制御装置および制御方法

JP7891662B2Active Publication Date: 2026-07-17PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
View PDF 6 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
Filing Date
2025-03-10
Publication Date
2026-07-17

AI Technical Summary

Benefits of technology

【0011】 本発明によれば、得られる素子チップの品質が向上する。 本発明の新規な特徴を添付の請求の範囲に記述するが、本発明は、構成および内容の両方に関し、本発明の他の目的および特徴と併せ、図面を照合した以下の詳細な説明によりさらによく理解されるであろう。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007891662000001
    Figure 0007891662000001
  • Figure 0007891662000002
    Figure 0007891662000002
  • Figure 0007891662000003
    Figure 0007891662000003
Patent Text Reader

Abstract

To improve the quality of obtained element chips.SOLUTION: A disclosed control device operates at least one device selected from a group consisting of: a protective layer forming device that forms a protective layer on the surface of a substrate; a patterning device that patterns the protective layer to form a mask; and a plasma processing device that plasma-etches the substrate exposed through the mask to form element chips on the basis of a recipe determined for each device. The control device determines whether or not to change the recipe on the basis of third processing data in at least one processing data acquired from a measurement device that acquires the at least one processing data selected from the group consisting of first processing data related to the protective layer, second processing data related to the mask, and the third processing data related to the element chips, changes at least one recipe when the change of the recipe is necessary, and operates the at least one device on the basis of the changed recipe.SELECTED DRAWING: Figure 1
Need to check novelty before this filing date? Find Prior Art