Conveying device

Abstract

To suppress generation of garbage when transporting a workpiece to a processing unit.SOLUTION: A transportation unit 61 of a transportation device 60 comprises, in an enclosure 610, a battery 123 as a power source for each of constituent elements, a suction mechanism 121 as a suction source for a transportation pad 71, a separating mechanism 122 as an air source for the transportation pad 71, and a water supply mechanism 130 circulating water stored in a water storage portion 131. Therefore, the transportation unit 61 does not need to receive supply of electric power, water and air from the outside, and therefore does not comprise wiring and piping extending from the transportation unit 61 to the outside, and a storage member that stores the wiring and the piping. This can suppress the generation of garbage due to scraping of the storage member, the wiring and the piping.SELECTED DRAWING: Figure 3

Description

Technical Field

[0006] , , , ,

[0001] The present invention relates to a conveying device.

Background Art

[0002] A processing device as disclosed in Patent Documents 1 and 2 includes a conveying device that conveys a workpiece to a plurality of processing units.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0004] This conveying device is moving to a position corresponding to each processing unit while being connected to a suction source, an air source, a water source, and a power source as disclosed in Patent Documents 3 and 4. Therefore, the conveying device connects one end side of a housing member such as a cable carrier (registered trademark) that houses piping and wiring, and pulls the housing member to move. For this reason, during movement, the housing member rubs against the wiring and piping, generating dust. This dust may contaminate the clean room in which the processing device is installed.

[0005] Therefore, an object of the present invention is to suppress the generation of dust when conveying a workpiece to a plurality of processing units.

Means for Solving the Problems

[0006] The present invention provides a conveying device for conveying workpieces to a plurality of processing units, comprising: a track provided along a movement route corresponding to the arrangement of the plurality of processing units; a conveying unit having a holding part for holding and releasing workpieces; and a movement mechanism for moving the conveying unit so as to be guided along the track, wherein the conveying unit comprises: a suction mechanism for applying suction force to the holding part; a release mechanism for releasing the workpiece held by the holding part from the holding part; a holding part movement mechanism for moving the holding part horizontally and vertically using electricity; and a storage battery for supplying power to the holding part movement mechanism. The device comprises a circulating water supply mechanism that supplies water to a workpiece held in the holding part, a vacuum pump driven by power supplied from the storage battery, a single-acting cylinder disposed between the vacuum pump and the holding part, a piston that divides the single-acting cylinder into a first chamber and a second chamber and slides inside it, a spring that biases the piston to expand the first chamber, a first connecting passage that connects the first chamber of the single-acting cylinder and the vacuum pump, and a device disposed in the first connecting passage that connects the first chamber and the vacuum pump, The device comprises a first valve for switching between connecting the first chamber and the atmosphere, and a second communication passage connecting the second chamber of the single-acting cylinder and the holding part. The suction mechanism applies suction force to the holding part by driving a vacuum pump and connecting the vacuum pump and the first chamber with the first valve. The separation mechanism connects the first chamber and the atmosphere with the first valve, slides the piston by the biasing force of the spring to expand the first chamber, and sends air from the second chamber to the holding part.

[0007] In this conveying device, The suction mechanism comprises a third valve located in the second communication passage that switches between connecting the second chamber and the holding part, or connecting the second chamber and the atmosphere; a third communication passage that branches off from the second communication passage between the third valve and the holding part and connects to the vacuum pump; and a second valve located in the third communication passage that opens and closes the third communication passage. The first valve is configured to connect the third communication passage when the first chamber is connected to the atmosphere. The suction mechanism applies suction force to the holding part by driving the vacuum pump, connecting the first chamber and the atmosphere with the first valve to form the third communication passage, opening the second valve, then closing the second valve, and connecting the vacuum pump and the first chamber with the first valve.

[0008] In this conveying device, The water supply mechanism is provided on the upper surface of the housing and includes a water reservoir for immersing the workpiece held in the holding section, an ultraviolet irradiation section for irradiating the water recovered from the water reservoir with ultraviolet light, an ion exchange unit for ion exchange with the water discharged from the ultraviolet irradiation section, and a filter for filtering the water discharged from the ion exchange unit. The filtered water is then supplied back to the water reservoir. The transport unit does not have any wiring or piping extending from the transport unit to the outside and operates without receiving external power or water supply when moving along the track. [Effects of the Invention]

[0009] In this conveying device, the conveying unit is equipped with a suction mechanism that applies suction force to a holding part that holds the workpiece, a separation mechanism for separating the workpiece from the holding part, a holding part movement mechanism for moving the holding part, and a storage battery for supplying power to the holding part movement mechanism. Therefore, the conveying unit does not need to receive power or fluids from an external source, and thus does not need to have wiring and piping extending from the conveying unit to the outside, nor a housing member to house the wiring and piping. Consequently, the generation of debris caused by friction between the housing member and the wiring and piping can be suppressed. [Brief explanation of the drawing]

[0010] [Figure 1] This is an explanatory diagram showing the configuration of the processing system. [Figure 2] Figures 2(a) and 2(b) are perspective views showing the wafer. [Figure 3] This is an explanatory diagram showing the configuration of the transport unit. [Figure 4]It is an explanatory diagram showing the configuration of the transfer unit. [Figure 5] It is an explanatory diagram showing the configuration of the transfer unit. [Figure 6] It is an explanatory diagram showing the configuration of the suction / separation mechanism.

Mode for Carrying Out the Invention

[0011] As shown in FIG. 1, the processing system 1 according to the present embodiment processes the wafer 100 accommodated in the cassette 12 of the cassette mechanism 10 using a plurality of processing units, namely, the alignment unit 20, the grinding unit 30, the polishing unit 40, and the spinner cleaning unit 50. For example, it is disposed in a clean room (not shown).

[0012] In the processing system 1, the wafer 100 is transferred between a plurality of processing units by a transfer device 60. The transfer device 60 transfers the wafer 100, which is an example of a workpiece, to a plurality of processing units and is configured to move along a movement route L1 extending in the X-axis direction corresponding to the arrangement of the plurality of processing units.

[0013] The cassette mechanism 10 has a plurality of cassettes 12, and each cassette 12 houses a plurality of wafers 100. The wafer 100 is an example of a workpiece, for example, a circular semiconductor wafer. In the present embodiment, the wafer 100 is accommodated in the cassette 12 in a state provided with a protective sheet 103 for protecting the wafer 100 as shown in FIG. 2(a).

[0014] Alternatively, the wafer 100 may be handled in the state of the workpiece set 110 as shown in FIG. 2(b). The workpiece set 110 is formed by integrating a ring frame 111 having an opening capable of accommodating the wafer 100 and the wafer 100 positioned in the opening of the ring frame 111 with a tape 113 which is a dicing tape.

[0015] When such a wafer 100 is processed by the processing system 1 as shown in FIG. 1, it is taken out from the cassette 12 by the transfer device 60 and placed on the alignment table 21 of the alignment unit 20.

[0016] The alignment unit 20 has an alignment table 21 and a plurality of alignment pins 22 arranged outside so as to surround the alignment table 21. In the alignment unit 20, the plurality of alignment pins 22 are moved radially toward the center of the alignment table 21, so that the circle connecting the alignment pins 22 is reduced in diameter. As a result, the wafer 100 placed on the alignment table 21 is aligned (centered) at a predetermined position. The aligned wafer 100 is transferred to the grinding unit 30 by the transfer device 60.

[0017] The grinding unit 30 includes a rough grinding unit 31 that performs rough grinding on the wafer 100 and a finish grinding unit 32 that performs finish grinding on the wafer 100. Further, the grinding unit 30 has three chuck tables 33 for holding the wafer 100 and a turntable 35 for holding the three chuck tables 33.

[0018] In the grinding unit 30, when the turntable 35 rotates, the three chuck tables 33 revolve. As a result, in the grinding unit 30, the chuck table 33 can be arranged at the transfer position on the -Y direction side, and the wafer 100 can be carried into and out of the chuck table 33 by the transfer device 60. Also, the chuck table 33 holding the wafer 100 can be arranged in order below the rough grinding unit 31 and the finish grinding unit 32, and the wafer 100 can be ground by the rough grinding unit 31 and the finish grinding unit 32. The ground wafer 100 is transferred to the polishing unit 40 by the transfer device 60.

[0019] The polishing unit 40 includes a polishing unit 41 for polishing the wafer 100. Furthermore, the polishing unit 40 has two chuck tables 43 and a turntable 45 that holds the two chuck tables 43. The polishing unit 41 has, for example, a polishing pad containing fixed abrasive grains.

[0020] In the polishing unit 40, the two chuck tables 43 revolve as the turntable 45 rotates. This allows the chuck tables 43 to be positioned in the transport position on the -Y direction side in the polishing unit 40, enabling the transport device 60 to load and unload wafers 100 to and from the chuck tables 43. Additionally, the chuck table 33 holding the wafers 100 can be positioned below the polishing unit 41 to perform the polishing process. The polished wafer 100 is placed on the spinner table 51 of the spinner cleaning unit 50 by the transport device 60.

[0021] The spinner cleaning unit 50 is used to clean the wafer 100 and includes a spinner table 51 for holding the wafer 100, and a nozzle 52 for spraying cleaning water and drying air toward the spinner table 51.

[0022] In the spinner cleaning unit 50, a spinner table 51 holding the wafer 100 rotates, and cleaning water is sprayed towards the wafer 100, so the wafer 100 is spinner cleaned. After that, drying air is blown onto the wafer 100 to dry it.

[0023] The wafers 100, which have been cleaned by the spinner cleaning unit 50, are then transported by the transfer device 60 into the cassette 12 of the cassette mechanism 10.

[0024] Furthermore, as shown in Figure 1, the processing system 1 includes a control unit 7 that controls each of the components of the processing system 1 described above. The control unit 7 controls a plurality of processing units, namely the alignment unit 20, the grinding unit 30, the polishing unit 40, and the spinner cleaning unit 50, while the wafer 100 is being transported by the transport device 60, to perform processing on the wafer 100.

[0025] Next, the configuration of the conveying device 60 will be described. As shown in Figure 1, the conveying device 60 has a conveying unit 61 having a housing 610 and guide rails 62. The guide rails 62 are an example of a track provided along the movement route L1 of the conveying device 60. In this embodiment, as shown in Figure 3, a pair of upper and lower guide rails 62 are attached to the -Y side of the grinding unit 30 and polishing unit 40 so as to extend along the movement route L1.

[0026] Furthermore, the conveying device 60 has a sliding member 63 on the +Y direction side of the housing 610 of the conveying unit 61 that is fitted onto the guide rail 62 and can slide along the guide rail 62. The conveying unit 61 is supported by the guide rail 62 via this sliding member 63 and is able to move along the guide rail 62. In addition, the conveying device 60 may be equipped with wheels that engage with the guide rail 62 and can roll on the guide rail 62 instead of the sliding member 63.

[0027] Furthermore, the transport device 60 includes a linear motor 65 between the housing 610 of the transport unit 61 and the grinding unit 30 and polishing unit 40. The linear motor 65 includes a fixed rail 651 provided along a guide rail 62 on the -Y side of the grinding unit 30 and polishing unit 40, and a movable element 652 provided on the +Y side of the housing 610 of the transport unit 61 facing the fixed rail 651. The linear motor 65 is configured to provide a thrust force in the direction along the guide rail 62 to the transport unit 61 equipped with the movable element 652. This linear motor 65 is controlled by a motor control unit 69 provided in the transport unit 61.

[0028] In the conveying device 60, the conveying unit 61 is able to move along the guide rail 62 by means of these sliding members 63 and the linear motor 65. The sliding members 63, the linear motor 65, and the motor control unit 69 are an example of a moving mechanism that moves the conveying unit 61 so as to be guided by the guide rail 62.

[0029] Furthermore, a pair of floor rails 67 are installed on the floor surface below the housing 610 of the transport unit 61, extending along the movement route L1 (see Figure 1) of the transport device 60. Multiple (for example, four) wheels 66 capable of rolling on the floor rails 67 are provided on the underside of the housing 610 of the transport unit 61.

[0030] Thus, in the transport device 60, the transport unit 61 is supported from below by wheels 66 that can roll on floor rails 67 along the movement route L1. Therefore, when the transport unit 61 is moved along the guide rails 62 by the linear motor 65, the transport unit 61 can be firmly supported from below.

[0031] The transport device 60 may also be equipped with a motor 68 for rotating the wheels 66. The motor 68 is controlled, for example, by a motor control unit 69. In this case, when the transport unit 61 is moved by the linear motor 65, the motor 68 rotates the wheels 66, thereby accelerating the movement of the transport unit 61. In this case, the floor rail 67 is also an example of a track provided along the movement route L1 of the transport device 60, and the wheels 66, motor 68, and motor control unit 69 are also examples of a movement mechanism that moves the transport unit 61 so as to be guided by the floor rail 67. Furthermore, if the transport unit 61 can be moved along the floor rail 67 by the motor 68, the transport unit 61 does not need to be equipped with a sliding member 63 and a linear motor 65.

[0032] Furthermore, as shown in Figure 3, the transport unit 61 has a column 611 extending upward from inside the housing 610. The transport unit 61 is equipped with a wafer holding section 70 at the top of the column 611, which has a transport pad 71 that holds and releases the wafer 100, which is the workpiece. In addition, the transport unit 61 is equipped with a battery 123 inside the housing 610.

[0033] The wafer holding unit 70 is used to handle the wafer 100 shown in Figure 2(a). As shown in Figure 3, the wafer holding unit 70 includes a transport pad 71 for holding the wafer 100, a transport arm 72 with the transport pad 71 at its tip, and a transport pad moving mechanism 73 for supporting and moving the transport pad 71.

[0034] The transport pad moving mechanism 73 is located on top of the column 611 and supports the transport arm 72. The transport pad moving mechanism 73 can extend and retract the transport arm 72 using power supplied from the battery 123.

[0035] Furthermore, the transport unit 61 is equipped with a lifting mechanism 612 inside the housing 610 that moves a column 611 supporting the transport pad moving mechanism 73 vertically using power supplied from the battery 123.

[0036] Therefore, in the transport unit 61, the power supplied from the battery 123 allows the lifting mechanism 612 to raise and lower the transport pad moving mechanism 73 together with the column 611, and the transport pad moving mechanism 73 to extend and retract the transport arm 72, thereby making it possible to move the transport pad 71, which is provided at the tip of the transport arm 72, to a desired position, as shown in Figure 4.

[0037] Thus, the transport arm 72, the transport pad moving mechanism 73, the column 611, and the lifting mechanism 612 function as a holding unit moving mechanism that moves the transport pad 71 horizontally and vertically using electricity. The battery 123 also functions as a storage battery to supply power to the holding unit moving mechanism.

[0038] Furthermore, the transport unit 61 is equipped with a suction mechanism 121 and a separation mechanism 122 inside the housing 610. The suction mechanism 121 is a suction source that applies suction force to the transport pad 71 of the wafer holding section 70. In other words, the transport pad 71, by communicating with the suction mechanism 121, obtains suction force and becomes able to hold the wafer 100.

[0039] The release mechanism 122 is an air source that releases the wafer 100 held by the transport pad 71 from the transport pad 71. In other words, the transport pad 71 communicates with the release mechanism 122, allowing it to spray air onto the wafer 100 and release the wafer 100 it is holding.

[0040] In a transport device 60 having such a configuration, the position of the transport pad 71 is adjusted by the transport arm 72, the transport pad moving mechanism 73, the column 611, and the lifting mechanism 612, and by connecting the transport pad 71 to the suction mechanism 121 or the separation mechanism 122, the wafer 100 can be transported to and from the cassette 12 of the cassette mechanism 10, the alignment unit 20, the grinding unit 30, the polishing unit 40, and the spinner cleaning unit 50.

[0041] The transport unit 61 may use a suction mechanism 125 and a detachment mechanism 126 instead of the suction mechanism 121 and the detachment mechanism 122. The suction mechanism 125 and the detachment mechanism 126 have the same functions as the suction mechanism 121 and the detachment mechanism 122, except that they are provided on the column 611.

[0042] Furthermore, the transport unit 61 includes a workset holding unit 80 which has a gripping unit 81 that is a separate holding unit from the transport pad 71. The workset holding unit 80 is used to handle a workset 110, including the wafer 100 shown in Figure 2(b).

[0043] As shown in Figure 3, the workset holding unit 80 includes a gripping part 81 for gripping the ring frame 111 of the workset 110, a gripping arm 82 with the gripping part 81 at its tip, and a gripping arm movement mechanism 83 for supporting and moving the gripping arm 82. Furthermore, the workset holding unit 80 includes a frame guide 84 for guiding the ring frame 111 of the workset 110, and a frame guide movement mechanism 85 for supporting and moving the frame guide 84.

[0044] The gripping section 81 is, for example, a mechanical clamp and can grip the outer edge of the ring frame 111. The gripping section movement mechanism 83 is located above the transport pad movement mechanism 73 in the wafer holding section 70 and supports the gripping section arm 82. The gripping section movement mechanism 83 can extend and retract the gripping section arm 82 using power supplied from the battery 123.

[0045] Furthermore, the gripping section moving mechanism 83 is supported on the column 611 via a support column 86 and a rotation mechanism 90 that extend through the transport pad moving mechanism 73. The rotation mechanism 90 rotates the support column 86 with a motor 91, thereby allowing the gripping section moving mechanism 83, together with the gripping section arm 82 and the gripping section 81, to rotate horizontally.

[0046] Furthermore, as described above, the transport unit 61 is equipped with a lifting mechanism 612 inside the housing 610 that moves a column 611 supporting the gripping mechanism 83 vertically using power supplied from the battery 123.

[0047] The frame guide 84 is used to hold the ring frame 111 of the workpiece set 110 gripped by the gripping section 81. The frame guide moving mechanism 85 is stacked on top of the gripping section moving mechanism 83 and moves up and down and pivots together with the gripping section moving mechanism 83, and the frame guide 84 can be extended and retracted by power supplied from the battery 123.

[0048] Therefore, in the transport unit 61, the power supplied from the battery 123 allows the lifting mechanism 612 to raise and lower the gripping mechanism 83 and frame guide moving mechanism 85 of the workset holding unit 80 together with the column 611, the rotating mechanism 90 to rotate the gripping mechanism 83 and frame guide moving mechanism 85, the gripping mechanism 83 to extend and retract the gripping arm 82, and the frame guide moving mechanism 85 to extend and retract the frame guide 84, thereby making it possible to move the gripping part 81 and frame guide 84 to a desired position, as shown in Figure 5. In the example shown in Figure 5, the workset holding unit 80 loads or unloads the workset 110 into or out of the cassette 12.

[0049] The rotating mechanism 90 has a clutch 92 for connecting the transport pad moving mechanism 73 of the wafer holding section 70 to the motor 91. Therefore, the rotating mechanism 90 can rotate the transport pad moving mechanism 73 horizontally together with the transport arm 72 and the transport pad 71 by connecting the transport pad moving mechanism 73 to the motor 91 with the clutch 92.

[0050] Furthermore, the transport unit 61 is equipped with a water supply mechanism 130 that supplies water to the wafer 100, which is the workpiece held on the transport pad 71 of the wafer holding section 70. The water supply mechanism 130 is a circulating device that is powered by the battery 123. The flow rate of the water circulated in the water supply mechanism 130 is, for example, about 1 to 1.5 L / min.

[0051] As shown in Figure 3, the water supply mechanism 130 includes a water reservoir 131 provided on the upper surface of the housing 610, and a buffer tank 132, a pump 133, a UV irradiation unit 134, an ion exchange unit 135, a filtration filter 136, and a resistivity meter 137, all located inside the housing 610.

[0052] The water reservoir 131 is configured as a water tank that stores water internally and can receive the transport pad 71 that holds the wafer 100. In other words, the water reservoir 131 is used to keep the wafer 100, which is held on the transport pad 71, wet by submerging it in water. By keeping the wafer 100 held on the transport pad 71 wet, it is possible to prevent the slurry remaining on the wafer 100 from adhering to the workpiece after CMP polishing by the polishing unit 40. The water supply mechanism 130 is configured to collect and purify the water accumulated inside the water reservoir 131 and return it to the water reservoir 131.

[0053] In other words, in the water supply mechanism 130, the water accumulated in the water reservoir 131 is collected and stored in the buffer tank 132, for example, at predetermined intervals. The capacity of the buffer tank 132 is, for example, about 1.5 L. The water accumulated in the buffer tank 132 is sucked in by the pump 133 and introduced into the UV irradiation unit (ultraviolet irradiation unit) 134. The UV irradiation unit 134 sterilizes the water collected from the water reservoir 131 by irradiating it with ultraviolet light. The water sterilized in the UV irradiation unit 134 is discharged from the UV irradiation unit 134 and introduced into the ion exchange unit 135. The ion exchange unit 135 performs ion exchange on the water discharged from the UV irradiation unit 134. Through this ion exchange, the water sterilized in the UV irradiation unit 134 is purified to, for example, pure water.

[0054] The water purified in this way may contain fine impurities such as resin fragments from the ion exchange resin. Therefore, the purified water is introduced into the filtration filter 136. The filtration filter 136 is, for example, a microfiltration filter, and filters the water discharged from the ion exchange unit 135. This removes impurities from the water.

[0055] Furthermore, a first pressure sensor 138 and a second pressure sensor 139 are installed on the upstream and downstream sides of the filtration filter 136, respectively, to detect the pressure of the water passing through it. If the water pressure measured by these first and second pressure sensors 138 and 139 exceeds a predetermined value, it can be determined that the filtration filter 136 has deteriorated due to the accumulation of impurities.

[0056] The water from which impurities have been removed by the filtration filter 136 is returned to the water reservoir 131 after passing through the resistivity meter 137 for measuring resistivity. In other words, the water supply mechanism 130 supplies the water filtered by the filtration filter 136 back to the water reservoir 131. The resistivity value of water measured by the resistivity meter 137 can be used, for example, to detect the degree of purity of that water.

[0057] As described above, in this embodiment, the transport unit 61 of the transport device 60 has a battery 123 which is the power source for each component, a suction mechanism 121 which is the suction source for the transport pad 71, a separation mechanism 122 which is the air source for the transport pad 71, and a water supply mechanism 130 which circulates the water accumulated in the water reservoir 131, all within the housing 610. Therefore, the transport unit 61 does not need to receive power, water, air, or other fluids from the outside, and does not have wiring and piping extending from the transport unit 61 to the outside, nor does it have a housing member to house the wiring and piping. As a result, there is no generation of debris due to friction between the housing member and the wiring and piping, and it is possible to prevent contamination of the cleanroom in which the processing system 1, including the transport device 60, is installed by this debris.

[0058] In this embodiment, in order to apply suction force to the transport pad 71 of the wafer holding section 70 in the transport unit 61, and to separate the wafer 100 held by the transport pad 71 from the transport pad 71, a suction / separation mechanism 150 as shown in Figure 6(a) may be provided instead of the suction mechanism 121 and separation mechanism 122 shown in Figure 3. As shown in Figure 6(a), the suction / separation mechanism 150 includes a vacuum pump 151 and a single-acting cylinder 153.

[0059] The single-acting cylinder 153 comprises a cylinder 201 and a piston 202 housed inside the cylinder 201.

[0060] The piston 202 is formed in a disc shape and is installed inside the cylinder 201 so as to divide the inside of the cylinder 201 into an upstream first chamber 210 and a downstream second chamber 220. One side of the piston 202 is connected to the inner wall 230 on the first inlet / outlet 205 side of the cylinder 201 by a spring 203. That is, as shown in Figure 6(a), the piston 202 is biased by the spring 203 in a direction away from the inner wall 230 on the first inlet / outlet 205 side of the cylinder 201.

[0061] The cylinder 201 has a cylindrical shape and is equipped with a first inlet 205 and a second inlet 206 at both ends, respectively, for introducing and releasing air into and out of the cylinder 201. The first inlet 205 is used to introduce and release air into and out of the first chamber 210 of the cylinder 201. The second inlet 206 is used to introduce and release air into and out of the second chamber 220 of the cylinder 201.

[0062] The vacuum pump 151 is connected to the first inlet / outlet 205 in the cylinder 201 of the single-acting cylinder 153 via the first valve 155. The vacuum pump 151 is also connected to the transport pad 71 of the wafer holding section 70 via the first valve 155 and the second valve 156. Furthermore, the first inlet / outlet 205 in cylinder 201 is also connected to the outside air via the first valve 155.

[0063] Furthermore, the second inlet / outlet 206 of cylinder 201 in the single-acting cylinder 153 is connected to the transport pad 71 of the wafer holding section 70 via the third valve 157 and the first filter 158. The second inlet / outlet 206 is also connected to the outside air via the third valve 157 and the second filter 159.

[0064] In the suction / detachment mechanism 150 having such a configuration, when applying suction force to the transport pad 71 of the wafer holding section 70 in order to hold the wafer 100 by suction with the transport pad 71, the control unit 7 of the processing system 1 (see Figure 1) controls the first valve 155 and the second valve 156, as shown in Figure 6(a), to connect the vacuum pump 151 to the transport pad 71 of the wafer holding section 70. As a result, the suction force of the vacuum pump 151 is applied to the transport pad 71, and the wafer 100 can be held by the transport pad 71 by suction, as indicated by the arrow 300.

[0065] Furthermore, as shown in Figure 6(a), the control unit 7 controls the first valve 155 to connect the first inlet / outlet 205 of the cylinder 201 in the single-acting cylinder 153 to the outside air. In this state, the piston 202 is separated from the inner wall 230 by the biasing force of the spring 203, and the first chamber 210 of the cylinder 201 is expanded. Outside air is introduced into this first chamber 210 via the first valve 155.

[0066] Furthermore, after the wafer 100 is held in place by the transport pad 71, the control unit 7 closes the second valve 156, as shown in Figure 6(b). This maintains the wafer 100 in place on the transport pad 71.

[0067] Furthermore, at this time, the control unit 7 controls the third valve 157 to connect the second inlet outlet 206 of the cylinder 201 of the single-acting cylinder 153 to the outside air. In addition, the control unit 7 controls the first valve 155 to connect the vacuum pump 151 to the first inlet outlet 205 of the cylinder 201 of the single-acting cylinder 153.

[0068] As a result, air is drawn in from the first chamber 210 side of cylinder 201, causing piston 202 to move toward the inner wall 230 of the first chamber 210 against the biasing force of spring 203, as indicated by arrow 301. This causes the second chamber 220 of cylinder 201 to expand, and outside air is introduced and accumulated in this second chamber 220 via the third valve 157 and the second filter 159.

[0069] Furthermore, when the transport pad 71 releases the wafer 100 that it has held by suction, the control unit 7 controls the first valve 155, as shown in Figure 6(c), to block communication between the first inlet / outlet 205 of the cylinder 201 and the vacuum pump 151, thereby opening the first inlet / outlet 205 to the outside air. In addition, the control unit 7 controls the third valve 157 to connect the second inlet / outlet 206 of the cylinder 201 to the transport pad 71 of the wafer holding unit 70.

[0070] As a result, the biasing force of the spring 203 causes the piston 202 to move away from the inner wall 230, expanding the first chamber 210 of the cylinder 201, and outside air is introduced into this first chamber 210 via the first valve 155. Furthermore, the outside air accumulated in the second chamber 220 of the cylinder 201 is sent to the transport pad 71 via the first filter 158. Consequently, air is injected from the transport pad 71 onto the wafer 100, causing the wafer 100 held by the transport pad 71 to move away, as indicated by the arrow 302. [Explanation of symbols]

[0071] 1: Processing system, 7: Control unit, 10: Cassette mechanism, 12: Cassette, 20: Alignment unit, 21: Alignment table, 22: Alignment pin, 30: Grinding unit, 31: Rough grinding unit, 32: Finishing grinding unit, 33: Chuck table, 35: Turntable, 40: Polishing unit, 41: Polishing unit, 43: Chuck table, 45: Turntable, 50: Spinner cleaning unit, 51: Spinner table, 52: Nozzle, 60: Conveying device, 61: Conveying unit, 62: Guide rail, 63: Sliding member, 65: Linear motor, 66: Wheels, 67: Floor rails, 68: Motor, 69: Motor control unit, 70: Wafer holder, 71: Transport pad, 72: Transport arm, 73: Transport pad moving mechanism, 80: Workset holding part, 81: Gripping part, 82: Gripping arm, 83: Gripping mechanism 84: Frame guide, 85: Frame guide movement mechanism, 86: Support column, 90: Rotating mechanism, 91: Motor, 92: Clutch, 100: Wafer, 103: Protective sheet, 110: Workset, 111: Ring frame, 113: Tape, 121: Suction mechanism, 122: Separation mechanism, 123: Battery, 125: Suction mechanism, 126: Separation mechanism, 130: Water supply mechanism, 131: Water reservoir, 132: Buffer tank, 133: Pump, 134: UV irradiation unit, 135: Ion exchange unit, 136: Filtration filter, 137: Resistivity meter, 138: First pressure sensor, 139: Second pressure sensor, 150: Suction / separation mechanism, 151: Vacuum pump, 153: Single-acting cylinder, 155: First valve, 156: Second valve, 157: Third valve, 158: First filter, 159: Second filter, 201: Cylinder, 202: Piston, 203: Spring, 205: First inlet outlet, 206: 2nd inflow / outlet, 210: 1st chamber, 220: 2nd chamber, 230: Inner wall, 610: Enclosure, 611: Column, 612: Lifting mechanism, 651: Fixed rail, 652: Movable element, L1: Movement route

Claims

1. A conveying device for transporting workpieces to multiple processing units, A track provided along a movement route corresponding to the arrangement of the multiple processing units, A conveying unit having a holding part for holding and releasing a workpiece, The transport unit is equipped with a moving mechanism that moves the transport unit so as to be guided along the track, The transport unit is, A suction mechanism that applies suction force to the holding part, A release mechanism that releases the workpiece held by the holding part from the holding part, A holding part movement mechanism that moves the holding part horizontally and vertically using electricity, A storage battery for supplying power to the holding mechanism, It comprises a circulating water supply mechanism that supplies water to the workpiece held in the holding part, A vacuum pump powered by electricity supplied from the battery, A single-acting cylinder is positioned between the vacuum pump and the holding part, The single-acting cylinder is divided into a first chamber and a second chamber, and a piston slides inside them. A spring that biases the piston to expand the first chamber, A first connecting passage that connects the first chamber of the single-acting cylinder to the vacuum pump, A first valve is provided in the first communication passage and switches between connecting the first chamber and the vacuum pump, or connecting the first chamber and the atmosphere. A second connecting passage that connects the second chamber and the holding portion of the single-acting cylinder, Equipped with, The suction mechanism is, By driving the vacuum pump and connecting the vacuum pump and the first chamber with the first valve, suction force is applied to the holding part. The separation mechanism is, The first valve connects the first chamber to the atmosphere, and the biasing force of the spring causes the piston to slide, expanding the first chamber and sending air from the second chamber to the holding part. Conveying device.

2. A third valve disposed in the second communication passage for switching between connecting the second chamber and the holding portion, or connecting the second chamber and the atmosphere, A third communication passage that branches off between the third valve and the retaining part of the second communication passage and communicates with the vacuum pump, It comprises a second valve disposed in the third connecting passage and for opening and closing the third connecting passage, The first valve is configured to connect the third communication passage when the first chamber is connected to the atmosphere. The suction mechanism is, To drive the vacuum pump, The first valve connects the first chamber to the atmosphere, forming the third communication passage; after opening the second valve, the second valve is closed, and the first valve connects the vacuum pump to the first chamber. This applies suction force to the holding part. The conveying device according to claim 1.

3. The transport unit has a housing, The water supply mechanism is A water reservoir is provided on the upper surface of the housing and is used to submerge the workpiece held in the holding part, A UV irradiation unit that irradiates ultraviolet light onto the water collected from the water reservoir, An ion exchange unit that exchanges ions with the water discharged from the ultraviolet irradiation unit, The unit comprises a filter for filtering the water discharged from the ion exchange unit, The filtered water is then supplied back to the water reservoir. The transport unit does not have any wiring or piping extending from it to the outside, and operates without receiving external power or water supply when moving along the track. The conveying device according to claim 1 or 2.

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