基板処理方法および基板処理装置

Abstract

The present invention provides a substrate processing method that can shorten the time during which the surface tension of the processing solution is applied to the pattern on the surface of the substrate. [Solution] The substrate processing method involves moving the substrate W, which is in an inclined position with respect to a vertical plane, and the liquid surface LS, which is the surface of the processing liquid in the immersion tank 21, relative to each other in the vertical direction. This changes the substrate W from an immersed state, where the entire substrate W is positioned in the processing liquid in the immersion tank 21, to a non-immersed state, where the entire substrate W is positioned above the liquid surface LS.

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