [Figure 6] It is a perspective view showing a part of the lower surface of the first body in an embodiment of the present invention. [Figure 7] It is a perspective view showing the coupling structure of the first body and the printed circuit board according to an embodiment of the present invention. [Figure 8] It is a cross-sectional view of the first guide according to an embodiment of the present invention. [Figure 9] It is a cross-sectional view showing the coupling structure of the first guide and the printed circuit board according to an embodiment of the present invention. [Figure 10] It is a perspective view showing the upper surface of the second body according to an embodiment of the present invention. [Figure 11] It is a perspective view showing the coupling structure of the first body and the printed circuit board according to an embodiment of the present invention.

Mode for Carrying Out the Invention

[0019] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0020] However, the technical idea of the present invention is not limited to some of the described embodiments, and can be implemented in various different forms. Within the scope of the technical idea of the present invention, one or more of the components can be selectively combined or replaced and used between the embodiments.

[0021] Furthermore, the terms (including technical and scientific terms) used in the embodiments of the present invention can be interpreted in a meaning generally understood by those having ordinary knowledge in the technical field to which the present invention belongs, unless specifically defined and described clearly. Terms generally used like those defined in a dictionary can be interpreted considering their meaning in the context of the related technology.

[0022] Furthermore, the terms used in the embodiments of the present invention are for illustrative purposes only and do not limit the invention. In this specification, the singular form may also include the plural form unless otherwise specified in the text, and where it is written "A and / or at least one of B, C," it may include one or more of all possible combinations of A, B, and C.

[0023] Furthermore, when describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used.

[0024] These terms are used to distinguish one component from another, and do not limit the nature, order, or sequence of that component.

[0025] Furthermore, when it is stated that one component is “linked,” “joined,” or “connected” to another component, this may include not only cases where the component is “linked,” “joined,” or “connected” to the other component directly, but also cases where it is “linked,” “joined,” or “connected” to the other component by another component between it and the other component.

[0026] Furthermore, when each component is described as being formed or positioned "above" or "below," "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or positioned between the two components. Also, when expressed as "above" or "below," it can include not only an upward direction relative to one component, but also a downward direction.

[0027] Figure 1 is a perspective view showing the external appearance of a camera module according to an embodiment of the present invention; Figure 2 is a cross-sectional view of a camera module according to an embodiment of the present invention; Figure 3 is an exploded perspective view of a camera module according to an embodiment of the present invention; Figure 4 is a drawing of Figure 3 from a different angle; Figure 5 is a cross-sectional view showing the coupling structure of the first body, second body, and printed circuit board according to an embodiment of the present invention; Figure 6 is a perspective view showing a part of the lower surface of the first body in an embodiment of the present invention; Figure 7 is a perspective view showing the coupling structure of the first body and printed circuit board according to an embodiment of the present invention; Figure 8 is a cross-sectional view of the first guide according to an embodiment of the present invention; Figure 9 is a cross-sectional view showing the coupling structure of the first guide and printed circuit board according to an embodiment of the present invention; Figure 10 is a perspective view showing the upper surface of the second body according to an embodiment of the present invention; and Figure 11 is a perspective view showing the coupling structure of the first body and printed circuit board according to an embodiment of the present invention.

[0028] Referring to Figures 1 to 11, the camera module 10 according to the embodiment of the present invention may be a vehicle camera module. The camera module 10 can be coupled to a vehicle. The camera module 10 can be used as one or more of the vehicle's front camera, side camera, rear camera, and black box. The camera module 10 can be positioned at the front of the vehicle. The camera module 10 can be positioned at the rear of the vehicle. The camera module 10 can be coupled to the vehicle's windshield. The camera module 10 can be coupled to the front or rear windshield of the vehicle. The camera module 10 can be positioned on the side of the vehicle. The camera module 10 can capture a subject and output the image to a display (not shown).

[0029] The camera module 10 may include a first body 100. The first body 100 may be named as a front body, an upper housing, or a first housing. The first body 100 may include a body section 110. The first body 100 may include a barrel section 120. The first body 100 may include a lens 300. The body section 110, barrel section 120, and lens 300 of the first body 100 may be formed as a single unit. Two or more of the body section 110, barrel section 120, and lens 300 of the first body 100 may be formed as a single unit. In a modified example, the body section 110, barrel section 120, and lens 300 may each be formed separately.

[0030] The body portion 110 can be coupled to the barrel portion 120. The body portion 110 can be formed integrally with the barrel portion 120. The body portion 110 can be made of a metal material. The body portion 110 can be placed on the second body 200, which will be described later. The body portion 110 can be coupled to the second body 200. The lower end of the body portion 110 can be fixed to the second body 200. The body portion 110 can be bonded to the second body 200 with adhesive. The body portion 110 can be bonded to the printed circuit board 400, which will be described later.

[0031] The body portion 110 can be formed in a rectangular shape with an open bottom. In this case, the corners of the body portion 110 can be formed in a rounded shape. The body portion 110 can include a top plate 112 and a first side plate 114 extending from the top plate 112. The top plate 112 can be formed in a rectangular shape. The top plate 112 can extend outward from the outer peripheral surface of the lower end of the barrel portion 120. The first side plate 114 can extend downward from the outer peripheral edge of the top plate 112. The first side plate 114 can be provided in multiple quantities. The first side plate 114 can include four side plates. The first side plate 114 can be formed in a rectangular plate shape. The first side plate 114 can include a 1-1 side plate, a 1-2 side plate, a 1-3 side plate positioned on the opposite side of the 1-1 side plate, and a 1-4 side plate positioned on the opposite side of the 1-2 side plate. The first side plate 114 may include first to fourth corners positioned between the first-1st to fourth side plates. Each of the first to fourth corners may include a rounded shape in at least part of it.

[0032] A space can be formed inside the body portion 110, separated from other areas. The space can have an opening at the bottom and be covered at the top via the barrel portion 120 and the lower surface of the lens 300.

[0033] The body portion 110 may include a first peripheral region 130 (see Figures 5 and 9). The first peripheral region 130 may be located outside the space. The first peripheral region 130 may form the lower surface of the body portion 110.

[0034] The first peripheral region 130 may include a first projection 132, a second projection 180, and a first groove 134. With respect to the center of the body portion 110, the second projection 180 may be positioned inside the first projection 132, and the first groove 134 may be positioned between the first projection 132 and the second projection 180.

[0035] The first protrusion 132 can be formed to protrude downward from the lower surface of the body portion 110 compared to other areas. The lower end of the first protrusion 132 can be positioned above the upper surface of the printed circuit board 300. The lower surface of the first protrusion 132 can contact the upper surface of the second side plate 204 of the second body 200, which will be described later. The lower end of the first protrusion 132 can be positioned above the lower end of the second protrusion 180.

[0036] The second protrusion 180 can be positioned inside the first protrusion 132. The lower surface of the second protrusion 180 may be the lower surface of the first body 100. The lower surface of the second protrusion 180 can contact the upper surface of the printed circuit board 400. That is, the lower surface of the first body 100 can contact the upper surface of the printed circuit board 400. The lower end of the second protrusion 180 can protrude below the lower end of the first protrusion 132. A space can be formed inside the second protrusion 180. The inner surface of the second protrusion 180 can form the inner surface of the space.

[0037] The first groove 134 is positioned between the first projection 132 and the second projection 180 and may have a shape that is recessed above other areas. The first groove 134 may be positioned such that at least a portion of it overlaps with the second side plate 204 of the second body 200 in the optical axis direction. An inclined surface may be formed on the inner surface of the first groove 134, such that the cross-sectional area of ​​the first groove 134 becomes narrower towards the top.

[0038] An adhesive member (not shown) can be placed in the first groove 134 between the first projection 132 and the upper surface of the second side plate 204. The adhesive member may include epoxy. The first body 100 and the second body 200 can be bonded together by the curing of the epoxy. Optionally, an adhesive member can also be placed between the second projection 180 and the printed circuit board 400, and on the side surface of the printed circuit board 400.

[0039] The outer surface of the first body 100, excluding the adhesive area where the adhesive member is placed, can be coated. That is, the metal portion of the first body 100 can be exposed to the outside through the adhesive area.

[0040] The first body 100 may include a barrel portion 120. The barrel portion 120 may be a lens barrel. The barrel portion 120 may be made of a metal material. The barrel portion 120 may be positioned on the body portion 110. The barrel portion 120 may extend from the upper surface of the body portion 110. The barrel portion 120 may be formed integrally with the body portion 110. In a modified example, the barrel portion 120 may be coupled to the body portion 110. In this case, the barrel portion 120 may be fixed to the body portion 110 with an adhesive. The barrel portion 120 can house a lens 300 inside. The barrel portion 120 may include a hole 121. The lens 300 may be positioned in the hole 121 of the barrel portion 120. The inner circumferential surface of the hole in the barrel portion 120 may be formed in a shape and size corresponding to the outer circumferential shape of the lens 300.

[0041] The first body 100 may include a first guide 140. The first guide 140 may be formed to protrude downward from the lower surface of the first body 100. The first guide 140 protrudes downward from the lower surface of the upper plate 112 and at least a portion of it can be coupled to the printed circuit board 400.

[0042] In detail, the first guide 140 may include a first guide body 142 projecting downward from the lower surface of the upper plate 112, and a first projection 150 projecting downward from the lower surface of the first guide body 142. The first guide body 142 may have a shape that projects inward from the inner surface of the space within the first body 100. The lower surface of the first guide body 142 may form a coplanar plane with the lower surface of the second projection 180.

[0043] The first projection 150 can protrude downward from the lower surface of the first guide body 142. The cross-sectional area of ​​the first projection 150 can be made smaller than the cross-sectional area of ​​the first guide body 142. The lower end of the first projection 150 can be positioned below the lower surface of the second projection 180. The first projection 150 can be coupled to the first guide hole 430 of the printed circuit board 400, which will be described later. The first projection 150 can be soldered to the first guide hole 430.

[0044] The first projection 150 can be formed with a circular cross-section. The first projection 150 may include a first region 152 having a first diameter and a second region 154 located below the first region 152 and having a second diameter smaller than the first diameter. An inclined region 153 can be positioned between the first region 152 and the second region 154 to connect them. The region between the first region 152 and the second region 154 can be positioned within a first guide hole 430, which will be described later. The region between the first region 152 and the second region 154 can be positioned to overlap with a region that divides the height of the first guide hole 430 into 1 / 2 sections, with respect to the optical axis direction, in a direction perpendicular to the optical axis direction.

[0045] The outer surface of the first projection 150 can be plated. For example, a plated area of ​​Ni or Ni+Sn material can be formed on the outer surface of the first projection 150. This allows a grounding structure to be realized between the grounding area 450 of the printed circuit board 400 (described later) and the first body 100.

[0046] A relief groove 144 can be formed between the first projection 150 and the lower surface of the first body 100, having a shape that is recessed upward from other areas. The relief groove 144 can be positioned between the second projection 180 and the outer circumferential surface of the first projection 150. The relief groove 144 can have an arc-shaped cross-section. The relief groove 144 can be positioned outside the first area 152. A portion of the solder paste, such as lead, is contained through the relief groove 144, allowing the printed circuit board 400 and the first body 100 to be firmly bonded, ensuring a gap between the upper surface of the printed circuit board 400 and the first body 100, and preventing tilt between the printed circuit board 400 and the lower surface of the second projection 180.

[0047] On the other hand, the first guide 140 can be provided in multiple units and arranged at mutual distances along the periphery of the first body 100. For example, four first guides 140 can be provided and arranged in each corner region of the first body 100.

[0048] The first body 100 may include a second guide 162. The second guide 162 may be formed to protrude downward from the lower surface of the upper plate 112 and may have a coupling groove 160 in the center that is recessed upward. For example, the second guide 162 may be positioned between a plurality of adjacent first guides 140. The second guide 162 may be formed to protrude inward from the inner surface of a region that forms one side of the inner surface of the space within the first body 100. The lower surface of the second guide 162 may form a coplanar plane with the lower surface of the second projection 180.

[0049] The coupling groove 160 has a circular cross-section, allowing the second body 200 (described later) to connect with the third guide 270. An inclined surface 165 is formed in the entrance area of ​​the coupling hole 160, with a shape that narrows towards the top, thereby allowing the third guide 270 (described later) to easily enter the space within the coupling hole 160.

[0050] The first body 100 may include a lens 300. The lens 300 may be positioned in the barrel portion 120. The lens 300 may be coupled to the barrel portion 120. The lens 300 may be positioned in the hole 121 of the barrel portion 120. The lens 300 may include a plurality of lenses 310. The plurality of lenses 310 may be housed within the barrel. The lens 300 may be aligned with an image sensor, as described later. The optical axis of the lens 300 may be aligned with the optical axis of the image sensor. The optical axis of the lens 300 may coincide with the optical axis of the image sensor. The first body 100 may include an infrared filter (IR filter) positioned between the lens 300 and the image sensor.

[0051] A protruding region 320 can be provided on the outer surface of the lens 300, which protrudes outward. When the lens 300 and the first body 100 are connected, the protruding region 320 can be provided on the upper surface of the barrel portion 120. To prevent foreign matter from flowing into the space inside the first body 100, a sealing member (not shown) can be provided between the lower surface of the protruding region 320 and the upper surface of the barrel portion 120.

[0052] The camera module 10 may include a second body 200. The second body 200 may be named a rear body, a lower housing, or a second housing. The second body 200 may be formed in a rectangular shape with an open top. The second body 200 may be made of a metal material. The second body 200 may be positioned below the first body 100. The second body 200 may be coupled to the first body 100. The second body 200 may form an internal space through coupling with the first body 100. The second body 200 may include a space 207 with an open top.

[0053] The second body 200 may include a base plate 202. The base plate 202 may face the upper plate 112 of the body portion 110 of the first body 100. The base plate 202 may be spaced apart from the upper plate 112 of the body portion 110 of the first body 100 in the optical axis direction. The base plate 202 may be parallel to the upper plate 112 of the body portion 110 of the first body 100. The base plate 202 may be formed in a rectangular shape. In this case, the corners of the base plate 202 may include a rounded shape in at least part of it.

[0054] The second body 200 may include a second side plate 204. The second side plate 204 may extend from the bottom plate 202. The second side plate 204 may extend from the outer periphery of the bottom plate 202. A shield can (not shown) may be placed on the second side plate 204. The shield can may be in surface contact with the inner surface of the second side plate 204. The upper end of the second side plate 204 may be coupled to the first body 100. The upper surface of the second side plate 204 may be in contact with the lower surface of the first projection 132. The outer surface of the second side plate 204 may be coplanar with the outer surface of the first side plate 114 of the first body 100.

[0055] The second body 200 may include a connector lead-out section 290. The connector lead-out section 290 can be coupled to the bottom plate 202. The connector lead-out section 290 can be positioned in a hole (not shown) in the bottom plate 202. The connector lead-out section 290 can pass through a hole in the bottom plate 202. A connector 500 can be positioned inside the connector lead-out section 290. The connector lead-out section 290 may be made of a metal material.

[0056] When the first body 100 and the second body 200 are joined, a portion of the upper surface of the second side plate 204 is in contact with the lower surface of the first projection 132, and the other portion of the upper surface of the second side plate 204 is positioned to overlap with the first groove 134 in the optical axis direction. As a result, epoxy-cured adhesive regions can be formed between the lower surface of the first projection 132 and the upper surface of the second side plate 204, and between the first groove 134 and the upper surface of the second side plate 204.

[0057] The second body 200 may include a third guide 270. The third guide 270 may be formed to protrude upward from the upper surface of the bottom plate 202. The third guide 270 may be positioned opposite the second guide 162 in the optical axis direction. The third guide 270 may include third guide bodies 274, 276 and a second projection 272 that protrudes upward from the upper surfaces of the third guide bodies 274, 276 and connects to the coupling groove 160. The cross-sectional shape of the second projection 272 may be formed to correspond to the cross-sectional shape of the coupling groove 160.

[0058] The third guide bodies 274 and 276 may have multiple regions with different cross-sectional areas. For example, the third guide bodies 274 and 276 may include a third-first guide body 276 and a third-second guide body 274. The cross-sectional area of ​​the third-first guide body 276 may be larger than that of the third-first guide body 276. The third-first guide body 276 may be positioned below the third-second guide body 274.

[0059] To reinforce the rigidity of the third guide 270, the second body 200 may include a reinforcing portion 280 that connects the inner surfaces of the third guide bodies 274 and 276 and the second side plate 204. The length of the reinforcing portion 280 in the optical axis direction can correspond to the length of the third guide bodies 274 and 276 in the optical axis direction.

[0060] On the other hand, as described above, when the first body 100 and the second body 200 are joined, the joining structure of the second projection 272 and the joining groove 160 can guide the assembly direction of the first body 100 and the second body 200. Furthermore, the joining structure of the second projection 272 and the joining groove 160, which are positioned in a fixed location, can prevent misassembly or misalignment when the printed circuit board 400 is placed.

[0061] The camera module 10 may include a printed circuit board 400. The printed circuit board 400 can be placed between the first body 100 and the second body 200. The upper surface of the printed circuit board 400 can contact the lower surface of the second protrusion 180. The printed circuit board 400 can be placed in the space 207 within the second body 200.

[0062] An image sensor 410 can be placed on the upper surface of the printed circuit board 400. A connector 500 can be connected to the lower surface of the printed circuit board 400. The printed circuit board 400 can be electrically connected to the connector 500.

[0063] A first guide hole 430 can be placed in the area of ​​the printed circuit board 400 that faces the first guide 140. The first guide hole 430 can be formed to penetrate from the top surface to the bottom surface of the printed circuit board 400. Multiple first guide holes 430 can be provided to correspond to the number and position of the first guides 140. As an example, the first guide holes 430 can be placed in each corner area of ​​the printed circuit board 400.

[0064] Therefore, when the first body 100 and the printed circuit board 400 are joined, the first projection 150 can be joined to the first guide hole 430. The first projection 150 can be soldered to the first guide hole 430. A solder portion 250 can be placed between the outer surface of the first projection 150 and the inner surface of the first guide hole 430, and on the upper and lower surfaces of the printed circuit board 400 in the area where the first guide hole 430 is formed. With the above structure, parts such as screws for joining the printed circuit board 400 in the camera module 10 become unnecessary, thus reducing the number of parts. Furthermore, since the joint between the first body 100 and the printed circuit board 400 is firmly fixed via the solder portion 250, damage to the printed circuit board 400 due to external impact can be prevented.

[0065] On the other hand, a grounding region 450 for the ground power supply can be formed on the upper and lower surfaces of the printed circuit board 400, outside the first guide hole 430. This enables a grounding structure between the first body 100 and the printed circuit board 400.

[0066] A second guide hole 420 can be placed in the region of the printed circuit board 400 that faces the second guide 162 or the third guide 270. The second guide hole 420 can be formed to penetrate from the top surface to the bottom surface of the printed circuit board 400. When viewed from the side, the second guide hole 420 may have a groove shape that is recessed inward from other regions. A second projection 272 can be coupled to the second guide hole 420 so as to penetrate it. A portion of the lower end of the second guide 162 can be coupled to the second guide hole 420.

[0067] Therefore, with the first body 100 and the printed circuit board 400 bonded together through soldering, the bonding structure between the connector 500 and the connector lead portion 290 primarily guides the bonding direction of the second body 200, and the bonding structure of the second guide hole 420, the bonding groove 160, and the second projection 272 provides secondary guidance for the bonding of the second body 200.

[0068] With the aforementioned structure, the first body, the second body, and the printed circuit board are electrically connected to form a ground region. This prevents electromagnetic waves generated in the circuit region of the printed circuit board from being radiated to the outside, affecting adjacent electronic components, and prevents electromagnetic waves generated externally from flowing into the printed circuit board. As a result, the electrical characteristics of the camera module can be improved, noise can be prevented from being included in the electrical signal, and images of excellent quality can be obtained.

[0069] Furthermore, the bonding structure, which involves soldering the printed circuit board and the first body, has the advantage of reducing the manufacturing cost by decreasing the number of components.

[0070] Although all components constituting the embodiments of the present invention have been described above as being combined into one or operating in combination, the present invention is not necessarily limited to these embodiments. That is, within the scope of the object of the present invention, it is also possible for all components to be selectively combined into one or more components and operate in combination. Furthermore, unless otherwise stated, terms such as "contains," "constitutes," or "has" above should be interpreted as meaning that the component may be inherent, not as excluding other components, but as potentially including other components. All terms, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention belongs, unless otherwise defined. Commonly used terms, such as predefined terms, should be interpreted to be consistent with their meaning in the context of the relevant art, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the present invention.

[0071] The above description is merely illustrative of the technical concept of the present invention, and any person with ordinary skill in the art to which the present invention pertains can make various modifications and alterations without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed herein are for illustrative purposes only and not to limit the technical concept of the present invention, and these embodiments do not limit the scope of the technical concept of the present invention. The scope of protection of the present invention should be interpreted by the following claims, and all technical concepts within an equivalent scope should be interpreted as being included within the scope of the rights of the present invention.

Claims

1. The first body, including the lens, A second body which connects to the first body, Includes a printed circuit board disposed between the first body and the second body, The first body protrudes downward and includes a first guide which includes a first projection, The printed circuit board includes a first guide hole into which the first projection is connected. The first guide is soldered into the first guide hole. The first body includes a second projection that protrudes downward and contacts the upper surface of the printed circuit board. Between the second protrusion and the first guide, a relief groove is provided that is recessed compared to the surrounding area. A camera module in which at least a portion of the solder paste for soldering is contained in the relief groove.

2. The first projection includes a first region having a first diameter and a second region having a second diameter smaller than the first diameter. The camera module according to claim 1, wherein the region between the first region and the second region is located inside the first guide hole.

3. The camera module according to claim 2, wherein an inclined region is arranged between the first region and the second region.

4. The camera module according to claim 1, wherein the first guide and the first guide hole are provided in multiple quantities and are arranged in the corner regions of the first body and the printed circuit board.

5. The first body includes a second guide that protrudes downward and has a coupling groove formed in the center. The camera module according to claim 1, wherein the second body includes a third guide that protrudes upward and is coupled to the second guide.

6. The camera module according to claim 5, wherein a second guide hole is provided on the printed circuit board facing the second guide and the third guide, to which the second guide or the third guide is coupled.

7. The camera module according to claim 1, wherein epoxy is disposed between the lower surface of the first body and the upper surface of the second body.

8. A first body including an upper plate and a first side plate projecting downward from the periphery of the upper plate, A second body including a bottom plate and a second side plate projecting upward from the periphery of the bottom plate, The second body includes a printed circuit board disposed in the space within the second body, The first body includes a first guide that protrudes downward from the lower surface of the upper plate. The printed circuit board is connected to the first guide and includes a first guide hole for the ground power supply. The first guide is soldered into the first guide hole. The first body includes a second projection that protrudes downward and contacts the upper surface of the printed circuit board. Between the second protrusion and the first guide, a relief groove is provided that is recessed compared to the surrounding area. A camera module in which at least a portion of the solder paste for soldering is contained in the relief groove.

Images