LIDARシステム用の光学構造体を組み立てる方法

Abstract

To provide an innovative packaging technology for silicon photonic devices.SOLUTION: A method for assembling an optical structure 1001 for a light detection and ranging (LIDAR) system comprises: forming a trench 1064 and one or more pedestals 1066 on a wafer 1060; forming a plurality of solder deposits on a surface of the trench 1064; placing a chip on the wafer by positioning the chip with respect to the one or more pedestals 1066, such that, when the chip is initially placed on the wafer 1060, the solder deposits do not contact the chip; and reflowing the solder deposits to form a plurality of joints, each contacting the chip.SELECTED DRAWING: Figure 10

Images