Substrate processing equipment

Abstract

To provide a substrate treatment device that is configured so that workability in maintaining respective parts of the substrate treatment device can be improved while suppressing footprints from enlarging.SOLUTION: A substrate treatment device 1 comprises a substrate carry-in / carry-out part, a conveying part 310 and a treating part 330 provided to extend in parallel in a first direction from the substrate carry-in / carry-out part. The conveying part 310 conveys a carrier 9 that stores untreated substrates in the first direction from the substrate carry-in / carry-out part. The treating part 330 includes a plurality of treatment tanks 331a. In the treating part 330, the carrier 9 storing a plurality of substrates is conveyed in a second direction that is opposite to the first direction. The conveyed carried 9 is immersed in at least one of a plurality of treatment liquids stored in the plurality of treatment tanks 331a. A maintenance space MS1 is formed adjacently to the treating part 330 in a planer view. The conveying part 310 overlaps with at least a part of the treating part 330 and the maintenance space MS1 in a planar view.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus that processes a plurality of substrates in a processing tank.

Background Art

[0002] A substrate processing apparatus is used to perform various processes on substrates such as semiconductor substrates, substrates for flat panel displays (FPDs) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, or solar cell substrates.

[0003] As such a substrate processing apparatus, there is a batch-type substrate processing apparatus that immerses a plurality of substrates in a processing liquid stored in a processing tank and performs processes such as etching. For example, the batch-type substrate processing apparatus described in Patent Document 1 has a substrate processing unit. The substrate processing unit has a configuration in which a first chemical solution tank, a first rinse solution tank, a second chemical solution tank, a second rinse solution tank, and a drying processing unit are arranged in this order in a straight line. In the above substrate processing apparatus, a first delivery position and a second delivery position are set so as to be arranged in a straight line further from the drying processing unit of the substrate processing unit.

[0004] A plurality of unprocessed substrates carried into the substrate processing apparatus are received by a main transfer mechanism at the first delivery position and transferred to the substrate processing unit. In the substrate processing unit, the plurality of unprocessed substrates are transferred to a position above, for example, the first chemical solution tank or the second chemical solution tank. Further, the plurality of substrates are immersed in the chemical solution in the tank located below for a predetermined time and then pulled up. Thereafter, the plurality of substrates are transferred to a position above the first rinse solution tank or the second rinse solution tank. Further, the plurality of substrates are immersed in the rinse solution in the tank located below for a predetermined time and then pulled up.

[0005] After treatment with the chemical solution in the first or second chemical solution tank, the substrates are transported to the drying section. After drying in the drying section, the substrates are removed from the second transfer position and transported out of the substrate processing equipment. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2011-238945 [Overview of the project] [Problems that the invention aims to solve]

[0007] In the above-described substrate processing apparatus, a chuck cleaning unit is provided at the first transfer position, and multiple substrate transfer mechanisms are arranged to the side of the first transfer position (in a direction perpendicular to the first straight line). Furthermore, two substrate transfer mechanisms (intermediary robots) are provided at the second transfer position, and several more substrate transfer mechanisms are arranged to the side of the second transfer position (in a direction perpendicular to the first straight line). In addition, a hoop holding section is provided near these multiple substrate transfer mechanisms. The hoop holding section is configured to hold a container (FOUP) that accommodates multiple substrates, and is equipped with an opener for opening and closing the lid of the container.

[0008] The multiple components (chuck cleaning unit, multiple substrate transfer mechanisms, and hoop holding section) located at the first and second transfer positions and their surroundings in the above-described substrate processing apparatus are arranged adjacent to each other. Therefore, it is difficult to secure a sufficiently large maintenance space for each component, resulting in poor maintenance efficiency.

[0009] Therefore, in order to secure a sufficiently large maintenance space for each configuration related to the loading and unloading of substrates, it is conceivable to arrange the first and second transfer positions so as to sandwich the substrate processing unit. In this case, since the first and second transfer positions are separated, it is necessary to provide a new transport route connecting the hoop holding unit and the first transfer position, or a new transport route connecting the hoop holding unit and the second transfer position. However, providing a new transport route to the substrate processing unit may increase the footprint of the substrate processing unit.

[0010] The objective of the present invention is to provide a substrate processing apparatus that can improve the workability of maintenance for each part of the substrate processing apparatus while suppressing the expansion of the footprint. [Means for solving the problem]

[0011] (1) A substrate processing apparatus according to one aspect of the present invention is A substrate processing apparatus that performs predetermined processing on multiple substrates, The system comprises a substrate loading / unloading section configured to load and unload multiple substrates, a transport section and a processing section provided so as to extend in parallel from the substrate loading / unloading section in a first direction, the transport section having a first end and a second end arranged sequentially in the first direction, and configured to transport a carrier that accommodates multiple substrates loaded into the substrate loading / unloading section from the first end to the second end in the first direction, and the processing section having a third end and a fourth end arranged sequentially in the first direction, and having multiple processing tanks provided between the third end and the fourth end. In the transport section, the carrier transported to the second end is transported from the fourth end towards the third end in a second direction opposite to the first direction, and the transported carrier is immersed in at least one of the processing liquids stored in the multiple processing tanks, thereby processing the multiple substrates contained in the carrier. Prescribed processing The system is configured to perform the following and to allow multiple processed substrates to be passed to the substrate loading / unloading section, and in a plan view, the processing unit is located in a third direction that intersects the first and second directions. Multiple processing tanks Next to it, Multiple processing tanks A maintenance space is formed for the transport section, The maintenance unit is positioned so as to overlap at least a portion of the maintenance space in a plan view, but not overlap with the processing unit in a plan view, and is located above the maintenance space and the multiple processing tanks. The maintenance space is formed below the transport unit, between the installation surface of the substrate processing unit and the transport unit, and the upper limit of the height of the maintenance space is located above the position higher than the multiple processing tanks, and maintenance work can be performed from the maintenance space to the multiple processing tanks adjacent to the maintenance space. .

[0012] In this substrate processing apparatus, multiple unprocessed substrates are loaded into the substrate loading / unloading section. These multiple substrates, while housed in a carrier, are transported in a first direction from the first end to the second end of the transport section. The multiple substrates transported to the second end of the transport section are then transported in a second direction from the fourth end to the third end of the processing section, while still housed in the carrier. During this transport, the carrier containing the multiple substrates is immersed in at least one of several processing liquids stored in several processing tanks, between the fourth end and the third end. As a result, a predetermined process is performed on the multiple substrates housed in the carrier. After processing, the multiple substrates are passed to the substrate loading / unloading section and transported out.

[0013] With the above configuration, the third and fourth ends of the processing unit are spaced apart, separated by multiple processing tanks, so the components for transferring the substrate to the fourth end of the processing unit and the components for removing the substrate from the third end of the processing unit are not provided in close proximity. Furthermore, a maintenance space is formed adjacent to at least a part of the processing unit. Therefore, it becomes easy to secure a sufficiently large maintenance space for each part of the substrate processing unit. Moreover, with the above configuration, it is not necessary to provide the transport unit in a position away from the processing unit and maintenance space in a plan view.

[0014] As a result, it becomes possible to improve the workability of maintenance on each part of the circuit board processing unit while suppressing the expansion of the footprint. Furthermore, with the above configuration, the maintenance space is adjacent to multiple processing tanks, improving the efficiency of maintenance for the multiple processing tanks. In addition, since the transport unit is located above the maintenance space and the multiple processing tanks, it is prevented that particles and other contaminants generated in the maintenance space and the multiple processing tanks adhere to the multiple substrates during transport. Furthermore, the above configuration allows for effective use of the space above the maintenance area. Also, since the transport unit is not provided above the processing unit, the design flexibility in the height direction of the processing unit is not limited by the transport unit.

[0015] (2) The processing unit may allow the carrier to move in a second direction and restrict the carrier to move in a first direction. In this case, the direction of movement of the carrier in the processing unit is restricted to the second direction. This suppresses interference that occurs when one carrier and other carriers move in opposite directions when multiple carriers are transported in the processing unit.

[0016] Also, since the carrier does not reciprocate in the first and second directions within the processing unit, the length of the carrier conveyance path in the processing unit in a plan view does not exceed the distance between the third end and the fourth end of the processing unit. Therefore, it is possible to suppress the carrier conveyance path from becoming excessively long.

[0019] ( 3 ) The substrate processing apparatus , transportation feeding unit The either at the two ends Ra processing unit The at the four ends ni Ki further includes a first transfer device for transferring the carrier , basis The substrate loading / unloading unit , transportation feeding unit The is provided adjacent to one end , basis The unprocessed multiple number of substrates loaded into the substrate loading / unloading unit are no Ki inserted into the empty , processing unit The is provided adjacent to the three ends , passed from the processing unit ru ki and the processed multiple number of substrates accommodated in the carrier are , basis removed from the substrate loading / unloading unit by a substrate removal unit for unloading , basis either the substrate removal unit ra base or the substrate insertion unit multiple The empty no Ki carrier that has had the number of substrates removed may include a second transfer device for transferring the carrier.

[0020] In this case, multiple unprocessed substrates are placed in an empty carrier in the substrate insertion section. The carrier containing the multiple substrates is transported to the fourth end of the processing section by the transport section and the first transport device. The carrier is then transported from the fourth end to the third end within the processing section. Subsequently, the processed substrates are removed from the carrier containing the processed substrates in the substrate removal section. The empty carrier is transported to the substrate insertion section by the second transport device. This allows the empty carrier transported to the substrate insertion section to be used for processing multiple new substrates. Therefore, there is no need to prepare an excessive number of carriers to accommodate multiple substrates.

[0021] ( 4 The system may further include a carrier cleaning unit for cleaning the empty carrier from which multiple substrates have been removed after processing by the processing unit. In this case, the clean carrier can be used for processing new multiple substrates. [Effects of the Invention]

[0022] According to the present invention, it is possible to improve the workability of maintenance for each part of the substrate processing apparatus while suppressing the expansion of the footprint. [Brief explanation of the drawing]

[0023] [Figure 1] This is a schematic plan view showing the basic configuration of a substrate processing apparatus according to one embodiment of the present invention. [Figure 2] This is a schematic cross-sectional view of the substrate processing apparatus along line AA in Figure 1. [Figure 3] This is a plan view of the carrier used in the substrate processing apparatus shown in Figure 1. [Figure 4] Figure 3 is a side view of the carrier. [Figure 5] Figure 4 is a cross-sectional view of the carriers along the BB line. [Figure 6] This figure illustrates the transport paths of multiple substrates and carriers in the substrate processing apparatus shown in Figure 1. [Figure 7]This figure illustrates the transport paths of multiple substrates and carriers in the substrate processing apparatus shown in Figure 1. [Figure 8] This figure illustrates the transport paths of multiple substrates and carriers in the substrate processing apparatus shown in Figure 1. [Modes for carrying out the invention]

[0024] Hereinafter, a substrate processing apparatus according to one embodiment of the present invention will be described with reference to the drawings. In the following description, "substrate" refers to a substrate used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, such as a flat panel display (FPD) substrate, semiconductor substrate, optical disk substrate, magnetic disk substrate, magneto-optical disk substrate, photomask substrate, ceramic substrate, or solar cell substrate. Furthermore, the substrate described below has a rectangular shape in plan view.

[0025] <1> Configuration of a substrate processing apparatus

[0026] (1) Definition of overall structure and direction Figure 1 is a schematic plan view showing the basic configuration of a substrate processing apparatus according to one embodiment of the present invention. Figure 2 is a schematic cross-sectional view of the substrate processing apparatus 1 along line AA in Figure 1. As shown in Figures 1 and 2, the substrate processing apparatus 1 mainly comprises a substrate loading / unloading block 100, a relay block 200, a processing block 300, and a cleaning block 400.

[0027] Here, in Figures 1 and subsequent figures, arrows indicating the mutually orthogonal X, Y, and Z directions are added to clarify the positional relationships of each component of the substrate processing apparatus 1. The X and Y directions are mutually orthogonal in the horizontal plane, and the Z direction corresponds to the vertical direction. In each direction, the direction in which the arrow points is designated as the + direction, and the direction opposite to the + direction is designated as the - direction. In the following explanation, when simply referred to as the X direction, it includes the +X and -X directions. Similarly, when simply referred to as the Y direction, it includes the +Y and -Y directions. Similarly, when simply referred to as the Z direction, it includes the +Z and -Z directions.

[0028] (2) PCB loading / unloading block 100 The substrate loading / unloading block 100 includes a plurality of hoop racks 110, hoop transport devices 111, 112, openers 120, 130, substrate transfer robots 140, 150, two hoop mounting sections 190, and a control unit 160 (Figure 2). The substrate loading / unloading block 100 also has an end face portion 101, one side portion 102, and the other side portion 103 that constitute part of the outer wall of the substrate processing apparatus 1. The end face portion 101 is located at one end of the substrate processing apparatus 1 facing the -X direction and is perpendicular to the X direction. The one side portion 102 and the other side portion 103 extend parallel to the +X direction from both ends of the end face portion 101 in a plan view, so that they face each other in the Y direction.

[0029] The two hoop mounting sections 190 are provided so as to protrude from the end face 101 in the -X direction. Each hoop mounting section 190 is configured to accommodate a hoop (FOUP: Front Opening Unified Pod) 8 that accommodates multiple substrates in multiple stages. In the end face 101, passage openings (not shown) are formed in the portions corresponding to each hoop mounting section 190 to allow the hoop 8 to pass through in the X direction.

[0030] The hoop 8 has an opening for removing a substrate from its internal space and for inserting a substrate into its internal space. The hoop 8 also includes a lid for opening and closing the opening. The opening of the hoop 8 is closed when the hoop 8 is being transported and when it is in standby mode, and is opened when a substrate is being removed from and inserted into the hoop 8. In Figures 1 and 2, the hoop 8 is hatched and the carrier 9 is marked with a dot pattern so that the hoop 8 and the carrier 9, which will be described later, can be clearly distinguished. In the example in Figure 1, the hoop 8 is placed on one of the two hoop mounting sections 190 aligned in the Y direction, while the hoop 8 is not placed on the other hoop mounting section 190.

[0031] Multiple hoop shelves 110 are provided spaced apart from each other at a predetermined distance in the +X direction from the end face portion 101. In this example, 16 hoop shelves 110 are fixed together by fixing members (not shown) so as to be arranged in 4 rows and 4 columns in a plane parallel to the Z and Y directions. Each hoop shelf 110 is configured to accommodate a hoop 8. In the example in Figure 1, three of the four hoop shelves 110 located at the top have a hoop 8 on them, while the remaining hoop shelf 110 does not have a hoop 8 on it. The number of hoops 8 and the arrangement of the hoop shelves 110 may be changed as appropriate according to the device design specifications.

[0032] The two openers 120 and 130 are positioned spaced apart from each other at a predetermined distance in the +X direction from the multiple hoop shelves 110. In this example, the two openers 120 and 130 are fixed together by a fixing member (not shown) so that they are aligned in the Y direction. One opener 120 is located near one side surface 102, and the other opener 130 is located near the other side surface 103. Each opener 120 and 130 is configured to be able to place a hoop 8 on it and to open and close the lid of the placed hoop 8. In the example in Figure 1, a hoop 8 is placed on one opener 120, but not on the other opener 130.

[0033] The substrate transfer robot 140 is positioned adjacent to the opener 120 in the +X direction. The substrate transfer robot 140 is configured to be rotatable around an axis in the Z direction and movable (up and down) in the Z direction. The substrate transfer robot 140 is equipped with a hand for transferring one or more substrates. The hand is supported by a multi-joint arm and is able to move back and forth horizontally. The substrate transfer robot 140 is used to remove a substrate from a hoop 8 containing an unprocessed substrate, which is placed on the opener 120, and to insert the removed substrate into a carrier 9 located in the relay block 200, which will be described later.

[0034] The substrate transfer robot 150 is positioned adjacent to the opener 130 in the +X direction. The substrate transfer robot 150 has the same configuration as the substrate transfer robot 140. The substrate transfer robot 150 is used to retrieve a substrate from the carrier 9, which will be described later, located in the relay block 200, with an empty hoop 8 placed on the opener 130, and to insert the retrieved substrate into the hoop 8 on the opener 130.

[0035] The hoop conveying device 111 is located between the end face portion 101 and the plurality of hoop shelves 110 in the X direction. The hoop conveying device 111 has a gripping portion (not shown) configured to grip the hoop 8, and the gripping portion is configured to be movable in the Y direction and the Z direction. As a result, the hoop conveying device 111 conveys the hoop 8 between one of the two hoop placement portions 190 and one of the plurality of hoop shelves 110.

[0036] The hoop conveying device 112 is located between the multiple hoop racks 110 and the two openers 120 and 130 in the X direction. The hoop conveying device 112 has the same configuration as the hoop conveying device 111. The hoop conveying device 112 conveys the hoops 8 between any of the multiple hoop racks 110 and any of the two openers 120 and 130.

[0037] The control unit 160 (Figure 2) consists of a computer including a CPU (Central Processing Unit), ROM (Read-Only Memory), and RAM (Random Access Memory), and controls the operation of each component within the substrate processing device 1.

[0038] (3) Relay block 200 The relay block 200 mainly comprises two carrier support sections 210 and 220, a first standby section 230, a second standby section 240, and a standby transport device 250. The carrier support section 210 is positioned adjacent to the substrate transfer robot 140 of the substrate loading / unloading block 100 in the +X direction. The carrier support section 210 is also configured to support a carrier 9 that accommodates multiple substrates in multiple stages. Details of the carrier 9 will be described later. Furthermore, the carrier support section 210 supports the carrier 9 and is also configured to change the orientation of the supported carrier 9. Details of the configuration of the carrier support section 210 for changing the orientation of the carrier 9 will be described later. In the example in Figure 1, the carrier 9 is supported on the carrier support section 210.

[0039] The carrier support section 220 is positioned adjacent to the substrate transfer robot 150 of the substrate loading / unloading block 100 in the +X direction. The carrier support section 220 has the same configuration as the carrier support section 210. Note that in the example shown in Figure 1, the carrier 9 is not supported on the carrier support section 220.

[0040] The first standby section 230 is provided adjacent to the carrier support section 210 in the +X direction. The first standby section 230 is configured to support the carrier 9. Furthermore, the first standby section 230 is configured to pass the carrier 9 supported by the first standby section 230 to the carrier support section 210, and to receive the carrier 9 supported by the carrier support section 210 from the carrier support section 210.

[0041] The second standby section 240 is provided adjacent to the carrier support section 220 in the +X direction. The second standby section 240 is configured to support the carrier 9. Furthermore, the second standby section 240 is configured to pass the carrier 9 supported by the second standby section 240 to the carrier support section 220, and to receive the carrier 9 supported by the carrier support section 220 from the carrier support section 220.

[0042] The standby transport device 250 is provided between the first standby section 230 and the second standby section 240. The standby transport device 250 is configured to be able to hold the carrier 9 and to be movable in the Y direction between the first standby section 230 and the second standby section 240. The standby transport device 250 transports, for example, the carrier 9 supported in the second standby section 240 to the first standby section 230.

[0043] (4) Processing block 300 The processing block 300 includes a first transport unit 310, a second transport unit 320, and a processing unit 330. The first transport unit 310 and the processing unit 330 are arranged in this order in the +Y direction and are provided to extend in parallel from the relay block 200 in the +X direction. The second transport unit 320 is formed to extend in the Y direction and connects the end of the first transport unit 310 facing the +X direction with the end of the processing unit 330 facing the +X direction.

[0044] In the following explanation, of the two ends of the first transport section 310 extending in the X direction, one end facing the -X direction will be appropriately referred to as the first end TA1, and the other end facing the +X direction will be appropriately referred to as the second end TA2. Also, of the two ends of the processing section 330 extending in the X direction, one end facing the -X direction will be appropriately referred to as the third end TA3, and the other end facing the +X direction will be appropriately referred to as the fourth end TA4.

[0045] The first transport unit 310 includes a main transport device 311 and two sub-transport devices 312A and 312B. The main transport device 311 includes a movable stage 311a and a guide rail 311b. The guide rail 311b is provided to extend from a first end TA1 to a second end TA2 of the first transport unit 310. The movable stage 311a is configured to be movable in the X direction on the guide rail 311b and to be capable of supporting a carrier 9. The main transport device 311 further includes a drive mechanism (not shown) for moving the movable stage 311a in the X direction on the guide rail 311b. As a result, when a carrier 9 is placed on the movable stage 311a at the first end TA1 adjacent to the relay block 200, the main transport device 311 transports the supported carrier 9 in the +X direction to the second end TA2 adjacent to the second transport unit 320.

[0046] Sub-transport devices 312A and 312B are provided at the first end TA1 and the second end TA2 of the first transport unit 310 in the X direction, respectively. When a carrier 9 containing an unprocessed substrate is supported by the carrier support unit 210, sub-transport device 312A places the carrier 9 on the movable stage 311a of the main transport device 311 located at the first end TA1. Sub-transport device 312A also transports an empty carrier 9 from the first waiting unit 230 to the carrier support unit 210. On the other hand, when the movable stage 311a on which the carrier 9 is placed moves to the second end TA2, sub-transport device 312B transfers the carrier 9 to the transport device 321 of the second transport unit 320, which will be described later.

[0047] Here, as shown in Figure 2, the first transport unit 310 is positioned at a location separated from the installation surface of the substrate processing apparatus 1 in the +Z direction (upward). As a result, the space located in the -Z direction (downward) of the first transport unit 310 can be used as a maintenance space MS1 for maintaining the processing unit 330, which will be described later. Therefore, in the substrate processing apparatus 1 according to this embodiment, as shown in Figure 1, the first transport unit 310 overlaps with the maintenance space MS1 of the processing unit 330 in a plan view. In Figure 8, which will be described later, a worker WP is shown performing maintenance work on the processing unit 330 below the first transport unit 310 in the maintenance space MS1.

[0048] The second transport unit 320 includes a transport device 321. The transport device 321 supports the carrier 9 and is configured to change the orientation of the supported carrier 9. Details of the configuration of the transport device 321 for changing the orientation of the carrier 9 will be described later. Furthermore, the transport device 321 is configured to be movable in the Y direction. This allows the second transport unit 320 to receive the carrier 9 from the sub-transport device 312B near the second end TA2 of the first transport unit 310. The second transport unit 320 can also change the orientation of the carrier 9 received from the sub-transport device 312B and move the carrier 9 to a position near the fourth end TA4 of the processing unit 330.

[0049] The processing unit 330 includes a plurality of (five in this example) liquid processing units 331, a drying unit 332, and a plurality of (three in this example) main conveying devices 333A, 333B, 333C. The plurality of liquid processing units 331 and drying units 332 are arranged in the X direction such that the drying unit 332 is located at the third end TA3.

[0050] Multiple main conveying devices 333A, 333B, and 333C are arranged in this order along a straight line extending in the +X direction from the third end TA3 to the fourth end TA4. Each main conveying device 333A, 333B, and 333C is configured to hold a carrier 9 and to transport the held carrier 9 between multiple liquid processing units 331 and drying units 332. The main conveying device 333C, located furthest from the relay block 200, receives the carrier 9 when it is transported to the vicinity of the processing unit 330 in the second conveying section 320. The main conveying device 333C then transports the received carrier 9 to one of the multiple liquid processing units 331.

[0051] Each of the multiple liquid processing units 331 comprises one or more processing tanks 331a and lifters 331b. In this example, each liquid processing unit 331 comprises two processing tanks 331a. Each processing tank 331a is configured to allow the carrier 9 to be inserted and removed from a position above the processing tank 331a. The processing tanks 331a also store a processing liquid (chemical solution or rinsing solution) for cleaning the multiple substrates housed in the carrier 9.

[0052] The lifter 331b of each liquid processing unit 331 is configured to hold the carrier 9. The lifter 331b is also configured to receive the carrier 9 from any of the multiple main conveying devices 333A, 333B, and 333C, and to pass the carrier 9 to any of the multiple main conveying devices 333A, 333B, and 333C. Furthermore, the lifter 331b is configured to allow immersion of the carrier 9 into the processing liquid and lifting of the carrier 9 from the processing liquid for each of the two processing tanks 331a of the liquid processing unit 331. As a result, when the carrier 9 containing the unprocessed substrates is passed to the processing unit 330, the multiple substrates contained in the carrier 9 are immersed in one or more processing liquids for a predetermined time, and a common processing is performed on the multiple substrates.

[0053] The drying unit 332 performs a drying process on the carrier 9, which is transported by the main transport device 333A located closest to the relay block 200. This drying process dries the multiple substrates contained within the carrier 9. After the drying process, the carrier 9 is transferred to the second waiting section 240 of the relay block 200 by the main transport device 333A located closest to the relay block 200.

[0054] Here, in the multiple processing tanks 331a of the multiple liquid processing units 331, multiple processing liquids corresponding to multiple processes to be performed on the substrate are stored so as to be arranged in the -X direction in the order of the processes to be performed on the substrate. The control unit 160 in Figure 2 allows each of the main transport devices 333A, 333B, and 333C to move in the -X direction while holding the carrier 9, and restricts them from moving in the +X direction while holding the carrier 9. In this case, when the multiple carriers 9 are transported by the multiple main transport devices 333A, 333B, and 333C, interference caused by one carrier 9 moving in opposite directions to another carrier 9 is suppressed. Also, since the carrier 9 does not move back and forth in the X direction within the processing unit 330, the length of the transport path of the carrier 9 in the processing unit 330 does not exceed the length of the processing unit 330 in the X direction.

[0055] As shown by the dotted line in Figure 1, in addition to the maintenance space MS1 described above, a further maintenance space MS2 is formed on the +Y side of the processing unit 330 in the processing block 300 and its vicinity. In this way, by forming two maintenance spaces MS1 and MS2 so as to sandwich the processing unit 330 in the Y direction, a sufficiently large maintenance space for the processing unit 330 is secured.

[0056] (5) Washing block 400 The cleaning block 400 includes a cleaning and transport device 410 and a carrier cleaning unit 420. The carrier cleaning unit 420 is positioned laterally (+Y direction) to the substrate loading / unloading block 100 and the intermediate block 200, extending in the X direction. The carrier cleaning unit 420 also includes a plurality of carrier cleaning tanks 421, a carrier drying section 422, and a plurality of carrier waiting sections 423 arranged in the X direction.

[0057] Each of the multiple carrier cleaning tanks 421, carrier drying section 422, and multiple carrier standby section 423 is configured to allow the insertion and removal of carriers 9 from a position above the tank, drying section, or standby section. Each of the multiple carrier cleaning tanks 421 also stores a treatment liquid (chemical solution or rinsing solution) for cleaning the carriers 9. The carrier drying section 422 performs a drying treatment on the inserted carriers 9.

[0058] The cleaning and transport device 410 is configured to transport empty carriers 9 between the second waiting section 240 of the relay block 200, multiple carrier cleaning tanks 421, a carrier drying section 422, and multiple carrier waiting sections 423. In the cleaning block 400, empty carriers 9 are transported between multiple carrier cleaning tanks 421 and immersed in the processing liquid stored in one of the carrier cleaning tanks 421. As a result, empty carriers 9 that have been used to process multiple substrates in the processing block 300 are cleaned.

[0059] After cleaning, the carrier 9 is transported to the carrier drying section 422 where it undergoes drying. After drying, the carrier 9 is transported to the carrier waiting section 423 and held there. Subsequently, depending on the timing of receiving multiple substrates in the relay block 200, it is removed from the carrier waiting section 423 by the cleaning and transport device 410 and transported to the second waiting section 240 of the relay block 200.

[0060] <2> The composition of Career 9 and the attitudes of Career 9 Figure 3 is a plan view of the carrier 9 used in the substrate processing apparatus 1 of Figure 1, Figure 4 is a side view of the carrier 9 of Figure 3, and Figure 5 is a cross-sectional view of the carrier 9 along line BB of Figure 4. As shown in Figures 3 to 5, the carrier 9 includes four frame members 10a, 10b, 10c, and 10d.

[0061] Each of the frame members 10a and 10b is formed from a substantially square plate-like member and has an outer shape larger than the substrate to be processed. Four openings 13 are formed in the central part of each of the frame members 10a and 10b. Each of the frame members 10c and 10d is formed from a substantially rectangular plate-like member. The length of the long side of the frame members 10c and 10d is approximately equal to the length of one side of the frame members 10a and 10b.

[0062] Frame members 10a and 10b are arranged facing each other and spaced apart. Frame member 10c is provided to connect one side of frame member 10a and one side of frame member 10b. Frame member 10d is provided to connect the other side of frame member 10a and the other side of frame member 10b. In this state, frame members 10c and 10d are also arranged facing each other. As a result, the carrier 9 has a rectangular tube shape.

[0063] A rectangular opening formed at one end of the rectangular tubular carrier 9 functions as a substrate entrance / exit 12 for inserting a substrate into the carrier 9 and for removing a substrate from the carrier 9. At the other end of the carrier 9, a plurality of support pieces 11 (six in this example) are provided so as to connect frame member 10a and frame member 10b and to be distributed between frame member 10c and frame member 10d.

[0064] Each support piece 11 is composed of a long plate member and is provided parallel to the frame members 10c and 10d. Each support piece 11 also has multiple grooves (not shown) formed at a predetermined reference pitch, into which a portion of the outer edges of the multiple substrates to be housed in the carrier 9 can be inserted. The number of grooves formed in each support piece 11 is equal to the number of substrates to be housed in the carrier 9.

[0065] Multiple protrusions pr are formed on each of the two opposing surfaces of the frame members 10c and 10d. The multiple protrusions pr extend in the direction of the long side of the frame members 10c and 10d and are arranged in the direction of the short side at the aforementioned reference pitch. As a result, a groove is formed between each pair of adjacent protrusions pr into which the outer edge of the substrate can be inserted.

[0066] As described above, in the substrate processing apparatus 1 of Figure 1, the orientation of the carrier 9 is changed as appropriate. Here, for the carrier 9 having the above configuration, the orientation in which the multiple support pieces 11 are located at the lower end and the frame members 10a and 10b are maintained parallel to the vertical direction is called the vertical orientation. On the other hand, the orientation in which the frame members 10a and 10b are maintained perpendicular to the vertical direction is called the horizontal orientation.

[0067] When inserting multiple substrates into an empty carrier 9, the substrates are inserted into the interior of the carrier 9 through the substrate inlet / outlet 12 of the carrier 9, which is in a horizontal position. At this time, both sides of the outer edge of each substrate (the two sides that face each other) are inserted between any two of the multiple protrusions pr of the frame member 10c and between any two of the multiple protrusions pr of the frame member 10d. As a result, when the carrier 9 containing the multiple substrates is in a horizontal position, each substrate is held with both sides of the substrate supported by the multiple protrusions pr. On the other hand, when the carrier 9 containing the multiple substrates is in a vertical position, each substrate is held with multiple portions of the lower end of the substrate fitted into the multiple grooves of the multiple support pieces 11.

[0068] As described above, when the carrier 9 is in a horizontal position, each of the multiple substrates it houses is supported by multiple protrusions pr across its entire sides. On the other hand, when the carrier 9 is in a vertical position, each of the multiple substrates it houses is locally supported by multiple support pieces 11 at multiple points on its lower end. Therefore, when the carrier 9 is in a horizontal position, the load applied to the outer edge of each substrate it houses (the load due to the weight of each substrate) is reduced compared to when the carrier 9 is in a vertical position.

[0069] The carrier 9 according to this embodiment is formed such that the vertical dimension (height) of the carrier 9 when it is in a horizontal position is smaller than the vertical dimension (height) of the carrier 9 when it is in a vertical position.

[0070] <3> Transport paths of multiple substrates and carriers 9 in a substrate processing apparatus Figures 6 to 8 are diagrams illustrating the transport paths of multiple substrates and carriers 9 in the substrate processing apparatus 1 shown in Figure 1. Figure 6 shows a schematic plan view of the substrate processing apparatus 1, similar to Figure 1. Figure 7 shows a schematic external perspective view of the substrate processing apparatus 1 shown in Figure 1, viewed from one direction. Figure 8 shows a schematic external perspective view of the substrate processing apparatus 1 shown in Figure 1, viewed from another direction. Note that the cleaning block 400 shown in Figure 1 is omitted in Figures 7 and 8. Furthermore, the maintenance spaces MS1 and MS2 shown in Figure 1 are also omitted in Figures 6 to 8, except for the maintenance space MS1 shown in Figure 8.

[0071] Let's consider a scenario where a series of processes are performed on multiple unprocessed substrates W housed in a single hoop 8. In this case, the single hoop 8 is loaded into the substrate loading / unloading block 100, and as shown in Figure 6, it is placed on the opener 120 and its lid is opened. Also, an empty carrier 9 is supported in a horizontal position on the carrier support section 210 of the relay block 200. At this time, the substrate inlet / outlet 12 (Figure 5) of the carrier 9 faces the -X direction so as to face the hoop 8. In this state, the substrate transfer robot 140 removes the multiple unprocessed substrates W from the single hoop 8 and inserts them into the carrier 9. The transport path of the multiple substrates W in this case is shown by the thick dotted arrow a1 in Figures 6 to 8.

[0072] Afterward, the empty hoop 8 is closed, held by the hoop transport device 112, and placed on one of the hoop shelves 110. Meanwhile, the carrier 9 containing the multiple substrates W is received by the carrier support unit 210 and placed on the movable stage 311a of the main transport device 311 by the sub-transport device 312A of the first transport unit 310. The transport path of the carrier 9 in this case is shown by the thick solid arrow a2 in Figures 6 to 8.

[0073] Next, the carrier 9, placed on the movable stage 311a, is transported in a horizontal position in the +X direction from a position near the relay block 200 (first end TA1) to a position near the second transport unit 320 (second end TA2). The state of the carrier 9 being transported by the main transport device 311 of the first transport unit 310 is shown in the blowout BA3 of Figure 8.

[0074] Subsequently, the carrier 9, having reached a position near the second transport unit 320, is transferred to the transport unit 321 of the second transport unit 320 by the sub-transport device 312B of the first transport unit 310. There, the carrier 9, having been transferred to the transport unit 321, has its orientation changed from horizontal to vertical. The state of the orientation change of the carrier 9 in the transport unit 321 is schematically shown in the blown-out BA2 of Figure 7.

[0075] As shown in the blowout BA2 of Figure 7, the conveying device 321 includes a movable base 322 and a carrier holder 323. The movable base 322 is provided so as to be movable in the Y direction within the second conveying section 320. The carrier holder 323 consists of a first holding section 323a and a second holding section 323b. The first holding section 323a has a rectangular flat plate shape capable of holding the lower end of the carrier 9 when it is in a horizontal position. The second holding section 323b also has a rectangular flat plate shape capable of holding the lower end of the carrier 9 when it is in a vertical position.

[0076] The first holding portion 323a and the second holding portion 323b are connected such that one side of the first holding portion 323a and one side of the second holding portion 323b are in contact with each other and the two holding portions are perpendicular to each other. The movable base 322 holds a portion of the carrier holder 323 such that both the first holding portion 323a and the second holding portion 323b are parallel to the Y direction and the carrier holder 323 is rotatable around an axis extending in the Y direction.

[0077] The transport device 321 further includes a drive unit (not shown) on the movable base 322 that can adjust the rotation angle of the carrier holder 323. Thus, when receiving a horizontally positioned carrier 9 from the first transport unit 310, the carrier holder 323 is rotated so that the first holding part 323a is horizontal and the second holding part 323b is vertical. Subsequently, when the horizontally positioned carrier 9 is received onto the carrier holder 323, the carrier holder 323 is rotated again so that the first holding part 323a is vertical and the second holding part 323b is horizontal. This changes the orientation of the carrier 9 from horizontal to vertical.

[0078] The transport device 321 further includes a drive unit (not shown) that moves the movable base 322 in the Y direction in the second transport section 320. As a result, the carrier 9, which is maintained in a vertical position, is transported in a vertical position in the +Y direction from a position near the first transport section 310 to a position near the processing section 330.

[0079] Subsequently, the carrier 9, having reached a position near the processing unit 330, is received from the transport device 321 by the main transport device 333C of the processing unit 330. The carrier 9 received by the main transport device 333C is transported by the main transport device 333C and other main transport devices 333B, 333A to one or more liquid processing units 331, and is immersed in various processing liquids for a predetermined period while maintaining a vertical orientation. As a result, the multiple substrates W contained within the carrier 9 are processed according to the processing liquid they are immersed in. The state of the carrier 9 being transported by the main transport devices 333A, 333B, 333C of the processing unit 330 is shown in the blowout BA4 of Figure 8.

[0080] As shown in the blowout BA4 of Figure 8, each main conveying device 333A, 333B, 333C includes a movable support column 333a and a pair of chuck members 333b. The movable support column 333a is provided to the side (+Y direction side) of the multiple liquid processing units 331 so as to be movable in the X direction and movable (up and down) in the Z direction. A pair of chuck members 333b are provided so as to extend upward from the upper end of the movable support column 333a to the liquid processing units 331. The pair of chuck members 333b are configured to hold the carrier 9 in a vertical position. Furthermore, each main conveying device 333A, 333B, 333C has a drive unit (not shown) that can switch between holding the carrier 9 with the pair of chuck members 333b and releasing the carrier 9 from the pair of chuck members 333b. This allows the carrier 9 to be transferred between the multiple main conveying devices 333A, 333B, 333C and the multiple liquid processing units 331.

[0081] Subsequently, the carrier 9 containing the multiple substrates W after processing with the processing liquid is further transported to a drying unit 332 located adjacent to the relay block 200. Thereafter, the carrier 9 and the multiple substrates W within the carrier 9 are dried by the drying unit 332. As described above, the series of transport paths for the carrier 9 in the processing block 300 are shown by the thick solid arrow a3 in Figures 6 to 8.

[0082] The carrier 9, containing multiple processed substrates W, is transported by the main transport device 333A from the drying unit 332 to the carrier support section 220 of the relay block 200, where it is supported. The transport path of the carrier 9 in this case is shown by the thick dotted arrow a4 in Figures 6 to 8.

[0083] Therefore, the carrier 9, which is passed to the carrier support section 220, has its orientation changed from a vertical to a horizontal orientation by the carrier support section 220. The state of the orientation change of the carrier 9 at the carrier support section 220 is schematically shown in the callout BA1 in Figure 7.

[0084] As shown in the vent BA1 of Figure 7, the carrier support section 220 includes a fixed base 211 and a carrier holder 212 fixed within the relay block 200. The carrier holder 212 consists of a first holder 212a and a second holder 212b. The first holder 212a has a rectangular flat plate shape capable of holding the lower end of the carrier 9 when it is in a horizontal position. The second holder 212b also has a rectangular flat plate shape capable of holding the lower end of the carrier 9 when it is in a vertical position.

[0085] The first holding portion 212a and the second holding portion 212b are connected such that one side of the first holding portion 212a and one side of the second holding portion 212b are in contact with each other and the two holding portions are perpendicular to each other. The fixed base 211 holds a portion of the carrier holder 212 such that both the first holding portion 212a and the second holding portion 212b are parallel to the Y direction and the carrier holder 212 is rotatable around an axis extending in the Y direction.

[0086] The carrier support section 220 further includes a drive unit (not shown) on the fixed base 211 that can adjust the rotation angle of the carrier holder 212. This allows the carrier holder 212 to adjust its rotation angle so that when receiving the carrier 9 in a vertical position from the drying unit 332, the second holding section 212b becomes horizontal and the first holding section 212a becomes vertical. Subsequently, when the carrier 9 in a vertical position is received onto the carrier holder 212, the carrier holder 212 adjusts its rotation angle so that the second holding section 212b becomes vertical and the first holding section 212a becomes horizontal. This changes the orientation of the carrier 9 from vertical to horizontal. At this time, the substrate inlet / outlet 12 (Figure 5) of the carrier 9 faces the -X direction.

[0087] When the carrier 9 containing multiple substrates W is supported by the carrier support section 220 in a horizontal position, an empty hoop 8 is placed on the opener 130 of the substrate loading / unloading block 100. The lid of the hoop 8 is also opened. In this state, the substrate transfer robot 150 removes the processed multiple substrates W from the carrier 9 and inserts them into the hoop 8 on the opener 130. The transport path of the multiple substrates W in this case is shown by the thick dotted arrow a5 in Figures 6 to 8.

[0088] Subsequently, the hoop 8 containing the processed substrates W is closed, held by the hoop transport device 112, and placed on one of the hoop shelves 110. The hoop 8 is then transported to the hoop placement section 190 by the hoop transport device 111 and discharged from the substrate processing device 1. Meanwhile, the carrier 9, which has become empty in the carrier support section 220, has its orientation changed back from horizontal to vertical by the carrier support section 220. The empty carrier 9, returned to the vertical position in the carrier support section 220, is transported by the main transport device 333A and received in the second waiting section 240.

[0089] In this embodiment, the empty carrier 9 received from the carrier support unit 220 by the second waiting unit 240 is transported to the carrier cleaning unit 420 by the cleaning and transport device 410 of the cleaning block 400 while maintaining a vertical orientation. The transport path of the carrier 9 in this case is shown in Figure 6 by the thick dashed arrow c1.

[0090] In the carrier cleaning unit 420, the carriers 9 are further transported by the cleaning and conveying device 410 between multiple carrier cleaning tanks 421, carrier drying sections 422, and multiple carrier waiting sections 423. This allows the carriers 9 to undergo cleaning and drying after use. After cleaning and drying, the carriers 9 are placed in one of the multiple carrier waiting sections 423. The vertical orientation of the carriers 9 is maintained in the multiple carrier cleaning tanks 421, carrier drying sections 422, and multiple carrier waiting sections 423.

[0091] Let's consider a case where a series of processes are performed on multiple unprocessed substrates W housed in a new, separate hoop 8. In this case, the clean carriers 9 housed in the carrier waiting section 423 of the cleaning block 400 are transported as new carriers 9 from the carrier cleaning unit 420 to the second waiting section 240 by the cleaning and transport device 410. The transport path of the new carriers 9 in this case is shown in Figure 6 by the thick dashed arrow c2.

[0092] The new carrier 9, passed to the second waiting section 240, is transported to the first waiting section 230 by the waiting transport device 250 while maintaining its vertical orientation, and is supported by the first waiting section 230. The transport path of the new carrier 9 in this case is shown in Figure 6 by the thick dashed arrow b1. The first waiting section 230 passes the new carrier 9, which is supported by the first waiting section 230, to the carrier support section 210. There, the new carrier 9, passed to the carrier support section 210, has its orientation changed from vertical to horizontal by the carrier support section 210. As described above, the two carrier support sections 210 and 220 in the relay block 200 have the same configuration. As a result, in the carrier support section 210, the orientation of the new carrier 9 is changed as shown in the blowout BA1 in Figure 7. Subsequently, multiple unprocessed substrates W, housed in other new hoops 8, are inserted into the new carrier 9, which is in the horizontal orientation.

[0093] The new carrier 9, containing multiple unprocessed substrates W, is transported along the transport path indicated by a series of arrows a2, a3, and a4 shown in Figures 6 to 8. This allows the multiple substrates W contained in the new carrier 9 to undergo a series of processing steps.

[0094] <4> effect (1) In the substrate processing apparatus 1 described above, the third end TA3 and the fourth end TA4 of the processing unit 330 are spaced apart, with multiple processing tanks 331a of multiple liquid processing units 331 in between. As a result, the configuration for loading the carrier 9 into the fourth end TA4 of the processing unit 330 and the configuration for unloading the carrier 9 from the third end TA3 of the processing unit 330 are not provided in close proximity. Furthermore, a maintenance space MS1 is formed adjacent to the processing unit 330, where numerous processing tanks 331a are lined up. Therefore, a sufficiently large maintenance space is secured for each part of the substrate processing apparatus 1. Furthermore, with the above configuration, the first transport unit 310 for transporting the carrier 9 to the fourth end TA4 of the processing unit 330 is not provided in a position that is outside the processing unit 330 and the maintenance spaces MS1 and MS2 in a plan view.

[0095] As a result, it is possible to improve the workability of maintenance for each part of the substrate processing device 1 while suppressing the expansion of the footprint.

[0096] (2) In the substrate processing apparatus 1 described above, the first transport unit 310 is located at a position spaced apart from the processing unit 330 in the -Y direction and above the maintenance space MS1, as shown in Figure 8. Furthermore, the first transport unit 310 is located above the multiple processing tanks 331a of the processing unit 330. Generally, a clean downward airflow is formed in the cleanroom where the substrate processing apparatus 1 is installed. This prevents particles and other contaminants generated in the maintenance space MS1 and the multiple processing tanks 331a from adhering to the multiple substrates W in the carrier 9 transported by the first transport unit 310.

[0097] (3) In addition, in the substrate processing apparatus 1 described above, the first transport unit 310 overlaps the maintenance space MS1 in a plan view, but does not overlap the processing unit 330 in a plan view. This makes it possible to effectively utilize the space above the maintenance space MS1. Also, since the first transport unit 310 is not provided above the processing unit 330, the degree of design freedom in the height direction of the processing unit 330 is not limited by the first transport unit 310.

[0098] (4) In the substrate processing apparatus 1 described above, the used carriers 9 that have been used to process multiple substrates W are cleaned by the carrier cleaning unit 420. The carriers 9 after being cleaned by the carrier cleaning unit 420 are used to process new substrates W. Therefore, it is not necessary to prepare an excessive number of carriers 9 in order to process a large number of substrates W.

[0099] (5) The vertical dimensions of the first transport unit 310 are determined according to the vertical dimensions (height) of the carrier 9 being transported. The carrier 9 used in the substrate processing apparatus 1 described above has a vertical dimension (height) that is smaller when it is in a horizontal position than when it is in a vertical position. In addition, the carrier 9 is transported in a horizontal position in the first transport unit 310. Therefore, the vertical dimensions of the first transport unit 310 can be made smaller than when the carrier 9 is transported in a vertical position. As a result, even if there are limitations on the vertical dimensions of the substrate processing apparatus 1, the vertical dimensions of the first transport unit 310 are reduced, so that a maintenance space MS1 of sufficient height is formed below the first transport unit 310.

[0100] <5> Other embodiments (1) In the substrate processing apparatus 1 according to the above embodiment, the first transport unit 310 is located above the maintenance space MS1, but the present invention is not limited thereto. The first transport unit 310 may be located below the maintenance space MS1 instead of above it. For example, some components of the substrate processing apparatus 1 and the maintenance space MS1 may be located above a predetermined installation surface, while other components, including the first transport unit 310, may be located below the installation surface.

[0101] Alternatively, the first transport unit 310 may be provided such that at least a portion of it overlaps the processing unit 330 in a plan view. That is, the first transport unit 310 may be provided such that at least a portion of it is located above or below the processing unit 330.

[0102] (2) In the substrate processing apparatus 1 according to the above embodiment, the frame members 10a and 10b of the carrier 9 in a vertical position are maintained parallel to the vertical direction, but the frame members 10a and 10b of the carrier 9 in a vertical position may be maintained substantially parallel to the vertical direction. That is, the carrier 9 in a vertical position only needs to be able to hold the plurality of substrates W to be housed so that they are parallel to or substantially parallel to the vertical direction.

[0103] Furthermore, in the substrate processing apparatus 1 according to the above embodiment, the frame members 10a and 10b of the carrier 9 in a horizontal position are maintained to be perpendicular to the vertical direction. However, the frame members 10a and 10b of the carrier 9 in a horizontal position may be maintained to be substantially perpendicular to the vertical direction. In other words, the carrier 9 in a horizontal position only needs to be able to hold the multiple substrates W to be housed so that they are parallel or substantially parallel to the horizontal direction.

[0104] (3) In the substrate processing apparatus 1 according to the above embodiment, the maintenance space MS1 is formed to be adjacent in the Y direction to all of the processing tanks 331a of the processing unit 330, but the present invention is not limited thereto. The maintenance space MS1 may be formed to be adjacent in the Y direction to some of the processing tanks 331a of the processing unit 330.

[0105] (4) The substrate processing apparatus 1 according to the above embodiment includes a cleaning block 400 for cleaning the used carrier 9 that has been used to process a plurality of substrates W, but the present invention is not limited thereto. The substrate processing apparatus 1 does not have to be provided with a cleaning block 400. In this case, the used carrier 9 from which the plurality of substrates W have been removed at the carrier support section 220 of the relay block 200 may be transported to the carrier support section 210 without being cleaned. Alternatively, the used carrier 9 may be removed from the substrate processing apparatus 1 and discarded without being cleaned.

[0106] (5) In the substrate processing apparatus 1 according to the above embodiment, the carrier support section 210 and the first standby section 230 are individually provided in the relay block 200, but the present invention is not limited thereto. If it is possible to add a function for changing the attitude of the carrier 9 to the first standby section 230, the carrier support section 210 may not be provided.

[0107] Furthermore, in the substrate processing apparatus 1 according to the above embodiment, the carrier support section 220 and the second standby section 240 are individually provided in the relay block 200, but the present invention is not limited thereto. If it is possible to add a function for changing the attitude of the carrier 9 to the second standby section 240, the carrier support section 220 may not be provided.

[0108] (6) In the second transport section 320 of the processing block 300 according to the above embodiment, the transport device 321 has the function of changing the orientation of the carrier 9 and the function of transporting the carrier 9, but the present invention is not limited thereto. In the second transport section 320, instead of the above transport device 321, a component that has the function of changing the orientation of the carrier 9 and a component that has the function of transporting the carrier 9 may be provided separately.

[0109] (7) In the substrate processing apparatus 1 according to the above embodiment, the substrate W to be processed has a rectangular shape in plan view, but the substrate to be processed may have a circular shape in plan view, or a polygonal shape other than a quadrilateral, such as a triangle or pentagon, in plan view.

[0110] (8) The carrier 9 according to the above embodiment supports both sides of the rectangular substrate W when the rectangular substrate W is housed in a horizontal position, but the present invention is not limited thereto. The carrier 9 may be configured to support the central part of the substrate W in a horizontal position.

[0111] (9) In the substrate processing apparatus 1 according to the above embodiment, processing liquid for cleaning the substrate W is stored in a plurality of processing tanks 331a of the processing unit 330, but the present invention is not limited thereto. At least a portion of the plurality of processing tanks 331a of the processing unit 330 may store as processing liquid a plating solution for plating the substrate W, or a liquid for modifying the surface state of the substrate W. Thus, the above embodiment is an example of applying the present invention to the cleaning process of a plurality of substrates W, but the present invention is not limited thereto and may be applied to other processes such as plating or surface modification of a plurality of substrates W.

[0112] (10) In the carrier 9 according to the above embodiment, four openings 13 are formed in the central portion of each of the frame members 10a and 10b, but the present invention is not limited thereto. In the central portion of each of the frame members 10a and 10b, there may be a number of openings 13 other than four, such as one, two, three, or five. Alternatively, no openings 13 may be formed in the central portion of each of the frame members 10a and 10b. Furthermore, the shapes of the frame members 10a and 10b may be modified as appropriate.

[0113] (11) In each of the main conveying devices 333A, 333B, and 333C according to the above embodiment, the pair of chuck members 333b hold the carrier 9 by clamping it in the X direction, but the present invention is not limited thereto. The pair of chuck members 333b may hold the carrier 9 by clamping it in the Y direction, or they may hold the carrier 9 by clamping it in directions that intersect the X and Y directions in the horizontal plane.

[0114] <6> Correspondence between each component of the claim and each element of the embodiment The following describes examples of the correspondence between each component of the claims and each element of the embodiments, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0115] In the above embodiment, the substrate loading / unloading block 100 and the relay block 200 are examples of substrate loading / unloading sections, the +X direction is an example of the first direction, the first transport section 310 is an example of a transport section, the processing section 330 is an example of a processing section, the first end TA1 of the first transport section 310 is an example of a first end, and the second end TA2 of the first transport section 310 is an example of a second end.

[0116] Furthermore, the third end TA3 of the processing unit 330 is an example of a third end, the fourth end TA4 of the processing unit 330 is an example of a fourth end, the multiple processing tanks 331a of the multiple liquid processing units 331 are an example of multiple processing tanks, the -X direction is an example of a second direction, the Y direction is an example of a third direction, and the maintenance space MS1 is an example of a maintenance space.

[0117] Furthermore, the substrate processing apparatus 1 is an example of a substrate processing apparatus, the transport apparatus 321 is an example of a first transport apparatus, the group of components including the opener 120, substrate transfer robot 140, carrier support unit 210, and first standby unit 230 is an example of a substrate insertion unit, the group of components including the opener 130, substrate transfer robot 150, carrier support unit 220, and second standby unit 240 is an example of a substrate removal unit, the standby transport apparatus 250 is an example of a second transport apparatus, and the carrier cleaning unit 420 is an example of a carrier cleaning unit. <7> Reference form (1) A substrate processing apparatus according to one aspect of the reference embodiment comprises a substrate loading / unloading section configured to load and unload a plurality of substrates, a transport section and a processing section provided to extend in parallel from the substrate loading / unloading section in a first direction, the transport section having a first end and a second end arranged in order in the first direction, and configured to transport a carrier that accommodates a plurality of substrates loaded into the substrate loading / unloading section from the first end to the second end in the first direction, the processing section having a third end and a fourth end arranged in order in the first direction, and a plurality of processing tanks provided between the third end and the fourth end, and in the transport section The carrier, which has been transported to one end, is transported from the fourth end towards the third end in a second direction opposite to the first direction, and the transported carrier is immersed in at least one of several processing liquids stored in several processing tanks to perform a predetermined process on the multiple substrates contained in the carrier, and the processed multiple substrates can be passed to the substrate loading / unloading section. A maintenance space is formed relative to the processing section so as to be adjacent to at least a part of the processing section in a third direction that intersects the first and second directions in a plan view, and the transport section overlaps with at least a part of the processing section and the maintenance space in a plan view. In this substrate processing apparatus, multiple unprocessed substrates are loaded into the substrate loading / unloading section. These multiple substrates, while housed in a carrier, are transported in a first direction from the first end to the second end of the transport section. The multiple substrates transported to the second end of the transport section are then transported in a second direction from the fourth end to the third end of the processing section, while still housed in the carrier. During this transport, the carrier containing the multiple substrates is immersed in at least one of several processing liquids stored in several processing tanks, between the fourth end and the third end. As a result, a predetermined process is performed on the multiple substrates housed in the carrier. After processing, the multiple substrates are passed to the substrate loading / unloading section and transported out. With the above configuration, the third and fourth ends of the processing unit are spaced apart, separated by multiple processing tanks, so the components for transferring the substrate to the fourth end of the processing unit and the components for removing the substrate from the third end of the processing unit are not provided in close proximity. Furthermore, a maintenance space is formed adjacent to at least a part of the processing unit. Therefore, it becomes easy to secure a sufficiently large maintenance space for each part of the substrate processing unit. Moreover, with the above configuration, it is not necessary to provide the transport unit in a position away from the processing unit and maintenance space in a plan view. As a result, it becomes possible to improve the workability of maintenance on each part of the circuit board processing unit while suppressing the expansion of the footprint. (2) The processing unit may allow the carrier to move in a second direction and restrict the carrier to move in a first direction. In this case, the direction of movement of the carrier in the processing unit is restricted to the second direction. This suppresses interference that occurs when one carrier and other carriers move in opposite directions when multiple carriers are transported in the processing unit. Furthermore, since the carrier does not reciprocate in the first and second directions within the processing unit, the length of the carrier transport path in the processing unit in a plan view does not exceed the distance between the third end and the fourth end of the processing unit. Therefore, the carrier transport path does not become excessively long. (3) The maintenance space may be formed adjacent to the processing tanks, and the transport unit may be located above the maintenance space and the processing tanks. In this case, since the maintenance space is adjacent to the processing tanks, the workability of maintenance for the processing tanks is improved. Also, since the transport unit is located above the maintenance space and the processing tanks, it is prevented that particles and other debris generated in the maintenance space and the processing tanks will adhere to the substrates being transported. (4) The transport unit may overlap at least a portion of the maintenance space in a plan view, but may not overlap the processing unit in a plan view. In this case, the space above the maintenance space can be effectively utilized. Also, since the transport unit is not provided above the processing unit, the design freedom in the height direction of the processing unit is not restricted by the transport unit. (5) The substrate processing apparatus further comprises a first transport device that transports a carrier from a second end of a transport section to a fourth end of a processing section, and the substrate loading / unloading section is provided adjacent to the first end of the transport section and includes a substrate insertion section that inserts a plurality of unprocessed substrates loaded into the substrate loading / unloading section into an empty carrier, a substrate removal section provided adjacent to the third end of the processing section and removes a plurality of processed substrates housed in a carrier passed from the processing section for unloading from the substrate loading / unloading section, and a second transport device that transports the empty carrier from which the plurality of substrates have been removed from the substrate removal section to the substrate insertion section. In this case, multiple unprocessed substrates are placed in an empty carrier in the substrate insertion section. The carrier containing the multiple substrates is transported to the fourth end of the processing section by the transport section and the first transport device. The carrier is then transported from the fourth end to the third end within the processing section. Subsequently, the processed substrates are removed from the carrier containing the processed substrates in the substrate removal section. The empty carrier is transported to the substrate insertion section by the second transport device. This allows the empty carrier transported to the substrate insertion section to be used for processing multiple new substrates. Therefore, there is no need to prepare an excessive number of carriers to accommodate multiple substrates. (6) The system may further include a carrier cleaning unit for cleaning the empty carrier from which the multiple substrates have been removed after processing by the processing unit. In this case, the clean carrier after cleaning can be used for processing new multiple substrates. [Explanation of symbols]

[0118] 1...Substrate processing device, 8...Hoop, 9...Carrier, 10a, 10b, 10c, 10d...Frame member, 11...Support piece, 12...Substrate entrance / exit, 13...Opening, 100...Substrate loading / unloading block, 101...End face, 102...One side, 103...Other side, 110...Hoop shelf, 111, 112...Hoop transport device, 120, 130...Opener, 140, 150...Substrate transfer robot 160…Control Unit, 190…Hoop Mounting Unit, 200…Relay Block, 210, 220…Carrier Support Unit, 211…Fixed Base, 212, 323…Carrier Holder, 212a, 323a…First Holding Unit, 212b, 323b…Second Holding Unit, 230…First Standby Unit, 240…Second Standby Unit, 250…Standby Transport Device, 300…Processing Block, 310…First Transport Unit, 311, 33 3A, 333B, 333C…Main conveying device, 311a…Movable stage, 311b…Guide rail, 312A, 312B…Sub-conveying device, 320…Second conveying section, 321…Conveying device, 322…Movable base, 330…Processing section, 331…Liquid processing unit, 331a…Processing tank, 331b…Lifter, 332…Drying unit, 333a…Movable support column, 333b…Chuck member, 400…Washing block, 410…Washing conveying device, 420…Carrier washing unit, 421…Carrier washing tank, 422…Carrier drying section, 423…Carrier waiting section, BA1, BA2, BA3, BA4…Blowout, MS1, MS2…Maintenance space, TA1…First end, TA2…Second end, TA3…Third end, TA4…Fourth end, W…Substrate, WP…Worker, pr…Protrusion

Claims

1. A substrate processing apparatus that performs a predetermined process on a plurality of substrates, A substrate loading / unloading unit configured to be able to load and unload the plurality of substrates, The system includes a transport unit and a processing unit that are provided so as to extend in parallel in a first direction from the substrate loading / unloading unit, The aforementioned transport unit is Having first ends and second ends arranged in order in the first direction, A carrier for accommodating the plurality of substrates loaded into the substrate loading / unloading section is configured to be transportable in the first direction from the first end to the second end. The aforementioned processing unit, It has a third end and a fourth end arranged in the first direction, and a plurality of processing tanks provided between the third end and the fourth end, The transport unit is configured to transport the carrier that has been transported to the second end in a second direction opposite to the first direction, from the fourth end toward the third end, and to perform the predetermined processing on the plurality of substrates contained in the carrier by immersing the transported carrier in at least one of the plurality of processing liquids stored in the plurality of processing tanks, and to pass the plurality of substrates after processing to the substrate loading / unloading unit. Maintenance spaces are formed for the plurality of processing tanks in the processing unit so as to be adjacent to the plurality of processing tanks in a third direction that intersects the first and second directions in a plan view. The transport unit is positioned above the maintenance space and the plurality of processing tanks, in a positional relationship that overlaps with at least a portion of the maintenance space in a plan view, and does not overlap with the processing unit in a plan view. A substrate processing apparatus wherein the maintenance space is formed below the transport section, between the installation surface of the substrate processing apparatus and the transport section, and the upper limit of the height of the maintenance space is located above the plurality of processing tanks, and the maintenance space is configured to allow maintenance work from the maintenance space to the plurality of processing tanks adjacent to the maintenance space.

2. The substrate processing apparatus according to claim 1, wherein the processing unit allows the carrier to move in the second direction and restricts the carrier to move in the first direction.

3. The system further comprises a first conveying device that conveys the carrier from the second end of the conveying section to the fourth end of the processing section, The aforementioned substrate loading / unloading section is, A substrate insertion section is provided adjacent to the first end of the transport section and inserts the plurality of unprocessed substrates that have been transported to the substrate loading / unloading section into the empty carrier, A substrate removal unit is provided adjacent to the third end of the processing unit and for removing the plurality of processed substrates housed in the carrier passed from the processing unit in order to remove them from the substrate loading / unloading unit. The substrate processing apparatus according to claim 1 or 2, further comprising a second transport device for transporting the empty carrier from which the plurality of substrates have been removed from the substrate removal section to the substrate insertion section.

4. The substrate processing apparatus according to any one of claims 1 to 3, further comprising a carrier cleaning unit for cleaning the empty carrier from which the plurality of substrates have been removed after processing by the processing unit.

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