ポリアミドコンパウンド、それから製造される鋳型およびポリアミドコンパウンドの使用

JP7891810B2Active Publication Date: 2026-07-17EMS CHEM AG
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
EMS CHEM AG
Filing Date
2021-12-17
Publication Date
2026-07-17

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Abstract

To provide polyamide compounds allowing production of molds having improved heat aging resistance.SOLUTION: A polyamide compound comprises, in addition to 32 to 99.99 wt.% of at least one partially crystalline, partially aromatic polyamide, at least one unsubstituted or substituted metallocene, optionally at least one impact modifier, and optionally at least one additive.SELECTED DRAWING: None
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