Photosensitive resin composition, cured product, organic EL display device, and display device

A photosensitive resin composition with an alkali-soluble resin and phenol compound effectively reduces transmittance at 450 nm under low oxygen conditions, addressing electrode contamination issues in organic EL display devices and ensuring device reliability.

JP7893267B2Active Publication Date: 2026-07-22TORAY INDUSTRIES INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
TORAY INDUSTRIES INC
Filing Date
2023-11-17
Publication Date
2026-07-22

AI Technical Summary

Technical Problem

Existing photosensitive resin compositions used in organic EL display devices fail to reduce transmittance at a wavelength of 450 nm effectively when cured under low oxygen concentrations below 5%, leading to electrode contamination and deteriorated current-voltage characteristics.

Method used

A photosensitive resin composition comprising an alkali-soluble resin, a phenol compound with specific structural features, and a photosensitive compound, which can form a film with reduced transmittance at 450 nm even under low oxygen conditions, achieved by incorporating a phenol compound that adopts a quinone structure upon heating, absorbing in the 300-500 nm range.

Benefits of technology

The composition forms a film with low transmittance at 450 nm and high visible light shielding properties, preventing electrode contamination and maintaining device performance under low oxygen curing conditions.

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Patent Text Reader

Abstract

The present invention addresses the problem of providing a photosensitive resin composition that, even when the heating atmosphere during curing has a low oxygen concentration with an oxygen concentration of less than 5%, can still form a film that post-curing has a low transmittance in the vicinity of a wavelength of 450 nm. The photosensitive resin composition according to the present invention comprises an alkali-soluble resin (a), a phenol compound (b) having the structure represented by formula (1), and a photosensitive compound (c). (In formula (1), n represents an integer from 2 to 4 and * represents a bond.)
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