基板乾燥装置、基板処理装置及び基板乾燥方法

Abstract

To provide a substrate drying device, a substrate processing apparatus, and a substrate drying method, capable of reducing a generation of a water mark of a substrate.SOLUTION: A drying device (a substrate drying device) 300 includes: a support part 32 that receives a substrate W carried-into a drying chamber 31; a driving mechanism 33 that rotates the substrate W supported by the support part 32; a supply part 34 that supplies a processing liquid onto a processed surface of the substrate W to be rotated; a shield plate 35 that includes an opposite surface 35a that is opposite to the processed surface of the substrate W; a movement mechanism 36 that moves the shield plate 35 to a direction where it is separated to the substrate W; an air supply part 37 that eliminates oxygen in an atmosphere on the processed surface of the substrate W by supplying a gas without containing oxygen to a space between the opposite surface 35a and the substrate W; a measurement part 38 that measures a film thickness of the processing liquid supplied onto the processed surface of the substrate W; and an adjustment part 42 that adjusts a gap on the basis of information indicating a film thickness measured by the measurement part 38, and a distance (a gap) between the opposite surface 35a and the processed surface that are adopted to the film thickness predetermined.SELECTED DRAWING: Figure 3

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