切屑回収装置の設置方法および連結具

JP7891663B2Active Publication Date: 2026-07-17PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
View PDF 7 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
Filing Date
2022-05-25
Publication Date
2026-07-17

AI Technical Summary

Benefits of technology

【0009】 本発明によれば、メインダクトを組み立てるための広いスペースを別途必要とせず、設置に要する作業時間も大幅に短縮することができる。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007891663000001
    Figure 0007891663000001
  • Figure 0007891663000002
    Figure 0007891663000002
  • Figure 0007891663000003
    Figure 0007891663000003
Patent Text Reader

Abstract

To provide an installation method of a chip collection apparatus capable of largely reducing an operation time required for installation without an another wide space for assembling a main duct, and provide a coupling tool used for the same.SOLUTION: In installation of a chip collection apparatus which is installed below an operation line formed by arranging a component mounting device 3 mounting a component supplied by a tape feeder to a substrate in one direction, and collects a chip KZ of a carrier tape discharged from the tape feeder via a main duct 31 formed by being serially connected in a direction where a plurality of duct pieces 41 extend on an operation line, the plurality of duct pieces 41 are inserted into below the component mounting device 3, and thereafter, both of adjacent duct pieces 41 inserted into below the component mounting device 3 are connected by a coupling tool (a L-type coupling tool 42 and a flat-type coupling tool).SELECTED DRAWING: Figure 20
Need to check novelty before this filing date? Find Prior Art