エッチング用組成物、それを用いたエッチング方法および電子部品の製造方法

JP7892055B2Inactive Publication Date: 2026-07-17TOKYO OHKA KOGYO CO LTD
View PDF 7 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
TOKYO OHKA KOGYO CO LTD
Filing Date
2023-04-13
Publication Date
2026-07-17
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Benefits of technology

【0008】 本発明によれば、エッチング対象物、特にタングステンもしくはチタンを含む金属層に対して、エッチングレートが高速で、高いエッチング選択比を実現可能なエッチング用組成物、それを用いたエッチング方法、及び電子部品の製造方法を提供することができる。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007892055000001
    Figure 0007892055000001
  • Figure 0007892055000002
    Figure 0007892055000002
Patent Text Reader

Abstract

An etching composition for selectively removing an object being etched, the etching composition being characterized by containing a tertiary-amine-containing amine compound and an oxidizer. The etching composition furthermore contains, as needed, at least one component selected from alkali compounds, organic solvents, water, chelating agents, and surfactants.
Need to check novelty before this filing date? Find Prior Art