基板処理装置および基板処理方法

Abstract

To improve in-plane uniformity of processing for removing an object to be removed from a substrate.SOLUTION: A substrate processing device comprises a substrate holding unit, a fluid supply unit, a process liquid supply unit, a nozzle, a fluid flow rate adjustment unit, and a control unit. The substrate holding unit rotatably holds a substrate. The fluid supply unit supplies fluid containing steam or mist of pressurized pure water. The process liquid supply unit supplies process liquid containing at least sulfuric acid. The nozzle is connected to the fluid supply unit and the process liquid supply unit and discharges mixed fluid of fluid and process liquid to the substrate. The fluid flow rate adjustment unit adjusts a flow rate of fluid flowing through the fluid supply unit. The control unit controls the fluid flow rate adjustment unit. The control unit adjusts a ratio of the fluid to the process liquid by controlling the fluid flow rate adjustment unit.SELECTED DRAWING: Figure 7

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