材料除去操作を行うための組成物及び方法

JP7892142B2Active Publication Date: 2026-07-17SAINT GOBAIN CERAMICS & PLASTICS INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
SAINT GOBAIN CERAMICS & PLASTICS INC
Filing Date
2023-12-11
Publication Date
2026-07-17

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Abstract

In one embodiment, the polishing composition can include abrasive particles containing zirconia, an oxidizing agent containing hydroxylamine, and a triazole compound, wherein the triazole compound is selected from 1,2,4-triazole, 1,2,3-triazole, or a combination thereof. The polishing composition can even have a polishing selectivity of 1:1:1 between copper (Cu) and tantalum nitride (TaN) and silicon dioxide (SiO), with a selectivity variation of ±50% or less.
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