部品装着装置および部品装着方法

JP7891664B2Active Publication Date: 2026-07-17PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
Filing Date
2022-06-29
Publication Date
2026-07-17

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Abstract

To provide a component mounting device and a component mounting method that can appropriately derive a height of a nozzle of a mounting head that moves in a diagonal direction.SOLUTION: A component mounting method includes: a first direction imaging step (ST1, ST7) of imaging a tip of a mounting head that moves in a lateral direction along a substrate conveyance direction by a first imaging unit and a second imaging unit provided at separate positions; a second direction imaging step (ST2) of imaging the tip of the mounting head moving in an oblique direction by the first imaging unit and the second imaging unit; and a derivation step (ST3, ST8) of deriving a height of the tip on the basis of imaging results of the tip imaged by the first imaging unit and the second imaging unit.SELECTED DRAWING: Figure 14
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