研磨ヘッドおよび研磨装置

JP7891821B2Inactive Publication Date: 2026-07-17EBARA CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
EBARA CORP
Filing Date
2022-03-01
Publication Date
2026-07-17
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Benefits of technology

【0014】 押圧部材は、傾き調整機構によって固定された角度で予め傾いているので、押圧部材は研磨テープを撓んだ基板に対して均一に押し付けることができる。結果として、研磨テープは、基板を均一に研磨することができる。

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Patent Text Reader

Abstract

To provide a polishing head which enables a polishing tape to be pressed against a substrate, such as a wafer, with a uniform force.SOLUTION: A polishing head 10 includes: a pressing member 12 which presses a polishing tape 2 against a substrate W; an actuator 15 which moves the pressing member 12 in a predetermined pressing direction CL and applies a pressing force to the pressing member 12; and an inclination adjustment mechanism 40 which adjusts an inclination of the pressing member 12 relative to the pressing direction CL. The inclination adjustment mechanism 40 is configured to incline the pressing member 12 relative to the pressing direction CL and maintain an angle of the inclined pressing member 12.SELECTED DRAWING: Figure 6
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