レーザプロファイル計測装置
JP7891881B2Active Publication Date: 2026-07-17MITSUBISHI HEAVY IND LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- MITSUBISHI HEAVY IND LTD
- Filing Date
- 2022-09-08
- Publication Date
- 2026-07-17
AI Technical Summary
Benefits of technology
【0008】 本開示によれば、より小型で、より正確なレーザプロファイルの計測を行うことが可能なレーザプロファイル計測装置を提供することができる。
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Abstract
To provide a laser profile measuring device with which, of a more compact structure though, it is possible to perform more accurate laser profile measurement.SOLUTION: A laser profile measuring device comprises: a reflection attenuation unit that passes at least a portion of the laser entered from a first direction through and generates a measurement object laser that proceeds in the first direction, and that causes a residual component of the laser to be reflected in a second direction different from the first direction so as to generate an attenuated laser; a capture unit that is provided on one side in the first direction of the reflection attenuation unit and captures the measurement object laser; a casing that extends in the first direction and covers the reflection attenuation unit and capture unit from the outside; an attenuation cooling medium that is provided on at least one section in a circumferential direction of the casing, as seen from the first direction; and a pivoting support unit that supports the casing and attenuation cooling medium so as to be capable of rotationally moving toward an incidence direction of the laser.SELECTED DRAWING: Figure 4
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