ポリアミド成形コンパウンド、それから製造される成形品、およびポリアミド成形コンパウンドの使用
JP7891809B2Active Publication Date: 2026-07-17EMS CHEM AG
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- EMS CHEM AG
- Filing Date
- 2021-12-17
- Publication Date
- 2026-07-17
AI Technical Summary
Benefits of technology
【0121】 表6の結果は、安定剤としてフェロセン(C)を含む本発明の実施例1および6のポリアミド成形コンパウンドは、成分(D2)および(D3)からの無機安定剤を含む比較例3および7のポリアミド成形コンパウンドと比較して、流動性が著しく改善されたことを示す。
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Abstract
To provide polyamide molding compounds having improved heat aging resistance.SOLUTION: A filled polyamide molding compound comprises: 27 to 89.99 wt.% of at least one partially crystalline, partially aromatic polyamide, or a mixture of at least one partially crystalline, partially aromatic polyamide and at least one caprolactam-containing polyamide with a caprolactam content of at least 50 wt.%; at least one filler; at least one unsubstituted or substituted metallocene; and optionally at least one additive.SELECTED DRAWING: None
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