基板処理装置
JP7892021B2Inactive Publication Date: 2026-07-17SHIBAURA MECHATRONICS CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- SHIBAURA MECHATRONICS CORP
- Filing Date
- 2024-06-06
- Publication Date
- 2026-07-17
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Benefits of technology
【0008】 本発明の実施形態によれば、基板の周縁領域の冷却効率を向上させることができる基板処理装置が提供される。
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Abstract
To provide a substrate processing apparatus capable of suppressing liquid before freezing from being discharged from the peripheral edge of a substrate.SOLUTION: A substrate processing apparatus according to an embodiment includes a mount that can support a substrate, a cooling unit capable of supplying cooling gas to a space between the mount and the substrate, a liquid supply unit capable of supplying liquid to the surface of the substrate opposite to the mount side, a plate that has a plate shape and surrounds the periphery of the substrate, and a liquid-repellent unit provided at least on the surface of the plate opposite to the mount side and having a property of repelling the liquid more easily than the substrate.SELECTED DRAWING: Figure 2
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