Resin compositions and adhesives

The resin composition addresses incomplete curing and optical axis misalignment in image sensor modules by using (meth)acrylate and thiol compounds with a photopolymerization initiator, achieving high curability and adhesive strength with 405 nm UV light and ambient light stability.

JP7893495B2Active Publication Date: 2026-07-22NAMICS CORPORATION
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
NAMICS CORPORATION
Filing Date
2022-08-01
Publication Date
2026-07-22

AI Technical Summary

Technical Problem

Existing UV-curable adhesives used in image sensor modules face issues with incomplete curing due to UV light absorption by components and require high curing accuracy to prevent optical axis misalignment, especially when exposed to ambient light.

Method used

A resin composition containing (meth)acrylate compounds, thiol compounds, and a photopolymerization initiator, optimized with specific ratios and optionally including a thermal polymerization initiator, to achieve curing with longer wavelength UV light and stability against ambient light.

Benefits of technology

The composition ensures high curability and adhesive strength with 405 nm UV light, preventing incomplete curing and optical axis misalignment, while maintaining stability under ambient lighting conditions.

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Abstract

The present invention addresses the problem of providing a resin composition and an adhesive that are highly curable and have a high photocuring adhesive strength with UV light having a longer wavelength (for example, 405 nm) and that are stable with respect to ambient light. The present invention provides a resin composition comprising: (A) a (meth)acrylate compound; (B) a thiol compound; and (C) a photopolymerization initiator represented by formula (1) (in the formula, R is hydrogen or an alkyl group).
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