Automotive wiring board

Abstract

To easily realize a current path corresponding to a vehicle type while attaining improvement of heat radiation property by utilizing a common substrate on which a conductor part can be mounted.SOLUTION: A manufacturing method of an on-vehicle wiring board uses a substrate part main body 10. The manufacturing method of the on-vehicle wiring board includes a selection step. In the selection step, at least any one of whether to join a conductor part 50 to a plurality of land parts 23, the number of junctions of the conductor part 50 to the plurality of land parts 23, and a destination to join the lands 23 via the conductor parts 50 in a plurality of second cable runs insulated from a cable run 25 is selected in accordance with a type of a vehicle on which the on-vehicle wiring board (e.g., an on-vehicle wiring board 92) is mounted. The manufacturing method of the on-vehicle wiring board configures a current path using the cable run 25 by applying a selection result in the selection step to the substrate part main body 10.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing an in-vehicle wiring board and an in-vehicle wiring board.

Background Art

[0002] Patent Document 1 discloses a structure in which a part of a current path is constituted by a connection member mounted on a substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The current path may vary depending on the vehicle type, grade, etc. If a substrate corresponding to each current path is prepared individually, there is a concern that the number of substrate types will increase. Also, it is desired to improve the heat dissipation of the current path.

[0005] An object of the present disclosure is to provide a technology that can easily realize a current path corresponding to the type of vehicle while improving heat dissipation by using a common substrate on which a conductor portion can be mounted.

Means for Solving the Problems

[0006] The method for manufacturing an in-vehicle wiring board according to the present disclosure is a method for manufacturing an in-vehicle wiring board using a substrate portion main body, where the substrate portion main body has a conductor layer having a wiring pattern and an insulating layer having an insulating film covering a part of the wiring pattern, and includes a part region of the wiring pattern is configured as a land portion not covered by the insulating film, The wiring pattern has a power path in which a plurality of the land portions are formed. The aforementioned land portion can be joined to a heat-dissipating conductor portion. The process includes a selection step of selecting at least one of the following, according to the type of vehicle on which the vehicle-mounted wiring board is installed: whether or not the conductor portion is joined to the plurality of land portions; the number of connections of the conductor portion to the plurality of land portions; and the destination of the plurality of second power lines insulated from the power lines to which the land portions are joined via the conductor portion. The selection result from the selection step is applied to the main body of the substrate to configure a current path using the power path.

[0007] The automotive wiring board disclosed herein is The main circuit board unit, It comprises a heat-dissipating conductive part, The aforementioned substrate body is A conductor layer having a wiring pattern, An insulating layer having an insulating film that covers a portion of the wiring pattern, Equipped with, A portion of the wiring pattern is configured as a land portion not covered by the insulating film, The wiring pattern has a power path in which a plurality of the land portions are formed. The conductor portion satisfies at least one of the following conditions: it is joined to a plurality of land portions, and it is joined to the land portion to at least one of the plurality of second power lines which are insulated from the power line. [Effects of the Invention]

[0008] The technology disclosed herein utilizes a common substrate on which conductive parts can be mounted, enabling easy implementation of current paths tailored to different vehicle types while improving heat dissipation. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a plan view of a part of the main body of the substrate portion of the first embodiment. [Figure 2]FIG. 2 is a plan view of a part of an in-vehicle wiring board when the conductor portion is not connected. [Figure 3] FIG. 3 is a plan view of a part of an in-vehicle wiring board when the conductor portion is joined to a single row of land rows. [Figure 4] FIG. 4 is a plan view of a part of an in-vehicle wiring board when the conductor portion is joined to two rows of land rows. [Figure 5] FIG. 5 is a cross-sectional view taken along line A-A of FIG. 3. [Figure 6] FIG. 6 is a plan view of a part of the substrate portion main body of the second embodiment. [Figure 7] FIG. 7 is a plan view of a part of the in-vehicle wiring board of the second embodiment. [Figure 8] FIG. 8 is a plan view of a part of the substrate portion main body of the third embodiment. [Figure 9] FIG. 9 is a plan view of a part of the in-vehicle wiring board of the third embodiment. [Figure 10] FIG. 10 is an explanatory view showing an example in which the land portion and the conductor portion are arranged side by side in the second direction. [Figure 11] FIG. 11 is an explanatory view showing an example in which a plurality of conductor portions arranged offset in the first direction are packed and arranged in the second direction.

Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present disclosure will be listed and exemplified.

[0011] 〔1〕A method for manufacturing an in-vehicle wiring board using a substrate portion main body, The substrate portion main body, A conductor layer having a wiring pattern, An insulating layer having an insulating film covering a part of the wiring pattern, And, A part of the wiring pattern region is configured as a land portion not covered by the insulating film, The wiring pattern has a power path in which a plurality of the land portions are formed. The aforementioned land portion can be joined to a heat-dissipating conductor portion. The process includes a selection step of selecting at least one of the following, according to the type of vehicle on which the vehicle-mounted wiring board is installed: whether or not the conductor portion is joined to the plurality of land portions; the number of connections of the conductor portion to the plurality of land portions; and the destination of the plurality of second power lines insulated from the power lines to which the land portions are joined via the conductor portion. The selection result from the selection step is applied to the substrate body to configure a current path using the power path. A method for manufacturing automotive wiring boards.

[0012] The above-described method for manufacturing automotive wiring boards can realize current paths corresponding to multiple types depending on which option is selected in the selection process. Moreover, since the conductor portion has heat dissipation properties, heat dissipation is improved when the conductor portion is joined to the land portion. Therefore, the above-described method for manufacturing automotive wiring boards can easily realize current paths corresponding to different vehicle types while improving heat dissipation by using a common substrate on which the conductor portion can be mounted.

[0013] [2] In the selection step, at least one of the following is selected according to the type of vehicle on which the vehicle-mounted wiring board is installed: whether or not the conductor portion is joined to the multiple land portions, and the number of conductor portions joined to the multiple land portions. A method for manufacturing an in-vehicle wiring board as described in [1].

[0014] As the number of connections in the conductor increases, the cross-sectional area of ​​the current path increases, which reduces the resistance of the current path and increases the maximum current value (current tolerance) that can flow through the current path. In other words, the above method for manufacturing an in-vehicle wiring board can easily realize a current path with a current tolerance value that is appropriate for the type of vehicle.

[0015] [3] The power line is provided with multiple rows of land sections, each row consisting of multiple land sections arranged in a line. In the selection step, when selecting the number of connections of the conductor portion to the multiple land portions, the number of land rows to which the conductor portion is connected is selected. The method for manufacturing an in-vehicle wiring board as described in [2].

[0016] Automotive wiring boards manufactured by the above method can be distinguished by the number of land rows to which the conductor portion is joined. Therefore, it is easy to visually identify which type of automotive wiring board an automotive wiring board manufactured by the above method belongs to.

[0017] [4] The multiple land portions are arranged in the direction of current flow, If the selection step selects to join the conductor portion to the land portion, a joining step is performed to join the conductor portion to a plurality of land portions aligned in the direction of current flow. A method for manufacturing an in-vehicle wiring board as described in [2] or [3].

[0018] In automotive wiring boards manufactured using the above method, the conductors are arranged in the direction of current flow, making it easier for current to flow through the power path to flow through the conductors.

[0019] [5] In the selection step, the destination of the plurality of second power paths to join the land portion via the conductor portion is selected. A method for manufacturing an in-vehicle wiring board as described in [1].

[0020] The above method for manufacturing an in-vehicle wiring board allows for the selection of at least one of the power source supplying power to the power circuit and the destination of the power supply from the power circuit, depending on which second power circuit is selected. In other words, the above method for manufacturing an in-vehicle wiring board allows for the selection of at least one of the power source supplying power to the power circuit and the destination of the power supply from the power circuit, according to the type of vehicle, while improving heat dissipation.

[0021] [6] A second land portion is formed in each of the second power lines. The plurality of land portions include the land portion provided in correspondence to each of the second land portions, In the selection step, the land portion and the second land portion corresponding to the land portion are selected. If the land portion and the second land portion corresponding to the land portion are selected by the selection step, a joining step is performed to join the selected land portion and the second land portion to the conductor portion. The method for manufacturing an in-vehicle wiring board as described in [5].

[0022] In the above-described method for manufacturing automotive wiring boards, the conductor portion is joined to the corresponding land portion and the second land portion. Therefore, it is easier to join the land portion and the second land portion in a more appropriate positional relationship.

[0023] [7] When joining the conductor portion to the land portion, surface mounting is performed on the main body of the substrate portion. A method for manufacturing an in-vehicle wiring board as described in any of [1] to [6].

[0024] The automotive wiring boards manufactured using the above method make better use of the back surface of the board compared to configurations in which the conductors are mounted through holes.

[0025] [8] Main body of the circuit board, It comprises a heat-dissipating conductive part, The aforementioned substrate body is A conductor layer having a wiring pattern, An insulating layer having an insulating film that covers a portion of the wiring pattern, Equipped with, A portion of the wiring pattern is configured as a land portion not covered by the insulating film, The wiring pattern has a power path in which a plurality of the land portions are formed. The conductor portion is joined to a plurality of land portions, and is joined to at least one of the second power paths, which are insulated from the power path, to the land portion. Automotive wiring board.

[0026] In the above-mentioned automotive wiring board, where the conductor portion is joined to multiple land portions, the cross-sectional area of ​​the current path is increased by the conductor portion. As a result, the resistance value of the current path decreases, and the allowable current value increases. Furthermore, in the above-mentioned automotive wiring board, where the conductor portion is joined to at least one of the second power paths and land portions, a current path is formed in which the power path is connected to at least one of the second power paths. Therefore, the above-mentioned automotive wiring board utilizes a common board on which the conductor portion can be mounted, improving heat dissipation and configuring current paths according to the type of vehicle.

[0027] [9] The conductor portion is joined to a plurality of the land portions. The automotive wiring board described in [8].

[0028] The above-mentioned automotive wiring board has a larger cross-sectional area of ​​the current path due to the conductor portion. As a result, the resistance value of the current path decreases, and the allowable current value increases.

[0029]

[10] A second land portion is formed in each of the second power lines, Each of the aforementioned second land portions is positioned at a location corresponding to each of the aforementioned land portions. The conductor portion is joined to the corresponding land portion and the second land portion. The automotive wiring board described in [8].

[0030] The above-mentioned automotive wiring board forms a current path in which a power path is connected to at least one of the second power paths by connecting the corresponding land portions and second land portions.

[0031] <First Embodiment> The following description relates to a method for manufacturing an automotive wiring board using the main board unit 10.

[0032] (Main body of circuit board 10) As shown in Figures 1 and 5, the main body of the substrate 10 comprises a conductor layer 20 and an insulating layer 30. The conductor layer 20 is made of, for example, metal foil (for example, copper foil). The conductor layer 20 has a wiring pattern 21. The wiring pattern 21 has a longitudinal shape. An input-side electrical component 41 and an output-side electrical component 42 are provided in the wiring pattern 21. The wiring pattern 21 functions as an electrical path that supplies power input via the input-side electrical component 41 to the output-side electrical component 42. The input-side electrical component 41 is not particularly limited and may be a connector, a switch, a fuse, or other electrical component. The output-side electrical component 42 is not particularly limited and may be a connector, a switch, a fuse, or other electrical component.

[0033] As shown in Figure 5, the insulating layer 30 has a base portion 31 and an insulating film 32. The base portion 31 is insulating and is made of, for example, resin. The base portion 31 is plate-shaped. The thickness of the base portion 31 is greater than the thickness of the insulating film 32. The base portion 31 is positioned on one side of the substrate body 10 in the thickness direction relative to the conductor layer 20. Hereinafter, "thickness direction of the substrate body 10" will also be simply referred to as "thickness direction". The conductor layer 20 (more specifically, the wiring pattern 21) is provided on the other side of the base portion 31 in the thickness direction. The insulating film 32 covers a portion of the other side of the conductor layer 20 (more specifically, the wiring pattern 21) in the thickness direction. The insulating film 32 is made of, for example, solder resist. The insulating film 32 is insulating and is made of, for example, resin.

[0034] As shown in Figure 5, a portion of the wiring pattern 21 is configured as a land portion 23 that is not covered by the insulating film 32. A heat-dissipating conductor portion 50 can be joined to the land portion 23. The conductor portion 50 is a member that is joined to the land portion 23 by solder 55. The conductor portion 50 is a heat-dissipating member. The conductor portion 50 is configured not to be covered with resin. That is, the surface of the conductor portion 50 is exposed and not covered with resin. For this reason, the conductor portion 50 can improve heat dissipation compared to a jumper wire made of insulated wire. The conductor portion 50 is configured as, for example, a busbar (more specifically, a tip busbar). In this embodiment, the conductor portion 50 is rectangular parallelepiped, but it may take other forms. For example, the conductor portion 50 may be cubic, or it may have a curved surface. The conductor portion 50 has a longitudinal shape. The conductor portion 50 has an opposing surface 51 on one side in the thickness direction. The opposing surface 51 is a flat surface. The opposing surface 51 is positioned along the main body 10 of the substrate. The opposing surface 51 is joined to the land portion 23 by solder 55.

[0035] As shown in Figure 1, the land portion 23 is surrounded by an insulating film 32. The land portion 23 is rectangular in shape. The wiring pattern 21 has a power path 25 in which multiple land portions 23 are formed. The multiple land portions 23 are arranged in a line in the first direction. The multiple land portions 23 are arranged in a line in the line. The multiple land portions 23 are arranged in the direction in which the current flows. The direction in which the current flows is along the first direction.

[0036] As shown in Figure 5, the power line 25 has a first connection part 26 to which the input electrical component 41 is electrically connected, and a second connection part 27 to which the output electrical component 42 is electrically connected. In the example shown in Figure 5, the first connection part 26 and the second connection part 27 are configured as through holes. The first connection part 26 and the second connection part 27 do not have to be through holes; for example, they may be lands. Multiple land parts 23 are arranged between the first connection part 26 and the second connection part 27. The "direction of current flow" is the direction from the first connection part 26 to the second connection part 27.

[0037] As shown in Figures 1 and 5, the multiple land portions 23 include land pairs, which are composed of pairs of land portions 23. The pairs of land portions 23 are spaced apart from each other in a first direction. . Guidance The body portion 50 is joined to a pair of land portions 23. More specifically, one longitudinal end of the longitudinally shaped conductor portion 50 is joined to one land portion 23A, and the other longitudinal end is joined to the other land portion 23B. With this configuration, the amount of solder 55 used can be reduced compared to a configuration in which the entire opposing surface 51 of the conductor portion 50 is joined to the power line 25 with solder 55.

[0038] The multiple land sections 23 include multiple land pairs, as shown in Figure 1. The power line 25 includes a configuration in which the multiple land pairs are arranged side by side in a first direction. The power line 25 also includes a configuration in which the multiple land pairs are arranged offset in a second direction.

[0039] As shown in Figure 1, the power line 25 is provided with multiple rows of land sections 23, each row consisting of multiple land sections 23 arranged side by side. The multiple rows of land sections are arranged in a second direction perpendicular to the first direction and the thickness direction. In the example shown in Figure 1, there are two rows of land sections. The number of land sections 23 is the same in each row of land sections. Each row of land sections is composed of multiple land pairs. Each land pair in adjacent rows of land sections is offset from each other in the first direction.

[0040] As shown in Figure 3, the distance GA between one land portion 23A and the other land portion 23B of a pair of land portions 23 is longer than the length of the land portion 23 in the first direction and longer than the length (width) of the land portion 23 in the second direction. The length of the land portion 23 in the first direction is shorter than the length (width) of the land portion 23 in the second direction. The distance GB between adjacent land pairs in the first direction is shorter than the distance GA described above, shorter than the length of the land portion 23 in the first direction and shorter than the length (width) of the land portion 23 in the second direction. The distance GB between adjacent land pairs is the distance between the land portion 23 on the other land pair side of one land pair and the land portion 23 on the other land pair side of the other land pair.

[0041] As shown in Figure 3, the length of the conductor portion 50 in the longitudinal direction (first direction) is longer than the length of the land portion 23 in the first direction and longer than the length (width) of the land portion 23 in the second direction. The length of the conductor portion 50 in the short direction (second direction) is longer than the length of the land portion 23 in the first direction and shorter than the length (width) of the land portion 23 in the second direction.

[0042] When the conductor portion 50 is joined to multiple land portions 23, the conductor portion 50 also becomes part of the current path formed by the power lines 25. As a result, the cross-sectional area of ​​the current path formed by the power lines 25 increases. When the cross-sectional area of ​​the current path increases, the resistance of the current path decreases, and the maximum current value that can flow through the current path (allowable current value) increases.

[0043] Furthermore, the power line 25 is provided with multiple land pairs. As the number of conductors 50 joined to the power line 25 increases, the cross-sectional area of ​​the current path increases, the resistance of the current path decreases, and the allowable current value increases.

[0044] For example, in a configuration where the conductor portion 50 is not joined to the land portion 23, the allowable current value is 30A. In a configuration where the conductor portion 50 is joined to land row "1" (specifically, a configuration in which it is joined to each land pair included in land row "1"), the allowable current value is 60A. In a configuration where the conductor portion 50 is joined to land row "2" (specifically, a configuration in which it is joined to each land pair included in land row "2"), the allowable current value is 100A.

[0045] In this way, the allowable current value of the substrate body 10 is set by the number of connections of the conductor portion 50. Furthermore, since the conductor portion 50 has heat dissipation properties, the heat dissipation is also improved by connecting the conductor portion 50.

[0046] (Manufacturing method for automotive wiring boards) A method for manufacturing an automotive wiring board includes a preparation step and a selection step.

[0047] In the preparation step, the main body 10 of the circuit board is prepared. Also in the preparation step, the conductive part 50 is prepared as needed.

[0048] In the selection process, the number of connections of the conductor portion 50 to multiple land portions 23 is selected according to the type of vehicle on which the in-vehicle wiring board is mounted. In this embodiment, "selecting the number of connections of the conductor portion 50 to multiple land portions 23" is synonymous with "selecting the number of land pairs to which the conductor portion 50 is connected."

[0049] "Vehicle type" refers to a classification based on vehicle type, grade, destination, options, etc. More specifically, "vehicle type" refers to a type of vehicle in which the allowable current value in the power line 25 differs depending on the vehicle type, grade, destination, options, etc. "Allowable current value in power line 25" refers to the maximum current value that can flow through the power line 25. In this embodiment, "vehicle type" includes type A, type B, and type C. A type A vehicle requires an allowable current value of 30A. A type B vehicle requires an allowable current value of 60A. A type C vehicle requires an allowable current value of 100A.

[0050] The "number of connections of the conductor portion 50 to multiple land portions 23" also includes "0". In this embodiment, the "number of connections of the conductor portion 50 to multiple land portions 23" is one of "0", "3", or "6". In the selection step, when selecting the number of connections of the conductor portion 50 to multiple land portions 23, the number of land rows to which the conductor portion 50 is connected is selected. The "number of land rows to which the conductor portion 50 is connected" also includes "0". In this embodiment, the "number of land rows to which the conductor portion 50 is connected" is one of "0", "1", or "2".

[0051] In the selection process, if the vehicle type is type A, "0" is selected as the "number of land rows to which the conductor portion 50 is joined". In other words, if the vehicle type is type A, "0" is selected as the "number of conductor portion 50 connections to multiple land portions 23". In this case, as shown in Figure 2, the conductor portion 50 is not joined to any of the land portions 23. As a result, an in-vehicle wiring board 91 containing a current path with an allowable current value of 30A is manufactured.

[0052] Furthermore, in the selection process, if the vehicle type is type B, "1" is selected as the "number of land rows to which the conductor portion 50 is joined". In other words, if the vehicle type is type B, "3" is selected as the "number of conductor portion 50 connections to multiple land portions 23". In this way, if joining the conductor portion 50 to the land portions 23 is selected in the selection process, a joining process is performed to join the conductor portion 50 to multiple land portions 23. In the joining process, as shown in Figure 3, the conductor portion 50 is joined to the land row of "1". Specifically, in the joining process, the conductor portion 50 is joined to each land pair included in the land row of "1". As a result, an in-vehicle wiring board 92 containing a current path with an allowable current value of 60A is manufactured.

[0053] Furthermore, in the selection process, if the vehicle type is type C, "2" is selected as the "number of land rows to which the conductor portion 50 is joined". In other words, if the vehicle type is type C, "6" is selected as the "number of conductor portion 50 connections to multiple land portions 23". In this way, if joining the conductor portion 50 to the land portions 23 is selected in the selection process, a joining process is performed to join the conductor portion 50 to multiple land portions 23. In the joining process, as shown in Figure 4, the conductor portion 50 is joined to the "2" land rows. Specifically, in the joining process, the conductor portion 50 is joined to each land pair included in the "2" land rows. As a result, an in-vehicle wiring board 93 containing a current path with an allowable current value of 100A is manufactured.

[0054] In the bonding process, the conductor portion 50 is bonded to the land portion 23 by solder 55. Soldering is performed, for example, by reflow soldering. The conductor portion 50 is surface-mounted onto the main body 10 of the circuit board.

[0055] As shown in Figures 2 to 5, the input electrical components 41 are connected to the first connection points 26 of the vehicle-mounted wiring boards 91, 92, and 93 by soldering or the like. The output electrical components 42 are connected to the second connection points 27 of the vehicle-mounted wiring boards 91, 92, and 93 by soldering or the like.

[0056] (Example of effect) The manufacturing method for an in-vehicle wiring board of the first embodiment can realize current paths with allowable current values ​​according to multiple types by selecting the number of connections of the conductor portion 50 to multiple land portions 23 in the selection step. Moreover, since the conductor portion 50 has heat dissipation properties, heat dissipation is improved when the conductor portion 50 is connected to the land portion 23. More specifically, since the conductor portion 50 is not covered with resin, heat dissipation is improved compared to a configuration in which a jumper wire made of insulated wire is connected. Therefore, the manufacturing method for an in-vehicle wiring board can easily realize current paths according to the type of vehicle while improving heat dissipation by using a common substrate on which the conductor portion 50 can be mounted.

[0057] The first embodiment of the method for manufacturing an in-vehicle wiring board involves joining conductor portions 50 to a selected number of land rows. In-vehicle wiring boards manufactured by this method can be distinguished by the number of land rows to which the conductor portions 50 are joined. Therefore, it is easy to visually identify which type of in-vehicle wiring board a manufactured by this method corresponds to.

[0058] Furthermore, in the automotive wiring board manufactured by the above method, the conductor portion 50 is arranged in the direction of current flow, making it easier for current flowing through the power line 25 to flow through the conductor portion 50.

[0059] Furthermore, since the automotive wiring board manufactured by the above method has a configuration in which the conductor portion 50 is surface-mounted on the main board body 10, it is easier to effectively utilize the back surface of the main board body 10 compared to a configuration in which the conductor portion is mounted through holes.

[0060] Furthermore, in the automotive wiring boards 92 and 93 shown in Figures 3 and 4, the conductor portion 50 is joined to multiple land portions 23, thereby increasing the cross-sectional area of ​​the current path formed by the power lines 25. As a result, the resistance value of the current path decreases, and the allowable current value increases. Therefore, the automotive wiring board 92 utilizes a common board on which the conductor portion 50 can be mounted, improving heat dissipation and configuring current paths according to the type of vehicle.

[0061] <Second Embodiment> In the second embodiment, a configuration is described in which the conductor portion is connected to the land portion of the power line and to at least one of the multiple second power lines arranged on the input side.

[0062] The following description relates to a method for manufacturing an in-vehicle wiring board according to a second embodiment using the main body 210 of the substrate unit.

[0063] (Main body of circuit board 210) As shown in Figure 6, the substrate body 210 comprises a conductor layer 220 and an insulating layer 230. The conductor layer 220 is made of, for example, a metal foil (for example, copper foil). The conductor layer 220 has a wiring pattern 221. The insulating layer 230 has a base portion 31 (see Figure 5) described in the first embodiment and an insulating film 232. The insulating film 232 is made of, for example, a solder resist. The insulating film 232 has insulating properties and is made of, for example, a resin.

[0064] The wiring pattern 221 has a first power line 270 and a plurality of second power lines 280, 281. The first power line 270 is spaced apart from each of the second power lines 280, 281. When the conductor portion 50 is not connected, the first power line 270 is insulated from each of the second power lines 280, 281. Each of the second power lines 280, 281 is spaced apart from each other. Each of the second power lines 280, 281 is insulated from each other.

[0065] A portion of the wiring pattern 221 is configured as first land portions 271, 272 that are not covered by the insulating film 232. Multiple first land portions 271, 272 are formed in the first power line 270. Each of the first land portions 271, 272 is spaced apart from the others.

[0066] A portion of the wiring pattern 221 is configured as a second land area 280A that is not covered by the insulating film 232. The second land area 280A is formed in the second power line 280.

[0067] A portion of the wiring pattern 221 is configured as a second land area 281A that is not covered by the insulating film 232. The second land area 281A is formed in the second power path 281. In other words, a second land area is formed in each second power path.

[0068] The multiple first land sections 271 and 272 include a first land section provided in individual correspondence to each second land section. Specifically, the first land section 271 is positioned at a location corresponding to the second power line 280 (specifically, the second land section 280A). The first land section 271 can be connected to the second power line 280 (specifically, the second land section 280A) via the conductor section 50. The first land section 272 is positioned at a location corresponding to the second power line 281 (specifically, the second land section 281A). The first land section 272 can be connected to the second power line 281 (specifically, the second land section 281A) via the conductor section 50. In other words, the second power lines 280 and 281 (specifically, the second land sections 280A and 281A) correspond to the options for "the destination to which the first land sections 271 and 272 are connected via the conductor section 50".

[0069] Each of the second power lines 280 and 281 is supplied with different power. These different powers may be supplied from different batteries, or they may be power from a common battery that has been modified by voltage conversion or other means.

[0070] As shown in Figure 7, for example, a first voltage (+B1 voltage) is applied to the second power line 280. For example, a second voltage (+B2 voltage) is applied to the second power line 281. When the first land section 271 is connected to the second power line 280 (specifically, the second land section 280A) via the conductor section 50, power is supplied from the second power line 280 to the first power line 270. In other words, a first voltage (+B1 voltage) is applied to the first power line 270. When the first land section 272 is connected to the second power line 281 (specifically, the second land section 281A) via the conductor section 50, power is supplied from the second power line 281 to the first power line 270. In other words, a second voltage (+B2 voltage) is applied to the first power line 270. The first power line 270 supplies the power supplied from the second power line to the load 275. The type of load is not particularly limited.

[0071] (Manufacturing method for automotive wiring boards) A method for manufacturing an automotive wiring board includes a preparation step and a selection step.

[0072] In the preparation step, the main body 210 of the circuit board and the conductor part 50 are prepared.

[0073] In the selection process, the destination to which the first land portions 271 and 272 are joined via the conductor portion 50 is selected from among the multiple second power lines 280 and 281, according to the type of vehicle on which the in-vehicle wiring board is installed. As described above, each first land portion is positioned in a location corresponding to each second land portion. Therefore, in the selection process, one of the multiple first land portions 271 and 272 is selected, along with the second land portion corresponding to that first land portion.

[0074] If a first land portion and a second land portion corresponding to the first land portion are selected by the selection process, a joining process is performed to join the conductor portion 50 to the selected first land portion and second land portion.

[0075] For example, if the first land portion 271 and the second land portion 280A are selected by the selection process, the conductor portion 50 is joined to the first land portion 271 and the second land portion 280A. In this case, an in-vehicle wiring board 291 is manufactured in which the second power line 280 is connected to the first power line 270 (see Figure 7).

[0076] If the first land portion 272 and the second land portion 281A are selected by the selection process, the conductor portion 50 is joined to the first land portion 272 and the second land portion 281A. In this case, an in-vehicle wiring board (not shown) is manufactured in which the second power line 281 is connected to the first power line 270.

[0077] (Example of effect) In the second embodiment of the method for manufacturing an in-vehicle wiring board, the power source that supplies power to the first power line 270 can be selected by choosing which second power line to supply in the selection step. Moreover, since the conductor portion 50 has heat dissipation properties, heat dissipation is improved. Therefore, in the second embodiment of the method for manufacturing an in-vehicle wiring board, by using a common substrate on which the conductor portion 50 can be mounted, it is possible to easily realize current paths according to the type of vehicle while improving heat dissipation.

[0078] Furthermore, the multiple first land portions 271, 272 include first land portions provided in correspondence to each of the second power lines 280, 281 (specifically, second land portions 280A, 281A). Then, in the joining process, the conductor portion 50 is joined to the first land portion and the second land portion corresponding to the first land portion. Therefore, in the manufacturing method of the automotive wiring board of the second embodiment, the conductor portion 50 is joined to the first land portion and the second land portion which are arranged in corresponding positions to each other. For this reason, a more appropriate positional relationship is achieved. 1 It is easy to join the land section and the second land section.

[0079] Furthermore, the automotive wiring board 291 shown in Figure 7 connects the first land portion and the second land portion, which are arranged in a corresponding positional relationship to each other, thereby forming a current path in which the first power path 270 is connected to either of the second power paths.

[0080] <Third Embodiment> In the third embodiment, a configuration is described in which the conductor portion is connected to the land portion of the power line and to at least one of the multiple second power lines arranged on the output side.

[0081] The following description relates to a method for manufacturing an in-vehicle wiring board according to a third embodiment using the main body 310 of the substrate section.

[0082] (Main body of circuit board 310) As shown in Figure 8, the substrate body 310 comprises a conductor layer 320 and an insulating layer 330. The conductor layer 320 is made of, for example, a metal foil (e.g., copper foil). The conductor layer 320 has a wiring pattern 321. The insulating layer 330 has a base portion 31 (see Figure 5) as described in the first embodiment and an insulating film 332. The insulating film 332 is made of, for example, a solder resist. The insulating film 332 has insulating properties and is made of, for example, a resin.

[0083] The wiring pattern 321 has a first power line 370 and a plurality of second power lines 380, 381. The first power line 370 is spaced apart from each of the second power lines 380, 381. When the conductor portion 50 is not connected, the first power line 370 is insulated from each of the second power lines 380, 381. Each of the second power lines 380, 381 is spaced apart from each other. Each of the second power lines 380, 381 is insulated from each other.

[0084] A portion of the wiring pattern 321 is configured as first land portions 371, 372 that are not covered by the insulating film 332. Multiple first land portions 371, 372 are formed in the first power line 370. Each of the first land portions 371, 372 is spaced apart from the others.

[0085] A portion of the wiring pattern 321 is configured as a second land portion 380A that is not covered by the insulating film 332. The second land portion 380A is formed in the second power line 380.

[0086] A portion of the wiring pattern 321 is configured as a second land portion 381A that is not covered by the insulating film 332. The second land portion 381A is formed in the second power path 381. In other words, a second land portion is formed in each second power path.

[0087] The multiple first land portions 371, 372 include a first land portion provided in correspondence to each second land portion individually. Specifically, the first land portion 371 is positioned in a location corresponding to the second power line 380 (specifically, the second land portion 380A). The first land portion 371 can be connected to the second power line 380 (specifically, the second land portion 380A) via the conductor portion 50. The first land portion 372 is positioned in a location corresponding to the second power line 381 (specifically, the second land portion 381A). The first land portion 372 can be connected to the second power line 381 (specifically, the second land portion 381A) via the conductor portion 50.

[0088] As shown in Figure 9, each of the second power lines 380 and 381 can be connected to a different load. For example, the first load 385 can be connected to the second power line 380, and the second load 386 can be connected to the second power line 381. The types of the first load 385 and the second load 386 are not particularly limited.

[0089] As shown in Figure 9, a +B voltage is applied to the first power line 370. When the first land section 371 is connected to the second power line 380 (specifically, the second land section 380A) via the conductor section 50, power is supplied from the first power line 370 to the second power line 380. In other words, a +B voltage is applied to the second power line 380. When the first land section 372 is connected to the second power line 381 (specifically, the second land section 381A) via the conductor section 50, power is supplied from the first power line 370 to the second power line 381. In other words, a predetermined voltage (for example, a +B voltage) is applied to the second power line 381.

[0090] (Manufacturing method for automotive wiring boards) A method for manufacturing an automotive wiring board includes a preparation step and a selection step.

[0091] In the preparation step, the main body 310 of the circuit board and the conductor part 50 are prepared.

[0092] In the selection process, the destination to which the first land portions 371 and 372 are joined via the conductor portion 50 is selected from among the multiple second power lines 380 and 381, according to the type of vehicle on which the in-vehicle wiring board is installed. In this embodiment, the options for "the destination to which the first land portions 371 and 372 are joined" are "only the second power line 380" and "both the second power lines 380 and 381".

[0093] If "only the second power line 380" is selected in the selection process, a joining process is performed in which the conductor portion 50 is joined to the second land portion 380A and the first land portion 371 of the second power line 380. In this case, an in-vehicle wiring board (see Figure 9) is manufactured in which the first power line 370 is connected to the second power line 380.

[0094] If "both second power lines 380 and 381" are selected in the selection process, a joining process is performed in which the conductor portion 50 is joined to the second land portion 380A and the first land portion 371 of the second power line 380, and the conductor portion 50 is joined to the second land portion 381A and the first land portion 372 of the second power line 381. In this case, an in-vehicle wiring board (not shown) is manufactured in which the first power line 370 is connected to each of the multiple second power lines 380 and 381.

[0095] (Example of effect) In the third embodiment of the method for manufacturing an in-vehicle wiring board, the power supply destination from which power is supplied from the first power line 370 can be selected by which second power line is selected in the selection step. Moreover, since the conductor portion 50 has heat dissipation properties, heat dissipation is improved.Therefore, 3 The manufacturing method for an in-vehicle wiring board of this embodiment utilizes a common substrate on which the conductor portion 50 can be mounted, thereby improving heat dissipation and easily realizing current paths according to the type of vehicle.

[0096] Furthermore, the multiple first land portions 371 and 372 include first land portions provided in correspondence to each of the second power lines 380 and 381 (specifically, second land portions 380A and 381A). Then, in the joining process, the conductor portion 50 is joined to the first land portion and the second land portion corresponding to the first land portion. Therefore, in the manufacturing method of the automotive wiring board of the third embodiment, the conductor portion 50 is joined to the first land portion and the second land portion which are arranged in corresponding positions to each other. For this reason, a more appropriate positional relationship is achieved. 1 It is easy to join the land section and the second land section.

[0097] Furthermore, the automotive wiring board 391 shown in Figure 9 connects the first land portion and the second land portion, which are arranged in a corresponding positional relationship to each other, thereby forming a current path that connects the first power path 370 to the desired second power path.

[0098] <Other Embodiments> This disclosure is not limited to the embodiments described above and in the drawings. For example, any combination of the features of the embodiments described above or below is possible as long as it does not contradict each other. Furthermore, any feature of the embodiments described above or below may be omitted unless explicitly stated as essential. In addition, the embodiments described above may be modified as follows.

[0099] In the embodiments described above, the conductor portion was surface-mounted onto the main body of the substrate; however, it may also be configured to be mounted through holes.

[0100] In the first embodiment described above, the selection step was configured to select the number of connections of the conductor to multiple land portions. However, the selection step may also be configured to select whether or not to connect the conductor to multiple land portions.

[0101] In the first embodiment described above, the pair of land portions were arranged along the direction of current flow, but the configuration is not limited to this. For example, the straight line connecting the pair of land portions may be inclined with respect to the direction of current flow. From the viewpoint of facilitating current flow in the conductor portion joined to the pair of land portions, the inclination angle with respect to the direction of current flow is preferably 45° or less.

[0102] In the first embodiment described above, there were two rows of lands, but there may be one row or three or more rows.

[0103] In the first embodiment described above, the number of connections in the conductor section was selected on a land row basis, but other configurations are also possible. For example, the number of connections in the conductor section may be selected independently of the land rows.

[0104] In the first embodiment described above, the conductor portion was joined to two land portions, but it may also be configured so that the conductor portion is joined to three or more land portions.

[0105] In the first embodiment described above, the multiple land portions and conductor portions, which are offset in the second direction, were offset from each other in the first direction, but other configurations are also possible. For example, as shown in Figure 10, the multiple land portions 423 and conductor portions 50 may be arranged side by side in the second direction.

[0106] In the first embodiment described above, the positional relationship between the conductor portion and the land portion may be as shown in Figure 11. That is, the two conductor portions 50 may be positioned so that they overlap each other in the second direction and are offset in the first direction, and the land portion 523 joined to one conductor portion 50 and the land portion 523 joined to the other conductor portion 50 may be positioned so that they overlap each other in the first direction. With this configuration, it is easier to reduce the spacing between the conductor portions 50 in the second direction.

[0107] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is not limited to the embodiments disclosed herein, and is intended to include all modifications within the scope set forth in the claims or equivalents thereof. [Explanation of Symbols]

[0108] 10...Main circuit board 20...Conducting layer 21…Wiring Pattern 23...Land Department 23A...Land section 23B...Land Section 25…Power line 26...First connection section 27...Second connection section 30…Insulating layer 31...Base section 32…Insulating film 41…Input-side electrical components 42…Electrical components on the output side 50...Conductor part 51… Opposite side 55... solder 91...Automotive wiring board 92…Automotive wiring board 93…Automotive wiring board 210...Main circuit board unit 220...Conducting layer 221...Wiring pattern 230...Insulating layer 232… Insulating film 270...1st power path (power path) 271... 1st Land Division (Land Division) 272... 1st Land Division (Land Division) 275...load 280…Second power path 280A... Second Land Section 281…Second power path 281A... Second Land Section 291...Automotive wiring board 310...Main circuit board unit 320...Conducting layer 321...Wiring pattern 330...Insulating layer 332… Insulating film 370...1st power path (power path) 371... 1st Land Division (Land Division) 372... 1st Land Division (Land Division) 380…Second power path 380A...Second Land Section 381…Second power path 381A... Second Land Section 385…1st load 386…Second load 391...Automotive wiring board 423...Land Department 523...Land Department

Claims

[Claim 1] The main circuit board unit, It comprises multiple conductive parts that have heat dissipation properties, The aforementioned substrate body is A conductor layer having a wiring pattern, An insulating layer having an insulating film that covers a portion of the wiring pattern, Equipped with, A portion of the wiring pattern is configured as a land portion not covered by the insulating film, The wiring pattern has a power path in which a plurality of the land portions are formed. The plurality of conductor parts include a first conductor part and a second conductor part. The plurality of land portions include a plurality of first land portions joined to the first conductor portion and a plurality of second land portions joined to the second conductor portion. The first conductor portion and the second conductor portion are arranged offset from each other in a first direction, and are also arranged to overlap each other in a second direction perpendicular to the first direction. The plurality of first land portions and the plurality of second land portions are arranged to overlap each other in the first direction. Automotive wiring board.

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