Circuit formation substrate, and method for manufacturing a circuit formation substrate

The circuit formation substrate with a controlled resin layer and plating process addresses the inkjet droplet alignment issue, enabling miniaturized and resistant circuit formation.

JP7891311B1Active Publication Date: 2026-07-16ELEPHANTECH INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
ELEPHANTECH INC
Filing Date
2025-11-04
Publication Date
2026-07-16

AI Technical Summary

Technical Problem

The inkjet method for manufacturing circuit boards faces challenges in controlling the landing position of inkjet droplets, which hinders the miniaturization of circuits due to potential misalignment and interference between droplets, especially in fine wiring applications.

Method used

A circuit formation substrate is developed with a resin layer containing epoxy resin, having a specific elastic modulus and dissipation energy, which controls the landing position of inkjet droplets, followed by a plating layer to form a desired wiring pattern.

Benefits of technology

The solution enables precise control of inkjet droplet landing, allowing for further miniaturization of wiring patterns and improved plating resistance, resulting in high-quality circuit formation.

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Abstract

In the inkjet method, the landing position of inkjet droplets is controlled to further miniaturize the wiring. The circuit forming substrate, which has a wiring pattern on at least a portion of it, comprises an insulating substrate, a resin layer formed on the insulating substrate and containing epoxy resin, an inkjet droplet landing layer formed by the landing of a plurality of inkjet droplets containing metal particles formed on the resin layer, and a plating layer formed on the inkjet droplet landing layer, wherein the elastic modulus (Pa) of the surface of the resin layer, measured using an atomic force microscope at 25°C, is 7.0 × 10⁻⁶. 6 The above is 12.0 × 10 6 The following applies:
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