resin composition

A resin composition combining aliphatic liquid oxetane and epoxy resins with a photocationic initiator addresses the viscosity and curing trade-off, enabling efficient bonding of optical fibers to silicon chips with high adhesive strength and transparency.

JP7893269B2Active Publication Date: 2026-07-22AJINOMOTO CO INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
AJINOMOTO CO INC
Filing Date
2024-02-01
Publication Date
2026-07-22

AI Technical Summary

Technical Problem

Existing resin compositions used for bonding optical fibers to silicon chips in silicon photonics face a trade-off between high viscosity for uniform application and low exposure for rapid curing, which is necessary for high-speed mass production.

Method used

A resin composition comprising aliphatic liquid oxetane resin, aliphatic solid epoxy resin, and aliphatic liquid epoxy resin, with a photocationic polymerization initiator, and limited inorganic particles, achieving high viscosity and rapid curing without delamination.

Benefits of technology

The resin composition effectively bonds optical fibers to silicon chip grooves with minimal exposure, ensuring high adhesive strength and transparency for silicon photonics applications.

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Patent Text Reader

Abstract

To provide a resin composition which has high viscosity, and enables an optical fiber to be bonded to a groove of a silicon chip with a small exposure amount.SOLUTION: There is provided a resin composition for bonding an optical fiber to a groove of a silicon chip. The resin composition contains (A) a liquid aliphatic oxetane resin, (B) a solid aliphatic epoxy resin, (C) a liquid aliphatic epoxy resin, and (D) a photocationic polymerization initiator. The resin composition contains or does not contain (E) inorganic particles, and the amount of (E) the inorganic particles is 15 mass% or less with respect to 100 wt.% of the total amount of the resin composition.SELECTED DRAWING: Figure 1
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