封止用樹脂組成物、シート材、半導体装置及び半導体装置の製造方法
JP7891675B2Active Publication Date: 2026-07-17PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
- Filing Date
- 2022-04-14
- Publication Date
- 2026-07-17
AI Technical Summary
Benefits of technology
【0010】 本実施形態によれば、封止用樹脂組成物から作製されたシート材を用いて基材と半導体チップとの隙間を封止する封止材を作製する場合に、封止材中に空洞を生じさせにくくできる。
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Abstract
To provide a sealing resin composition less likely to create cavities in a sealing material when manufacturing the sealing material for sealing the gap between the base material and the semiconductor chip by using a sheet material manufactured from the sealing resin composition.SOLUTION: A sealing resin composition contains: a polyphenylene ether resin (A) that has a substituent that has radical polymerizability; tiallylisocyanurate (B); an inorganic filler (C); a radical polymerization initiator (D); and a thermoplastic elastomer (E). The percentage of the triallyl isocyanurate (B) is 5% by mass or more and 20% by mass or less based on the solid content of the sealing resin composition. The percentage of the thermoplastic elastomer (E) is 5% by mass or more and 18% by mass or less based on the solid content of the sealing resin composition.SELECTED DRAWING: Figure 1
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