切削装置及びパッケージ基板の切削方法

Abstract

To enable offcuts to be removed from a holding table during cutting.SOLUTION: A cutting apparatus 1 includes a holding table 10 for holding the back side of a package substrate formed of a device area in which a plurality of devices are partitioned on the surface thereof by division-scheduled lines and an extra area surrounding the device area, and a cutting unit having a cutting blade. The holding table 10 includes cutting blade clearance grooves 14 formed at positions corresponding to the division-scheduled lines of a package board, a plurality of suction holes 15 for suctioning and holding a plurality of package devices formed in areas compartmentalized by the clearance grooves 14, a suction source 152 that communicates with the plurality of suction holes 15, a plurality of jetting holes 18 that jet fluid formed in an area below the extra area on a holding surface 11, and a fluid supply source 182 that communicates with the plurality of jetting holes 18. When cutting the extra area, the fluid is jetted from the jetting holes 18.SELECTED DRAWING: Figure 3

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