レーザ加工装置

Abstract

To achieve both of suppression of damage on a laser light incident surface and suitable processing.SOLUTION: A laser processing apparatus 1 comprises: a laser light source part 3 which outputs laser light L; a spatial light modulator 51 which includes a modulation surface 51a on which the laser light L output from the laser light source part 3 is incident, and modulates and emits the laser light L according to a modulation pattern by displaying the modulation pattern on the modulation surface 51a; a condensing lens 54 which condenses the laser light L emitted from the spatial light modulator 51 to the inside of an object 11; a damper 55 which shuts down a portion of the laser light L in a space between the spatial light modulator 51 and the condensing lens 54; and a control part 9. The control part 9 executes switching processing of switching the modulation pattern including a diffraction pattern MP3. The damper 55 shuts down diffracted light Lg generated by the diffraction pattern MP3 in the laser light L so as not to be incident on the condensing lens 54.SELECTED DRAWING: Figure 7

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