Component mounting system
The component mounting system addresses productivity and labor cost issues by automating the replacement of adhesive supply and confirmation devices, enhancing efficiency through automated installation and reducing downtime.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- FUJI CORP
- Filing Date
- 2022-10-28
- Publication Date
- 2026-07-16
AI Technical Summary
Existing component mounting machines require manual replacement of adhesive supply devices and application status confirmation devices, leading to decreased productivity and increased labor costs due to production stops.
A component mounting system with detachable and movable adhesive supply and application status confirmation devices, allowing automatic installation and replacement using a moving device, reducing downtime and labor requirements.
Enhances productivity by enabling automated replacement of adhesive supply and confirmation devices, minimizing production stops and labor costs.
Smart Images
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Abstract
Description
Technical Field
[0001] The technology disclosed in this specification relates to a component mounting system for mounting electronic components on a substrate.
Background Art
[0002] In a component mounter for mounting electronic components on a substrate, an adhesive may be applied to the substrate to mount the electronic components. For example, Japanese Patent Laid-Open No. 9-75830 discloses a component mounter including an adhesive supply device for supplying an adhesive. When the adhesive is applied to the substrate by the adhesive supply device, the adhesive may not be appropriately applied on the substrate, for example, the amount of the adhesive applied is small. Therefore, before applying the adhesive to the substrate, a trial application is performed in which the adhesive is applied experimentally at a position different from the substrate. The component mounter of Japanese Patent Laid-Open No. 9-75830 is provided with a coating state confirmation device including a sheet for trial-applying the adhesive. Before applying the adhesive to the circuit board, the adhesive is trial-applied to the sheet of the coating state confirmation device. By checking the state of the adhesive trial-applied to the sheet, it is confirmed whether the adhesive is appropriately supplied from the adhesive supply device.
Summary of the Invention
Problems to be Solved by the Invention
[0003] Depending on the production plan, the type of circuit board to be produced may change, which in turn requires a different type of adhesive to be applied to the circuit board. This means that the adhesive may need to be replaced with a different type before production can begin using the component mounting machine. Also, if the amount of adhesive remaining in the adhesive supply device becomes insufficient, the adhesive supply device needs to be replaced. Similarly, if there is no longer any area on the sheet where the application status can be tested, the application status confirmation device needs to be replaced. However, in the component mounting machine described in Japanese Patent Publication No. 9-75830, the adhesive supply device and the application status confirmation device were installed on the component mounting machine by an operator. Therefore, when it became necessary to replace the adhesive supply device or the application status confirmation device, the component mounting process of the machine would be stopped until the operator completed the replacement work, resulting in decreased productivity and increased labor costs.
[0004] This specification discloses techniques for efficiently replacing or installing equipment used for applying adhesives and equipment used for checking the application status of adhesives. [Means for solving the problem]
[0005] The component mounting system disclosed herein mounts electronic components onto a substrate. The component mounting system comprises a component mounting machine provided with a feeder holder; a component supply feeder detachably held in the feeder holder and supplying electronic components to the component mounting machine; an adhesive supply device detachably held in the feeder holder and supplying adhesive to the component mounting machine; an application state confirmation device detachably held in the feeder holder and equipped with a sheet to which adhesive supplied from the adhesive supply device can be applied, and which confirms the application state of the adhesive supplied from the adhesive supply device based on the state of the adhesive applied to the sheet; a storage unit housing the component supply feeder, the adhesive supply device, and the application state confirmation device; and a moving device configured to move the component supply feeder between the storage unit and the feeder holder, and to move the adhesive supply device and the application state confirmation device between the storage unit and the feeder holder.
[0006] The component supply feeder, the adhesive supply device, and the coating state confirmation device can be installed on the feeder holding part and are movable by a moving device. Thus, the adhesive supply device and the coating state confirmation device can be moved using the moving device that moves the component supply feeder, and the adhesive supply device and the coating state confirmation device can be automatically installed on the component mounter. Therefore, the replacement work of the adhesive supply device and the coating state confirmation device by an operator becomes unnecessary, and productivity can be improved.
Brief Description of the Drawings
[0007] [Figure 1] A diagram showing the schematic configuration of a component mounting system according to an embodiment. [Figure 2] A diagram showing the schematic configuration of a component mounter. [Figure 3] A cross-sectional view taken along line III-III of FIG. 2. [Figure 4] A block diagram showing the control system of a component mounter. [Figure 5] A diagram showing the schematic configuration of a component feeder. [Figure 6] A diagram showing the schematic configuration of an adhesive supply device. [Figure 7] A diagram showing the schematic configuration of a coating state confirmation device.
Modes for Carrying Out the Invention
[0008] The main features of the embodiments described below are listed. Note that the technical elements described below are each independent technical elements, which exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.
[0009] In the component mounting system disclosed herein, a component supply feeder may store first identification information to identify the component supply feeder. An adhesive supply device may store second identification information to identify the adhesive supply device. A coating status confirmation device may store third identification information to identify the coating status confirmation device. The component mounting machine may be able to communicate with the component supply feeder, adhesive supply device, and coating status confirmation device held in the feeder holding section, and may include an acquisition unit that acquires first identification information, second identification information, and third identification information from the component supply feeder, adhesive supply device, and coating status confirmation device, respectively, and an identification unit that identifies the component supply feeder, adhesive supply device, and coating status confirmation device held in the feeder holding section based on the first identification information, second identification information, and third identification information acquired by the acquisition unit. With such a configuration, when a component supply feeder, adhesive supply device, or coating status confirmation device is installed in the feeder holding section, it is possible to identify which of the component supply feeder, adhesive supply device, or coating status confirmation device is installed in the feeder holding section. Furthermore, the type of parts supply feeder or adhesive supply device can also be identified from the identification information.
[0010] The component mounting system disclosed herein may further include a control device for managing the component mounting machine and the moving device. The adhesive supply device may include a remaining amount measuring unit for measuring the remaining amount of adhesive in the adhesive supply device. The component mounting machine may include a communication unit for transmitting information regarding the remaining amount of adhesive measured by the remaining amount measuring unit of the adhesive supply device held in the feeder holding unit to the control device. When the remaining amount of adhesive in the adhesive supply device held in the feeder holding unit falls below a predetermined amount, the control device may use the moving device to move the adhesive supply device from the feeder holding unit to the storage unit, and also move other adhesive supply devices stored in the storage unit to the feeder holding unit. With such a configuration, when the remaining amount of adhesive in the adhesive supply device held in the feeder holding unit becomes low, the adhesive supply device can be automatically replaced.
[0011] The component mounting system disclosed herein may further include a control device for managing the component mounting machine and the moving device. The coating status confirmation device may include a winding unit for winding up a sheet and a winding amount measuring unit for measuring the amount of sheet wound up by the winding unit. The component mounting machine may include a communication unit for transmitting information regarding the amount of sheet wound up, measured by the winding amount measuring unit of the coating status confirmation device held in the feeder holding unit, to the control device. When the amount of sheet wound up of the coating status confirmation device held in the feeder holding unit exceeds a predetermined amount, the control device may use the moving device to move the coating status confirmation device from the feeder holding unit to a storage unit, and also move other coating status confirmation devices stored in the storage unit to the feeder holding unit. With such a configuration, when the number of usable sheets for the coating status confirmation device held in the feeder holding unit decreases, the coating status confirmation device can be automatically replaced.
[0012] In the component mounting system disclosed herein, the feeder holder may be configured to hold multiple adhesive supply devices. With such a configuration, by installing multiple adhesive supply devices in the feeder holder, the time during which the mounting process is stopped for the replacement of adhesive supply devices can be reduced. In addition, multiple adhesive supply devices that supply different types of adhesives can be installed simultaneously. [Examples]
[0013] Referring to the drawings, a component mounting system 1 according to an embodiment will be described. As shown in Figure 1, the component mounting system 1 comprises a plurality of component mounting machines 10, a management device 8, a component feeder 30, a loader 50, a storage cabinet 54, an adhesive supply device 60, and a coating state confirmation device 80.
[0014] As shown in Figure 1, each component mounting machine 10 is communicated to a control device 8. The control device 8 is communicated to multiple component mounting machines 10 and loaders 50, and manages the multiple component mounting machines 10 and loaders 50. The control device 8 and the multiple component mounting machines 10 constitute a component mounting line 100. The control device 8 is configured using a computer equipped with a CPU and memory. The control device 8 controls the entire component mounting line 100 by controlling the operation of each component mounting machine 10. That is, the control device 8 determines the type and position of the electronic components 4 to be mounted on the circuit board 2 by each of the multiple component mounting machines 10, and instructs the component mounting machines 10 accordingly. As each component mounting machine 10 operates based on the instructions from the control device 8, the necessary electronic components 4 are mounted on the circuit board 2.
[0015] The component mounting machine 10 mounts electronic components 4 onto the circuit board 2. The component mounting machine 10 is also called a surface mount machine or chip mounter. The circuit board 2 is fed from one end of the component mounting line 100 to the other. Predetermined electronic components 4 are mounted onto the circuit board 2 at each component mounting machine 10. Once the circuit board 2 has reached the other end of the component mounting line 100, it is shipped as a final product or sent to a later process as a semi-finished product.
[0016] As shown in Figures 2 to 4, the component mounting machine 10 includes a feeder holding unit 14, a head 16, an imaging device 20, a moving device 18 for moving the head 16 and the imaging device 20, a substrate conveyor 22, an operation panel 24, a communication unit 28, and a control device 26.
[0017] The feeder holder 14 has multiple slots, and a component feeder 30 can be detachably installed in each of the multiple slots. The feeder holder 14 may be fixed to the component mounting machine 10 or it may be detachably installed from the component mounting machine 10. As shown in Figure 3, the feeder holder 14 is equipped with a connector 15. Note that in Figure 3, the slot furthest to the +X direction shows a state in which the component feeder 30 (and the adhesive supply device 60 and coating state confirmation device 80, which will be described later) are not installed. The connector 15 is provided at a position to connect to the connector 40 (described later) of the component feeder 30 when the component feeder 30 is installed in the feeder holder 14. In addition, the adhesive supply device 60 and the coating state confirmation device 80 can also be detachably installed in the feeder holder 14. The component feeder 30, adhesive supply device 60 and coating state confirmation device 80 will be described in detail later.
[0018] The head 16 is detachably attached to the mobile base 18a (described later) of the mobile device 18. The head 16 has one or more nozzles 6 for picking up electronic components 4. The nozzles 6 are detachably attached to the head 16. The head 16 is movable with the nozzles 6 in the Z direction (here, the vertical direction), and moves the nozzles 6 closer to and further away from the component feeder 30 and circuit board 2 installed in the feeder holding unit 14. The head 16 can pick up electronic components 4 supplied from the component feeder 30 with the nozzles 6 and mount the electronic components 4 picked up by the nozzles 6 onto the circuit board 2. Different types of heads 16 can be attached to the mobile base 18a depending on the type of electronic component 4. In addition, a head 16 to which an adhesive tool 66 (described later) can be attached can also be attached to the mobile base 18a.
[0019] The imaging device 20 is fixed to a moving base 18a (described later) and moves integrally with the moving base 18a. The imaging device 20 includes a camera and a light source. The camera is arranged such that its imaging direction is downward, and images the upper surface of the circuit board 2 and the upper surface of a sheet 84 (described later) provided in the coating state confirmation device 80. For example, a CCD camera is used as the camera. The light source is constituted by an LED and illuminates the upper surface of the circuit board 2 and the upper surface of the sheet 84. The image data of the image captured by the imaging device 20 is stored in a memory (not shown) of the control device 26.
[0020] The moving device 18 moves the head 16 and the imaging device 20 between the component feeder 30 and the circuit board 2. The moving device 18 in this embodiment is an XY robot that moves the moving base 18a in the X direction and in the Y direction perpendicular to the X direction in the horizontal plane. The moving device 18 is constituted by a guide rail for guiding the moving base 18a, a moving mechanism for moving the moving base 18a along the guide rail, and a motor for driving the moving mechanism, etc. The moving device 18 is arranged above the component feeder 30 and the circuit board 2. The head 16 and the imaging device 20 are attached to the moving base 18a. The head 16 and the imaging device 20 move above the component feeder 30 installed in the feeder holding portion 14, the adhesive supply device 60 or the coating state confirmation device 80, or above the circuit board 2 by the moving device 18.
[0021] The substrate conveyor 22 conveys the circuit board 2 in the X direction. The substrate conveyor 22 in this embodiment is constituted by a pair of belt conveyors, a support device that is attached to the belt conveyor and supports the circuit board 2 from below, and a driving device for driving the belt conveyor. The substrate conveyor 22 receives the circuit board 2 from an adjacent substrate working machine on one side and carries it into the component mounter 10, and positions the circuit board 2 at the component mounting position. When the mounting of the electronic component 4 on the circuit board 2 is completed, the substrate conveyor 22 carries out the circuit board 2 from the component mounter 10 and delivers it to an adjacent substrate working machine on the other side.
[0022] The control device 26 is configured using a computer including a CPU and a storage device. The control device 26 controls the operations of each part of the component mounter 10 based on the production program transmitted from the management device 8. As shown in FIG. 4, the control device 26 is connected to the head 16, the moving device 18, the imaging device 20, the substrate conveyor 22, the operation panel 24, and the communication unit 28, and controls each of the head 16, the moving device 18, the imaging device 20, the substrate conveyor 22, the operation panel 24, and the communication unit 28. Further, the control device 26 acquires information from the component feeder 30 installed in the feeder holding unit 14, the adhesive supply device 60, and the coating state confirmation device 80 via the connector 15. The information acquired from the component feeder 30 is, for example, identification information (described later) for identifying the component feeder 30 and information regarding the remaining amount of the electronic component 4. The information acquired from the adhesive supply device 60 is, for example, identification information (described later) for identifying the adhesive supply device 60 and information regarding the remaining amount of the adhesive in the adhesive tool 66 (described later). The information acquired from the coating state confirmation device 80 is, for example, identification information (described later) for identifying the coating state confirmation device 80 and information regarding the winding amount of the sheet 84 (described later).
[0023] The operation panel 24 is a display device that provides various information of the component mounter 10 to the operator and is an input device that receives instructions and information from the operator.
[0024] The communication unit 28 transmits and receives information to and from the management device 8. Specifically, the communication unit 28 receives information regarding the production program from the management device 8. Further, the communication unit 28 transmits information regarding the component feeder 30, the adhesive supply device 60, and the coating state confirmation device 80 installed in the feeder holding unit 14 to the management device 8. The information regarding the component feeder 30 is, for example, the identification information of the component feeder 30 and the remaining amount of the electronic component 4 accommodated in the component feeder 30. The information regarding the adhesive supply device 60 is, for example, the identification information of the adhesive supply device 60 and the remaining amount of the adhesive in the adhesive tool 66 (described later) accommodated in the adhesive supply device 60. The information regarding the coating state confirmation device 80 is, for example, the identification information of the coating state confirmation device 80 and the winding amount of the sheet 84 (described later) installed in the coating state confirmation device 80.
[0025] The component feeder 30 is detachably installed in the feeder holding section 14 and supplies electronic components 4 to the component mounting machine 10 (specifically, the nozzle 6). As shown in Figure 5, the component feeder 30 comprises a main body 32, a reel 34 detachably attached to the main body 32, a tape delivery mechanism 38, a connector 40, and a control device 42.
[0026] A long tape 36 containing multiple electronic components 4 at regular intervals is wound around the reel 34. The tape feeding mechanism 38 feeds out a fixed amount of the tape 36 containing the electronic components 4 from the reel 34. The amount of tape 36 fed out by the tape feeding mechanism 38 is set according to the spacing of the electronic components 4 contained in the tape 36. The electronic components 4 on the fed-out tape 36 are picked up by the head 16 at the component pick-up position 44. The reel 34 is replaceable with the main body 32 of the component feeder 30.
[0027] The connector 40 is located on the side of the component feeder 30 in the +Y direction (i.e., the side facing the substrate conveyor 22 when the component feeder 30 is installed in the feeder holding unit 14). When the component feeder 30 is installed in the feeder holding unit 14, the connector 40 is connected to the connector 15 of the feeder holding unit 14.
[0028] The control device 42 controls various parts of the parts feeder 30. The control device 42's memory (not shown) stores identification information for the parts feeder 30. This identification information includes information about the reels 34 installed in the parts feeder 30 and the types of electronic components 4 contained within them.
[0029] In this embodiment, the component feeder 30 is a tape-type component feeder, but the configuration is not limited to this. For example, the component feeder may be a tray-type component feeder that stores multiple electronic components 4 on a tray, or a bulk-type component feeder that stores multiple electronic components 4 randomly in a container.
[0030] As shown in Figure 1, the loader 50 is a device that automatically attaches and detaches parts feeders 30 to and from the feeder holding section 14. The loader 50 is configured to remove and collect parts feeders 30 to be replaced from the feeder holding section 14, and to attach parts feeders 30 to be used in production to the feeder holding section 14. The parts mounting machines 10 that make up the parts mounting line 100 are arranged along one direction, and the loader 50 is configured to be movable to each slot of the feeder holding section 14 of each parts mounting machine 10 by a guide rail 52 provided along that one direction (the X direction in Figure 3). The loader 50 moves along the guide rail 52 between the feeder holding section 14 of each parts mounting machine 10 and the storage unit 54. Furthermore, the loader 50 also moves the adhesive supply device 60 and the coating status confirmation device 80 between the feeder holding section 14 of each component mounting machine 10 and the storage unit 54, and attaches and detaches the adhesive supply device 60 and the coating status confirmation device 80 to the feeder holding section 14. The loader 50 is configured to communicate with the control device 8.
[0031] The storage unit 54 is located upstream of the component mounting machine 10, which is the upstreammost component mounting line 100. The storage unit 54 houses multiple component feeders 30. Specifically, the storage unit 54 houses component feeders 30 that are not used in the mounting process, as well as component feeders 30 that have been used in the mounting process. Guide rails 52 are installed on the front of the storage unit 54. That is, the guide rails 52 are installed in front of both the storage unit 54 and the multiple component mounting machines 10. The loader 50 moves the component feeders 30 housed in the storage unit 54 to the respective slots of the feeder holding section 14 of each component mounting machine 10, and also moves the component feeders 30 from the respective slots of the feeder holding section 14 of each component mounting machine 10 to the storage unit 54. In addition, the storage unit 54 also houses an adhesive supply device 60 and a coating state confirmation device 80 along with the component feeders 30.
[0032] The adhesive supply device 60 is detachably installed on the feeder holding unit 14 and supplies adhesive to the component mounting machine 10. As shown in Figure 6, the adhesive supply device 60 comprises a main body 62, a pocket 64 provided in the main body 62, an adhesive tool 66, a heater 68, a connector 70, and a control device 72.
[0033] The main body 62 has a shape that allows it to be installed in the feeder holding section 14. That is, the main body 62 has a shape that conforms to the slots of the feeder holding section 14. The X-direction dimension of the main body 62 is larger than the X-direction dimension of the parts feeder 30. For this reason, the adhesive supply device 60 is installed across multiple slots (two slots in this embodiment) of the feeder holding section 14.
[0034] Pocket 64 is provided on the upper surface of the main body 62 on the +Y direction side. Pocket 64 has a shape that can accommodate an adhesive tool 66. The adhesive tool 66 is housed in pocket 64. The adhesive tool 66 contains adhesive (e.g., glue). The adhesive tool 66 is mounted on a head 16 of a type that can accommodate the adhesive tool 66, and is moved between the adhesive supply device 60 and the circuit board 2 by a moving device 18 while mounted on the head 16. The adhesive tool 66 is used to apply adhesive to the circuit board 2. When the adhesive tool 66 is mounted on the head 16, pressure is applied to the adhesive inside the adhesive tool 66 by a pressure applying device (not shown), causing the adhesive inside the adhesive tool 66 to be discharged from the tip.
[0035] The heater 68 is positioned around the pocket 64. The heater 68 adjusts the temperature of the adhesive tool 66 housed in the pocket 64. In order to apply the adhesive to the circuit board 2 in a stable state, the adhesive needs to be adjusted to a predetermined temperature higher than room temperature. By positioning the heater 68 near the pocket 64, the temperature of the adhesive housed in the adhesive tool 66 can be suitably adjusted while the adhesive tool 66 is housed in the pocket 64.
[0036] The connector 70 is located on the side of the adhesive supply device 60 in the +Y direction (i.e., the side facing the substrate conveyor 22 when the adhesive supply device 60 is installed in the feeder holding unit 14). When the adhesive supply device 60 is installed in the feeder holding unit 14, the connector 70 is connected to the connector 15 of the feeder holding unit 14.
[0037] The control device 72 controls various parts of the adhesive supply device 60. The memory of the control device 72 (not shown) stores identification information to identify the adhesive supply device 60. The identification information includes information about the type of adhesive contained in the adhesive supply device 60. The control device 72 also calculates the remaining amount of adhesive in the adhesive tool 66. Specifically, the control device 72 calculates the remaining amount of adhesive from the amount of adhesive applied in one application and the number of uses of the adhesive tool 66. The calculated remaining amount of adhesive is stored in the memory of the control device 72. In this embodiment, the control device 72 calculates the remaining amount of adhesive, but the configuration is not limited to this. For example, the adhesive supply device may be equipped with a mass measuring device that measures the mass of the adhesive in the adhesive tool 66, and the control device 72 may store the mass of the adhesive obtained from the mass measuring device as the remaining amount of adhesive in its memory.
[0038] The coating state confirmation device 80 is used to confirm whether the adhesive is properly applied (i.e., the adhesive application state) from the adhesive tool 66 housed in the adhesive supply device 60. The coating state confirmation device 80 is detachably installed in the feeder holding unit 14. As shown in Figure 7, the coating state confirmation device 80 comprises a main body 82, a sheet 84, a supply unit 86 for supplying the sheet 84, a winding unit 88 for winding up the sheet 84, a motor 89, a connector 90, and a control device 92.
[0039] The main body 82, like the main body 62 of the adhesive supply device 60, has a shape that allows it to be installed in the feeder holding section 14. The X-direction dimension of the main body 82 is larger than the X-direction dimension of the parts feeder 30. For this reason, the coating state confirmation device 80 is installed across multiple slots (two slots in this embodiment) of the feeder holding section 14.
[0040] Sheet 84 is used to test-apply adhesive (i.e., test-apply adhesive) using an adhesive tool 66 housed in the adhesive supply device 60. Sheet 84 is supplied from the supply unit 86, exposed to the outside from the main body 82 at the test application position 85, and wound onto the winding unit 88. The supply unit 86 and the winding unit 88 are rotatably supported by the main body 82. A motor 89 is connected to the winding unit 88, and the motor 89 rotates the winding unit 88 in the direction that winds up the sheet 84 (clockwise in Figure 7). As the winding unit 88 rotates and winds up the sheet 84, the sheet 84 is pulled, and the supply unit 86 also rotates.
[0041] The connector 90 is located on the side of the coating status confirmation device 80 in the +Y direction (i.e., the side facing the substrate conveyor 22 when the coating status confirmation device 80 is installed on the feeder holding unit 14). When the coating status confirmation device 80 is installed on the feeder holding unit 14, the connector 90 is connected to the connector 15 of the feeder holding unit 14.
[0042] The control device 92 controls various parts of the coating status confirmation device 80. The memory of the control device 92 (not shown) stores identification information to identify the coating status confirmation device 80. The control device 92 also calculates the amount of sheet 84 wound onto the winding unit 88. Specifically, it calculates the amount of sheet 84 wound from the drive amount of the motor 89 connected to the winding unit 88. The calculated amount of sheet 84 wound is stored in the memory of the control device 92.
[0043] Here, we will describe the operation of checking the adhesive application status using the application status confirmation device 80. The operation of checking the adhesive application status is performed when the adhesive supply device 60 and the application status confirmation device 80 are installed in the feeder holding unit 14. Furthermore, the operation of checking the adhesive application status is performed before the adhesive is applied to the circuit board 2.
[0044] First, the control device 26 of the component mounting machine 10 mounts the adhesive tool 66, housed in the adhesive supply device 60, onto the head 16. Next, the control device 26 moves the adhesive tool 66 above the test application position 85 and applies the adhesive from the adhesive tool 66 onto the sheet 84 exposed at the test application position 85. Next, the control device 26 moves the imaging device 20 above the test application position 85 and images the test application position 85 from above. Next, the control device 26 determines from the captured image whether the size and shape of the applied adhesive are within a predetermined range. Finally, the control device 26 transmits information to the application status confirmation device 80 via connectors 15 and 90 indicating that the test application is complete.
[0045] When the control device 92 of the coating status confirmation device 80 receives information from the control device 26 that the test coating is complete, it drives the motor 89 by a predetermined amount and winds up the sheet 84 in the winding unit 88. As a result, the sheet 84 to which the adhesive has been applied during the test coating moves from the test coating position 85 towards the winding unit 88, and the sheet 84 without adhesive is exposed at the test coating position 85.
[0046] In this embodiment, the loader 50 moves the component feeder 30 between the storage unit 54 and each component mounting machine 10. When production starts on the component mounting line 100, the control device 8 moves the component feeder 30 required for each component mounting machine 10 using the loader 50, according to the production program. As mentioned above, the loader 50 can also move the adhesive supply device 60 and the application status confirmation device 80. Depending on the production program, adhesive may be applied to the circuit board 2. In addition, multiple different types of adhesive may be applied to the circuit board 2. When production starts on the component mounting line 100, the control device 8 moves the adhesive supply device 60 required for each component mounting machine 10 using the loader 50, according to the production program. Furthermore, the component mounting machine 10 on which the adhesive supply device 60 is installed needs to have an application status confirmation device 80 installed for test application. Before production begins on the component mounting line 100, the control device 8 uses a loader 50 to move the appropriate type of component feeder 30, adhesive supply device 60, and coating status confirmation device 80 between the storage unit 54 and each component mounting machine 10 so that the necessary component feeder 30, adhesive supply device 60, and coating status confirmation device 80 are installed at each component mounting machine 10.
[0047] In this case, as shown in Figure 3, the control device 8 may, if necessary, have multiple adhesive supply devices 60 installed in one component mounting machine 10. For example, different types of adhesive supply devices 60 may be installed in one component mounting machine 10, or two or more adhesive supply devices 60 of the same type may be installed in one component mounting machine 10. In this case as well, the adhesive supply devices 60 are moved to the component mounting machine 10 by the loader 50. In this embodiment, the adhesive supply devices 60 can be installed in the feeder holding unit 14. Therefore, two or more adhesive supply devices 60 can be installed in one component mounting machine 10. In Figure 3, two adhesive supply devices 60 are installed in the feeder holding unit 14, but the number of adhesive supply devices 60 installed in the feeder holding unit 14 is not particularly limited. The number of adhesive supply devices 60 installed in the feeder holding unit 14 may be one or three or more. By being able to install multiple adhesive supply devices 60 in one component mounting machine 10, production programs in the component mounting line 100 can be flexibly created. Alternatively, two or more coating condition checking devices 80 may be installed on a single component mounting machine 10.
[0048] When the component feeder 30, adhesive supply device 60, and coating status confirmation device 80 are installed in the feeder holding section 14 of the component mounting machine 10, identification information of the component feeder 30, adhesive supply device 60, and coating status confirmation device 80 installed in the feeder holding section 14 is output to the control device 26 of the component mounting machine 10 via connectors 15, 40, 70, and 90. Based on the acquired identification information, the control device 26 identifies what kind of device is installed in each slot of the feeder holding section 14. For example, when the component feeder 30 is installed in the feeder holding section 14, the control device 26 identifies from the acquired identification information that the device installed in the feeder holding section 14 is the component feeder 30 and the type of electronic component 4 that the component feeder 30 will contain. Similarly, when the adhesive supply device 60 is installed in the feeder holding section 14, the control device 26 identifies from the acquired identification information that the device installed in the feeder holding section 14 is the adhesive supply device 60 and the type of adhesive that the adhesive supply device 60 will contain. Furthermore, if the coating status confirmation device 80 is installed in the feeder holding unit 14, the control device 26 identifies the device installed in the feeder holding unit 14 as the coating status confirmation device 80 based on the acquired identification information.
[0049] Furthermore, during the assembly process, the component mounting machine 10, which is equipped with an adhesive supply device 60 and a coating status confirmation device 80, acquires information regarding the remaining amount of adhesive from the adhesive supply device 60 and information regarding the amount of sheet 84 wound from the coating status confirmation device 80. When the component mounting machine 10 acquires information regarding the remaining amount of adhesive and the amount of sheet 84 wound, it transmits the acquired information to the management device 8 via the communication unit 28. As a result, the management device 8 can determine the remaining amount of adhesive in the adhesive supply device 60 installed in each component mounting machine 10 and the remaining amount of usable sheet 84 in the coating status confirmation device 80.
[0050] Based on information regarding the remaining amount of adhesive and the amount of sheet 84 wound, the control device 8 causes the loader 50 to exchange the adhesive supply device 60 and the coating status confirmation device 80. Specifically, if the control device 8 determines from the acquired information regarding the remaining amount of adhesive that the remaining amount of adhesive is less than a predetermined amount, it moves the adhesive supply device 60 equipped with the adhesive tool 66 that has less than a predetermined amount of adhesive remaining from the feeder holding unit 14 to the storage unit 54 using the loader 50. Then, the control device 8 moves the adhesive supply device 60 equipped with the adhesive tool 66 that has a sufficient amount of adhesive remaining from the storage unit 54 to the feeder holding unit 14 using the loader 50. Similarly, if the management device 8 determines from the acquired information on the amount of sheets 84 wound that there are fewer usable sheets 84 than a predetermined amount, it moves the coating status confirmation device 80 with fewer sheets 84 remaining than a predetermined amount from the feeder holding unit 14 to the storage unit 54 using the loader 50, and moves the coating status confirmation device 80 with a sufficient amount of usable sheets 84 from the storage unit 54 to the feeder holding unit 14 using the loader 50. In this embodiment, not only the parts feeder 30 but also the adhesive supply device 60 and the coating status confirmation device 80 can be moved between the feeder holding unit 14 and the storage unit 54 using the loader 50, making it possible to automatically replace the adhesive supply device 60 and the coating status confirmation device 80 installed in the parts mounting machine 10. Furthermore, since the adhesive supply device 60 and the coating status confirmation device 80 can be moved using the loader 50 that moves the parts feeder 30, the adhesive supply device 60 and the coating status confirmation device 80 can be automatically replaced without adding a dedicated configuration for replacing the adhesive supply device 60 and the coating status confirmation device 80.
[0051] The following points should be noted regarding the component mounting system 1 described in the embodiment. In the embodiment, the connector 15 is an example of an "acquisition unit," the control device 26 is an example of an "identification unit," the component feeder 30 is an example of a "component supply feeder," the loader 50 is an example of a "moving device," the control device 72 is an example of a "remaining amount measurement unit," and the control device 92 is an example of a "winding amount measurement unit."
[0052] The specific examples of the technologies disclosed herein have been described in detail above, but these are merely illustrative and do not limit the scope of the claims. The technologies described in the claims include various modifications and changes to the specific examples described above. Furthermore, the technical elements described herein or in the drawings exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technologies illustrated herein or in the drawings achieve multiple objectives simultaneously, and achieving even one of these objectives constitutes technical usefulness in itself.
[0053] This specification also discloses a technical concept in which "the component mounting system described in claim 2" is changed to "the component mounting system described in claim 2 or 3" in claim 4.
Claims
1. A component mounting system for mounting electronic components onto a circuit board, A component mounting machine equipped with a feeder holding section, A component supply feeder, which is detachably held in the feeder holding section and supplies the electronic components to the component mounting machine, An adhesive supply device that is detachably held in the feeder holding section and supplies adhesive to the component mounting machine, A coating state confirmation device is provided, which includes a sheet detachably held in the feeder holding section and capable of applying the adhesive supplied from the adhesive supply device, and which confirms the coating state of the adhesive supplied from the adhesive supply device based on the state of the adhesive applied to the sheet, A storage cabinet housing the aforementioned parts supply feeder, the adhesive supply device, and the coating state confirmation device, A component mounting system comprising a moving device configured to move the component supply feeder between the storage unit and the feeder holding unit, and to move the adhesive supply device and the coating state confirmation device between the storage unit and the feeder holding unit.
2. The aforementioned parts supply feeder stores first identification information that identifies the parts supply feeder, The adhesive supply device stores a second identification information that identifies the adhesive supply device. The coating status confirmation device stores a third identification information that identifies the coating status confirmation device. The aforementioned component mounting machine is An acquisition unit that is capable of communicating with the parts supply feeder, the adhesive supply device, and the coating status confirmation device, respectively, which are held in the feeder holding unit, and acquires the first identification information, the second identification information, and the third identification information from the parts supply feeder, the adhesive supply device, and the coating status confirmation device, respectively, The component mounting system according to claim 1, further comprising: an identification unit that identifies the component supply feeder, the adhesive supply device, and the coating state confirmation device held in the feeder holding unit based on the first identification information, the second identification, and the third identification information acquired by the acquisition unit.
3. The system further includes a management device for managing the component mounting machine and the moving device. The adhesive supply device is equipped with a remaining amount measuring unit that measures the remaining amount of adhesive in the adhesive supply device. The component mounting machine includes a communication unit that transmits information regarding the remaining amount of adhesive measured by the remaining amount measuring unit of the adhesive supply device held in the feeder holding unit to the management device. The component mounting system according to claim 2, wherein when the amount of adhesive remaining in the adhesive supply device held in the feeder holding section falls below a predetermined amount, the management device moves the adhesive supply device from the feeder holding section to the storage section using the moving device, and moves other adhesive supply devices housed in the storage section to the feeder holding section.
4. The system further includes a management device for managing the component mounting machine and the moving device. The coating condition confirmation device comprises a winding unit for winding the sheet and a winding amount measuring unit for measuring the amount of the sheet wound up by the winding unit. The component mounting machine includes a communication unit that transmits information regarding the winding amount of the sheet, measured by the winding amount measuring unit of the coating state confirmation device held in the feeder holding unit, to the management device. The component mounting system according to claim 2, wherein when the amount of sheet wound from the coating state confirmation device held in the feeder holding unit exceeds a predetermined amount, the management device moves the coating state confirmation device from the feeder holding unit to the storage unit using the moving device, and moves other coating state confirmation devices stored in the storage unit to the feeder holding unit.
5. The component mounting system according to any one of claims 1 to 4, wherein the feeder holding section is configured to hold a plurality of adhesive supply devices.