Vehicle control device and vehicle

Abstract

To provide a vehicle control device having a high level of security.SOLUTION: A vehicle control device includes an operation unit, a first light receiving and emitting unit, and a control unit. The operation unit includes a steering wheel with a rim, a hub, and spokes. The rim is connected to the hub via the spokes. The first light receiving and emitting unit is provided along a surface of the hub. The first light receiving and emitting unit includes a first light emitting element and a first light receiving element. The first light emitting element has a function of emitting light in a first wavelength range. The first light receiving element has a function of receiving light in the first wavelength range and converting the light into an electrical signal. The first light emitting element and the first light receiving element are arranged side by side on the same plane. The first light receiving and emitting unit has a function of outputting first light receiving data to the control unit. The control unit has a function of acquiring first biological information of a driver from the first light receiving data and executing first processing according to the first biological information.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] One aspect of the present invention relates to a control device for a moving object such as a vehicle. Another aspect of the present invention relates to a light-receiving device. Another aspect of the present invention relates to a biosensor. Another aspect of the present invention relates to a display device.

[0002] It should be noted that one aspect of the present invention is not limited to the above-mentioned technical field. Examples of technical fields of one aspect of the present invention disclosed herein include semiconductor devices, display devices, light-emitting devices, energy storage devices, memory devices, electronic devices, lighting devices, input devices, input / output devices, methods for driving them, or methods for manufacturing them. A semiconductor device refers to any device that can function by utilizing semiconductor properties. [Background technology]

[0003] Vehicle thefts, including cars, have been occurring frequently, highlighting the need for improved security measures against theft.

[0004] Furthermore, drowsiness is one of the most common causes of accidents for drivers while operating a vehicle, and various methods for monitoring the driver's alertness are being considered. For example, Patent Document 1 discloses a technology for determining the driver's level of alertness from the vehicle's acceleration and the driver's heart rate. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2005-312653 [Overview of the project] [Problems that the invention aims to solve]

[0006] One aspect of the present invention aims to provide a vehicle control device with a high security level. One aspect of the present invention aims to provide a vehicle control device with high safety. One aspect of the present invention aims to provide a vehicle control device with high convenience. One aspect of the present invention aims to monitor the driver's state without making the driver aware. One aspect of the present invention aims to provide a vehicle control device or a vehicle control method having a novel configuration, etc.

[0007] One aspect of the present invention aims to provide a new electronic device, moving body, vehicle, device, system, program, or method using biological information. One aspect of the present invention aims to provide an electronic device, moving body, vehicle, device, system, program, or method having a novel configuration. One aspect of the present invention aims to reduce at least one of the problems of the prior art.

[0008] Note that the description of these problems does not prevent the existence of other problems. Note that one aspect of the present invention does not need to solve all of these problems. Note that other problems can be extracted from the descriptions in the specification, drawings, claims, etc.

Means for Solving the Problems

[0009] One aspect of the present invention is a vehicle control device having an operation unit, a first light transmitting and receiving unit, and a control unit. The operation unit has a steering wheel having a rim, a hub, and spokes. The rim is connected to the hub via the spokes. The first light transmitting and receiving unit is provided along the surface of the hub. The first light transmitting and receiving unit has a first light emitting element and a first light receiving element. The first light emitting element has a function of emitting light in a first wavelength range. The first light receiving element has a function of receiving light in the first wavelength range and converting it into an electrical signal. The first light emitting element and the first light receiving element are arranged side by side on the same plane. The first light transmitting and receiving unit has a function of outputting first light reception data to the control unit. The control unit has a function of acquiring first biometric information of the driver from the first light reception data and executing a first process according to the first biometric information.

[0010] Also, in the above, the first biometric information is preferably information on fingerprints, veins, or palm prints. Further, the first process is preferably an authentication process of the driver.

[0011] Also, in any of the above, the first light transmitting and receiving unit preferably has a function of displaying an image and a function as a touch sensor.

[0012] Also, in any of the above, it is preferable to further have a second light transmitting and receiving unit. The second light transmitting and receiving unit is provided along the surface of the rim. The second light transmitting and receiving unit has a second light emitting element and a second light receiving element, and the second light emitting element has a function of emitting light in a second wavelength range. Further, the second light receiving element preferably has a function of receiving light in the second wavelength range and converting it into an electrical signal.

[0013] Also, in the above, the second light transmitting and receiving unit preferably has a function of sequentially outputting second light reception data to the control unit. At this time, the control unit preferably has a function of acquiring second biometric information of the driver from a plurality of second light reception data and executing a second process according to the second biometric information.

[0014] Furthermore, in the above, the second biological information is preferably one or more of the pulse wave, heart rate, pulse rate, and arterial blood oxygen saturation. In this case, the second process is preferably a warning process for the driver.

[0015] Furthermore, in any of the above, it is preferable that the light in the second wavelength range includes infrared light.

[0016] Furthermore, in any of the above, it is preferable that the light in the first wavelength range includes visible light or infrared light.

[0017] Furthermore, in any of the above, it is preferable that the first light-emitting element has a laminated structure in which a first electrode, a first organic layer, and a common electrode are stacked. Furthermore, it is preferable that the first photodetector has a laminated structure in which a second electrode, a second organic layer, and a common electrode are stacked. In this case, it is preferable that the first organic layer includes a light-emitting layer, the second organic layer includes a photoelectric conversion layer, and the light-emitting layer and the photoelectric conversion layer each contain different organic compounds. Furthermore, it is preferable that the first electrode and the second electrode are provided spaced apart on the same plane, and the common electrode is provided covering the first organic layer and the second organic layer.

[0018] Furthermore, in the above, it is preferable that the angle between the bottom surface and the side surface of the first organic layer and the second organic layer is 60 degrees or more and 120 degrees or less, and that the side surface of the first organic layer and the side surface of the second organic layer are provided facing each other.

[0019] Another aspect of the present invention is a vehicle having any of the above-described vehicle control devices and a display device. In this case, the display device has a curved display section, and it is preferable that the display section is provided along the dashboard or pillar. [Effects of the Invention]

[0020] According to one aspect of the present invention, a vehicle control device with a high level of security can be provided. Or, a vehicle control device with high safety can be provided. Or, a vehicle control device with high convenience can be provided. Or, the driver's condition can be monitored without the driver being aware of it. Or, a vehicle control device or vehicle control method having a novel configuration can be provided.

[0021] According to one aspect of the present invention, it is possible to provide a new electronic device, mobile device, vehicle, apparatus, system, program, or method that utilizes biometric information. One aspect of the present invention can provide an electronic device, mobile device, vehicle, apparatus, system, program, or method having a novel configuration. One aspect of the present invention can mitigate at least one of the problems of the prior art.

[0022] Furthermore, the description of these effects does not preclude the existence of other effects. Moreover, one aspect of the present invention does not necessarily have to possess all of these effects. Other effects can be extracted from the description in the specification, drawings, claims, etc. [Brief explanation of the drawing]

[0023] [Figure 1] Figure 1 shows an example of a vehicle configuration. [Figure 2] Figure 2 shows an example of a vehicle configuration. [Figure 3] Figure 3A shows an example of the vehicle's configuration. Figures 3B to 3D show examples of the display unit's configuration. [Figure 4] Figure 4A shows an example of the vehicle's configuration. Figures 4B to 4E show examples of the display unit's configuration. [Figure 5] Figures 5A to 5D show examples of vehicle control system configurations. [Figure 6] Figure 6 shows an example of the configuration of a vehicle control device. [Figure 7] Figures 7A and 7B show examples of vehicle control system configurations. [Figure 8]Figures 8A and 8B show examples of vehicle control system configurations. [Figure 9] Figures 9A to 9D show examples of vehicle control system configurations. [Figure 10] Figures 10A to 10D show examples of the configuration of a vehicle control device. Figures 10E to 10G show examples of the configuration of pixels in the light-receiving unit. [Figure 11] Figure 11 is a flowchart illustrating an example of how a vehicle control device operates. [Figure 12] Figure 12 is a flowchart illustrating an example of how a vehicle control device operates. [Figure 13] Figure 13 is a flowchart illustrating an example of how a vehicle control device operates. [Figure 14] Figures 14A and 14B show examples of the configuration of a display device. [Figure 15] Figures 15A to 15C show examples of display device configurations. [Figure 16] Figures 16A, 16B, and 16D are cross-sectional views showing examples of display devices. Figures 16C and 16E are diagrams showing examples of images. Figures 16F through 16H are top views showing examples of pixels. [Figure 17] Figure 17A is a cross-sectional view showing an example of the configuration of a display device. Figures 17B to 17D are top views showing examples of pixels. [Figure 18] Figure 18A is a cross-sectional view showing an example of the configuration of a display device. Figures 18B to 18I are top views showing an example of a pixel. [Figure 19] Figures 19A to 19F show examples of the configuration of a light-emitting device. [Figure 20] Figures 20A and 20B show examples of configurations for light-emitting and light-receiving devices. [Figure 21] Figures 21A and 21B show examples of display device configurations. [Figure 22] Figures 22A to 22D show examples of display device configurations. [Figure 23] Figures 23A to 23C show examples of the configuration of a display device. [Figure 24] Figures 24A to 24D show examples of display device configurations. [Figure 25] Figures 25A to 25F show examples of display device configurations. [Figure 26] Figures 26A to 26F show examples of display device configurations. [Figure 27] Figure 27 shows an example of a display device configuration. [Figure 28] Figure 28A is a cross-sectional view showing an example of a display device. Figure 28B is a cross-sectional view showing an example of a transistor. [Figure 29] Figures 29A to 29F show examples of pixels. Figures 29G and 29H show examples of pixel circuit diagrams. [Modes for carrying out the invention]

[0024] The embodiments will be described below with reference to the drawings. However, it will be readily apparent to those skilled in the art that the embodiments can be implemented in many different ways, and their form and details can be modified in various ways without departing from the spirit and scope thereof. Accordingly, the present invention shall not be construed as being limited to the contents of the following embodiments.

[0025] In the configuration of the invention described below, the same reference numerals are used in common across different drawings for identical parts or parts having similar functions, and repeated explanations are omitted. Furthermore, when referring to similar functions, the hatch patterns are the same, and reference numerals may not be assigned.

[0026] In the figures described herein, the size of each component, the thickness of the layers, or the area may be exaggerated for clarity. Therefore, the scale is not necessarily limited to those figures.

[0027] Furthermore, ordinal numbers such as "the first," "the second," etc., used in this specification are added to avoid confusion of constituent elements and do not imply any numerical limitation.

[0028] (Embodiment 1) This embodiment describes a vehicle according to one aspect of the present invention, and a vehicle control device that can be applied to said vehicle.

[0029] [Example of vehicle configuration] Figure 1 shows an example configuration of a vehicle 50 equipped with a display unit 51 and a steering wheel 41. Figure 1 shows an example of a right-hand drive vehicle, but this is not particularly limited. For example, in the case of a left-hand drive vehicle, the left and right arrangement of the configuration shown in Figure 1 will be reversed.

[0030] Figure 1 shows the dashboard 52, steering wheel 41, windshield 54, camera 55, air vents 56, passenger-side door 58a, driver-side door 58b, etc., arranged around the driver's and passenger's seats. The display unit 51 is provided across the left and right sides of the dashboard 52.

[0031] Figure 1 shows an example in which a single display unit 51, formed using two display panels (display panel 60a and display panel 60b), is installed along a dashboard 52. Display panels 60a and 60b are positioned on the dashboard 52 such that their seam is not visible, or the width of their seam is 2 cm or less, preferably 1 cm or less. In Figure 1, the boundary between display panel 60a and display panel 60b is shown by a dashed line.

[0032] The display unit 51 is preferably equipped with a touch sensor or a non-contact proximity sensor. Alternatively, it is preferable that gesture operation using a separately provided camera or the like is possible.

[0033] The steering wheel 41 has a light-receiving unit 20. The light-receiving unit 20 has the function of emitting light and the function of capturing images. The light-receiving unit 20 can acquire biometric information such as the driver's fingerprint, palm print, or vein pattern, and the driver can be authenticated based on this biometric information. Therefore, since the vehicle cannot be started by any driver other than those who have been pre-registered, an extremely high level of security can be achieved.

[0034] The display panels 60a and 60b may also be flexible. The display panels 60a and 60b can be processed into complex shapes, making it easy to realize configurations such as providing the display unit 51 along a curved surface such as the dashboard 52, and configurations in which the display area of ​​the display unit 51 is not provided in the connection part of the steering wheel 41, instruments such as meters, and air vents 56.

[0035] Furthermore, multiple cameras 55 for capturing the rear and side conditions may be installed outside the vehicle. Figure 1 shows an example where cameras 55 are installed instead of side mirrors, but both side mirrors and cameras may be installed. CCD cameras, CMOS cameras, etc., can be used as cameras 55. In addition to these cameras, infrared cameras may also be used in combination. Since the output level of infrared cameras increases with the temperature of the subject, they can detect or extract living organisms such as people and animals.

[0036] Images captured by the camera 55 can be output to either the display unit 51 or the light-emitting / receiving unit 20, or both. The vehicle 50 can use the display unit 51 or the light-emitting / receiving unit 20 to assist the driver in operating the vehicle. For example, by using the camera 55 to capture the situation to the rear and sides with a wide field of view and displaying the image on the display unit 51 or the light-emitting / receiving unit 20, the driver can see their blind spots, thereby preventing accidents.

[0037] Furthermore, the discontinuity of the image at the seam between display panel 60a and display panel 60b may be compensated for by image processing or the like. This makes it possible to display an image where the seam is not noticeable, and improves the visibility of the display unit 51 during operation.

[0038] Alternatively, a distance image sensor may be installed on the roof of the car, and the image obtained by the distance image sensor may be displayed on the display unit 51. An image sensor, LiDAR (Light Detection and Ranging), etc., can be used as the distance image sensor. By displaying both the image obtained by the image sensor and the image obtained by the distance image sensor on the display unit 51, more information can be provided to the driver, thus assisting driving.

[0039] Furthermore, the display unit 51 may have functions for displaying map information, traffic information, television images, DVD images, etc. For example, display panels 60a and 60b can be used as a single display screen to display map information on a larger scale. The number of display panels can be increased depending on the image being displayed.

[0040] Figure 2 shows an example where the number of display panels is increased. In Figure 2, the display unit 51 is provided across the dashboard, front console, and left and right pillars. In Figure 2, an example is shown where the display unit 51 is composed of eight display panels (display panels 60a to 60h), but the number of display panels is not limited to this and may be seven or fewer, or nine or more. Display panels 60c and 60d are provided in a position corresponding to the center console. Display panels 60e and 60f are provided on the rear side of the dashboard as seen from the driver. Display panels 60g and 60h are provided along the pillars. One or more of the display panels 60a to 60h are provided along a curved surface.

[0041] The images displayed on display panels 60a to 60h can be freely configured according to the driver's preference. For example, television images, DVD images, and web videos can be displayed on the left-hand display panels 60a and 60e, map information can be displayed on the central display panel 60c, measuring instruments such as the speedometer and tachometer can be displayed on the driver's side display panels 60b and 60f, and audio information can be displayed on the display panel 60d between the driver and passenger seats. In addition, by displaying the external scenery in the driver's line of sight in real time on the display panels 60g and 60h installed on the pillars, it is possible to simulate a pillarless vehicle, reducing blind spots and thus achieving a safer vehicle.

[0042] Furthermore, Figure 2 shows that display units 59a and 59b are provided along the surfaces of the passenger-side door 58a and the driver-side door 58b, respectively. Each of the display units 59a and 59b can be formed using one or more display panels.

[0043] Display units 59a and 59b are positioned facing each other, and display unit 51 is provided on the dashboard 52 so as to connect the ends of display unit 59a and display unit 59b. As a result, the driver and the passenger in the front seat are surrounded on the front and both sides by display units 51, 59a, and 59b. For example, by displaying a continuous image on display units 59a, 51, and 59b, a high level of immersion can be provided to the driver or passenger.

[0044] The images displayed on display units 59a and 59b can also be freely configured according to the driver's or passenger's preferences. For example, if a child is sitting in the passenger seat, child-friendly content such as animation can be displayed on display unit 59a.

[0045] Furthermore, the display units 59a and 59b can display images that are synthesized from images acquired by the camera 55, etc., and are synchronized with the view from the car window. In other words, the display units 59a and 59b can also display images that appear to be transparent to the driver and passengers through the doors 58a and 58b. This allows the driver and passengers to experience a sensation as if they are floating.

[0046] Furthermore, it is preferable that at least one of the display panels 60a to 60h be a display panel with an imaging function. It is also possible to apply a display panel with an imaging function to one or more of the display panels provided in the display units 59a and 59b.

[0047] For example, the vehicle can perform biometric authentication, such as fingerprint or palm print authentication, by the driver touching the display panel. The vehicle may also have a function to adjust the environment to the driver's preferences once the driver has been authenticated by biometric authentication. For example, it is preferable to perform one or more actions after authentication, such as adjusting the seat position, adjusting the steering wheel position, adjusting the direction of the camera 55, setting the brightness of the lighting, setting the air conditioning, setting the wiper speed (frequency), setting the audio volume, and reading the audio playlist.

[0048] Furthermore, once the driver is authenticated by biometric authentication, the vehicle can be put into a drivable state, such as with the engine running or, in the case of an electric vehicle, ready to start, eliminating the need for a key, which is preferable.

[0049] While this explanation focuses on display devices surrounding the driver's and passenger's seats, display units can also be installed in the rear seats to surround passengers. For example, a display unit can be installed along the back of the driver's or passenger's seat, or along the side of the rear door.

[0050] Furthermore, as shown in Figure 3A, a spherical display unit 61 may be provided between the front and rear seats. The spherical display unit 61 allows the image to be viewed from any direction. Therefore, even if multiple people are sitting in the rear seats, there is no need to prepare a separate display device for each person, and everyone in the rear seats can see a single display unit 61. Also, by rotating the passenger seat backward, the passenger in the front seat can also see the display unit 61. In addition, when applied to an autonomous vehicle, the driver can also see the display unit 61 by rotating the driver's seat backward.

[0051] The display unit 61 can be constructed by bonding together multiple display panels 62. Figure 3B shows a schematic diagram of a single display panel, and Figure 3C shows a schematic diagram of a display unit 61 formed by bonding together multiple display panels 62.

[0052] As shown in Figure 3B, the display unit 61 has a display area 63 and a non-display area 64. The display area 63 is provided with a plurality of pixels arranged in a matrix. The non-display area 64 is provided with one or more of the following: wiring, terminals, electrodes, and drive circuits (gate drivers or source drivers). An IC chip or FPC (Flexible Printed Circuit) may also be mounted in the non-display area.

[0053] As shown in Figure 3C, by joining multiple display panels 62 so that the non-display area 64 of one display panel 62 overlaps the display area 63 of another display panel 62, the width of the seam can be reduced, making the seam less visible.

[0054] Figures 3B and 3C show an example in which a display unit 61 is constructed using multiple display panels 62, but a spherical display unit 61 may also be realized by deforming a single large display panel 62.

[0055] Figure 3D shows an unfolded view of the display panel 62 used for the spherical display unit 61. The display panel 62 shown in Figure 3D has a shape that is formed by connecting multiple units of the configuration shown in Figure 3B in the horizontal direction.

[0056] Furthermore, since the display panel can be installed along various curved surfaces, the shape of the display unit that can be realized with such a display panel is not limited to a spherical shape.

[0057] Figure 4A shows an example of an autonomous vehicle having a hemispherical display unit 61A and a display unit 61B that is shaped like a combination of a hemisphere and a cylinder inside the vehicle. The hemispherical display unit 61A is equipped with a touch sensor or proximity sensor on its surface, and the driver can perform various operations such as setting a destination and setting a route by operating the hemispherical display unit 61A. The driver can also drive the vehicle by operating the display unit 61A.

[0058] Figure 4B shows a schematic diagram of the display unit 61B, which has a shape resembling a cylinder with a hemisphere of the same diameter placed on one of its planes. Figure 4C shows an unfolded view of the display panel 62B used in the display unit 61B. The display panel 62B has a display area 63 and a non-display area 64.

[0059] Figure 4D shows a display unit 61C that resembles a cylinder with a hemisphere of the same diameter placed on one of its planes, cut in half lengthwise, and then extending the cut surface in the normal direction. Figure 4E shows an unfolded view of the display panel 62C used for the display unit 61C.

[0060] [Vehicle control system] In the following, a vehicle control device that can be incorporated into a vehicle according to one embodiment of the present invention will be described with reference to the drawings.

[0061] Figure 5A shows a block diagram of the vehicle control device 10 illustrated below. The vehicle control device 10 includes a light-receiving unit 20, a control unit 30, and an operation unit 40, etc.

[0062] The light-receiving and light-emitting unit 20 has the function of acquiring light-receiving data including the driver's biometric information and the function of outputting the light-receiving data to the control unit 30. The control unit 30 has the function of generating (acquiring) data including the driver's biometric information (also called biometric data) based on the light-receiving data supplied from the light-receiving and light-emitting unit 20 and the function of performing various processes based on the biometric data. The operation unit 40 corresponds to the means by which the driver operates the vehicle. The operation unit 40 is provided with light-receiving and light-emitting areas of the light-receiving and light-emitting unit 20 along the parts that the driver grips or touches.

[0063] The light-receiving unit 20 has the function of irradiating light onto, for example, a part of the driver's body and acquiring the reflected light as light data. By imaging a part of the skin, the light-receiving unit 20 can acquire biometric data such as fingerprints and palm prints. By using this biometric data for authentication, a key (including a smart key) to start the vehicle becomes unnecessary, and a vehicle can be realized in which the engine (or power supply) can be started by biometric authentication without carrying a key.

[0064] Here, since the light reflectivity of human skin changes periodically with blood flow, pulse wave data can be obtained from the time change in the intensity of reflected light acquired by repeatedly receiving light with the light-receiving unit 20. Various vital data can then be obtained from this pulse wave. For example, heart rate can be obtained from the period of the pulse wave. In addition, arterial blood oxygen saturation (SpO2) can be measured using two sets of received light data acquired using light of different wavelengths (for example, infrared light and red light). Furthermore, stress levels, vascular age, etc., can be obtained from highly accurate pulse waves acquired by increasing the sampling frequency. In addition, it is possible to estimate the progression of arteriosclerosis, and to estimate blood pressure using separately measured electrocardiograms and pulse waves.

[0065] The biometric data that can be used by the control unit 30 can be broadly divided into vital data and biometric authentication data. Vital data is data related to life information derived from a person's life activities, and includes data such as pulse wave, heart rate, pulse rate, arterial blood oxygen saturation, and blood pressure. On the other hand, biometric data is data derived from a person's physical characteristics that can be used for personal authentication (biometric authentication), and includes data such as fingerprints, palm prints, pulse patterns (including vein patterns and arterial patterns), iris scans, and voiceprints. In addition, data derived from a person's behavioral characteristics (for example, the position in which they grip the steering wheel) can also be included in biometric data.

[0066] The light emitted and received by the light-emitting / receiving unit 20 on a part of the driver's body can be visible light, infrared light, or ultraviolet light. In particular, it is preferable that the light includes infrared light, preferably near-infrared light. Such light is preferable because it is not visible to the driver and therefore does not interfere with the driver's driving, allowing for continuous imaging.

[0067] As shown in Figure 5A, the light-receiving unit 20 includes a light-emitting element 21, a light-receiving element 22, a drive circuit 23, and a readout circuit 24. The control unit 30 includes a data generation unit 31, a determination unit 32, and a processing unit 33, etc. The operation unit 40 includes at least a steering wheel 41. The steering wheel 41 has a rim 42, a hub 43, and spokes 44.

[0068] In the light-emitting and light-receiving section 20, it is preferable that the light-emitting element 21 and the light-receiving element 22 are arranged side by side on the same plane. The light-receiving element 22 functions as a photoelectric conversion element that receives incident light and converts it into an electrical signal. The light-receiving element 22 is sensitive to at least a portion of the light emitted by the light-emitting element 21. In particular, it is preferable that the light-emitting element 21 emits light in a wavelength range that includes infrared light, and that the light-receiving element 22 is also sensitive to light in a wavelength range that includes infrared light.

[0069] The light emitted by the light-emitting element 21 preferably includes infrared light, and more preferably near-infrared light. In particular, near-infrared light having one or more peaks in the wavelength range of 700 nm to 2500 nm can be suitably used. In particular, using light having one or more peaks in the wavelength range of 750 nm to 1000 nm is preferable because it broadens the range of materials that can be used for the active layer of the photodetector element 22.

[0070] In particular, it is preferable that the light-emitting and light-receiving section 20 is provided with a plurality of light-emitting elements 21 and a plurality of light-receiving elements 22. In this case, it is preferable that the light-emitting elements 21 and the light-receiving elements 22 are arranged side by side on the same plane. Furthermore, it is preferable that the light-emitting elements 21 and the light-receiving elements 22 are arranged alternately in one direction, or alternately in a matrix.

[0071] The light-receiving and light-emitting unit 20 may have a function to display an image by having a light-emitting element 21 that emits visible light. In this case, the light-receiving and light-emitting unit 20 may be configured to have a light-emitting element that emits visible light and a light-emitting element that emits infrared light. Furthermore, it is preferable that the light-receiving and light-emitting unit 20 functions as a touch panel or a proximity sensor panel.

[0072] As the light-emitting element 21, it is preferable to use an EL element such as an OLED (Organic Light Emitting Diode) or a QLED (Quantum-dot Light Emitting Diode). Examples of light-emitting materials for the EL element include fluorescent materials, phosphorescent materials, thermally activated delayed fluorescence (TADF) materials, and inorganic compounds (such as quantum dot materials).

[0073] As the light-receiving element 22, for example, a pn-type or pin-type photodiode can be used. The light-receiving element functions as a photoelectric conversion element that detects incident light and generates an electric charge. The amount of charge generated by the photoelectric conversion element is determined by the amount of incident light. In particular, it is preferable to use an organic photodiode having a layer containing an organic compound as the light-receiving element. Organic photodiodes are easy to thin, lighten, and enlarge in area, and also offer a high degree of freedom in shape and design, so they can be applied to various devices.

[0074] Furthermore, it is preferable to use an organic compound in the active layer of the light-receiving element 22. In this case, it is preferable to provide one electrode (also called a pixel electrode) of the light-emitting element 21 and the light-receiving element 22 on the same plane. Moreover, it is even more preferable that the other electrode of the light-emitting element 21 and the light-receiving element 22 be an electrode formed by a continuous single conductive layer (also called a common electrode). Furthermore, it is even more preferable that the light-emitting element 21 and the light-receiving element 22 have a common layer. This simplifies the manufacturing process when producing the light-emitting element 21 and the light-receiving element 22, reduces manufacturing costs, and improves manufacturing yield.

[0075] The drive circuit 23 includes a circuit for controlling the emission of light from the light-emitting element 21 and a circuit for controlling the light-receiving element 22. For example, if the light-emitting / receiving unit 20 is configured such that multiple pixels, each containing a light-emitting element 21 and a light-receiving element 22, are arranged in a matrix, the drive circuit 23 includes pixel circuits, scan line drive circuits, signal line drive circuits, and so on.

[0076] The readout circuit 24 has the function of generating light-receiving data based on the electrical signal output by the light-receiving element 22 and outputting it to the control unit 30. For example, the readout circuit 24 includes an amplification circuit, an AD conversion circuit, etc. The light-receiving data output from the readout circuit 24 to the control unit 30 is preferably digital data.

[0077] Light emitted from the light-emitting element 21 is reflected by an object that touches or approaches the light-emitting surface of the light-receiving unit 20 and incident on the light-receiving element 22. The light-receiving element 22 outputs an electrical signal corresponding to the amount of incident light. This makes it possible to detect contact or approach of an object. Alternatively, the light-emitting unit 20 may be equipped with other types of touch sensors or proximity sensors, such as capacitive, resistive, or surface acoustic wave sensors.

[0078] The data generation unit 31 has the function of generating biological data to be output to the determination unit 32 from the light-receiving data input from the light-receiving unit 20.

[0079] Vital data, a type of biological data, includes data such as pulse waves and heart rate, or various data calculated from pulse waves, which are generated from time-series data including data sampled within a certain period. In addition, imaging data such as fingerprints, palm prints, and vein patterns, generated from still images, can be used as biometric data and are included in biological data.

[0080] The determination unit 32 has the function of determining whether or not to have the processing unit 33 execute a process based on the biological data supplied from the data generation unit 31. The determination unit 32 also has the function of selecting the process to be executed by the processing unit 33 based on the biological data.

[0081] The light-receiving unit 20 and the data generation unit 31 can periodically and continuously acquire various vital data or biometric data, allowing the determination unit 32 to use this vital data or biometric data for personal authentication, driver status management, and other purposes.

[0082] For example, biometric data obtainable using visible light and infrared light include fingerprints, palm prints, vein patterns, pulse waves, respiratory rate, pulse rate, oxygen saturation, blood glucose levels, and triglyceride concentration. Other biometric data that can be obtained by other means include facial expressions, complexion, pupil size, voiceprints, and body temperature. It is preferable to use such a variety of biometric data because it allows for a comprehensive assessment of the user's health status.

[0083] For each of the multiple measured biometric data points, it is possible to individually determine whether they are within the normal range or are abnormal, and then decide on the processing based on these multiple determinations. Alternatively, for each of the multiple measured biometric data points, the driver's state may be determined (for example, whether the pulse rate is elevated, low, or normal), and then the processing may be decided based on these multiple determinations. This method has the advantage of providing a clear rationale for the obtained determinations.

[0084] Alternatively, features may be extracted from all measured biometric data, and the processing may be determined based on these features. This method makes it easy to make decisions based not only on individual biometric data but also on the correlation between multiple biometric data.

[0085] For classifiers or discriminators used to determine processing based on various biometric data, it is preferable to use machine learning models trained through machine learning. Machine learning can be broadly categorized into supervised machine learning, unsupervised machine learning, and outlier detection.

[0086] Examples of supervised machine learning include K-nearest neighbors, naive Bayes classifiers, decision trees, support vector machines, random forests, and neural networks. In particular, neural networks are suitable for extracting features from multiple sources of information because they allow learning to occur during the feature extraction stage.

[0087] Feature extraction methods used in unsupervised machine learning include principal component analysis (PCA) and non-negative matrix factorization (NMF). Classifiers include k-means clustering and DBSCAN.

[0088] A combination of supervised and unsupervised machine learning models may be used to classify multiple acquired biometric data. In this case, the labels used for each classification by the unsupervised machine learning model may be the same as those used by other supervised machine learning models.

[0089] Outlier detection determines whether acquired biometric data, or features derived from one or more biometric data points, are outliers that deviate from the normal range. When an outlier is detected, it is presumed that there is a high probability that the driver's state is deviating from normal.

[0090] Models for detecting outliers include k-nearest neighbors, Local Outlier Factor, One-class SVM, and Mahalabunus distance. For outlier detection, using multidimensional data that combines various pieces of information is effective. Performing outlier detection based on multiple pieces of information can prevent false positives. Furthermore, if the biometric data is information that changes over time depending on the user's state (e.g., pulse rate, respiratory rate), methods such as the nearest neighbor method using a sliding window, Dynamic Time Warping (DTW), or Singular Spectral Transform may be used. Additionally, for periodically changing biometric information, deviations from the prediction model can be detected using methods such as LSTM (Long Short-Term Memory).

[0091] Furthermore, the determination unit 32 may have a function to compare the fingerprint, palm print, or blood vessel shape information input from the data generation unit 31 with the driver's fingerprint, palm print, or blood vessel shape information stored in advance, and to perform a process (authentication process) to determine whether they match or not. As a method used for the authentication process performed by the determination unit 32, for example, a template matching method or a pattern matching method that compares two images and uses their similarity can be used. Alternatively, the fingerprint authentication process may be performed by inference using machine learning. In this case, it is particularly preferable that the authentication process be performed by inference using a neural network.

[0092] The processing unit 33 has the function of performing various processes according to the result of the determination unit 32.

[0093] For example, when the determination unit 32 authenticates the driver based on biometric information such as the driver's fingerprint, palm print, or vein pattern, the processing unit 33 can transition the vehicle to a drivable state (also known as an idling state). In addition, when the determination unit 32 authenticates the driver, the processing unit 33 may perform processing to adjust the in-vehicle environment to the driver's preference. For example, it is preferable that the processing unit 33 performs one or more of the following after authentication: adjusting the seat position, adjusting the steering wheel position, adjusting the direction of the side mirrors and rearview mirror, setting the brightness of the lighting, setting the air conditioning, setting the speed and frequency of the wipers, setting the audio volume, and reading the audio playback list.

[0094] Furthermore, if the determination unit 32 determines the degree of the driver's alertness, the processing unit 33 will execute a process according to that degree. For example, this could involve changing the brightness of the interior lighting, playing audio, or spraying a scent to encourage the driver to become alert. Also, if it is determined that the driver is unable to drive, the system can take actions such as changing the vehicle's driving mode to emergency automatic driving mode, flashing the hazard lights, moving the vehicle to the side of the road, and contacting the police, ambulance, and insurance company.

[0095] Furthermore, the determination unit 32 may have functions to determine whether or not alcohol has been consumed from the biological data, and functions to determine whether or not a heart attack or the like has occurred.

[0096] Furthermore, the determination unit 32 may have a function to constantly monitor whether the driver is holding the steering wheel 41. Depending on the type (level) of autonomous driving, it may be required to keep the driver holding the steering wheel 41 at all times. For example, if the determination unit 32 determines that the driver has released their hands from the steering wheel 41, the processing unit 33 may execute a process to warn the driver to hold the steering wheel 41.

[0097] The rim 42 of the steering wheel 41 functions as a grip for the driver and has an annular shape. The hub 43 is connected to an axle (shaft) extending from the vehicle and is located in the center of the steering wheel 41. The spokes 44 connect the rim 42 and the hub 43. There may be only one spoke 44, but it is preferable to have two or more as this increases the strength of the steering wheel 41. For example, it is preferable to have multiple spokes 44 (typically two to four) arranged radially around the hub 43.

[0098] The hub 43 and spokes 44 may be provided with operating switches or operating panels (touch panels).

[0099] The operating unit 40 may include, in addition to the steering wheel 41, operating levers such as column shifters and paddle shifters, as well as operating levers for turn signals, wipers, etc.

[0100] Here, it is preferable that a portion of the light-receiving unit 20 be provided on the surface of the hub 43. This allows the driver to acquire authentication data with a simple action, such as touching or holding their finger or palm over the surface of the hub 43 while seated. It is also preferable that a portion of the light-receiving unit 20 be provided along the surface of the rim 42 of the steering wheel 41. This allows light-receiving data from a portion of the driver's palm to be acquired when the driver grips the rim 42.

[0101] [Configuration Example 1-1] Figure 5B shows a perspective view of an example of a steering wheel 41 equipped with a light-receiving unit 20. Figure 5B also clearly shows a portion of the shaft 45 connected to the hub 43.

[0102] Figure 5B shows an example in which the light-receiving and light-emitting unit 20 is provided on the driver-side surface of the hub 43.

[0103] The right side of Figure 5B shows an enlarged view of a part of the light-receiving unit 20. The light-receiving unit 20 has a matrix arrangement of pixels, with three light-emitting elements 21 and one light-receiving element 22 forming a single unit (pixel). For example, a pixel may be configured to include three types of light-emitting elements 21 (red, green, and blue) and a light-receiving element 22 that is sensitive to visible light. Alternatively, it may be configured to include four types of light-emitting elements, including red, green, and blue light-emitting elements plus a light-emitting element that emits infrared light, and a light-receiving element 22 that is sensitive to infrared light, or both infrared light and visible light. Note that the arrangement method of the light-emitting elements 21 and light-receiving elements 22 is not limited to this, and various arrangement methods can be adopted.

[0104] For example, the light-receiving unit 20 can be used to acquire biometric information such as fingerprints, palm prints, and vein patterns, and perform authentication. Figure 5C shows the index finger of hand 35 touching the light-receiving unit 20. Figure 5D shows the palm of hand 35 being held over the light-receiving unit 20.

[0105] Furthermore, the light-emitting / receiving unit 20 provided on the hub 43 may have the function of displaying images and the function of detecting touch operations or gesture operations. For example, the light-emitting / receiving unit 20 may function as a touch panel. This allows the light-emitting / receiving unit 20 to display various types of information. For example, the light-emitting / receiving unit 20 can be used as a display unit for a navigation system.

[0106] [Configuration Example 1-2] Figure 6 shows an example in which a light-receiving and light-emitting unit is provided along the surface of the spoke 44.

[0107] In Figure 6, of the three spokes 44, the lower spoke 44 is equipped with a light-receiving unit 20b, the left spoke 44 is equipped with multiple light-receiving units 20c, and the right spoke 44 is equipped with multiple light-receiving units 20d. Note that the number of spokes 44 and the number of light-receiving units are not limited to these and can be changed as appropriate depending on the purpose.

[0108] The light-emitting and light-receiving units 20b, 20c, and 20d each have a configuration in which a light-emitting element and a light-receiving element are arranged side by side, similar to the light-emitting and light-receiving unit 20.

[0109] For example, the light-receiving unit 20b can acquire the driver's fingerprint information and use that information for authentication. Figure 6 shows a hand 35 with its fingers held over the light-receiving unit 20b.

[0110] Furthermore, it is preferable that the light-emitting / receiving unit 20c and the light-emitting / receiving unit 20d each function as touch sensors. By touching the light-emitting / receiving unit 20c and the light-emitting / receiving unit 20d, the driver can operate the vehicle's navigation system, audio system, call system, etc. The configuration may also allow for various operations such as adjusting the rearview mirror, adjusting the side mirrors, turning the interior lights on and off and adjusting their brightness, and opening and closing the windows.

[0111] Furthermore, it is preferable that the light-emitting and receiving units 20b, 20c, and 20d are equipped with light-emitting elements that emit visible light. Alternatively, they may be equipped with both light-emitting elements that emit visible light and light-emitting elements that emit infrared light. This allows the driver to see the location of the light-emitting and receiving units even at night. Alternatively, the light-emitting and receiving units 20b, 20c, and 20d or their vicinity may have raised or recessed areas to indicate the location of the light-emitting and receiving units.

[0112] [Configuration Examples 1-3] Figure 7A shows an example in which the light-receiving and light-emitting section 20a is provided along the surface of the annular-shaped rim 42. The rim 42 is processed so that the surface facing the driver is flat, and the light-receiving and light-emitting section 20a is provided along this flat surface.

[0113] The right side of Figure 7A shows an enlarged view of a part of the light-receiving unit 20a. In the light-receiving unit 20a, light-emitting elements 21 and light-receiving elements 22 are arranged alternately in a matrix. Note that the arrangement method of the light-emitting elements 21 and light-receiving elements 22 is not limited to this, and various arrangement methods can be adopted. For example, similar to the light-receiving unit 20, it may have multiple types of light-emitting elements that emit visible light.

[0114] Figure 7B shows the driver gripping the rim 42 with their left hand 35L and right hand 35R. At this time, the light-emitting element 21 emits light, and the light-receiving element 22 receives the light, allowing images to be taken of a portion of the palms of the driver's left hand 35L and right hand 35R. Since the light-emitting and receiving unit 20a has an annular upper surface shape similar to the surface of the rim 42, imaging can always be performed regardless of where the left hand 35L and right hand 35R are gripping the rim 42.

[0115] Since the light-emitting and receiving unit 20a is positioned on the driver-side surface of the rim 42, the unit 20a is located within the driver's field of view. In this case, by using an infrared light-emitting element as the light-emitting element 21, imaging can be performed without causing the driver to experience glare.

[0116] Furthermore, a light-emitting element that emits visible light may be used as the light-emitting element 21. In that case, it is important to keep the luminescence brightness during imaging to a level that does not dazzle the driver. For example, it is preferable to keep the luminescence brightness of the light-emitting element 21 lower at night than during the day.

[0117] Figure 8A shows an example of a schematic cross-sectional view of the rim 42.

[0118] The rim 42 has members 42a and 42b. Member 42b is translucent. The light-receiving and light-emitting section 20a is located inside the rim 42 and is provided along a part of member 42b. The light-receiving and light-emitting section 20a can emit light 25 through the translucent member 42b. Reflected light 25r reflected from the object is transmitted through member 42b and incident on the light-receiving and light-emitting section 20a.

[0119] In Figure 8A, a portion of the surface of member 42b (the side that the hand touches) is flat. This allows the imaging surface to be flat, making it possible to capture images with less distortion when capturing images used for authentication, such as fingerprints, palm prints, and blood vessel shapes.

[0120] Furthermore, as shown in Figure 8B, the surface may be curved. This allows the cross-section of the rim 42 to be annular, making it easier to grip and less likely to cause discomfort to the driver compared to the case with a flat section. In addition, a part of member 42b can function as a lens.

[0121] As shown in Figures 8A and 8B, it is preferable that the light-receiving and light-emitting unit 20a be mounted on a flat surface. This eliminates the need to provide flexibility to the light-receiving and light-emitting unit 20a, thereby reducing manufacturing costs.

[0122] [Configuration Examples 1-4] The steering wheel 41 shown in Figure 9A is an example in which the light-receiving and light-emitting section 20a is provided along the outer circumference of the rim 42.

[0123] Figure 9B shows a schematic cross-sectional view of the rim 42 at the cross-section A shown in Figure 9A. Figure 9B is roughly equivalent to Figure 8A rotated 90 degrees clockwise.

[0124] In the configuration shown in Figures 9A and 9B, the strip-shaped light-receiving and light-emitting section 20a is attached along the member 42b. Since the light-receiving and light-emitting section 20a needs to be attached to a curved surface, it is preferable that it be flexible. For example, it is preferable to use an organic resin for the substrate on which the light-emitting element 21 and the light-receiving element 22 are supported. Alternatively, a thin glass or the like that is flexible may be used as the substrate.

[0125] [Configuration Examples 1-5] The steering wheel 41 shown in Figure 9C illustrates an example where the light-receiving and light-emitting unit 20a is positioned over most of the surface of the rim 42.

[0126] Figure 9D shows a schematic cross-sectional view of the rim 42. The rim 42 has members 42a and 42b. Member 42a is located on the back side of the rim 42 (opposite the driver side). The light-receiving and light-emitting section 20a is provided along the inner surface of member 42b. The inner surface of member 42b is a curved surface (3D curved surface) that is not a developable surface, and the light-receiving and light-emitting surface of the light-receiving and light-emitting section 20a also forms a 3D curved surface. Therefore, when attaching the light-receiving and light-emitting section 20a along the inner surface of member 42a, it is preferable that the light-receiving and light-emitting section 20a is expandable and contractible. For example, it is preferable to use an elastic material such as rubber for the substrate on which the light-emitting element 21 and the light-receiving element 22 are supported in the light-receiving and light-emitting section 20a.

[0127] The configuration shown in Figure 9C allows for a larger imageable area, thereby improving imaging sensitivity. For example, when estimating pulse waves from the time change in skin reflectivity, higher sensitivity is preferable because it improves measurement accuracy. Furthermore, it allows for imaging of fingerprints, palm prints, blood vessel shapes, etc., used for authentication over a wide area, thereby improving authentication accuracy.

[0128] [Configuration Examples 1-6] The steering wheel 41 shown in Figure 10A is an example in which the light-receiving and light-emitting section 20 provided on the hub 43 is approximately the same as the outer shape of the hub 43 (in this case, a circle). By providing the light-receiving and light-emitting section 20 over approximately the entire surface of the hub 43 in this way, the design can be improved compared to the case in which the light-receiving and light-emitting section 20 is rectangular in shape.

[0129] Figure 10B shows the palm of a hand 35 being held over the light-receiving unit 20.

[0130] The surface of the hub 43 may be curved. In this case, as shown in the example of member 42b in Figure 8B, the translucent protective member covering the light-receiving surface may have a curved surface, and the light-receiving surface of the light-receiving unit 20 may be flat. Alternatively, the light-receiving surface of the light-receiving unit 20 may be curved. In this case, the light-receiving surface of the light-receiving unit 20 may be a developable surface or a three-dimensional curved surface.

[0131] Figure 10C shows an example in which the light-receiving unit 20 is provided covering the surface of the hub 43, which has an asymmetrical shape. The light-receiving unit is provided not only on the driver-side surface of the hub 43 but also on the side surface.

[0132] Figure 10D shows an exploded view of a display panel 70 that can be used in the light-receiving unit 20 shown in Figure 10C. The display panel 70 has a display area 71a in the center, and rectangular display areas 71b to 71e on each of its four sides. Drive circuits 72x and 72y are connected to the display areas 71b to 71e. Three holes 73 for passing spokes 44 are provided in the display areas 71c to 71e.

[0133] In configuration examples 1-3 to 1-6, since light-receiving units are provided on the rim 42 and the hub 43 respectively, the information acquired by the light-receiving unit 20a on the rim 42 and the information acquired by the light-receiving unit 20 on the hub 43 may be different. For example, the light-receiving unit 20 acquires an image for authentication as information, while the light-receiving unit 20a acquires the time change in skin reflectivity as information. In this case, the light-receiving unit 20 needs to capture a high-resolution image, so the light-receiving elements 22 are arranged at a high density. On the other hand, the light-receiving unit 20a does not require high resolution, so the light-receiving elements 22 are arranged at a lower density than in the light-receiving unit 20. In this way, the configuration of the light-receiving units can be different according to the information to be acquired.

[0134] Furthermore, while Figures 10A and 10B show the light-receiving and light-emitting section 20a provided on the rim 42 with the same configuration as in Figure 7A, etc., it is not limited to this, and the configuration shown in Figure 9A or Figure 9C can also be applied.

[0135] Furthermore, although the above description explains the case in which the light-receiving and light-emitting units 20 provided on the rim 42 are all provided in a continuous manner along the circumferential direction of the rim 42, the light-receiving and light-emitting units 20 do not necessarily have to be in a continuous annular shape, and may have an arc-shaped upper surface that follows the surface of the rim 42. In other words, there may be parts in the circumferential direction of the rim 42 in which no light-receiving and light-emitting units 20 are provided. Also, multiple light-receiving and light-emitting units 20 may be arranged along the surface of the rim 42. In that case, the multiple light-receiving and light-emitting units 20 may be arranged so that two adjacent light-receiving and light-emitting units 20 overlap each other, so that the light-receiving and light-emitting area is continuous along the circumferential direction of the rim 42.

[0136] [Example of configuration of the light-receiving unit] The following describes an example configuration of a light-receiving unit equipped with two or more types of light-emitting elements. The light-receiving unit illustrated below can be used not only as a light source for imaging but also for displaying images. In other words, the light-receiving unit illustrated below also functions as a display unit. Such a light-receiving unit can be applied to the light-receiving unit 20 and light-receiving units 20a to 20d, etc.

[0137] Figures 10E to 10G show enlarged views of the light-receiving and light-emitting section.

[0138] The light-receiving and light-emitting unit shown in Figure 10E includes a light-emitting element 21B that emits blue light, a light-emitting element 21IR that emits infrared light, and a light-receiving element 22. The light-receiving element 22 is a photoelectric conversion element that is sensitive to at least infrared light. The light-receiving element 22 may be sensitive to both blue and infrared light.

[0139] The light-receiving unit shown in Figure 10E is capable of displaying a blue image and illuminating in blue. Blue light is preferable because it is less dazzling and does not interfere with driving even when illuminated at night. The light-emitting element that emits visible light provided in the light-receiving unit is not limited to a light-emitting element that emits blue light; light-emitting elements of other colors such as red or green may also be used.

[0140] The light-receiving and light-emitting unit shown in Figure 10F includes a light-emitting element 21R that emits red light, a light-emitting element 21G that emits green light, a light-emitting element 21B that emits blue light, a light-emitting element 21IR that emits infrared light, and a light-receiving element 22. The light-receiving element 22 is a photoelectric conversion element that is sensitive to at least infrared light. The light-receiving element 22 may further be sensitive to at least one of red, blue, and green light.

[0141] The light-emitting and receiving unit shown in Figure 10F can display full-color images. Furthermore, even when no image is displayed, i.e., when the light-emitting and receiving unit does not emit visible light, imaging can be performed using infrared light.

[0142] The light-receiving and light-emitting unit shown in Figure 10G includes a light-emitting element 21R that emits red light, a light-emitting element 21G that emits green light, a light-emitting element 21B that emits blue light, and a light-receiving element 22. The light-receiving element 22 is sensitive to at least one of red, blue, and green light.

[0143] The light-receiving and light-emitting unit shown in Figure 10G has the function of imaging using visible light as a light source instead of infrared light. It can also display full-color images. Furthermore, compared to Figure 10F, since the light-emitting element 21IR is not provided, it is possible to arrange pixels at a higher density, and thus capture higher-resolution images. Alternatively, the area of ​​the light-receiving element can be increased, thereby increasing the sensitivity of the light-receiving element. Alternatively, the area of ​​each light-emitting element can be increased, thereby increasing the brightness of the light emission.

[0144] [Example of operation method] The following describes an example of how to operate a vehicle control device 10 according to one aspect of the present invention.

[0145] Figure 11 is a flowchart showing the operation of the vehicle control device 10. The flowchart shown in Figure 11 has steps S0 to S6.

[0146] First, in step S0, the operation begins.

[0147] In step S1, the light-receiving unit 20 or the like acquires the received light data. Specifically, the light-emitting element 21 is made to emit light, the light-receiving element 22 receives the light, and the readout circuit 24 reads the received light data. Alternatively, in step S1, the readout circuit 24 may output the received light data to the control unit 30.

[0148] In step S2, the data generation unit 31 extracts biological data. Specifically, the data generation unit 31 generates the necessary biological data from the light-receiving data supplied from the light-emitting / receiving unit 20. For example, it can generate vital data such as pulse wave waveform data, heart rate, pulse rate, blood oxygen saturation, blood pressure, stress level, blood glucose level, body temperature, triglyceride concentration, and blood alcohol concentration. It can also generate biometric data such as fingerprints, palm prints, and blood vessel shape as biological data.

[0149] In step S3, the determination unit 32 determines whether or not to execute the process. If the process is to be executed, the process proceeds to step S4. If the process is not to be executed, the process returns to step S1.

[0150] In step S3, the determination unit 32 can make a determination based on the above-described biological data. Alternatively, the determination unit 32 may make a determination based on two or more of the above-described biological data.

[0151] In step S4, the processing unit 33 executes the process.

[0152] In step S5, it is determined whether to terminate or not. Based on the processing performed in processing unit 33, if the operation is to terminate, the process proceeds to step S6 and terminates. If the operation is not to terminate (continues), the process returns to step S1.

[0153] The above is an explanation of one example of how it works.

[0154] In the above example of the driving method, various types of data can be used as biological data that can be used for determination by the determination unit 32. Furthermore, the processing performed by the processing unit 33 based on the determination by the determination unit 32 is also diverse. An example of this will be described below.

[0155] Figure 12 shows a flowchart illustrating the process of performing authentication based on biometric data and bringing the vehicle into a drivable state (idling state). In the flowchart shown in Figure 12, steps S2 to S4 in Figure 11 are replaced with steps S12 to S14.

[0156] In step S12, the data generation unit 31 extracts imaging data such as fingerprints, palm prints, and vein shapes as biometric data.

[0157] In step S13, the authentication process is performed. For example, the fingerprint, palm print, or vein pattern information obtained in step S12 is compared with the driver's biometric information that has been registered in advance, and it is determined whether they match or not. The determination can be made using an authentication method such as a pattern matching method that does not use a machine learning model, or authentication using a machine learning model. If authentication is successful (authentication OK), the process proceeds to step S14; otherwise, it returns to step S1.

[0158] In addition, if authentication fails in step S13, there is a risk of theft, so anti-theft actions may be taken, such as sounding an alarm, notifying the police and providing the current location and an image of the suspect, or locking the vehicle doors to prevent escape.

[0159] In step S14, the vehicle can be brought into a drivable state (idling state). In addition, as described above, processing may be performed to adjust the in-vehicle environment to the driver's preference.

[0160] The above is an explanation of the flowchart in Figure 12.

[0161] Figure 13 shows a flowchart illustrating the process of determining the driver's alertness and issuing a warning to the driver if there is a risk of drowsy driving. In the flowchart shown in Figure 13, steps S2 to S4 in Figure 11 are replaced with steps S22 to S24.

[0162] In step S22, the data generation unit 31 extracts heart rate as vital data.

[0163] In step S23, the determination unit 32 determines whether the level of arousal is below a certain level based on the change in heart rate. If the level of arousal is below a certain level, the process proceeds to step S24. On the other hand, if the level of arousal exceeds a certain level, the process returns to step S1.

[0164] For example, the determination unit 32 can estimate the driver's level of arousal from factors such as a decrease in heart rate or changes in heart rate variability.

[0165] In step S24, the processing unit 33 performs a warning process for the driver. The warning process can stimulate the driver's sight, hearing, touch, or smell to make the driver aware of a decrease in alertness or to encourage the driver to become alert. Specifically, the processes performed by the processing unit 33 include playing an audio message, increasing the volume, vibrating the seat, seat belt, or steering wheel, changing the brightness inside the car, opening the windows, or dispersing a fragrance from an aroma diffuser.

[0166] The above is an explanation of the flowchart in Figure 13.

[0167] Furthermore, if the driver's arousal level is too high, the system can determine that the driver is in an excited state, and it can then perform actions to make the driver aware of their condition or to calm them down.

[0168] Thus, a vehicle control device according to one aspect of the present invention can monitor various physical conditions of the driver and their changes from vital data obtainable by the light-receiving unit. Then, depending on the driver's condition, it can perform various processes to enable safe driving to continue or to avoid danger.

[0169] This embodiment can be implemented in appropriate combination with other embodiments described herein, at least in part.

[0170] (Embodiment 2) In this embodiment, an example of a laminated panel configuration, which is one type of display panel that can be easily enlarged, and an example of its application will be described with reference to the drawings.

[0171] One aspect of the present invention is a display panel that can be enlarged by arranging multiple display panels so that they partially overlap. Furthermore, of the two overlapping display panels, at least the display panel located on the display surface side (upper panel) has a portion adjacent to the display area that transmits visible light. The pixels of the lower display panel and the visible light-transmitting portion of the upper display panel are arranged to overlap. As a result, when the two display panels are viewed from the display surface side (in a plan view), the images displayed on them can be displayed seamlessly and continuously.

[0172] For example, one aspect of the present invention is a laminated panel having a first display panel and a second display panel. The first display panel has a first region, the first region having a first pixel and a second pixel. The second display panel has a second region, a third region and a fourth region. The second region has a third pixel, the third region has the function of transmitting visible light, and the fourth region has the function of blocking visible light. Furthermore, the second pixel of the first display panel and the third region of the second display panel have overlapping regions. It is also preferable that the aperture ratio of the second pixel is greater than that of the first pixel.

[0173] One or both of the first and second display panels may be a display device equipped with a light-emitting element and a light-receiving element, as illustrated above. In other words, at least one of the first pixel, second pixel, and third pixel may have a light-emitting element and a light-receiving element.

[0174] More specifically, the configuration can be as follows:

[0175] [Configuration Example 1] [Display Panel] Figure 14A is a schematic top view of a display panel 500 included in a display device according to one embodiment of the present invention.

[0176] The display panel 500 includes a display area 501, a visible light-transmitting area 510 adjacent to the display area 501, and an area 520 having a portion that blocks visible light. Figure 18A shows an example in which an FPC (Flexible Printed Circuit) 512 is provided on the display panel 500.

[0177] Here, the display panel 500 can display an image in the display area 501 even when used alone. Furthermore, the display panel 500 can capture an image using the display area 501 even when used alone.

[0178] Region 510 may be provided with, for example, a pair of substrates constituting the display panel 500, and a sealing material for sealing the display elements sandwiched between the pair of substrates. In this case, the members provided in region 510 are made of materials that are translucent to visible light.

[0179] Area 520 is provided with wiring that electrically connects to pixels included in the display area 501, for example. In addition to such wiring, it may also be provided with drive circuits for driving pixels (scan line drive circuits, signal line drive circuits, etc.), protection circuits, and other circuits. Area 520 also includes areas where terminals (also called connection terminals) that electrically connect to the FPC 512, and wiring that electrically connects to said terminals are provided.

[0180] For detailed explanations of cross-sectional configurations of display panels and other aspects, refer to other embodiments.

[0181] [Laminated Panel] A laminated panel 550 according to one aspect of the present invention comprises a plurality of the above-described display panels 500. Figure 14B shows a schematic top view of a laminated panel 550 comprising three display panels.

[0182] In the following, when describing individual display panels, components contained within each display panel, or components related to each display panel, an alphabet letter will be added after these symbols. Unless otherwise specified, the symbol "a" will be added to the lowest display panel (opposite the display surface) and its components among multiple display panels that partially overlap each other, and an alphabet letter will be added after the symbol in alphabetical order for one or more display panels and their components arranged sequentially above it. Unless otherwise specified, even when describing a configuration with multiple display panels, the alphabet letter will be omitted when describing matters common to each display panel or component.

[0183] The laminated panel 550 shown in Figure 14B comprises display panel 500a, display panel 500b, and display panel 500c.

[0184] Display panel 500b is positioned so that a portion of it overlaps the upper side (display surface side) of display panel 500a. Specifically, the display area 501a of display panel 500a and the visible light-transmitting area 510b of display panel 500b overlap, while the display area 501a of display panel 500a and the visible light-blocking area 520b of display panel 500b do not overlap.

[0185] Furthermore, a portion of the display panel 500c is positioned on top of the display panel 500b (on the display surface side). Specifically, the display area 501b of the display panel 500b and the visible light-transmitting area 510c of the display panel 500c overlap, while the display area 501b of the display panel 500b and the visible light-blocking area 520c of the display panel 500c do not overlap.

[0186] Since the visible light-transmitting area 510b is superimposed on the display area 501a, the entire display area 501a can be viewed from the display surface side. Similarly, the entire display area 501b can also be viewed from the display surface side by superimposing area 510c. Therefore, the area in which the display areas 501a, 501b, and 501c are arranged seamlessly can be made into the display area 551 of the laminated panel 550.

[0187] The stacked panel 550 can expand the display area 551 by the number of display panels 500. In this case, by using display panels with imaging capabilities (i.e., display panels having pixels with light-emitting elements and light-receiving elements) for all of the display panels 500, the entire display area 551 can be used as an imaging area.

[0188] However, this is not limited to the above, and a display panel with imaging capabilities may be combined with a display panel without imaging capabilities (for example, one without a light-receiving element). For example, a display panel with imaging capabilities may be applied only to the necessary parts, and a display panel without imaging capabilities may be applied to the rest.

[0189] [Configuration Example 2] Figure 14B shows a configuration in which multiple display panels 500 are stacked in one direction, but multiple display panels 500 may also be stacked in two directions, vertically and horizontally.

[0190] Figure 15A shows an example of a display panel 500 in which the shape of the region 510 differs from that of Figure 14A. In the display panel 500 shown in Figure 15A, a region 510 that transmits visible light is arranged along two sides of the display region 501.

[0191] Figure 15B shows a schematic perspective view of a laminated panel 550 in which two display panels 500, as shown in Figure 15A, are arranged vertically and horizontally. Figure 15C is a schematic perspective view of the laminated panel 550 as seen from the opposite side from the display surface.

[0192] In Figures 15B and 15C, the area along the short side of the display area 501a of display panel 500a and a portion of the area 510b of display panel 500b overlap. Also, the area along the long side of the display area 501a of display panel 500a and a portion of the area 510c of display panel 500c overlap. Furthermore, the area 510d of display panel 500d overlaps with the area along the long side of the display area 501b of display panel 500b and the area along the short side of the display area 501c of display panel 500c.

[0193] Therefore, as shown in Figure 15B, the area in which display areas 501a, 501b, 501c, and 501d are arranged seamlessly can be designated as the display area 551 of the laminated panel 550.

[0194] Here, it is preferable that the pair of substrates used in the display panel 500 are made of a flexible material, so that the display panel 500 is flexible. By doing so, for example, as shown in the display panel 500a in Figures 15B and 15C, when an FPC 512a is provided on the display surface side, a part of the display panel 500a on the side where the FPC 512a is provided can be curved, and the FPC 512a can be positioned so that it overlaps with the underside of the display area 501b of the adjacent display panel 500b. As a result, the FPC 512a can be positioned without physically interfering with the back surface of the display panel 500b. In addition, when the display panel 500a and the display panel 500b are overlapped and bonded together, it is not necessary to consider the thickness of the FPC 512a, so the height difference between the upper surface of the area 510b of the display panel 500b and the upper surface of the display area 501a of the display panel 500a can be reduced. As a result, it is possible to suppress the visibility of the edge of the display panel 500b located on the display area 501a.

[0195] Furthermore, by giving each display panel 500 flexibility, the display panel 500b can be gently curved so that the height of the top surface of the display area 501b of the display panel 500b matches the height of the top surface of the display area 501a of the display panel 500a. Therefore, except for the vicinity of the area where the display panels 500a and 500b overlap, the heights of each display area can be made equal, thereby improving the display quality of the image displayed in the display area 551 of the stacked panel 550.

[0196] The above explanation used the relationship between display panel 500a and display panel 500b as an example, but the same applies to two adjacent display panels.

[0197] Furthermore, in order to reduce the height difference between two adjacent display panels 500, it is preferable that the thickness of the display panels 500 be thin. For example, it is preferable that the thickness of the display panels 500 be 1 mm or less, preferably 300 μm or less, and more preferably 100 μm or less.

[0198] Furthermore, a substrate (for example, the second substrate in Embodiment 1) may be provided to protect the display area 551 of the laminated panel 550. In this case, the substrate may be provided for each display panel, or a single substrate may be provided across multiple display panels.

[0199] Although this example shows a configuration with four display panels 500 stacked on top of each other, increasing the number of display panels 500 makes it possible to create extremely large stacked panels. Furthermore, by changing the arrangement of the multiple display panels 500, the outline shape of the display area of ​​the stacked panel can be made into various shapes such as circles, ellipses, or polygons. In addition, by arranging the display panels 500 three-dimensionally, it is possible to realize a stacked panel with a display area having a three-dimensional shape.

[0200] This embodiment can be implemented in appropriate combination with other embodiments described herein, at least in part.

[0201] (Embodiment 3) This embodiment describes a light-receiving and light-emitting device according to one aspect of the present invention. The display device exemplified below can be suitably used in the light-receiving and light-emitting section of the vehicle control device described in Embodiment 1.

[0202] The light-receiving and light-emitting unit of one embodiment of the present invention has a light-receiving element (also called a light-receiving device) and a light-emitting element (also called a light-emitting device). The light-receiving and light-emitting unit has the function of displaying an image using the light-emitting element. Furthermore, the light-receiving and light-emitting unit has one or both of the functions of capturing an image and / or detecting an image using the light-receiving element. Therefore, the light-receiving and light-emitting unit of one embodiment of the present invention can also be described as a display device, and the light-receiving and light-emitting unit can also be described as a display unit.

[0203] Alternatively, the light-receiving and light-emitting device according to one aspect of the present invention may have a configuration comprising a light-receiving and light-emitting element (also called a light-receiving and light-emitting device) and a light-emitting element.

[0204] First, we will describe a light-receiving and light-emitting device having a light-receiving element and a light-emitting element.

[0205] One embodiment of the present invention provides a light-receiving and light-emitting device having a light-receiving element and a light-emitting element in its light-receiving and light-emitting section. In one embodiment of the present invention, the light-emitting elements are arranged in a matrix in the light-receiving and light-emitting device, and the light-receiving and light-emitting device can display an image. Furthermore, the light-receiving and light-emitting device also has light-receiving elements arranged in a matrix, and the light-receiving and light-emitting device has either an imaging function or a detection function, or both. The light-receiving and light-emitting device can be used as an image sensor, a touch sensor, etc. That is, by detecting light in the light-receiving and light-emitting device, it is possible to capture an image or detect touch operations of an object (finger, pen, etc.). Moreover, in one embodiment of the present invention, the light-emitting elements can be used as a light source for a sensor. Therefore, it is not necessary to provide a separate light-receiving section and light source from the light-receiving and light-emitting device, and the number of components in the electronic device can be reduced.

[0206] In one embodiment of the present invention, when an object reflects (or scatters) the light emitted by the light-emitting element of the light-emitting unit, the light-receiving element can detect the reflected (or scattered) light, making it possible to perform tasks such as image capture and touch operation detection even in dark places.

[0207] A light-emitting element in a light-receiving device according to one aspect of the present invention functions as a display element (also called a display device).

[0208] It is preferable to use EL elements (also called EL devices) such as OLEDs and QLEDs as light-emitting elements. Examples of light-emitting materials for EL elements include fluorescent materials, phosphorescent materials, and thermally activated delayed fluorescence (TADF) materials. Not only organic compounds but also inorganic compounds (such as quantum dot materials) can be used as light-emitting materials for EL elements. In addition, LEDs such as microLEDs can also be used as light-emitting elements.

[0209] A light-receiving and light-emitting device according to one aspect of the present invention has the function of detecting light using a light-receiving element.

[0210] When a light-receiving element is used as an image sensor, the light-receiving and light-emitting device can capture an image using the light-receiving element. For example, the light-receiving and light-emitting device can be used as a scanner.

[0211] An electronic device to which a light-receiving device according to one aspect of the present invention is applied can acquire data related to biometric information such as fingerprints and palm prints using its function as an image sensor. In other words, a biometric authentication sensor can be built into the light-receiving device. By building a biometric authentication sensor into the light-receiving device, the number of components in the electronic device can be reduced compared to a case where a separate biometric authentication sensor is provided in addition to the light-receiving device, enabling miniaturization and weight reduction of the electronic device.

[0212] Furthermore, when a light-receiving element is used in a touch sensor, the light-receiving and light-emitting device can use the light-receiving element to detect touch operations on the object.

[0213] For example, a pn-type or pin-type photodiode can be used as the light-receiving element. The light-receiving element functions as a photoelectric conversion element (also called a photoelectric conversion device) that detects light incident on it and generates an electric charge. The amount of charge generated from the light-receiving element is determined by the amount of light incident on it.

[0214] In particular, it is preferable to use an organic photodiode having a layer containing an organic compound as the light-receiving element. Organic photodiodes can be easily made thinner, lighter, and larger in area, and because they offer a high degree of freedom in shape and design, they can be applied to a variety of devices.

[0215] In one aspect of the present invention, an organic EL element (also called an organic EL device) is used as a light-emitting element, and an organic photodiode is used as a light-receiving element. The organic EL element and the organic photodiode can be formed on the same substrate. Therefore, an organic photodiode can be incorporated into a display device using an organic EL element.

[0216] If all the layers constituting an organic EL element and an organic photodiode were to be fabricated separately, the number of film deposition steps would become enormous. However, since organic photodiodes have many layers that can share the same configuration as organic EL elements, the increase in film deposition steps can be suppressed by depositing these common layers in a single batch.

[0217] For example, one of a pair of electrodes (the common electrode) can be a common layer for both the photodetector and the light-emitting element. Alternatively, at least one of the hole injection layer, hole transport layer, electron transport layer, and electron injection layer can be a common layer for both the photodetector and the light-emitting element. By having a common layer for both the photodetector and the light-emitting element in this way, the number of film deposition cycles and masks can be reduced, thereby reducing the manufacturing process and cost of the light-receiving device. Furthermore, a light-receiving device with a photodetector can be manufactured using existing manufacturing equipment and methods for display devices.

[0218] Next, we will describe a light-emitting / receiving element and a light-emitting / receiving device having a light-emitting element. Note that explanations of functions, operations, and effects similar to those described above may be omitted.

[0219] In one embodiment of the present invention, a sub-pixel exhibiting one of the colors has a light-receiving element instead of a light-emitting element, while a sub-pixel exhibiting another color has a light-emitting element. The light-receiving element has both a function of emitting light (light emission function) and a function of receiving light (light receiving function). For example, if a pixel has three sub-pixels, a red sub-pixel, a green sub-pixel, and a blue sub-pixel, at least one sub-pixel has a light-receiving element, and the other sub-pixels have light-emitting elements. Therefore, the light-receiving unit of one embodiment of the present invention has the function of displaying an image using both a light-receiving element and a light-emitting element.

[0220] By having the light-emitting element serve as both the light-emitting element and the light-receiving element, it is possible to add a light-receiving function to a pixel without increasing the number of subpixels included in the pixel. This makes it possible to add either or both an imaging function and a detection function to the light-emitting section of the light-emitting device while maintaining the aperture ratio of the pixel (aperture ratio of each subpixel) and the resolution of the light-emitting device. Therefore, in one embodiment of the present invention, the aperture ratio of the pixel can be increased and high resolution can be easily achieved compared to a case in which subpixels having light-receiving elements are provided separately from subpixels having light-emitting elements.

[0221] In one embodiment of the present invention, a light-receiving and light-emitting device has a light-receiving and light-emitting element arranged in a matrix in the light-receiving and light-emitting section, and can display an image in the light-receiving and light-emitting section. The light-receiving and light-emitting section can also be used as an image sensor, a touch sensor, etc. In one embodiment of the present invention, the light-emitting element can be used as a light source for a sensor. Therefore, imaging and detection of touch operations are possible even in dark places.

[0222] Light-emitting and receiving devices can be fabricated by combining organic EL elements and organic photodiodes. For example, a light-emitting and receiving device can be fabricated by adding an active layer of an organic photodiode to the stacked structure of an organic EL element. Furthermore, when fabricating a light-emitting and receiving device by combining an organic EL element and an organic photodiode, the number of deposition steps can be suppressed by depositing layers that can share a common structure with the organic EL element in a single deposition process.

[0223] For example, one of a pair of electrodes (the common electrode) can be a layer common to both the light-receiving and light-emitting elements. Alternatively, at least one of the hole injection layer, hole transport layer, electron transport layer, and electron injection layer may be a layer common to both the light-receiving and light-emitting elements.

[0224] Furthermore, the function of the layers in a light-receiving element may differ depending on whether the element functions as a light-receiving element or as a light-emitting element. In this specification, the components are referred to based on their function when the element functions as a light-emitting element.

[0225] The light-emitting and light-receiving device of this embodiment has the function of displaying an image using a light-emitting element and a light-receiving element. In other words, the light-emitting element and the light-receiving element function as display elements.

[0226] The light-receiving and light-emitting device of this embodiment has the function of detecting light using a light-receiving and light-emitting element. The light-receiving and light-emitting element can detect light with a shorter wavelength than the light it emits itself.

[0227] When the light-emitting and receiving element is used as an image sensor, the light-emitting and receiving device of this embodiment can capture an image using the light-emitting and receiving element. Furthermore, when the light-emitting and receiving element is used as a touch sensor, the light-emitting and receiving device of this embodiment can detect touch operations on an object using the light-emitting and receiving element.

[0228] The light-receiving element functions as a photoelectric conversion element. The light-receiving element can be fabricated by adding an active layer of a light-receiving element to the configuration of the light-receiving element described above. For example, the active layer of a pn-type or pin-type photodiode can be used for the light-receiving element.

[0229] In particular, it is preferable to use an organic photodiode with an active layer containing an organic compound as the light-emitting and receiving element. Organic photodiodes can be easily made thinner, lighter, and larger in area, and because they offer a high degree of freedom in shape and design, they can be applied to a variety of devices.

[0230] In the following section, a display device, which is an example of a light-receiving and light-emitting device according to one aspect of the present invention, will be described in more detail with reference to the drawings.

[0231] [Example of display device configuration 1] [Configuration Example 1-1] Figure 16A shows a schematic diagram of the display panel 200. The display panel 200 includes a substrate 201, a substrate 202, a light-receiving element 212, a light-emitting element 211R, a light-emitting element 211G, a light-emitting element 211B, a functional layer 203, and the like.

[0232] The light-emitting elements 211R, 211G, 211B, and 212 are located between substrates 201 and 202. The light-emitting elements 211R, 211G, and 211B emit red (R), green (G), or blue (B) light, respectively. In the following, when light-emitting elements 211R, 211G, and 211B are not distinguished, they may be referred to simply as "light-emitting element 211."

[0233] The display panel 200 has a plurality of pixels arranged in a matrix. Each pixel has one or more subpixels. Each subpixel has one light-emitting element. For example, a pixel can have a configuration with three subpixels (three colors: R, G, B, or three colors: yellow (Y), cyan (C), and magenta (M)), or a configuration with four subpixels (four colors: R, G, B, and white (W), or four colors: R, G, B, and Y). Furthermore, each pixel has a light-receiving element 212. The light-receiving element 212 may be provided in all pixels or in some pixels. Also, a single pixel may have multiple light-receiving elements 212.

[0234] Figure 16A shows how a finger 220 touches the surface of the substrate 202. A portion of the light emitted by the light-emitting element 211G is reflected at the contact point between the substrate 202 and the finger 220. A portion of the reflected light is then incident on the light-receiving element 212, allowing detection that the finger 220 has touched the substrate 202. In other words, the display panel 200 can function as a touch panel.

[0235] The functional layer 203 includes circuits for driving the light-emitting elements 211R, 211G, and 211B, and a circuit for driving the light-receiving element 212. The functional layer 203 is provided with switches, transistors, capacitors, wiring, etc. However, when the light-emitting elements 211R, 211G, 211B, and the light-receiving element 212 are driven in a passive matrix manner, the configuration may be made without switches, transistors, etc.

[0236] The display panel 200 preferably has a function to detect the fingerprint of the finger 220. Figure 16B schematically shows an enlarged view of the contact area when the finger 220 is in contact with the substrate 202. Figure 16B also shows alternately arranged light-emitting elements 211 and light-receiving elements 212.

[0237] Fingerprints are formed on finger 220 by recesses and protrusions. Therefore, as shown in Figure 16B, the protrusions of the fingerprints are in contact with the substrate 202.

[0238] Light reflected from a surface or interface can be either specular or diffuse. Specularly reflected light is highly directional, with the angle of incidence and the angle of reflection being the same, while diffusely reflected light is less directional, with low angle dependence of intensity. The light reflected from the surface of finger 220 is predominantly diffuse. On the other hand, the light reflected from the interface between substrate 202 and the atmosphere is predominantly specular.

[0239] The intensity of light reflected from the contact or non-contact surface between the finger 220 and the substrate 202, and incident on the photodetector 212 located directly beneath them, is the sum of specularly reflected light and diffusely reflected light. As described above, in the recessed areas of the finger 220, the substrate 202 and the finger 220 do not come into contact, so specularly reflected light (indicated by the solid arrow) is dominant, while in the convex areas, they come into contact, so diffusely reflected light from the finger 220 (indicated by the dashed arrow) is dominant. Therefore, the intensity of light received by the photodetector 212 located directly beneath the recessed areas is higher than that received by the photodetector 212 located directly beneath the convex areas. This allows for imaging of the fingerprint of the finger 220.

[0240] The spacing between the light-receiving elements 212 is set to be smaller than the distance between two protrusions of a fingerprint, preferably the distance between adjacent recesses and protrusions, thereby enabling the acquisition of a clear fingerprint image. Since the distance between recesses and protrusions in a human fingerprint is approximately 200 μm, for example, the spacing between the light-receiving elements 212 is 400 μm or less, preferably 200 μm or less, more preferably 150 μm or less, even more preferably 100 μm or less, and even more preferably 50 μm or less, and 1 μm or more, preferably 10 μm or more, and more preferably 20 μm or more.

[0241] Figure 16C shows an example of a fingerprint image captured by the display panel 200. In Figure 16C, the outline of the finger 220 is shown with a dashed line and the outline of the contact area 221 is shown with a dashed line within the imaging range 223. Within the contact area 221, a high-contrast fingerprint 222 can be captured due to the difference in the amount of light incident on the light-receiving element 212.

[0242] The display panel 200 can also function as a touch panel and a pen tablet. Figure 16D shows the tip of the stylus 225 in contact with the substrate 202 and being slid in the direction of the dashed arrow.

[0243] As shown in Figure 16D, diffusely reflected light diffused at the contact surface between the tip of the stylus 225 and the substrate 202 is incident on the light-receiving element 212 located in the portion overlapping with the contact surface, thereby enabling high-precision detection of the position of the tip of the stylus 225.

[0244] Figure 16E shows an example of the trajectory 226 of the stylus 225 detected by the display panel 200. Because the display panel 200 can detect the position of the object being detected, such as the stylus 225, with high positional accuracy, it is possible to perform high-resolution drawing in drawing applications, etc. Furthermore, unlike when using capacitive touch sensors or electromagnetic induction type touch pens, it is possible to detect the position of the object being detected even if it has high insulating properties, so the material of the tip of the stylus 225 is not a concern, and various writing instruments (e.g., brushes, glass pens, quill pens, etc.) can be used.

[0245] Here, Figures 16F to 16H show an example of a pixel applicable to the display panel 200.

[0246] The pixels shown in Figures 16F and 16G each have a red (R) light-emitting element 211R, a green (G) light-emitting element 211G, a blue (B) light-emitting element 211B, and a light-receiving element 212. Each pixel has a pixel circuit for driving the light-emitting elements 211R, 211G, 211B, and the light-receiving element 212.

[0247] Figure 16F shows an example where three light-emitting elements and one photodetector are arranged in a 2x2 matrix. Figure 16G shows an example where three light-emitting elements are arranged in a row, with a horizontally elongated photodetector 212 positioned below them.

[0248] The pixel shown in FIG. 16H is an example having a white (W) light-emitting element 211W. Here, four light-emitting elements are arranged in a row, and a light-receiving element 212 is arranged below them.

[0249] Note that the configuration of the pixel is not limited to the above, and various arrangement methods can be adopted.

[0250] 〔Configuration Example 1-2〕 Hereinafter, an example of a configuration including a light-emitting element that exhibits visible light, a light-emitting element that exhibits infrared light, and a light-receiving element will be described.

[0251] The display panel 200A shown in FIG. 17A has a light-emitting element 211IR in addition to the configuration illustrated in FIG. 16A. The light-emitting element 211IR is a light-emitting element that emits infrared light IR. At this time, it is preferable to use, as the light-receiving element 212, an element that can receive at least the infrared light IR emitted by the light-emitting element 211IR. More preferably, as the light-receiving element 212, an element that can receive both visible light and infrared light is used.

[0252] As shown in FIG. 17A, when a finger 220 touches the substrate 202, the infrared light IR emitted from the light-emitting element 211IR is reflected by the finger 220, and a part of the reflected light is incident on the light-receiving element 212, whereby the position information of the finger 220 can be obtained.

[0253] FIGS. 17B to 17D show an example of a pixel applicable to the display panel 200A.

[0254] FIG. 17B is an example in which three light-emitting elements are arranged in a row, and below them, the light-emitting element 211IR and the light-receiving element 212 are arranged side by side horizontally. FIG. 17C is an example in which four light-emitting elements including the light-emitting element 211IR are arranged in a row, and below them, the light-receiving element 212 is arranged.

[0255] FIG. 17D is an example in which three light-emitting elements and the light-receiving element 212 are arranged in four directions around the light-emitting element 211IR.

[0256] In addition, in the pixels shown in Figures 17B to 17D, the positions of the light-emitting elements and the light-emitting elements and the light-receiving elements are interchangeable.

[0257] [Configuration Examples 1-3] The following describes an example of a configuration comprising a light-emitting element that emits visible light and a light-receiving element that emits and receives visible light.

[0258] The display panel 200B shown in Figure 18A includes a light-emitting element 211B, a light-emitting element 211G, and a light-receiving element 213R. The light-receiving element 213R has the function of a light-emitting element that emits red (R) light and a function of a photoelectric conversion element that receives visible light. Figure 18A shows an example in which the light-receiving element 213R receives green (G) light emitted by the light-emitting element 211G. The light-receiving element 213R may also receive blue (B) light emitted by the light-emitting element 211B. Furthermore, the light-receiving element 213R may receive both green and blue light.

[0259] For example, it is preferable that the light-receiving element 213R receives light with a shorter wavelength than the light it emits. Alternatively, the light-receiving element 213R may be configured to receive light with a longer wavelength than the light it emits (e.g., infrared light). The light-receiving element 213R may also be configured to receive light with a wavelength similar to the light it emits, but in that case, it may also receive the light it emits, which may reduce its luminescence efficiency. Therefore, it is preferable that the light-receiving element 213R is configured such that the peaks of its emission spectrum and the peaks of its absorption spectrum do not overlap as much as possible.

[0260] Furthermore, the light emitted by the light-receiving element is not limited to red light. Nor is the light emitted by the light-emitting element limited to a combination of green and blue light. For example, the light-receiving element can emit green or blue light and receive light of a different wavelength than the light it emits.

[0261] In this way, by having the light-emitting element 213R serve as both a light-emitting element and a light-receiving element, the number of elements arranged in a single pixel can be reduced. This makes it easier to achieve higher resolution, higher aperture ratio, and higher resolution.

[0262] Figures 18B to 18I show examples of pixels applicable to the display panel 200B.

[0263] Figure 18B shows an example where the light-emitting element 213R, light-emitting element 211G, and light-emitting element 211B are arranged in a single row. Figure 18C shows an example where the light-emitting elements 211G and 211B are arranged alternately in the vertical direction, with the light-emitting element 213R positioned to the side of them.

[0264] Figure 18D shows an example where three light-emitting elements (light-emitting elements 211G, 211B, and 211X) and one light-receiving element are arranged in a 2x2 matrix. Light-emitting element 211X is an element that emits light other than R, G, and B. Examples of light other than R, G, and B include white (W), yellow (Y), cyan (C), magenta (M), infrared (IR), and ultraviolet (UV) light. If light-emitting element 211X emits infrared light, it is preferable that the light-receiving element has the function of detecting infrared light, or the function of detecting both visible light and infrared light. The wavelength of light detected by the light-receiving element can be determined according to the application of the sensor.

[0265] Figure 18E shows two pixels. The area enclosed by the dotted line, containing three elements, corresponds to one pixel. Each pixel has an element-emitting element 211G, an element-emitting element 211B, and an element-receiving element 213R. In the left pixel shown in Figure 18E, the element-emitting element 211G is located in the same row as the element-receiving element 213R, and the element-emitting element 211B is located in the same column as the element-receiving element 213R. In the right pixel shown in Figure 18E, the element-emitting element 211G is located in the same row as the element-receiving element 213R, and the element-emitting element 211B is located in the same column as the element-emitting element 211G. In the pixel layout shown in Figure 18E, the element-receiving element 213R, element-emitting element 211G, and element-emitting element 211B are repeatedly arranged in both odd and even rows, and in each column, the element-emitting element or element-receiving element with different emission colors are arranged in odd and even rows.

[0266] Figure 18F shows four pixels to which a PenTile array has been applied, and two adjacent pixels have light-emitting or light-receiving elements that emit two different colored light in different combinations. Figure 18F also shows the top surface shape of the light-emitting or light-receiving elements.

[0267] In Figure 18F, the upper left and lower right pixels have a light-emitting element 213R and a light-emitting element 211G. The upper right and lower left pixels have a light-emitting element 211G and a light-emitting element 211B. In other words, in the example shown in Figure 18F, each pixel is provided with a light-emitting element 211G.

[0268] The top surface shape of the light-emitting element and the light-receiving element is not particularly limited and can be a circle, ellipse, polygon, polygon with rounded corners, etc. Figure 18F shows an example where the top surface shape of the light-emitting element and the light-receiving element are a square (rhombus) tilted at approximately 45 degrees. Note that the top surface shapes of the light-emitting element and the light-receiving element of each color may be different from each other, or they may be the same for some or all colors.

[0269] Also, the sizes of the light-emitting regions (or light-receiving and emitting regions) of the light-emitting elements and light-receiving and emitting elements of each color may be different from each other, or may be the same for some or all colors. For example, in FIG. 18F, the area of the light-emitting region of the light-emitting element 211G provided in each pixel may be made smaller than the light-emitting regions (or light-receiving and emitting regions) of other elements.

[0270] FIG. 18G is a modified example of the pixel arrangement shown in FIG. 18F. Specifically, the configuration of FIG. 18G is obtained by rotating the configuration of FIG. 18F by 45 degrees. In FIG. 18F, it was described that one pixel has two elements, but as shown in FIG. 18G, it can also be considered that one pixel is composed of four elements.

[0271] FIG. 18H is a modified example of the pixel arrangement shown in FIG. 18F. The upper left pixel and the lower right pixel shown in FIG. 18H have the light-receiving and emitting element 213R and the light-emitting element 211G. Also, the upper right pixel and the lower left pixel have the light-receiving and emitting element 213R and the light-emitting element 211B. That is, in the example shown in FIG. 18H, the light-receiving and emitting element 213R is provided in each pixel. Since the light-receiving and emitting element 213R is provided in each pixel, the configuration shown in FIG. 18H can perform imaging with higher resolution than the configuration shown in FIG. 18F. Thereby, for example, the accuracy of biometric authentication can be improved.

[0272] FIG. 18I is a modified example of the pixel arrangement shown in FIG. 18H, and is a configuration obtained by rotating the pixel arrangement by 45 degrees.

[0273] In FIG. 18I, it is described that one pixel is composed of four elements (two light-emitting elements and two light-receiving and emitting elements). Thus, by having a plurality of light-receiving and emitting elements having a light-receiving function in one pixel, imaging with high resolution can be performed. Therefore, the accuracy of biometric authentication can be improved. For example, the imaging resolution can be made √2 times the display resolution.

[0274] A display device to which the configuration shown in Figure 18H or Figure 18I is applied has p (where p is an integer greater than or equal to 2) first light-emitting elements, q (where q is an integer greater than or equal to 2) second light-emitting elements, and r (where r is an integer greater than p and greater than q) receiving light-emitting elements. p and r satisfy r = 2p. Also, p, q, and r satisfy r = p + q. One of the first light-emitting elements and the second light-emitting elements emits green light, and the other emits blue light. The receiving light-emitting elements emit red light and have a light-receiving function.

[0275] For example, when detecting touch operations using a light-emitting / receiving device, it is preferable that the light emitted from the light source is not easily visible to the user. Since blue light is less visible than green light, it is preferable to use a light-emitting device that emits blue light as the light source. Therefore, it is preferable that the light-emitting / receiving device has the function of receiving blue light. However, it is not limited to this, and the light-emitting device used as the light source can be appropriately selected according to the sensitivity of the light-emitting / receiving device.

[0276] As described above, various pixel arrangements can be applied to the display device of this embodiment.

[0277] This embodiment can be implemented in appropriate combination with other embodiments described herein, at least in part.

[0278] (Embodiment 4) In this embodiment, a light-emitting element (also called a light-emitting device) and a light-receiving element (also called a light-receiving device) that can be used in a light-receiving device according to one aspect of the present invention will be described.

[0279] In this specification, devices fabricated using a metal mask or an FMM (Fine Metal Mask, a high-resolution metal mask) may be referred to as MM (Metal Mask) structured devices. Furthermore, in this specification, devices fabricated without using a metal mask or an FMM may be referred to as MML (Metal Maskless) structured devices.

[0280] In this specification, a structure in which different light-emitting layers are created or painted for each color of light-emitting device (here, blue (B), green (G), and red (R)) may be referred to as an SBS (Side By Side) structure. Also, in this specification, a light-emitting device capable of emitting white light may be referred to as a white light-emitting device. A white light-emitting device can be combined with a colored layer (for example, a color filter) to create a full-color display device.

[0281] [Light-emitting devices] Furthermore, light-emitting devices can be broadly classified into single structures and tandem structures. A single-structure device has one light-emitting unit between a pair of electrodes, and it is preferable that the light-emitting unit includes one or more light-emitting layers. When obtaining white light emission using two light-emitting layers, the light-emitting layers should be selected such that the light-emitting colors of each of the two layers are complementary colors. For example, by making the light-emitting color of the first light-emitting layer and the light-emitting color of the second light-emitting layer complementary colors, a configuration that emits white light as a whole can be obtained. Also, when obtaining white light emission using three or more light-emitting layers, the light-emitting device should be configured so that the light-emitting colors of the three or more layers combine to emit white light as a whole.

[0282] A tandem device preferably has two or more light-emitting units between a pair of electrodes, and each light-emitting unit preferably includes one or more light-emitting layers. By using light-emitting layers that emit light of the same color in each light-emitting unit, the brightness per given current can be increased, and a more reliable light-emitting device can be achieved compared to a single structure. To obtain white light emission in a tandem structure, the light from the light-emitting layers of multiple light-emitting units can be combined to produce white light emission. The combination of light-emitting colors that produces white light emission is the same as that for a single structure. In a tandem device, it is preferable to provide an intermediate layer, such as a charge-generating layer, between the multiple light-emitting units.

[0283] Furthermore, when comparing the aforementioned white light-emitting devices (single or tandem structure) with SBS structure light-emitting devices, SBS structure light-emitting devices can consume less power than white light-emitting devices. If you want to keep power consumption low, it is preferable to use SBS structure light-emitting devices. On the other hand, white light-emitting devices are preferable because their manufacturing process is simpler than that of SBS structure light-emitting devices, which can lead to lower manufacturing costs or higher manufacturing yields.

[0284] <Example of light-emitting device configuration> As shown in Figure 19A, the light-emitting device has an EL layer 790 between a pair of electrodes (lower electrode 791, upper electrode 792). The EL layer 790 can be composed of multiple layers, such as layer 720, light-emitting layer 711, and layer 730. Layer 720 may include, for example, a layer containing a material with high electron injection properties (electron injection layer) and a layer containing a material with high electron transport properties (electron transport layer). The light-emitting layer 711 may include, for example, a light-emitting compound. Layer 730 may include, for example, a layer containing a material with high hole injection properties (hole injection layer) and a layer containing a material with high hole transport properties (hole transport layer).

[0285] A configuration having a layer 720, an emissive layer 711, and a layer 730 provided between a pair of electrodes can function as a single emissive unit, and in this specification, the configuration shown in Figure 19A is referred to as a single structure.

[0286] Furthermore, Figure 19B shows a modified example of the EL layer 790 of the light-emitting device shown in Figure 19A. Specifically, the light-emitting device shown in Figure 19B includes a layer 730-1 on the lower electrode 791, a layer 730-2 on layer 730-1, a light-emitting layer 711 on layer 730-2, a layer 720-1 on the light-emitting layer 711, a layer 720-2 on layer 720-1, and an upper electrode 792 on layer 720-2. For example, when the lower electrode 791 is the anode and the upper electrode 792 is the cathode, layer 730-1 functions as a hole injection layer, layer 730-2 functions as a hole transport layer, layer 720-1 functions as an electron transport layer, and layer 720-2 functions as an electron injection layer. Alternatively, if the lower electrode 791 is used as the cathode and the upper electrode 792 as the anode, layer 730-1 functions as an electron injection layer, layer 730-2 functions as an electron transport layer, layer 720-1 functions as a hole transport layer, and layer 720-2 functions as a hole injection layer. By using such a layer structure, it is possible to efficiently inject carriers into the light-emitting layer 711 and increase the efficiency of carrier recombination within the light-emitting layer 711.

[0287] Furthermore, as shown in Figures 19C and 19D, a configuration in which multiple light-emitting layers (light-emitting layers 711, 712, and 713) are provided between layer 720 and layer 730 is also a variation of the single structure.

[0288] Furthermore, as shown in Figures 19E and 19F, a configuration in which multiple light-emitting units (EL layers 790a and EL layers 790b) are connected in series via an intermediate layer (charge generation layer) 740 is referred to as a tandem structure in this specification. In this specification, the configuration shown in Figures 19E and 19F is referred to as a tandem structure, but it is not limited to this, and for example, a tandem structure may also be called a stack structure. By using a tandem structure, a light-emitting device capable of high-brightness light emission can be made.

[0289] In Figure 19C, the light-emitting layers 711, 712, and 713 may be made of light-emitting materials that emit light of the same color.

[0290] Furthermore, different light-emitting materials may be used for the light-emitting layers 711, 712, and 713. For example, white light emission can be obtained by the light emitted by the light-emitting layers 711, 712, and 713, respectively. Figure 19D shows an example in which a colored layer 795, which functions as a color filter, is provided. By passing white light through the color filter, light of a desired color can be obtained.

[0291] Furthermore, in Figure 19E, the same light-emitting material may be used for both the light-emitting layer 711 and the light-emitting layer 712. Alternatively, light-emitting materials that emit different types of light may be used for both the light-emitting layer 711 and the light-emitting layer 712. When the light emitted by the light-emitting layer 711 and the light emitted by the light-emitting layer 712 are complementary colors, white light emission is obtained. Figure 19F shows an example in which a colored layer 795 is further provided.

[0292] Furthermore, in Figures 19C, 19D, 19E, and 19F, as shown in Figure 19B, layer 720 and layer 730 may be a laminated structure consisting of two or more layers.

[0293] Furthermore, in Figure 19D, the same light-emitting material may be used for light-emitting layers 711, 712, and 713. Similarly, in Figure 19F, the same light-emitting material may be used for light-emitting layers 711 and 712. In this case, by applying a color conversion layer instead of the colored layer 795, it is possible to obtain light of a desired color different from that of the light-emitting material. For example, by using a blue light-emitting material for each light-emitting layer, blue light can pass through the color conversion layer to obtain light with a longer wavelength than blue (e.g., red, green, etc.). Fluorescent materials, phosphorescent materials, or quantum dots can be used as the color conversion layer.

[0294] A structure in which different light-emitting layers (in this case, blue (B), green (G), and red (R)) are created for each light-emitting device is sometimes called an SBS (Side By Side) structure.

[0295] The light-emitting color of the light-emitting device can be red, green, blue, cyan, magenta, yellow, or white, depending on the material that makes up the EL layer 790. Furthermore, the color purity can be further enhanced by adding a microcavity structure to the light-emitting device.

[0296] A light-emitting device that emits white light preferably has a configuration that includes two or more types of light-emitting materials in its light-emitting layer. To obtain white light emission, it is sufficient to select light-emitting materials such that the light emitted by each of the two or more materials is complementary in color. For example, by making the light-emitting color of the first light-emitting layer and the light-emitting color of the second light-emitting layer complementary, a light-emitting device that emits white light as a whole can be obtained. The same applies to light-emitting devices that have three or more light-emitting layers.

[0297] The light-emitting layer preferably contains two or more light-emitting materials that emit light such as R (red), G (green), B (blue), Y (yellow), and O (orange). Alternatively, it is preferable to have two or more light-emitting materials, and for each light-emitting material to emit light that contains spectral components of two or more colors from R, G, and B.

[0298] [Light receiving device] Figure 20A shows schematic cross-sectional views of the light-emitting devices 750R, 750G, 750B, and 760. The light-emitting devices 750R, 750G, 750B, and 760 all share a common upper electrode 792 layer.

[0299] The light-emitting device 750R has a pixel electrode 791R, layers 751 and 752, a light-emitting layer 753R, layers 754 and 755, and an upper electrode 792. The light-emitting device 750G has a pixel electrode 791G and a light-emitting layer 753G. The light-emitting device 750B has a pixel electrode 791B and a light-emitting layer 753B.

[0300] Layer 751 includes, for example, a layer containing a material with high hole injection properties (hole injection layer). Layer 752 includes, for example, a layer containing a material with high hole transport properties (hole transport layer). Layer 754 includes, for example, a layer containing a material with high electron transport properties (electron transport layer). Layer 755 includes, for example, a layer containing a material with high electron injection properties (electron injection layer).

[0301] Alternatively, the configuration may include layer 751 having an electron injection layer, layer 752 having an electron transport layer, layer 754 having a hole transport layer, and layer 755 having a hole injection layer.

[0302] In Figure 20A, layers 751 and 752 are shown separately, but this is not the only way to represent them. For example, if layer 751 has the functions of both a hole injection layer and a hole transport layer, or if layer 751 has the functions of both an electron injection layer and an electron transport layer, then layer 752 may be omitted.

[0303] Furthermore, the light-emitting layer 753R of the light-emitting device 750R contains a light-emitting material that emits red light, the light-emitting layer 753G of the light-emitting device 750G contains a light-emitting material that emits green light, and the light-emitting layer 753B of the light-emitting device 750B contains a light-emitting material that emits blue light. The light-emitting devices 750G and 750B have a configuration in which the light-emitting layer 753R of the light-emitting device 750R is replaced with the light-emitting layer 753G and light-emitting layer 753B, respectively, and the other configurations are the same as those of the light-emitting device 750R.

[0304] Layers 751, 752, 754, and 755 may have the same configuration (material, film thickness, etc.) for each color of light-emitting device, or they may have different configurations from each other.

[0305] The light-receiving device 760 has a pixel electrode 791PD, layers 761, 762, 763, and an upper electrode 792. The light-receiving device 760 can be configured without a hole injection layer and an electron injection layer.

[0306] Layer 762 has an active layer (also called a photoelectric conversion layer). Layer 762 has the function of absorbing light in a specific wavelength band and generating carriers (electrons and holes).

[0307] Layers 761 and 763 each have, for example, either a hole transport layer or an electron transport layer. If layer 761 has a hole transport layer, then layer 763 has an electron transport layer. Conversely, if layer 761 has an electron transport layer, then layer 763 has a hole transport layer.

[0308] Furthermore, the light-receiving device 760 may have the pixel electrode 791PD as the anode and the upper electrode 792 as the cathode, or the pixel electrode 791PD as the cathode and the upper electrode 792 as the anode.

[0309] Figure 20B is a modified example of Figure 20A. In Figure 20B, layer 755 is provided in common between each light-emitting element and between each photodetector, similar to the upper electrode 792. In this case, layer 755 can be called a common layer. By providing one or more common layers between each light-emitting element and between each photodetector in this way, the manufacturing process can be simplified, and thus manufacturing costs can be reduced.

[0310] Here, layer 755 functions as an electron injection layer or hole injection layer for the light-emitting device 750R, etc. At the same time, it functions as an electron transport layer or hole transport layer for the photodetector 760. Therefore, the photodetector 760 shown in Figure 20B does not need to have a layer 763 that functions as an electron transport layer or hole transport layer.

[0311] [Light-emitting devices] Here, we will describe a specific example of the configuration of a light-emitting device.

[0312] The light-emitting device has at least a light-emitting layer. The light-emitting device may also have layers other than the light-emitting layer that include a material with high hole injection properties, a material with high hole transport properties, a hole-blocking material, a material with high electron transport properties, an electron-blocking material, a material with high electron injection properties, an electron-blocking material, or a bipolar material (a material with high electron transport and hole transport properties).

[0313] The light-emitting device may use either low-molecular-weight compounds or high-molecular-weight compounds, and may also contain inorganic compounds. The layers constituting the light-emitting device can be formed by methods such as vapor deposition (including vacuum deposition), transfer, printing, inkjet, and coating.

[0314] For example, a light-emitting device may have a configuration that includes, in addition to the light-emitting layer, one or more layers from among a hole injection layer, a hole transport layer, a hole blocking layer, an electron blocking layer, an electron transport layer, and an electron injection layer.

[0315] The hole injection layer is a layer that injects holes from the anode into the hole transport layer, and is a layer containing a material with high hole injection capabilities. Examples of materials with high hole injection capabilities include aromatic amine compounds and composite materials containing hole transport materials and acceptor materials (electron-accepting materials).

[0316] The hole transport layer is a layer that transports holes injected from the anode by the hole injection layer to the light-emitting layer. The hole transport layer is a layer containing a hole-transporting material. The hole-transporting material is 1 × 10⁻¹⁶ -6 cm 2 Materials having a hole mobility of / Vs or higher are preferred. However, other materials can also be used as long as they have higher hole transport capabilities than electron transport. Preferred hole transport materials include π-electron-rich heteroaromatic compounds (e.g., carbazole derivatives, thiophene derivatives, furan derivatives, etc.) and aromatic amines (compounds having an aromatic amine skeleton), which are materials with high hole transport capabilities.

[0317] The electron transport layer is a layer that transports electrons injected from the cathode by the electron injection layer to the light-emitting layer. The electron transport layer is a layer containing an electron-transporting material. As an electron-transporting material, 1 × 10 -6 cm 2 Materials having an electron mobility of 1 / Vs or higher are preferred. However, other materials can also be used as long as they have higher electron transport capabilities than holes. Examples of electron-transporting materials include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, metal complexes having a thiazole skeleton, as well as oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives having a quinoline ligand, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, and other π-electron-deficient heteroaromatic compounds containing nitrogen-containing heteroaromatic compounds, which are materials with high electron transport capabilities.

[0318] The electron injection layer is a layer that injects electrons from the cathode to the electron transport layer, and is a layer containing a material with high electron injection capabilities. Alkali metals, alkaline earth metals, or compounds thereof can be used as materials with high electron injection capabilities. Composite materials containing both electron transport materials and donor materials (electron-donating materials) can also be used as materials with high electron injection capabilities.

[0319] Examples of electron injection layers include lithium, cesium, ytterbium, lithium fluoride (LiF), cesium fluoride (CsF), calcium fluoride (CaF2), 8-(quinolinolato)lithium (abbreviated as Liq), 2-(2-pyridyl)phenolate (abbreviated as LiPP), 2-(2-pyridyl)-3-pyridinolatritium (abbreviated as LiPPy), 4-phenyl-2-(2-pyridyl)phenolate (abbreviated as LiPPP), and lithium oxide (LiO2). xAlkali metals such as cesium carbonate, alkaline earth metals, or compounds thereof can be used. Furthermore, the electron injection layer may be a multilayer structure of two or more layers. For example, this multilayer structure may consist of lithium fluoride as the first layer and ytterbium as the second layer.

[0320] Alternatively, an electron-transporting material may be used as the electron injection layer described above. For example, a compound having a lone pair of electrons and an electron-deficient heteroaromatic ring can be used as the electron-transporting material. Specifically, a compound having at least one of a pyridine ring, a diazine ring (pyrimidine ring, pyrazine ring, pyridazine ring), or a triazine ring can be used.

[0321] Furthermore, it is preferable that the lowest unoccupied molecular orbital (LUMO) of an organic compound containing a lone pair of electrons is between -3.6 eV and -2.3 eV. In addition, the highest occupied molecular orbital (HOMO) level and LUMO level of an organic compound can generally be estimated by methods such as cyclic voltammetry (CV), photoelectron spectroscopy, optical absorption spectroscopy, and inverse photoelectron spectroscopy.

[0322] For example, 4,7-diphenyl-1,10-phenanthroline (abbreviated as BPhen), 2,9-bis(naphthalene-2-yl)-4,7-diphenyl-1,10-phenanthroline (abbreviated as NBPhen), diquinoxalino[2,3-a:2',3'-c]phenazine (abbreviated as HATNA), and 2,4,6-tris[3'-(pyridine-3-yl)biphenyl-3-yl]-1,3,5-triazine (abbreviated as TmPPPyTz) can be used in organic compounds containing lone pairs of electrons. Compared to BPhen, NBPhen has a higher glass transition temperature (Tg) and superior heat resistance.

[0323] The luminescent layer is a layer containing a luminescent material. The luminescent layer may contain one or more types of luminescent materials. Suitable luminescent materials include those exhibiting colors such as blue, purple, blue-violet, green, yellow-green, yellow, orange, and red. Furthermore, materials emitting near-infrared light may also be used as luminescent materials.

[0324] Examples of luminescent materials include fluorescent materials, phosphorescent materials, TADF materials, and quantum dot materials.

[0325] Examples of fluorescent materials include pyrene derivatives, anthracene derivatives, triphenylene derivatives, fluorene derivatives, carbazole derivatives, dibenzothiophene derivatives, dibenzofuran derivatives, dibenzoquinoxaline derivatives, quinoxaline derivatives, pyridine derivatives, pyrimidine derivatives, phenanthrene derivatives, and naphthalene derivatives.

[0326] Examples of phosphorescent materials include organometallic complexes (especially iridium complexes) having a 4H-triazole skeleton, 1H-triazole skeleton, imidazole skeleton, pyrimidine skeleton, pyrazine skeleton, or pyridine skeleton; organometallic complexes (especially iridium complexes) using phenylpyridine derivatives having electron-withdrawing groups as ligands; platinum complexes; and rare earth metal complexes.

[0327] The light-emitting layer may contain one or more types of organic compounds (host material, assist material, etc.) in addition to the light-emitting substance (guest material). One or more of these organic compounds may be hole-transporting materials and / or electron-transporting materials. Alternatively, one or more of these organic compounds may be bipolar materials or TADF materials.

[0328] The light-emitting layer preferably has, for example, a phosphorescent material, a hole-transporting material, and an electron-transporting material that form an exciplex easily. By adopting such a configuration, efficient light emission using ExTET (Exciplex-Triplet Energy Transfer), which is energy transfer from an exciplex to a luminescent substance (phosphorescent material), can be obtained. By selecting a combination that forms an exciplex that emits light overlapping with the wavelength of the absorption band on the lowest energy side of the luminescent substance, energy transfer becomes smooth and efficient light emission can be obtained. With this configuration, high efficiency, low-voltage driving, and long life of the light-emitting device can be achieved simultaneously.

[0329] [Light-receiving device] The active layer of the light-receiving device contains a semiconductor. Examples of the semiconductor include inorganic semiconductors such as silicon and organic semiconductors containing organic compounds. In this embodiment, an example of using an organic semiconductor as the semiconductor in the active layer is shown. Using an organic semiconductor is preferable because the light-emitting layer and the active layer can be formed by the same method (e.g., vacuum evaporation method), and the manufacturing equipment can be shared.

[0330] Examples of the material of the n-type semiconductor in the active layer include electron-accepting organic semiconductor materials such as fullerenes (e.g., C 60 , C 70 , etc.) and fullerene derivatives. Fullerene has a shape like a soccer ball, and this shape is energetically stable. Fullerene has deep (low) HOMO and LUMO levels. Since fullerene has a deep LUMO level, it has extremely high electron-accepting (acceptor) properties. Usually, when π-electron conjugation (resonance) spreads in a plane like benzene, the electron-donating (donor) property increases. However, since fullerene has a spherical shape, despite the large spread of π electrons, its electron-accepting property is high. High electron-accepting property is beneficial for a light-receiving device because it causes efficient charge separation at high speed. C 60 , C 70 both have a broad absorption band in the visible light region. In particular, C 70 is C 60Compared to [another compound], it is preferable because it has a larger π-electron conjugation system and a broad absorption band in the long-wavelength region. Other examples of fullerene derivatives include [6,6]-Phenyl-C71-butyric acid methyl ester (abbreviated as PC70BM), [6,6]-Phenyl-C61-butyric acid methyl ester (abbreviated as PC60BM), and 1',1'',4',4''-Tetrahydro-di[1,4]methanonaphthaleno[1,2:2',3',56,60:2'',3''][5,6]fullerene-C60 (abbreviated as ICBA).

[0331] Furthermore, examples of n-type semiconductor materials include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, metal complexes having a thiazole skeleton, oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, naphthalene derivatives, anthracene derivatives, coumarin derivatives, rhodamine derivatives, triazine derivatives, and quinone derivatives.

[0332] Examples of p-type semiconductor materials for the active layer include electron-donating organic semiconductor materials such as copper(II) phthalocyanine (CuPc), tetraphenyldibenzoperiflanthene (DBP), zinc phthalocyanine (ZnPc), tin phthalocyanine (SnPc), and quinacridone.

[0333] Furthermore, examples of p-type semiconductor materials include carbazole derivatives, thiophene derivatives, furan derivatives, and compounds having an aromatic amine skeleton. In addition, examples of p-type semiconductor materials include naphthalene derivatives, anthracene derivatives, pyrene derivatives, triphenylene derivatives, fluorene derivatives, pyrrole derivatives, benzofuran derivatives, benzothiophene derivatives, indole derivatives, dibenzofuran derivatives, dibenzothiophene derivatives, indrocarbazole derivatives, porphyrin derivatives, phthalocyanine derivatives, naphthalocyanine derivatives, quinacridone derivatives, polyphenylenevinylene derivatives, polyparaphenylene derivatives, polyfluorene derivatives, polyvinylcarbazole derivatives, and polythiophene derivatives.

[0334] The HOMO level of electron-donating organic semiconductor materials is preferably shallower (higher) than the HOMO level of electron-accepting organic semiconductor materials. The LUMO level of electron-donating organic semiconductor materials is preferably shallower (higher) than the LUMO level of electron-accepting organic semiconductor materials.

[0335] It is preferable to use spherical fullerenes as electron-accepting organic semiconductor materials and organic semiconductor materials with a near-planar shape as electron-donating organic semiconductor materials. Molecules with similar shapes tend to aggregate, and when molecules of the same type aggregate, their molecular orbital energy levels are close, which can improve carrier transport.

[0336] For example, the active layer is preferably formed by co-depositing an n-type semiconductor and a p-type semiconductor. Alternatively, the active layer may be formed by stacking an n-type semiconductor and a p-type semiconductor.

[0337] The photodetector may further include layers other than the active layer, such as a material with high hole transport properties, a material with high electron transport properties, or a bipolar material (a material with high electron and hole transport properties). Furthermore, it may also further include layers containing a material with high hole injection properties, a hole blocking material, a material with high electron injection properties, an electron blocking material, etc.

[0338] The light-receiving device may use either low-molecular-weight compounds or high-molecular-weight compounds, and may also contain inorganic compounds. The layers constituting the light-receiving device can be formed by methods such as vapor deposition (including vacuum deposition), transfer, printing, inkjet, and coating.

[0339] For example, polymer compounds such as poly(3,4-ethylenedioxythiophene) / poly(styrenesulfonic acid) (PEDOT / PSS), and inorganic compounds such as molybdenum oxide and copper iodide (CuI) can be used as hole transporting materials or electron blocking materials. In addition, inorganic compounds such as zinc oxide (ZnO) and organic compounds such as polyethyleneimine ethoxylate (PEIE) can be used as electron transporting materials or hole blocking materials. The light-receiving device may have, for example, a mixed film of PEIE and ZnO.

[0340] Furthermore, the active layer can use polymer compounds such as Poly[[4,8-bis[5-(2-ethylhexyl)-2-thienyl]benzo[1,2-b:4,5-b']dithiophene-2,6-diyl]-2,5-thiophenediyl[5,7-bis(2-ethylhexyl)-4,8-dioxo-4H,8H-benzo[1,2-c:4,5-c']dithiophene-1,3-diyl]]polymer (abbreviated as PBDB-T) or PBDB-T derivatives, which function as donors. For example, a method of dispersing the acceptor material in PBDB-T or a PBDB-T derivative can be used.

[0341] Furthermore, the active layer may contain a mixture of three or more materials. For example, to broaden the absorption wavelength range, a third material may be mixed with an n-type semiconductor material and a p-type semiconductor material. In this case, the third material may be a low-molecular-weight compound or a high-molecular-weight compound.

[0342] The above is a description of the light-receiving device.

[0343] This embodiment can be implemented in appropriate combination with other embodiments described herein, at least in part.

[0344] (Embodiment 5) This embodiment describes an example configuration of a light-emitting device or display device that can be used as a light-receiving device according to one aspect of the present invention.

[0345] One aspect of the present invention is a display device having a light-emitting element (also called a light-emitting device) and a light-receiving element (also called a light-receiving device). For example, a full-color display device can be realized by having three types of light-emitting elements that emit red (R), green (G), or blue (B) light, respectively.

[0346] One aspect of the present invention involves processing EL layers into fine patterns using photolithography without using shadow masks such as metal masks, and between EL layers and the active layer. This makes it possible to realize a display device with high resolution and a large aperture ratio, which has been difficult to achieve until now. Furthermore, because the EL layers can be differentiated, it is possible to realize a display device with extremely vivid colors, high contrast, and high display quality.

[0347] While it is difficult to reduce the spacing between different colored EL layers, or between the EL layer and the active layer, to less than 10 μm using a metal mask formation method, the above method allows for narrowing the spacing to 3 μm or less, 2 μm or less, or even 1 μm or less. For example, by using an exposure apparatus for LSIs, the spacing can be narrowed to 500 nm or less, 200 nm or less, 100 nm or less, and even 50 nm or less. This significantly reduces the area of ​​non-emitting regions that may exist between two light-emitting elements or between a light-emitting element and a photodetector, making it possible to approach a 100% aperture ratio. For example, aperture ratios of 50% or more, 60% or more, 70% or more, 80% or more, and even 90% or more, can be achieved, and even less than 100%.

[0348] Furthermore, the size of the EL layer and the active layer itself can be made significantly smaller compared to when a metal mask is used. Also, for example, when a metal mask is used to create different EL layers, variations in thickness occur between the center and edges of the island-shaped EL layer, resulting in a smaller effective area that can be used as an emitting region relative to the total area of ​​the EL layer. On the other hand, with the above manufacturing method, island-shaped EL layers are formed by processing a film deposited to a uniform thickness, so the thickness can be made uniform, and even if the size of the EL layer is fine, almost the entire area can be used as an emitting region. Therefore, the above manufacturing method can achieve both high resolution and a high aperture ratio.

[0349] Organic films formed using FMM (Fine Metal Mask) often have an extremely small taper angle (for example, greater than 0 degrees and less than 30 degrees), with the thickness decreasing towards the edges. Therefore, it is difficult to clearly identify the sides of an organic film formed using FMM, as the sides and top surfaces are continuously connected. On the other hand, one embodiment of the present invention has an EL layer processed without using FMM, and thus has clearly defined sides. In particular, one embodiment of the present invention preferably has a portion of the EL layer with a taper angle of 30 degrees or more and 120 degrees or less, preferably 60 degrees or more and 120 degrees or less.

[0350] In this specification, an object is described as having a tapered end if the angle between the side surface (front) and the surface to be formed (bottom) in that end region is greater than 0 degrees and less than 90 degrees, and the cross-sectional shape has such that the thickness increases continuously from the end. The taper angle is the angle between the bottom surface (surface to be formed) and the side surface (front) at the end of the object.

[0351] The following provides more specific examples.

[0352] Figure 21A shows a schematic top view of the display device 100. The display device 100 has multiple red-emitting light-emitting elements 90R, green-emitting light-emitting elements 90G, blue-emitting light-emitting elements 90B, and light-receiving elements 90S on a substrate 101. In Figure 21A, the symbols R, G, B, and S are added within the light-emitting area of ​​each light-emitting element or light-receiving element to simplify the distinction between them.

[0353] The light-emitting elements 90R, 90G, 90B, and 90S are each arranged in a matrix. Figure 21A shows a configuration in which two elements are arranged alternately in one direction. Note that the arrangement method of the light-emitting elements is not limited to this, and other arrangement methods such as stripe arrangement, S-stripe arrangement, delta arrangement, Bayer arrangement, and zigzag arrangement may be applied, or a pentile arrangement or diamond arrangement may be used.

[0354] Figure 21A also shows a connecting electrode 111C that is electrically connected to the common electrode 113. The connecting electrode 111C is supplied with a potential (e.g., anode potential or cathode potential) to the common electrode 113. The connecting electrode 111C is located outside the display area where the light-emitting elements 90R and the like are arranged. The common electrode 113 is also shown with a dashed line in Figure 21A.

[0355] The connecting electrode 111C can be provided along the outer perimeter of the display area. For example, it may be provided along one side of the outer perimeter of the display area, or it may be provided across two or more sides of the outer perimeter of the display area. That is, if the top surface shape of the display area is rectangular, the top surface shape of the connecting electrode 111C can be a strip, L-shape, U-shape (angle bracket shape), or square, etc.

[0356] Figure 21B is a schematic cross-sectional view corresponding to the dashed lines A1-A2 and C1-C2 in Figure 21A. Figure 21B shows schematic cross-sectional views of the light-emitting element 90B, the light-emitting element 90R, the photodetector 90S, and the connecting electrode 111C.

[0357] Furthermore, the light-emitting element 90G, which is not shown in the cross-sectional schematic diagram, can have the same configuration as the light-emitting element 90B or 90R, and the explanations of these elements can be applied hereafter.

[0358] The light-emitting element 90B has a pixel electrode 111, an organic layer 112B, an organic layer 114, and a common electrode 113. The light-emitting element 90R has a pixel electrode 111, an organic layer 112R, an organic layer 114, and a common electrode 113. The light-receiving element 90S has a pixel electrode 111, an organic layer 115, an organic layer 114, and a common electrode 113. The organic layer 114 and the common electrode 113 are provided in common to the light-emitting elements 90B, 90R, and 90S. The organic layer 114 can also be called a common layer. The pixel electrodes 111 are spaced apart from each other between each light-emitting element and between the light-emitting elements and the light-receiving element.

[0359] Organic layer 112R has a luminescent organic compound that emits at least red light. Organic layer 112B has a luminescent organic compound that emits at least blue light. Organic layer 115 has a photoelectric conversion material that is sensitive to visible light or infrared light wavelengths. Organic layer 112R and organic layer 112B can also be called EL layers.

[0360] Organic layer 112R, organic layer 112B, and organic layer 115 may each have one or more of the following: an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer. Organic layer 114 may have a configuration without an emissive layer. For example, organic layer 114 may have one or more of the following: an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer.

[0361] In this case, it is preferable that the uppermost layer in the laminated structure of organic layer 112R, organic layer 112B, and organic layer 115, i.e., the layer in contact with organic layer 114, is a layer other than the light-emitting layer. For example, it is preferable to cover the light-emitting layer with an electron injection layer, electron transport layer, hole injection layer, hole transport layer, or other layer, and to have this layer in contact with organic layer 114. In this way, the reliability of the light-emitting device can be improved by protecting the upper surface of the light-emitting layer with another layer when manufacturing each light-emitting device.

[0362] Each pixel electrode 111 is provided for each element. The common electrode 113 and the organic layer 114 are provided as a continuous layer common to each light-emitting element. A conductive film that is transparent to visible light is used on either each pixel electrode or the common electrode 113, and a conductive film that is reflective is used on the other. By making each pixel electrode transparent and the common electrode 113 reflective, a bottom-emission type display device can be made. Conversely, by making each pixel electrode reflective and the common electrode 113 transparent, a top-emission type display device can be made. Furthermore, by making both each pixel electrode and the common electrode 113 transparent, a dual-emission type display device can be made.

[0363] An insulating layer 131 is provided covering the end of the pixel electrode 111. Preferably, the end of the insulating layer 131 is tapered. In this specification, etc., a tapered end of an object means that in the region of that end, the angle between the surface and the surface to be formed is greater than 0 degrees and less than 90 degrees, and the cross-sectional shape has such that the thickness increases continuously from the end.

[0364] Furthermore, by using an organic resin for the insulating layer 131, its surface can be made into a gently curved surface. This improves the coverage of the film formed on the insulating layer 131.

[0365] Examples of materials that can be used for the insulating layer 131 include acrylic resin, polyimide resin, epoxy resin, polyamide resin, polyimidoamide resin, siloxane resin, benzocyclobutene resin, phenol resin, and precursors of these resins.

[0366] Alternatively, an inorganic insulating material may be used as the insulating layer 131. Examples of inorganic insulating materials that can be used for the insulating layer 131 include oxides or nitrides such as silicon oxide, silicon oxide nitride, silicon nitride, silicon oxide, aluminum oxide, aluminum oxide nitride, or hafnium oxide. In addition, yttrium oxide, zirconium oxide, gallium oxide, tantalum oxide, magnesium oxide, lanthanum oxide, cerium oxide, and neodymium oxide may also be used.

[0367] As shown in Figure 21B, the two organic layers are spaced apart between light-emitting elements of different colors, and between the light-emitting elements and the light-receiving elements, with gaps between them. It is preferable that the organic layers 112R, 112B, and 115 are arranged so that they do not touch each other. This effectively prevents current from flowing through two adjacent organic layers, thus preventing unintended light emission. Therefore, contrast can be enhanced, and a display device with high display quality can be realized.

[0368] Organic layer 112R, organic layer 112B, and organic layer 115 preferably have a taper angle of 30 degrees or more. Organic layer 112R, organic layer 112G, and organic layer 112B preferably have an angle between the side surface (front) and the bottom surface (formed surface) at the end of 30 degrees or more and 120 degrees or less, preferably 45 degrees or more and 120 degrees or less, and more preferably 60 degrees or more and 120 degrees or less. Alternatively, organic layer 112R, organic layer 112G, and organic layer 112B preferably have a taper angle of 90 degrees or near that (for example, 80 degrees or more and 100 degrees or less).

[0369] A protective layer 121 is provided on the common electrode 113. The protective layer 121 has the function of preventing impurities such as water from diffusing to each light-emitting element from above.

[0370] The protective layer 121 can be, for example, a single-layer structure or a multilayer structure including at least an inorganic insulating film. Examples of inorganic insulating films include oxide films or nitride films such as silicon oxide film, silicon oxide nitride film, silicon nitride film, silicon nitride film, aluminum oxide film, aluminum oxide nitride film, and hafnium oxide film. Alternatively, semiconductor materials such as indium gallium oxide and indium gallium zinc oxide may be used as the protective layer 121.

[0371] Furthermore, a laminated film of an inorganic insulating film and an organic insulating film can also be used as the protective layer 121. For example, it is preferable to have a configuration in which an organic insulating film is sandwiched between a pair of inorganic insulating films. It is also preferable that the organic insulating film functions as a planarizing film. This makes the upper surface of the organic insulating film flat, thereby improving the coverage of the inorganic insulating film on top of it and enhancing its barrier properties. In addition, since the upper surface of the protective layer 121 is flat, it is preferable because it reduces the influence of uneven shapes caused by the structure below when a structure (e.g., a color filter, touch sensor electrodes, or lens array) is provided above the protective layer 121.

[0372] In the connection portion 130, a common electrode 113 is provided in contact with the connecting electrode 111C, and a protective layer 121 is provided covering the common electrode 113. In addition, an insulating layer 131 is provided covering the end of the connecting electrode 111C.

[0373] The following describes an example of a display device configuration that differs in some aspects from Figure 21B. Specifically, an example is shown in which the insulating layer 131 is not provided.

[0374] Figures 22A to 22C show examples where the side surface of the pixel electrode 111 roughly coincides with the side surface of the organic layer 112R, organic layer 112B, or organic layer 115.

[0375] In Figure 22A, the organic layer 114 is provided covering the top and side surfaces of organic layers 112R, 112B, and 115. The organic layer 114 prevents the pixel electrode 111 and the common electrode 113 from coming into contact and causing an electrical short circuit.

[0376] Figure 22B shows an example having organic layers 112R, 112G, and 112B, as well as an insulating layer 125 provided in contact with the side surface of the pixel electrode 111. The insulating layer 125 can effectively suppress electrical short circuits between the pixel electrode 111 and the common electrode 113, and leakage current between them.

[0377] The insulating layer 125 can be an insulating layer having an inorganic material. For example, inorganic insulating films such as oxide insulating films, nitride insulating films, oxidative nitride insulating films, and nitride oxide insulating films can be used for the insulating layer 125. The insulating layer 125 may be a single layer or a laminated structure. Examples of oxide insulating films include silicon oxide films, aluminum oxide films, magnesium oxide films, indium gallium zinc oxide films, gallium oxide films, germanium oxide films, yttrium oxide films, zirconium oxide films, lanthanum oxide films, neodymium oxide films, hafnium oxide films, and tantalum oxide films. Examples of nitride insulating films include silicon nitride films and aluminum nitride films. Examples of oxidative nitride insulating films include silicon oxidative nitride films and aluminum oxidative nitride films. Examples of nitride oxide insulating films include silicon nitride oxide films and aluminum nitride oxide films. In particular, by applying inorganic insulating films such as aluminum oxide films, hafnium oxide films, and silicon oxide films formed by the ALD method to the insulating layer 125, an insulating layer 125 can be formed that has few pinholes and excellent function in protecting the organic layer.

[0378] In this specification, the term "oxide-nitride" refers to a material in which the oxygen content is greater than the nitrogen content, and the term "nitride oxide" refers to a material in which the nitrogen content is greater than the oxygen content. For example, when "silicon oxynitride" is written, it refers to a material in which the oxygen content is greater than the nitrogen content, and when "silicon nitride oxide" is written, it refers to a material in which the nitrogen content is greater than the oxygen content.

[0379] The insulating layer 125 can be formed using sputtering, CVD, PLD, ALD, or other methods. It is preferable to form the insulating layer 125 using the ALD method, which provides good coverage.

[0380] In Figure 22C, a resin layer 126 is provided between two adjacent light-emitting elements or between a light-emitting element and a photodetector, filling the gap between two opposing pixel electrodes and the gap between two opposing organic layers. The resin layer 126 flattens the surfaces to be formed, such as the organic layer 114 and the common electrode 113, thereby preventing the common electrode 113 from breaking due to poor coating of the step difference between adjacent light-emitting elements.

[0381] As the resin layer 126, an insulating layer having an organic material can be suitably used. For example, as the resin layer 126, acrylic resin, polyimide resin, epoxy resin, imide resin, polyamide resin, polyimidoamide resin, silicone resin, siloxane resin, benzocyclobutene resin, phenol resin, and precursors of these resins can be applied. Alternatively, as the resin layer 126, organic materials such as polyvinyl alcohol (PVA), polyvinyl butyral, polyvinylpyrrolidone, polyethylene glycol, polyglycerin, pullulan, water-soluble cellulose, or alcohol-soluble polyamide resin may be used. Furthermore, a photosensitive resin can be used as the resin layer 126. A photoresist may be used as the photosensitive resin. The photosensitive resin can be a positive-type material or a negative-type material.

[0382] Furthermore, by using a colored material (for example, a material containing black pigment) as the resin layer 126, a function may be provided to block stray light from adjacent pixels and suppress color mixing.

[0383] In Figure 22D, an insulating layer 125 and a resin layer 126 are provided on the insulating layer 125. Because the insulating layer 125 prevents the organic layer 112R and the resin layer 126 from coming into contact, impurities such as moisture contained in the resin layer 126 can be prevented from diffusing into the organic layer 112R, resulting in a highly reliable display device.

[0384] Furthermore, a mechanism may be provided to improve light extraction efficiency by providing a reflective film (for example, a metal film containing one or more selected from silver, palladium, copper, titanium, and aluminum) between the insulating layer 125 and the resin layer 126, and reflecting the light emitted from the light-emitting layer with the reflective film.

[0385] Figures 23A to 23C show examples where the width of the pixel electrode 111 is greater than the width of the organic layer 112R, organic layer 112B, or organic layer 115. The organic layer 112R, etc., is located inside the edge of the pixel electrode 111.

[0386] Figure 23A shows an example where an insulating layer 125 is present. The insulating layer 125 is provided covering the side surfaces of the organic layer of the light-emitting element or photodetector, and a portion of the upper surface and side surfaces of the pixel electrode 111.

[0387] Figure 23B shows an example in which a resin layer 126 is present. The resin layer 126 is located between two adjacent light-emitting elements or between a light-emitting element and a photodetector, and is provided covering the sides of the organic layer and the top and sides of the pixel electrode 111.

[0388] Figure 23C shows an example where both an insulating layer 125 and a resin layer 126 are present. The insulating layer 125 is provided between the organic layer 112R, etc., and the resin layer 126.

[0389] Figures 24A to 24D show examples where the width of the pixel electrode 111 is smaller than the width of the organic layer 112R, organic layer 112B, or organic layer 115. The organic layer 112R, etc., extends outward beyond the edge of the pixel electrode 111.

[0390] Figure 24B shows an example having an insulating layer 125. The insulating layer 125 is provided in contact with the side surfaces of the organic layers of two adjacent light-emitting elements. Note that the insulating layer 125 may cover not only the side surfaces of the organic layer 112R, etc., but also a portion of the top surface.

[0391] Figure 24C shows an example having a resin layer 126. The resin layer 126 is located between two adjacent light-emitting elements and covers part of the side and top surfaces of the organic layer 112R, etc. Alternatively, the resin layer 126 may be in contact with the side surfaces of the organic layer 112R, etc., but not cover the top surface.

[0392] Figure 24D shows an example where both an insulating layer 125 and a resin layer 126 are present. The insulating layer 125 is provided between the organic layer 112R, etc., and the resin layer 126.

[0393] Here, we will describe an example of the configuration of the resin layer 126.

[0394] While it is preferable for the upper surface of the resin layer 126 to be flat, the surface of the resin layer 126 may be concave or convex depending on the uneven shape of the surface on which the resin layer 126 is formed, the formation conditions of the resin layer 126, etc.

[0395] Figures 25A to 26F show the end of the pixel electrode 111R of the light-emitting element 90R, the end of the pixel electrode 111G of the light-emitting element 90G, and magnified views of their vicinity. An organic layer 112G is provided on the pixel electrode 111G.

[0396] Figures 25A, 25B, and 25C show magnified views of the resin layer 126 and its vicinity when the upper surface of the resin layer 126 is flat. Figure 25A is an example where the width of the organic layer 112R, etc. is greater than that of the pixel electrode 111. Figure 25B is an example where their widths are roughly the same. Figure 25C is an example where the width of the organic layer 112R, etc. is smaller than that of the pixel electrode 111.

[0397] As shown in Figure 25A, since the organic layer 112R is provided covering the ends of the pixel electrodes 111, it is preferable that the ends of the pixel electrodes 111 have a tapered shape. This improves the stepped coverage of the organic layer 112R, resulting in a highly reliable display device.

[0398] Figures 25D, 25E, and 25F show an example where the upper surface of the resin layer 126 is concave. In this case, concave portions are formed on the upper surfaces of the organic layer 114, the common electrode 113, and the protective layer 121, reflecting the concave upper surface of the resin layer 126.

[0399] Figures 26A, 26B, and 26C show an example where the upper surface of the resin layer 126 is convex. In this case, convex portions are formed on the upper surfaces of the organic layer 114, the common electrode 113, and the protective layer 121, reflecting the convex upper surface of the resin layer 126.

[0400] Figures 26D, 26E, and 26F show an example where a portion of the resin layer 126 covers a portion of the upper end and upper surface of the organic layer 112R, and a portion of the upper end and upper surface of the organic layer 112G. In this case, an insulating layer 125 is provided between the resin layer 126 and the upper surface of the organic layer 112R or the organic layer 112G.

[0401] Figures 26D, 26E, and 26F show an example where a portion of the upper surface of the resin layer 126 is concave. In this case, the organic layer 114, the common electrode 113, and the protective layer 121 form an uneven shape that reflects the shape of the resin layer 126.

[0402] The above is an explanation of an example of the resin layer's composition.

[0403] This embodiment can be implemented in appropriate combination with other embodiments described herein, at least in part.

[0404] (Embodiment 6) This embodiment describes an example of the configuration of a display device that can be used in a light-receiving and receiving device according to one aspect of the present invention. Here, it is described as a display device capable of displaying images, but by using a light-emitting element as a light source, it can be used as a light-receiving and receiving device.

[0405] Furthermore, the display device of this embodiment can be a high-resolution display device or a large-screen display device. Therefore, the display device of this embodiment can be used in electronic devices with relatively large screens, such as television sets, desktop or notebook personal computers, computer monitors, digital signage, and large game machines such as pachinko machines, as well as in the display units of digital cameras, digital video cameras, digital photo frames, mobile phones, portable game consoles, smartphones, smartwatches, tablet devices, personal digital assistants, and audio playback devices.

[0406] [Display device 400] Figure 27 shows a perspective view of the display device 400, and Figure 28A shows a cross-sectional view of the display device 400.

[0407] The display device 400 has a configuration in which substrate 452 and substrate 451 are bonded together. In Figure 27, substrate 452 is clearly indicated by a dashed line.

[0408] The display device 400 includes a display unit 462, a circuit 464, wiring 465, etc. Figure 27 shows an example in which IC 473 and FPC 472 are mounted on the display device 400. Therefore, the configuration shown in Figure 13 can also be described as a display module having the display device 400, an IC (integrated circuit), and an FPC.

[0409] For example, a scan line drive circuit can be used as circuit 464.

[0410] Wiring 465 has the function of supplying signals and power to the display unit 462 and the circuit 464. These signals and power are input to wiring 465 from an external source via FPC 472 or from IC 473.

[0411] Figure 27 shows an example in which IC 473 is provided on the substrate 451 using a COG (Chip On Glass) method or COF (Chip On Film) method. IC 473 can be an IC having, for example, a scan line drive circuit or a signal line drive circuit. Note that the display device 400 and the display module may be configured without an IC. Alternatively, the IC may be mounted on an FPC using a COF method or the like.

[0412] Figure 28A shows an example of a cross-section of the display device 400 when a portion of the area including the FPC 472, a portion of the circuit 464, a portion of the display unit 462, and a portion of the area including the connection portion are cut. In Figure 28A, an example of a cross-section is shown when a portion of the display unit 462 is cut, specifically when a portion including the light-emitting element 430b that emits green light (G) and the light-receiving element 440 that receives reflected light (L) is cut.

[0413] The display device 400 shown in Figure 28A has transistors 252, 260, 258, light-emitting element 430b, and light-receiving element 440, etc., between substrates 453 and 454.

[0414] The light-emitting element 430b and the light-receiving element 440 can be the light-emitting element or light-receiving element exemplified above.

[0415] Here, if the pixels of the display device have three types of subpixels, each having a light-emitting element with a different emission color, examples of these three subpixels include subpixels of three colors: red (R), green (G), and blue (B); and subpixels of three colors: yellow (Y), cyan (C), and magenta (M). If there are four such subpixels, examples of these four subpixels include subpixels of four colors: R, G, B, and white (W); and subpixels of four colors: R, G, B, and Y. Alternatively, the subpixels may be equipped with light-emitting elements that emit infrared light.

[0416] Furthermore, the photodetector 440 can be a photoelectric conversion element sensitive to light in the red, green, or blue wavelength range, or a photoelectric conversion element sensitive to light in the infrared wavelength range.

[0417] The substrate 454 and the protective layer 416 are bonded together via an adhesive layer 442. The adhesive layer 442 is provided in superimposed on the light-emitting element 430b and the light-receiving element 440, and a solid encapsulation structure is applied to the display device 400. A light-shielding layer 417 is provided on the substrate 454.

[0418] The light-emitting element 430b and the light-receiving element 440 have conductive layers 411a, 411b, and 411c as pixel electrodes. Conductive layer 411b is reflective to visible light and functions as a reflective electrode. Conductive layer 411c is transparent to visible light and functions as an optical adjustment layer.

[0419] The conductive layer 411a of the light-emitting element 430b is connected to the conductive layer 272b of the transistor 260 through an opening provided in the insulating layer 264. The transistor 260 has the function of controlling the driving of the light-emitting element. On the other hand, the conductive layer 411a of the photodetector element 440 is electrically connected to the conductive layer 272b of the transistor 258. The transistor 258 has the function of controlling the exposure timing using the photodetector element 440.

[0420] An EL layer 412G or a photoelectric conversion layer 412S is provided covering the pixel electrodes. An insulating layer 421 is provided in contact with the side surfaces of the EL layer 412G and the photoelectric conversion layer 412S, and a resin layer 422 is provided to fill the recesses of the insulating layer 421. An organic layer 414, a common electrode 413, and a protective layer 416 are provided covering the EL layer 412G and the photoelectric conversion layer 412S. By providing a protective layer 416 covering the light-emitting element, it is possible to suppress the ingress of impurities such as water into the light-emitting element and improve the reliability of the light-emitting element.

[0421] The light G emitted by the light-emitting element 430b is emitted towards the substrate 452. The light-receiving element 440 receives the light L incident through the substrate 452 and converts it into an electrical signal. It is preferable to use a material with high transmittance to visible light for the substrate 452.

[0422] Transistors 252, 260, and 258 are all formed on the substrate 451. These transistors can be manufactured using the same materials and processes.

[0423] Furthermore, transistors 252, 260, and 258 may be manufactured to have different configurations. For example, transistors may be manufactured with or without a back gate, or transistors may be manufactured with different materials or thicknesses for the semiconductor, gate electrode, gate insulating layer, source electrode, and drain electrode, or both.

[0424] The substrate 453 and the insulating layer 262 are bonded together by an adhesive layer 455.

[0425] The method for manufacturing the display device 400 involves first bonding a fabricated substrate, on which an insulating layer 262, transistors, light-emitting elements, and light-receiving elements are provided, to a substrate 454 on which a light-shielding layer 417 is provided, using an adhesive layer 442. Then, the fabricated substrate is peeled off and a substrate 453 is attached to the exposed surface, thereby transferring the components formed on the fabricated substrate to the substrate 453. It is preferable that both the substrate 453 and the substrate 454 are flexible. This increases the flexibility of the display device 400.

[0426] A connection portion 254 is provided in the region of substrate 453 that does not overlap with substrate 454. At the connection portion 254, wiring 465 is electrically connected to FPC 472 via conductive layer 466 and connection layer 292. The conductive layer 466 can be obtained by processing the same conductive film as the pixel electrode. This allows the connection portion 254 and FPC 472 to be electrically connected via the connection layer 292.

[0427] Transistors 252, 260, and 258 each have a conductive layer 271 that functions as a gate, an insulating layer 261 that functions as a gate insulating layer, a semiconductor layer 281 having a channel forming region 281i and a pair of low-resistance regions 281n, a conductive layer 272a connected to one of the pair of low-resistance regions 281n, a conductive layer 272b connected to the other of the pair of low-resistance regions 281n, an insulating layer 275 that functions as a gate insulating layer, a conductive layer 273 that functions as a gate, and an insulating layer 265 covering the conductive layer 273. The insulating layer 261 is located between the conductive layer 271 and the channel forming region 281i. The insulating layer 275 is located between the conductive layer 273 and the channel forming region 281i.

[0428] The conductive layer 272a and the conductive layer 272b are each connected to the low-resistance region 281n via openings provided in the insulating layer 265. Of the conductive layer 272a and the conductive layer 272b, one functions as a source and the other functions as a drain.

[0429] Figure 28A shows an example in which the insulating layer 275 covers the top and sides of the semiconductor layer. The conductive layer 272a and conductive layer 272b are connected to the low-resistance region 281n through openings provided in the insulating layer 275 and insulating layer 265, respectively.

[0430] On the other hand, in the transistor 259 shown in Figure 28B, the insulating layer 275 overlaps with the channel formation region 281i of the semiconductor layer 281, but does not overlap with the low-resistance region 281n. For example, the structure shown in Figure 28B can be fabricated by processing the insulating layer 275 using the conductive layer 273 as a mask. In Figure 28B, an insulating layer 265 is provided covering the insulating layer 275 and the conductive layer 273, and the conductive layers 272a and 272b are connected to the low-resistance region 281n, respectively, through openings in the insulating layer 265. Furthermore, an insulating layer 268 covering the transistor may also be provided.

[0431] The transistor structure of the display device of this embodiment is not particularly limited. For example, planar transistors, staggered transistors, inverse staggered transistors, etc., can be used. Furthermore, either a top-gate or bottom-gate transistor structure may be used. Alternatively, gates may be provided above and below the semiconductor layer in which the channel is formed.

[0432] Transistors 252, 260, and 258 are configured in which a semiconductor layer on which a channel is formed is sandwiched between two gates. The transistors may be driven by connecting the two gates and supplying them with the same signal. Alternatively, the threshold voltage of the transistors may be controlled by applying a potential to control the threshold voltage to one of the two gates and a potential to drive the other gate.

[0433] The crystallinity of the semiconductor material used in the semiconductor layer of the transistor is not particularly limited; amorphous semiconductors, single-crystal semiconductors, or semiconductors with crystalline properties other than single crystals (microcrystalline semiconductors, polycrystalline semiconductors, or semiconductors having crystalline regions in part) may be used. Using a single-crystal semiconductor or a semiconductor with crystalline properties is preferable because it can suppress the degradation of transistor characteristics.

[0434] The semiconductor layer of the transistor preferably has a metal oxide (also called an oxide semiconductor). In other words, the display device of this embodiment preferably uses a transistor (hereinafter referred to as an OS transistor) that uses a metal oxide in the channel formation region.

[0435] The band gap of the metal oxide used in the semiconductor layer of the transistor is preferably 2 eV or more, and more preferably 2.5 eV or more. By using a metal oxide with a large band gap, the off-current of the OS transistor can be reduced.

[0436] The metal oxide preferably contains at least indium or zinc, and more preferably indium and zinc. For example, the metal oxide preferably contains indium, M (where M is one or more selected from gallium, aluminum, yttrium, tin, silicon, boron, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, and cobalt), and zinc. In particular, M is preferably one or more selected from gallium, aluminum, yttrium, and tin, and gallium is more preferred. A metal oxide containing indium, M, and zinc may hereafter be referred to as In-M-Zn oxide.

[0437] When the metal oxide is an In-M-Zn oxide, it is preferable that the atomic ratio of In in the In-M-Zn oxide is equal to or greater than the atomic ratio of M. Examples of such In-M-Zn oxide atomic ratios of metal elements include compositions where In:M:Zn=1:1:1 or close to it, In:M:Zn=1:1:1.2 or close to it, In:M:Zn=2:1:3 or close to it, In:M:Zn=3:1:2 or close to it, In:M:Zn=4:2:3 or close to it, In:M:Zn=4:2:4.1 or close to it, In:M:Zn=5:1:3 or close to it, In:M:Zn=5:1:6 or close to it, In:M:Zn=5:1:7 or close to it, In:M:Zn=5:1:8 or close to it, In:M:Zn=6:1:6 or close to it, In:M:Zn=5:2:5 or close to it, and so on. Note that "close to it" compositions include a range of ±30% of the desired atomic ratio. By increasing the atomic ratio of indium in a metal oxide, the on-current or field-effect mobility of a transistor can be increased.

[0438] For example, when describing a composition with an atomic ratio of In:Ga:Zn = 4:2:3 or a similar ratio, it includes cases where, with In being 4, Ga is between 1 and 3, and Zn is between 2 and 4. Also, when describing a composition with an atomic ratio of In:Ga:Zn = 5:1:6 or a similar ratio, it includes cases where, with In being 5, Ga is greater than 0.1 and 2 or less, and Zn is between 5 and 7. Furthermore, when describing a composition with an atomic ratio of In:Ga:Zn = 1:1:1 or a similar ratio, it includes cases where, with In being 1, Ga is greater than 0.1 and 2 or less, and Zn is greater than 0.1 and 2 or less.

[0439] Furthermore, the In content ratio in In-M-Zn oxide may be less than the M content ratio. Examples of such In-M-Zn oxide atomic ratios include In:M:Zn=1:3:2 or close to it, In:M:Zn=1:3:3 or close to it, In:M:Zn=1:3:4 or close to it, etc. By increasing the atomic ratio of M in the metal oxide, it is possible to increase the band gap of the In-M-Zn oxide and improve its resistance to photonegative bias stress testing. Specifically, it is possible to reduce the change in threshold voltage or the change in shift voltage (Vsh) measured in the NBTIS (Negative Bias Temperature Illumination Stress) test of a transistor. Note that the shift voltage (Vsh) is defined as the Vg at which the tangent line at the point where the slope of the drain current (Id)-gate voltage (Vg) curve is maximum intersects the straight line at Id=1pA.

[0440] Alternatively, the semiconductor layer of the transistor may contain silicon. Examples of silicon include amorphous silicon and crystalline silicon (such as low-temperature polysilicon and single-crystal silicon).

[0441] Low-temperature polysilicon, in particular, has relatively high mobility and can be formed on a glass substrate, making it suitable for use in display devices. For example, transistors using low-temperature polysilicon as the semiconductor layer can be applied to transistors 252 in the drive circuit, and transistors using oxide semiconductors as the semiconductor layer can be applied to transistors 260 and 258 provided in the pixels.

[0442] Alternatively, the semiconductor layer of a transistor may have a layered material that functions as a semiconductor. A layered material is a general term for a group of materials having a layered crystalline structure. A layered crystalline structure is a structure in which layers formed by covalent or ionic bonds are stacked via weaker bonds than covalent or ionic bonds, such as van der Waals forces. Layered materials have high electrical conductivity within a unit layer, that is, high two-dimensional electrical conductivity. By using a material that functions as a semiconductor and has high two-dimensional electrical conductivity in the channel formation region, a transistor with a large on-current can be provided.

[0443] Examples of the above-mentioned layered materials include graphene, silicene, and chalcogenides. Chalcogenides are compounds containing chalcogens (elements belonging to Group 16). Examples of chalcogenides include transition metal chalcogenides and Group 13 chalcogenides. Specific examples of transition metal chalcogenides applicable as semiconductor layers in transistors include molybdenum sulfide (typically MoS2), molybdenum selenide (typically MoSe2), molybdenum tellurium (typically MoTe2), tungsten sulfide (typically WS2), tungsten selenide (typically WSe2), tungsten tellurium (typically WTe2), hafnium sulfide (typically HfS2), hafnium selenide (typically HfSe2), zirconium sulfide (typically ZrS2), and zirconium selenide (typically ZrSe2).

[0444] The transistors in circuit 464 and the transistors in display unit 462 may have the same structure or different structures. The structures of the multiple transistors in circuit 464 may all be the same or there may be two or more different structures. Similarly, the structures of the multiple transistors in display unit 462 may all be the same or there may be two or more different structures.

[0445] It is preferable to use a material that does not easily allow impurities such as water and hydrogen to diffuse into at least one layer of the insulating layer covering the transistor. This allows the insulating layer to function as a barrier layer. With such a configuration, the diffusion of impurities from the outside into the transistor can be effectively suppressed, thereby improving the reliability of the display device.

[0446] It is preferable to use an inorganic insulating film for insulating layer 261, insulating layer 262, insulating layer 265, insulating layer 268, and insulating layer 275. Examples of inorganic insulating films that can be used include silicon nitride film, silicon oxynitride film, silicon oxide film, silicon nitride film, aluminum oxide film, and aluminum nitride film. Alternatively, hafnium oxide film, yttrium oxide film, zirconium oxide film, gallium oxide film, tantalum oxide film, magnesium oxide film, lanthanum oxide film, cerium oxide film, and neodymium oxide film may also be used. Furthermore, two or more of the above-mentioned inorganic insulating films may be laminated together.

[0447] Here, organic insulating films often have lower barrier properties than inorganic insulating films. Therefore, it is preferable that the organic insulating film has an opening near the edge of the display device 400. This prevents impurities from entering through the organic insulating film from the edge of the display device 400. Alternatively, the organic insulating film may be formed so that its edge is inside the edge of the display device 400, so that the organic insulating film is not exposed at the edge of the display device 400.

[0448] An organic insulating film is preferred for the insulating layer 264, which functions as a planarizing layer. Examples of materials that can be used as the organic insulating film include acrylic resins, polyimide resins, epoxy resins, polyamide resins, polyimidoamide resins, siloxane resins, benzocyclobutene resins, phenolic resins, and precursors of these resins.

[0449] It is preferable to provide a light-shielding layer 417 on the surface of the substrate 454 that faces the substrate 453. Various optical components can also be placed on the outside of the substrate 454. Examples of optical components include polarizing plates, phase difference plates, light diffusion layers (such as diffusion films), anti-reflective layers, and light-collecting films. Furthermore, an antistatic film to suppress the adhesion of dust, a water-repellent film to make it difficult for dirt to adhere, a hard coat film to suppress the occurrence of scratches during use, and an impact-absorbing layer may also be placed on the outside of the substrate 454.

[0450] Figure 28A shows the connection section 278. At the connection section 278, the common electrode 413 and the wiring are electrically connected. Figure 28A shows an example where the same stacked structure as the pixel electrode is applied as the wiring.

[0451] Substrates 453 and 454 can be made of glass, quartz, ceramic, sapphire, resin, metal, alloy, semiconductor, etc., respectively. The substrate on the side that extracts light from the light-emitting element should be made of a material that transmits the light. Using flexible materials for substrates 453 and 454 can increase the flexibility of the display device. Alternatively, a polarizing plate may be used as substrate 453 or substrate 454.

[0452] Substrates 453 and 454 can be made from polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, acrylic resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin (nylon, aramid, etc.), polysiloxane resin, cycloolefin resin, polystyrene resin, polyamide-imide resin, polyurethane resin, polyvinyl chloride resin, polyvinylidene chloride resin, polypropylene resin, polytetrafluoroethylene (PTFE) resin, ABS resin, cellulose nanofiber, etc. One or both of substrates 453 and 454 may be made of glass of a thickness sufficient to provide flexibility.

[0453] Furthermore, when a circular polarizing plate is superimposed on a display device, it is preferable to use a substrate with high optical isotropy for the substrate of the display device. A substrate with high optical isotropy has low birefringence (or a small amount of birefringence).

[0454] For substrates with high optical isotropy, the absolute value of the retardation (phase difference) is preferably 30 nm or less, more preferably 20 nm or less, and even more preferably 10 nm or less.

[0455] Examples of films with high optical isotropy include triacetylcellulose (TAC, also known as cellulose triacetate) film, cycloolefin polymer (COP) film, cycloolefin copolymer (COC) film, and acrylic film.

[0456] Furthermore, when using a film as the substrate, the film may absorb water, potentially causing wrinkles or other shape changes in the display panel. Therefore, it is preferable to use a film with low water absorption for the substrate. For example, it is preferable to use a film with a water absorption rate of 1% or less, more preferable to use a film with a water absorption rate of 0.1% or less, and even more preferable to use a film with a water absorption rate of 0.01% or less.

[0457] Various types of curing adhesives can be used as the adhesive layer, including UV-curing adhesives, reaction-curing adhesives, thermosetting adhesives, and anaerobic adhesives. Examples of these adhesives include epoxy resins, acrylic resins, silicone resins, phenolic resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, and EVA (ethylene vinyl acetate) resins. Materials with low moisture permeability, such as epoxy resins, are particularly preferred. Two-component mixed resins may also be used. Adhesive sheets may also be used.

[0458] As the connecting layer 292, an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), etc., can be used.

[0459] Materials that can be used for conductive layers such as the gate, source, and drain of transistors, as well as various wirings and electrodes that constitute display devices, include metals such as aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten, as well as alloys mainly composed of these metals. Films containing these materials can be used as single layers or in a multilayer structure.

[0460] Furthermore, conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide containing gallium, or graphene can be used as the light-transmitting conductive material. Alternatively, metallic materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, and titanium, or alloy materials containing such metallic materials, can be used. Alternatively, nitrides of such metallic materials (e.g., titanium nitride) may be used. When using metallic materials or alloy materials (or their nitrides), it is preferable to make them thin enough to be light-transmitting. In addition, a laminated film of the above materials can be used as a conductive layer. For example, using a laminated film of a silver-magnesium alloy and indium tin oxide is preferable because it can enhance conductivity. These can also be used for conductive layers of various wirings and electrodes that constitute a display device, and for conductive layers of light-emitting elements (conductive layers that function as pixel electrodes or common electrodes).

[0461] Examples of insulating materials that can be used for each insulating layer include resins such as acrylic resin and epoxy resin, and inorganic insulating materials such as silicon oxide, silicon oxide nitride, silicon nitride, silicon oxide, and aluminum oxide.

[0462] The configuration examples illustrated in this embodiment, and the corresponding drawings, etc., can be appropriately combined with other configuration examples or drawings, etc., at least in part.

[0463] This embodiment can be implemented in appropriate combination with other embodiments described herein, at least in part.

[0464] (Embodiment 7) This embodiment describes an example of a display device having a light-receiving device, etc., according to one aspect of the present invention.

[0465] In the display device of this embodiment, each pixel can be configured to have multiple subpixels, each having a light-emitting device with a different light-emitting color. For example, a pixel can be configured to have three types of subpixels. Examples of these three subpixels include subpixels of three colors: red (R), green (G), and blue (B); and subpixels of three colors: yellow (Y), cyan (C), and magenta (M). Alternatively, a pixel can be configured to have four types of subpixels. Examples of these four subpixels include subpixels of four colors: red, green, blue, and white (W); and subpixels of four colors: red, green, blue, and yellow.

[0466] There are no particular limitations on the arrangement of subpixels, and various methods can be applied. Examples of subpixel arrangements include stripe arrangements, S-stripe arrangements, matrix arrangements, delta arrangements, Bayer arrangements, and pentile arrangements.

[0467] Furthermore, the top surface shape of a sub-pixel can be, for example, a polygon such as a triangle, quadrilateral (including rectangles and squares), or pentagon, or a polygon with rounded corners, or an ellipse or a circle. The top surface shape of a sub-pixel referred to here corresponds to the top surface shape of the light-emitting area of ​​a light-emitting device.

[0468] In a display device having light-emitting and light-receiving devices in its pixels, the pixels have a light-receiving function, allowing for the detection of contact or proximity of an object while displaying an image. For example, in addition to displaying an image using all of the subpixels of the display device, some subpixels can emit light as a light source, some other subpixels can perform light detection, and the remaining subpixels can display an image.

[0469] The pixels shown in Figures 29A, 29B, and 29C have sub-pixels G, B, R, and PS.

[0470] The pixels shown in Figure 29A have a stripe array applied. The pixels shown in Figure 29B have a matrix array applied.

[0471] The pixel arrangement shown in Figure 29C has a configuration in which three subpixels (subpixel R, subpixel G, and subpixel S) are arranged vertically next to one subpixel (subpixel B).

[0472] The pixels shown in Figures 29D, 29E, and 29F have sub-pixels G, B, R, IR, and PS.

[0473] Figures 29D, 29E, and 29F show examples where a single pixel spans two rows. The upper row (first row) has three subpixels (subpixel G, subpixel B, and subpixel R), while the lower row (second row) has two subpixels (one subpixel PS and one subpixel IRS).

[0474] Figure 29D shows a configuration where three vertically elongated subpixels G, B, and R are arranged horizontally, with a subpixel PS and a horizontally elongated subpixel IR arranged horizontally below them. Figure 29E shows a configuration where two horizontally elongated subpixels G and R are arranged vertically, with a vertically elongated subpixel B next to them, and a horizontally elongated subpixel IR and a vertically elongated subpixel PS arranged horizontally below them. Figure 29F shows a configuration where three vertically elongated subpixels R, G, and B are arranged horizontally, with a horizontally elongated subpixel IR and a vertically elongated subpixel PS arranged horizontally below them. Figures 29E and 29F show the case where the area of ​​subpixel IR is the largest, and the area of ​​subpixel PS is about the same as that of the subpixels.

[0475] Note that the layout of the subpixels is not limited to the configuration shown in Figures 29A to 29F.

[0476] Sub-pixel R has a light-emitting device that emits red light. Sub-pixel G has a light-emitting device that emits green light. Sub-pixel B has a light-emitting device that emits blue light. Sub-pixel IR has a light-emitting device that emits infrared light. Sub-pixel PS has a light-receiving device. The wavelength of light detected by sub-pixel PS is not particularly limited, but it is preferable that the light-receiving device of sub-pixel PS is sensitive to the light emitted by the light-emitting devices of sub-pixel R, sub-pixel G, sub-pixel B, or sub-pixel IR. For example, it is preferable to detect one or more of the wavelengths of light in the blue, violet, blue-violet, green, yellow-green, yellow, orange, and red ranges, and the infrared wavelength range.

[0477] The light-receiving area of ​​a sub-pixel PS is smaller than the light-emitting area of ​​other sub-pixels. A smaller light-receiving area results in a narrower imaging range, which helps suppress blurring in the image and improves resolution. Therefore, using sub-pixel PS enables high-definition or high-resolution imaging. For example, sub-pixel PS can be used to capture images for personal authentication, such as fingerprints, palm prints, irises, pulse patterns (including vein and artery patterns), or faces.

[0478] Furthermore, the sub-pixel PS can be used in touch sensors (also called direct touch sensors) or near-touch sensors (also called hover sensors, hover-touch sensors, non-contact sensors, or touchless sensors). For example, it is preferable for the sub-pixel PS to detect infrared light. This enables touch detection even in dark places.

[0479] Here, a touch sensor or near-touch sensor can detect the proximity or contact of an object (such as a finger, hand, or pen). A touch sensor can detect an object when it comes into direct contact with the display device. A near-touch sensor can detect an object even if it does not come into contact with the display device. For example, it is preferable that the display device can detect an object when the distance between the display device and the object is in the range of 0.1 mm to 300 mm, preferably 3 mm to 50 mm. With this configuration, it becomes possible to operate the display device without the object directly touching it; in other words, it becomes possible to operate the display device without contact (touchless). With the above configuration, the risk of the display device becoming dirty or scratched can be reduced, or it becomes possible to operate the display device without the object directly touching any dirt (e.g., dust or viruses) attached to the display device.

[0480] Furthermore, in order to perform high-resolution imaging, it is preferable that sub-pixels PS be provided on all pixels of the display device. On the other hand, when sub-pixels PS are used in touch sensors or near-touch sensors, the accuracy required is not as high as when capturing fingerprints, so it is sufficient to provide them on only some of the pixels of the display device. The detection speed can be increased by reducing the number of sub-pixels PS in the display device to fewer than the number of sub-pixels R, etc.

[0481] Figure 29G shows an example of a pixel circuit for a subpixel having a light-receiving device, and Figure 29H shows an example of a pixel circuit for a subpixel having a light-emitting device.

[0482] The pixel circuit PIX1 shown in Figure 29G comprises a light-receiving device PD, transistors M11, M12, M13, M14, and a capacitive element C2. Here, an example is shown in which a photodiode is used as the light-receiving device PD.

[0483] The light-receiving device PD has its anode electrically connected to wiring V1 and its cathode electrically connected to either the source or drain of transistor M11. Transistor M11 has its gate electrically connected to wiring TX and its other source or drain electrically connected to one electrode of capacitive element C2, one source or drain of transistor M12, and the gate of transistor M13. Transistor M12 has its gate electrically connected to wiring RES and its other source or drain electrically connected to wiring V2. Transistor M13 has its source or drain electrically connected to wiring V3 and its other source or drain electrically connected to either the source or drain of transistor M14. Transistor M14 has its gate electrically connected to wiring SE and its other source or drain electrically connected to wiring OUT1.

[0484] Constant potentials are supplied to wirings V1, V2, and V3, respectively. When the photodetector PD is driven with reverse bias, a potential higher than that of wiring V1 is supplied to wiring V2. Transistor M12 is controlled by a signal supplied to wiring RES and has the function of resetting the potential of the node connected to the gate of transistor M13 to the potential supplied to wiring V2. Transistor M11 is controlled by a signal supplied to wiring TX and has the function of controlling the timing at which the potential of the above node changes according to the current flowing through the photodetector PD. Transistor M13 functions as an amplifying transistor that provides an output according to the potential of the above node. Transistor M14 is controlled by a signal supplied to wiring SE and functions as a selection transistor for reading the output according to the potential of the above node with an external circuit connected to wiring OUT1.

[0485] The pixel circuit PIX2 shown in Figure 29H includes a light-emitting device EL, transistors M15, M16, M17, and a capacitive element C3. Here, an example using a light-emitting diode as the light-emitting device EL is shown. In particular, it is preferable to use an organic EL element as the light-emitting device EL.

[0486] Transistor M15 has its gate electrically connected to wiring VG, one of its source or drain electrically connected to wiring VS, and the other of its source or drain electrically connected to one electrode of capacitive element C3 and the gate of transistor M16. One of the source or drain of transistor M16 is electrically connected to wiring V4, and the other is electrically connected to the anode of light-emitting device EL and one of the source or drain of transistor M17. Transistor M17 has its gate electrically connected to wiring MS, and the other of its source or drain electrically connected to wiring OUT2. The cathode of light-emitting device EL is electrically connected to wiring V5.

[0487] Constant potentials are supplied to wirings V4 and V5, respectively. This allows the anode side of the light-emitting device EL to be at a high potential and the cathode side to be at a lower potential than the anode side. Transistor M15 is controlled by a signal supplied to wiring VG and functions as a selection transistor to control the selected state of the pixel circuit PIX2. Transistor M16 functions as a drive transistor that controls the current flowing to the light-emitting device EL according to the potential supplied to its gate. When transistor M15 is conducting, the potential supplied to wiring VS is supplied to the gate of transistor M16, and the luminescence brightness of the light-emitting device EL can be controlled according to that potential. Transistor M17 is controlled by a signal supplied to wiring MS and has the function of outputting the potential between transistor M16 and the light-emitting device EL to the outside via wiring OUT2.

[0488] Here, it is preferable to apply transistors to which the semiconductor layer in which the channel is formed is made of a metal oxide (oxide semiconductor) for transistors M11, M12, M13, and M14 in the pixel circuit PIX1, and transistors M15, M16, and M17 in the pixel circuit PIX2.

[0489] Transistors using metal oxides, which have a wider bandgap and lower carrier density than silicon, can achieve extremely low off-currents. Therefore, this low off-current allows the charge accumulated in the capacitive element connected in series with the transistor to be retained for extended periods. For this reason, it is preferable to use transistors made of oxide semiconductors, particularly for transistors M11, M12, and M15 connected in series with capacitive element C2 or C3. Similarly, using oxide semiconductor transistors for other transistors can reduce manufacturing costs.

[0490] Furthermore, transistors M11 to M17 can also be transistors in which silicon is applied as the semiconductor in which the channel is formed. In particular, using highly crystalline silicon such as single-crystal silicon or polycrystalline silicon is preferable because it can achieve high field-effect mobility, enabling faster operation.

[0491] Alternatively, a configuration may be used in which one or more transistors among transistors M11 to M17 have oxide semiconductors applied, and the others have silicon applied.

[0492] Note that in Figures 29G and 29H, transistors are shown as n-channel transistors, but p-channel transistors can also be used.

[0493] It is preferable that the transistors in pixel circuit PIX1 and pixel circuit PIX2 be formed side by side on the same substrate. In particular, it is preferable to configure the transistors in pixel circuit PIX1 and pixel circuit PIX2 to be mixed within a single region and arranged periodically.

[0494] Furthermore, it is preferable to provide one or more layers having either or both transistors and / or capacitive elements in a position that overlaps with the light-receiving device PD or light-emitting device EL. This reduces the effective area occupied by each pixel circuit, enabling the realization of a high-definition light-receiving or display unit.

[0495] This embodiment can be implemented in appropriate combination with other embodiments described herein, at least in part.

[0496] (Embodiment 8) This embodiment describes metal oxides (also called oxide semiconductors) that can be used in the OS transistor described in the above embodiment.

[0497] The metal oxide used in the OS transistor preferably contains at least indium or zinc, and more preferably indium and zinc. For example, the metal oxide preferably contains indium, M (where M is one or more selected from gallium, aluminum, yttrium, tin, silicon, boron, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, and cobalt), and zinc. In particular, M is preferably one or more selected from gallium, aluminum, yttrium, and tin, and more preferably gallium.

[0498] Furthermore, metal oxides can be formed by methods such as sputtering, chemical vapor deposition (CVD) methods including metal-organic chemical vapor deposition (MOCVD), or atomic layer deposition (ALD).

[0499] In the following sections, we will describe oxides containing indium (In), gallium (Ga), and zinc (Zn) as examples of metal oxides. Note that oxides containing indium (In), gallium (Ga), and zinc (Zn) are sometimes called In-Ga-Zn oxides.

[0500] <Classification of crystal structures> Examples of crystalline structures for oxide semiconductors include amorphous (including completely amorphous), CAAC (c-axis-aligned crystalline), nc (nanocrystalline), CAC (cloud-aligned composite), single crystal, and polycrystal.

[0501] The crystal structure of a film or substrate can be evaluated using X-ray diffraction (XRD) spectroscopy. For example, it can be evaluated using the XRD spectrum obtained from a GIXD (Grazing-Incidence XRD) measurement. The GIXD method is also known as the thin-film method or the Seemann-Bohlin method. In the following text, the XRD spectrum obtained from a GIXD measurement may simply be referred to as the XRD spectrum.

[0502] For example, in a quartz glass substrate, the peak shape of the XRD spectrum is nearly symmetrical. On the other hand, in an In-Ga-Zn oxide film with a crystalline structure, the peak shape of the XRD spectrum is asymmetrical. The asymmetrical shape of the XRD spectrum peaks clearly indicates the presence of crystals in the film or substrate. In other words, if the peak shape of the XRD spectrum is not symmetrical, the film or substrate cannot be said to be in an amorphous state.

[0503] Furthermore, the crystalline structure of a film or substrate can be evaluated by the diffraction pattern (also called the nano-beam electron diffraction pattern) observed using nano-beam electron diffraction (NBED). For example, a halo is observed in the diffraction pattern of a quartz glass substrate, confirming that the quartz glass is in an amorphous state. On the other hand, a spot-like pattern is observed in the diffraction pattern of an In-Ga-Zn oxide film deposited at room temperature, rather than a halo. Therefore, it is presumed that an In-Ga-Zn oxide film deposited at room temperature is in an intermediate state, neither single-crystal nor polycrystalline, nor amorphous, and cannot be concluded to be in an amorphous state.

[0504] <<Oxide semiconductor structure>> It should be noted that oxide semiconductors may be classified differently from those described above when considering their structure. For example, oxide semiconductors can be divided into single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors. Examples of non-single-crystal oxide semiconductors include the aforementioned CAAC-OS and nc-OS. Non-single-crystal oxide semiconductors also include polycrystalline oxide semiconductors, pseudo-amorphous oxide semiconductors (a-like OS), and amorphous oxide semiconductors.

[0505] Here, we will explain the details of the CAAC-OS, nc-OS, and a-like OS mentioned above.

[0506] [CAAC-OS] CAAC-OS is an oxide semiconductor having multiple crystalline regions, the c-axis of which is oriented in a specific direction. This specific direction is the thickness direction of the CAAC-OS film, the normal direction to the surface on which the CAAC-OS film is formed, or the normal direction to the surface of the CAAC-OS film. A crystalline region is a region with periodic atomic arrangement. If we consider the atomic arrangement as a lattice arrangement, then a crystalline region is also a region with a aligned lattice arrangement. Furthermore, CAAC-OS has regions where multiple crystalline regions are connected in the ab-plane direction, and these regions may exhibit distortion. Distortion refers to a point in the connected region where the orientation of the lattice arrangement changes between a region with a aligned lattice arrangement and another region with a aligned lattice arrangement. In short, CAAC-OS is an oxide semiconductor that is c-axis oriented and does not exhibit clear orientation in the ab-plane direction.

[0507] Each of the multiple crystalline regions described above is composed of one or more minute crystals (crystals with a maximum diameter of less than 10 nm). When a crystalline region is composed of a single minute crystal, the maximum diameter of that crystalline region is less than 10 nm. When a crystalline region is composed of many minute crystals, the size of that crystalline region may be around several tens of nanometers.

[0508] Furthermore, in In-Ga-Zn oxides, CAAC-OS tends to have a layered crystalline structure (also called a layered structure) consisting of layers containing indium (In) and oxygen (hereinafter referred to as the In layer) and layers containing gallium (Ga), zinc (Zn), and oxygen (hereinafter referred to as the (Ga,Zn) layer). Note that indium and gallium are mutually substitutable. Therefore, the (Ga,Zn) layer may contain indium. Also, the In layer may contain gallium. Also, the In layer may contain zinc. This layered structure can be observed, for example, as a lattice image in high-resolution TEM (Transmission Electron Microscope) images.

[0509] When structural analysis of a CAAC-OS film is performed using an XRD instrument, for example, out-of-plane XRD measurements using θ / 2θ scanning show a peak indicating c-axis orientation at 2θ = 31° or nearby. Note that the position of the c-axis orientation peak (value of 2θ) may vary depending on the type and composition of the metal elements constituting the CAAC-OS.

[0510] Furthermore, for example, multiple bright spots are observed in the electron diffraction pattern of a CAAC-OS film. These spots are observed at point-symmetric positions with respect to the incident electron beam spot (also called the direct spot) that passed through the sample.

[0511] When the crystal region is observed from the specific direction described above, the lattice arrangement within that crystal region is based on a hexagonal lattice, but the unit cell is not necessarily a regular hexagon and may be non-regular hexagonal. Furthermore, the strain may have lattice arrangements such as pentagons or heptagons. Moreover, in CAAC-OS, clear grain boundaries cannot be observed even near the strain. In other words, it can be seen that the formation of grain boundaries is suppressed by the strain in the lattice arrangement. This is thought to be because CAAC-OS can tolerate strain due to factors such as the non-dense arrangement of oxygen atoms in the ab-plane direction and the change in interatomic bond distances due to the substitution of metal atoms.

[0512] A crystal structure in which clear grain boundaries are observed is called a polycrystal. Grain boundaries act as recombination centers, trapping carriers and potentially causing a decrease in transistor on-current and field-effect mobility. Therefore, CAAC-OS, in which clear grain boundaries are not observed, is one of the crystalline oxides with a suitable crystal structure for the semiconductor layer of a transistor. In addition, a structure containing Zn is preferred for the composition of CAAC-OS. For example, In-Zn oxide and In-Ga-Zn oxide are preferred because they suppress the generation of grain boundaries more than In oxide.

[0513] CAAC-OS is an oxide semiconductor with high crystallinity and no clearly defined grain boundaries. Therefore, CAAC-OS is less susceptible to the decrease in electron mobility caused by grain boundaries. Furthermore, since the crystallinity of oxide semiconductors can decrease due to the inclusion of impurities and the generation of defects, CAAC-OS can be said to be an oxide semiconductor with few impurities and defects (such as oxygen vacancies). Consequently, oxide semiconductors containing CAAC-OS have stable physical properties. Therefore, oxide semiconductors containing CAAC-OS are heat resistant and highly reliable. In addition, CAAC-OS is stable even at high temperatures (so-called thermal budget) during the manufacturing process. Therefore, using CAAC-OS in OS transistors allows for greater flexibility in the manufacturing process.

[0514] [nc-OS] nc-OS exhibits periodicity in atomic arrangement in minute regions (e.g., regions between 1 nm and 10 nm, particularly between 1 nm and 3 nm). In other words, nc-OS contains minute crystals. These minute crystals are also called nanocrystals because their size is, for example, between 1 nm and 10 nm, particularly between 1 nm and 3 nm. Furthermore, nc-OS shows no regularity in crystal orientation between different nanocrystals. Therefore, no orientation is observed throughout the film. Consequently, depending on the analytical method, nc-OS may be indistinguishable from a-like OS or amorphous oxide semiconductors. For example, when structural analysis of an nc-OS film is performed using an XRD instrument, no peaks indicating crystallinity are detected in out-of-plane XRD measurements using θ / 2θ scanning. Also, when electron diffraction (also called limited-field electron diffraction) is performed on an nc-OS film using an electron beam with a probe diameter larger than that of the nanocrystals (e.g., 50 nm or larger), a diffraction pattern resembling a halo pattern is observed. On the other hand, when electron diffraction (also called nanobeam electron diffraction) is performed on an nc-OS film using an electron beam with a probe diameter close to or smaller than the size of the nanocrystal (for example, 1 nm to 30 nm), an electron diffraction pattern may be obtained in which multiple spots are observed within a ring-shaped region centered on a direct spot.

[0515] [a-like OS] a-like OS is an oxide semiconductor having a structure between nc-OS and amorphous oxide semiconductors. a-like OS has porous or low-density regions. That is, a-like OS has lower crystallinity compared to nc-OS and CAAC-OS. Also, a-like OS has a higher hydrogen concentration in the film compared to nc-OS and CAAC-OS.

[0516] <<Oxide Semiconductor Composition>> Next, we will explain the details of CAC-OS mentioned above. Note that CAC-OS refers to the material composition.

[0517] [CAC-OS] CAC-OS is a material composition in which, for example, the elements constituting the metal oxide are unevenly distributed in sizes of 0.5 nm to 10 nm, preferably 1 nm to 3 nm, or close to that size. In the following, a state in which one or more metal elements are unevenly distributed in a metal oxide, and the regions containing these metal elements are mixed in sizes of 0.5 nm to 10 nm, preferably 1 nm to 3 nm, or close to that size, is also referred to as a mosaic or patchy state.

[0518] Furthermore, CAC-OS is a composite metal oxide having a mosaic-like structure formed by the separation of the material into a first region and a second region, with the first region distributed within the film (hereinafter also referred to as a cloud-like structure). In other words, CAC-OS is a composite metal oxide having a structure in which the first region and the second region are mixed.

[0519] Here, the atomic ratios of In, Ga, and Zn to the metal elements constituting the CAC-OS in In-Ga-Zn oxide are denoted as [In], [Ga], and [Zn], respectively. For example, in the CAC-OS of In-Ga-Zn oxide, the first region is the region where [In] is greater than the [In] in the composition of the CAC-OS film. The second region is the region where [Ga] is greater than the [Ga] in the composition of the CAC-OS film. Alternatively, for example, the first region is the region where [In] is greater than the [In] in the second region, and [Ga] is smaller than the [Ga] in the second region. The second region is the region where [Ga] is greater than the [Ga] in the first region, and [In] is smaller than the [In] in the first region.

[0520] Specifically, the first region described above is a region whose main components are indium oxide, indium zinc oxide, etc. The second region described above is a region whose main components are gallium oxide, gallium zinc oxide, etc. In other words, the first region can be rephrased as a region whose main component is In. Similarly, the second region can be rephrased as a region whose main component is Ga.

[0521] Furthermore, a clear boundary may not be observed between the first region and the second region described above.

[0522] Furthermore, CAC-OS in In-Ga-Zn oxide refers to a material composition containing In, Ga, Zn, and O, in which regions with Ga as the main component and regions with In as the main component are arranged in a mosaic-like manner, with these regions existing randomly. Therefore, it is presumed that CAC-OS has a structure in which metal elements are unevenly distributed.

[0523] CAC-OS can be formed by sputtering, for example, under conditions where the substrate is not intentionally heated. When forming CAC-OS by sputtering, one or more gases selected from inert gases (typically argon), oxygen gas, and nitrogen gas may be used as the deposition gas. Furthermore, a lower ratio of the oxygen gas flow rate to the total deposition gas flow rate during film formation is preferable. For example, the ratio of the oxygen gas flow rate to the total deposition gas flow rate during film formation should be 0% or more and less than 30%, preferably 0% or more and 10% or less.

[0524] Furthermore, for example, in the case of CAC-OS in In-Ga-Zn oxide, EDX mapping obtained using energy dispersive X-ray spectroscopy (EDX) confirms that it has a structure in which regions mainly composed of In (first region) and regions mainly composed of Ga (second region) are unevenly distributed and mixed.

[0525] Here, the first region is a region with higher conductivity compared to the second region. In other words, the conductivity of the metal oxide is exhibited when carriers flow through the first region. Therefore, a high field-effect mobility (μ) can be achieved when the first region is distributed in a cloud-like manner within the metal oxide.

[0526] On the other hand, the second region is a region with higher insulating properties compared to the first region. In other words, the distribution of the second region within the metal oxide can suppress leakage current.

[0527] Therefore, when CAC-OS is used in a transistor, the conductivity due to the first region and the insulation due to the second region work complementaryly to give CAC-OS a switching function (on / off function). In other words, CAC-OS has conductive function in part of the material, insulating function in part of the material, and semiconductor function as a whole. By separating the conductive function and the insulating function, both functions can be maximized. Therefore, by using CAC-OS in a transistor, a high on-current (I on ), high field-effect mobility (μ), and good switching operation can be achieved.

[0528] Furthermore, transistors using CAC-OS offer high reliability. Therefore, CAC-OS is ideal for various semiconductor devices, including display devices.

[0529] Oxide semiconductors can take on diverse structures, each possessing different properties. One embodiment of the present invention may include two or more of the following: amorphous oxide semiconductors, polycrystalline oxide semiconductors, a-like OS, CAC-OS, nc-OS, and CAAC-OS.

[0530] <Transistors containing oxide semiconductors> Next, we will explain the case where the above oxide semiconductor is used in a transistor.

[0531] By using the above-mentioned oxide semiconductor in transistors, it is possible to realize transistors with high field-effect mobility. Furthermore, it is possible to realize highly reliable transistors.

[0532] It is preferable to use an oxide semiconductor with a low carrier concentration for the transistor. For example, the carrier concentration of an oxide semiconductor is 1 × 10⁻⁶. 17 cm -3 The following is preferably 1 × 10 15 cm -3 More preferably 1 × 10 13 cm -3More preferably 1 × 10 11 cm -3 More preferably 1 × 10 10 cm -3 It is less than 1 × 10 -9 cm -3 This concludes the explanation. Furthermore, when lowering the carrier concentration of an oxide semiconductor film, the impurity concentration in the oxide semiconductor film should be lowered to reduce the defect level density. In this specification, a low impurity concentration and low defect level density are referred to as high-purity intrinsic or substantially high-purity intrinsic. Note that oxide semiconductors with low carrier concentrations are sometimes referred to as high-purity intrinsic or substantially high-purity intrinsic oxide semiconductors.

[0533] Furthermore, oxide semiconductor films that are highly intrinsic or substantially highly intrinsic may have a low trap level density due to their low defect level density.

[0534] Furthermore, charges trapped in the trap levels of oxide semiconductors can take a long time to disappear, sometimes behaving like fixed charges. Therefore, transistors in which channel formation regions are formed in oxide semiconductors with a high trap level density may exhibit unstable electrical properties.

[0535] Therefore, reducing the impurity concentration in the oxide semiconductor is effective in stabilizing the electrical characteristics of a transistor. Furthermore, in order to reduce the impurity concentration in the oxide semiconductor, it is preferable to also reduce the impurity concentration in adjacent films. Examples of impurities include hydrogen, nitrogen, alkali metals, alkaline earth metals, iron, nickel, and silicon. Note that impurities in an oxide semiconductor refer to elements other than the main components that make up the oxide semiconductor. For example, elements with a concentration of less than 0.1 atomic percent can be considered impurities.

[0536] <Impurities> Here, we will explain the effects of various impurities in oxide semiconductors.

[0537] In oxide semiconductors, the presence of silicon or carbon, which are Group 14 elements, leads to the formation of defect levels in the oxide semiconductor. Therefore, the concentration of silicon or carbon in the oxide semiconductor and the concentration of silicon or carbon near the interface with the oxide semiconductor (concentration obtained by secondary ion mass spectrometry (SIMS)) are compared by 2 × 10⁻⁶. 18 atoms / cm 3 The following is preferably 2 × 10 17 atoms / cm 3 The following applies:

[0538] Furthermore, if an oxide semiconductor contains alkali metals or alkaline earth metals, it may form defect levels and generate carriers. Therefore, transistors using oxide semiconductors containing alkali metals or alkaline earth metals tend to exhibit normally-on characteristics. For this reason, the concentration of alkali metals or alkaline earth metals in the oxide semiconductor obtained by SIMS should be set to 1 × 10⁻⁶. 18 atoms / cm 3 The following is preferably 2 × 10 16 atoms / cm 3 Do the following:

[0539] Furthermore, in oxide semiconductors, the presence of nitrogen generates electrons, which act as carriers, increasing the carrier concentration and making it easier for the semiconductor to become n-type. As a result, transistors using oxide semiconductors containing nitrogen tend to exhibit normally-on characteristics. Alternatively, the presence of nitrogen in oxide semiconductors can lead to the formation of trap levels. As a result, the electrical properties of the transistor may become unstable. For this reason, the nitrogen concentration in oxide semiconductors obtained by SIMS should be set to 5 × 10⁻⁶. 19 atoms / cm 3 Less than 5 × 10 18 atoms / cm 3 More preferably 1 × 10 18 atoms / cm 3 More preferably 5 × 10 17 atoms / cm 3 Do the following:

[0540] Furthermore, hydrogen contained in oxide semiconductors can react with oxygen bonded to metal atoms to form water, potentially creating oxygen vacancies. Hydrogen can then fill these vacancies, generating electrons as carriers. Additionally, some of the hydrogen can combine with oxygen bonded to metal atoms to generate electrons. Therefore, transistors using oxide semiconductors containing hydrogen tend to exhibit normally-on characteristics. For this reason, it is preferable to reduce the hydrogen content in oxide semiconductors as much as possible. Specifically, the hydrogen concentration in the oxide semiconductor obtained by SIMS should be 1 × 10⁻⁶. 20 atoms / cm 3 Less than 1 × 10 19 atoms / cm 3 Less than 5x10 18 atoms / cm 3 Less than 1 × 10 18 atoms / cm 3 Make it less than.

[0541] By using an oxide semiconductor with sufficiently reduced impurities in the channel formation region of a transistor, stable electrical characteristics can be provided.

[0542] This embodiment can be implemented in appropriate combination with other embodiments described herein, at least in part. [Explanation of Symbols]

[0543] 10: Vehicle control device, 20a to 20d: Light-receiving and light-emitting unit, 20: Light-receiving and light-emitting unit, 21B: Light-emitting element, 21G: Light-emitting element, 21IR: Light-emitting element, 21R: Light-emitting element, 21: Light-emitting element, 22: Light-receiving element, 23: Drive circuit, 24: Read circuit, 25r: Reflected light, 25: Light, 30: Control unit, 31: Data generation unit, 32: Judgment unit, 33: Processing unit, 35L: Left hand, 35R: Right hand, 35: Hand, 40: Operation unit, 41: Steering wheel, 42a: Member, 4 2b: component, 42: rim, 43: hub, 44: spoke, 45: shaft, 50: vehicle, 51: display unit, 52: dashboard, 54: windshield, 55: camera, 56: air vent, 58a: door, 58b: door, 59a: display unit, 59b: display unit, 60a to 60h: display panel, 61A to 61C: display unit, 61: display unit, 62B: display panel, 62C: display panel, 62: display panel, 63: display area, 64: non-display area,

Claims

1. A steering wheel having a rim, a hub, and spokes, The rim is connected to the hub via the spokes, The rim has a light-receiving and light-emitting section, The light-receiving and light-emitting unit comprises a light-emitting element and a light-receiving element. The light-emitting element and the light-receiving element are arranged side by side on the same plane. The light-emitting element has a laminated structure in which a first electrode, a first organic layer, a common layer, and a common electrode are stacked. The light-receiving element has a laminated structure in which a second electrode, a second organic layer, the common layer, and the common electrode are stacked. The first organic layer described above includes a light-emitting layer, The second organic layer includes a photoelectric conversion layer, The light-emitting layer and the photoelectric conversion layer each contain different organic compounds. Between the light-emitting element and the light-receiving element, there is a first insulating layer and a second insulating layer provided on the first insulating layer. The first insulating layer has a region in contact with the side surface of the first electrode, a region in contact with the side surface of the first organic layer, a region in contact with the side surface of the second electrode, a region in contact with the side surface of the second organic layer, and a region in contact with the lower surface of the common layer. A vehicle control device comprising the second insulating layer having a region in contact with the lower surface of the common layer.

2. The vehicle control device according to claim 1, A vehicle having a display device, The display device has a display section having a curved surface, The display unit is provided along the dashboard or pillar. vehicle.

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