Cooling module
The cooling module addresses reduced cooling efficiency by using a circuit board and heat conductive member with a coolant channel to dissipate heat from the driver, achieving enhanced cooling performance and miniaturization.
JP7893308B2Active Publication Date: 2026-07-22AISIN CORP
View PDF 8 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- AISIN CORP
- Filing Date
- 2023-10-05
- Publication Date
- 2026-07-22
AI Technical Summary
Technical Problem
The existing motor drive devices suffer from reduced cooling efficiency due to protrusions on the second cover member, which hinder effective heat dissipation from the heating element to the circulating oil.
Method used
A cooling module configuration with a circuit board mounted on a module housing that includes a cooling channel and a heat conductive member, where the substrate is housed in a space enclosed by the flow path housing, and an insert-molded busbar provides power to the substrate, allowing for heat dissipation through a coolant flowing through the cooling channel.
Benefits of technology
This configuration enhances cooling performance by efficiently dissipating heat generated by the driver to the coolant, enabling miniaturization and improved cooling efficiency.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 0007893308000001 
Figure 0007893308000002 
Figure 0007893308000003
Abstract
A cooling module according to the present invention includes: a substrate on which a driver for energizing an auxiliary machine installed on a vehicle is mounted; and a module housing for holding the substrate. The module housing has a flow-path housing inside of which is formed a cooling flow path through which a cooling liquid circulates. A heat conducting member is provided spanning the substrate and the cooling flow path.
Need to check novelty before this filing date? Find Prior Art