基板の化学及び / 又は電解表面処理のためのプロセス流体の分配システム
JP7891966B2Active Publication Date: 2026-07-17ラム リサーチ ザルツブルク ゲゼルシャフト ミット ベシュレンクテル ハフツング
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- ラム リサーチ ザルツブルク ゲゼルシャフト ミット ベシュレンクテル ハフツング
- Filing Date
- 2021-07-07
- Publication Date
- 2026-07-17
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Figure 0007891966000003 
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Figure 0007891966000002
Abstract
The present disclosure relates to a process fluid distribution system for chemical and / or electrolytic surface treatment of substrates and a method for manufacturing the process fluid distribution system for chemical and / or electrolytic surface treatment of substrates. The process fluid distribution system for chemical and / or electrolytic surface treatment of substrates comprises a distribution body and a distribution medium. The distribution body comprises several openings for the process fluid and / or electric current. The distribution medium covers at least some of the openings of the distribution body. The distribution medium comprises a reticulated framework with passages for distributing the process fluid and / or electric current from the distribution body.
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