ワークピースの膜厚測定の異常を検出する方法
JP7891888B2Active Publication Date: 2026-07-17EBARA CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- EBARA CORP
- Filing Date
- 2022-09-28
- Publication Date
- 2026-07-17
AI Technical Summary
Benefits of technology
【0012】 スペクトルは、ワークピースの表面構造に依存して変化する。例えば、ワークピースの表面上の配線パターン領域からの反射光のスペクトルと、ワークピースの表面上のスクライブラインからの反射光のスペクトルは、異なる形状を有する。反射光の複数のスペクトルは、各スペクトルの特徴量(例えばスペクトルの形状、またはスペクトルに示される反射光の強度データ)に基づいて複数のグループに分類される。
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Abstract
To provide a technology for detecting an abnormality in film thickness measurement on a workpiece such as a wafer.SOLUTION: A method includes generating multiple spectra of reflected light from multiple measurement points on a workpiece over a predetermined period of time during polishing of the workpiece, classifying the plurality of spectra into a plurality of groups including at least a first group and a second group according to the feature amount of each of the spectra, determining a monitoring index value on the basis of the number of spectra included in at least the first group, and detecting an abnormality in the film thickness measurement of at least one workpiece on the basis of a comparison between the monitoring index value and a threshold value.SELECTED DRAWING: Figure 10
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