基板処理装置、及び基板処理方法

Abstract

To provide a technique for improving throughput of a substrate processing apparatus.SOLUTION: A substrate processing apparatus includes a joining device, a conveyance device, and a control device. The joining device joins a first substrate and a second substrate to manufacture a superposed substrate. The joining device includes a first holding portion, a second holding portion, a moving mechanism, a pressing unit, and a displacement detection unit. The moving mechanism moves the relative position of the first holding portion and the second holding portion. The pressing unit depresses the center of the first substrate spaced from the second substrate to be brought into contact with the second substrate. The displacement detection unit detects downward displacement of the first substrate with respect to the first holding portion, in a point separate from the center of the first substrate. The control device controls the conveyance device to start moving toward a substrate carry-in / carry / out position with respect to the joining device, which is triggered by at least one of depressing the first substrate by the pressing unit, detecting the displacement by the displacement detection unit, and starting to move the relative position by the moving mechanism.SELECTED DRAWING: Figure 14

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