溶着ウエハ、チューブ溶着装置、及びチューブ溶着方法
JP7892073B2Active Publication Date: 2026-07-17TERUMO KK +1
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- TERUMO KK
- Filing Date
- 2022-09-29
- Publication Date
- 2026-07-17
AI Technical Summary
Benefits of technology
【0040】 本実施形態の溶着ウエハ18は、2本の樹脂チューブ12同士を溶着させるための溶着ウエハ18であって、平板状に形成された第1基板50と、第1基板50の内表面46aに接合された第2基板52と、第1基板50の内表面46aと第2基板52の内表面46aとの間に設けられた発熱体(例えば、配線パターン56)と、第2基板52を厚さ方向に貫通し第1基板50の内表面46aを露出させる温度測定孔44と、を備える。
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Abstract
The present invention relates to a welded wafer (18), a tube welding device (10), and a tube welding method. The welded wafer (18) includes a first substrate and a second substrate formed in a flat plate shape, a heating element formed between the inner surfaces of the first substrate and the second substrate, and a temperature measurement hole (44) that penetrates the second substrate in the thickness direction and exposes the inner surface of the first substrate. The internal temperature of the welded wafer (18) can be detected by the temperature measurement hole. It is ideal to detect the temperature of the wafer (18) by a non-contact sensor such as an infrared radiation thermometer (70). The wafer is advantageous for use in cutting and melting resin tubes for medical use and the like.
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