新規ポリマーおよびそれを含む樹脂組成物とその成形体

Abstract

The present invention addresses the problem of providing a polymer that has exceptional heat resistance and dielectric properties and that can be dissolved at a high concentration in an organic solvent, a resin composition including the polymer, and a molded body thereof.　This polymer has a repeating unit derived from a polymerizable compound represented by formula (I) (in the formula, X1 and X2 each independently represent a C3-C6 branched alkyl group, a C3-C6 cyclic alkyl group, a C3-C6 branched alkoxy group, or a C3-C6 cyclic alkoxy group, n represents 0 or 1, Z1 and Z2 each independently represent a single bond or a C1-C3 alkylene group, each R independently represents an organic group or a halogeno group, m1 and m2 each independently represent any integer of 0-4, and Y represents a polymerizable functional group).

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