Connector devices and electronic equipment

Abstract

To suppress high frequency noise from a connection terminal with a simpler structure.SOLUTION: A connector device includes: a ground member; a first substrate in which grounds are formed on one surface and multiple through holes to be electrically connected to the grounds are formed; a capacity coupling part which allows the ground member and the grounds to be capacitively coupled; a connection terminal which receives connection of an external terminal; and a shield cover which covers the connection terminal from a direction different from an insertion / removal direction of the connection terminal and is connected to the multiple through holes and formed by a conductor. The multiple through holes are arranged so as to sandwich the connection terminal therebetween.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a connector device and an electronic device.

Background Art

[0002] In an electronic device, a connector device for realizing connection with other devices is used (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In connection terminals conforming to various standards such as Universal Serial Bus (USB, registered trademark), a shield for suppressing noise from the connection terminals is used. Such a shield is grounded via a bypass capacitor or the like on a substrate, but this leads to an increase in the number of mounting components on the substrate and makes it difficult to save space for wiring.

[0005] One aspect of the disclosed technology aims to provide a connector device and an electronic device capable of suppressing high-frequency noise from connection terminals with a simpler configuration.

Means for Solving the Problems

[0006] One aspect of the disclosed technology is exemplified by the following connector device: The connector device comprises a ground member; a first substrate having a ground formed on one side and a plurality of through-holes electrically connected to the ground; a capacitive coupling portion capacitively coupling the ground member and the ground; a connection terminal for receiving the connection of an external terminal; and a shield cover made of a conductor that covers the connection terminal from a direction different from the insertion / removal direction of the connection terminal and is connected to the plurality of through-holes. The plurality of through-holes are arranged so as to sandwich the connection terminal between them. [Effects of the Invention]

[0007] According to the disclosed technology, high-frequency noise from connection terminals can be suppressed with a simpler configuration. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 shows an example of the appearance of a smartphone according to this embodiment. [Figure 2] Figure 2 shows an example of the hardware configuration of a smartphone according to this embodiment. [Figure 3] Figure 3 is a first diagram showing an example of a USB connector device according to the embodiment. [Figure 4] Figure 4 is a second diagram showing an example of a USB connector device according to the embodiment. [Figure 5] Figure 5 is a third diagram showing an example of a USB connector device according to the embodiment. [Figure 6] Figure 6 is a fourth diagram showing an example of a USB connector device according to the embodiment. [Figure 7] Figure 7 shows an example of a USB connector device related to a comparative example. [Figure 8] Figure 8 shows an example of a USB connector device according to the first modified example. [Modes for carrying out the invention]

[0009] <Embodiment> Hereinafter, the embodiments will be further described using a smartphone as an example and referring to the drawings. Figure 1 is a diagram showing an example of the appearance of a smartphone 100 according to the embodiment. Figure 1 illustrates the front view of the smartphone 100. The smartphone 100 is a portable electronic device. A speaker 111, a microphone 112, and a display 113 are provided on the front of the housing 110. A USB terminal 11 for connecting other electronic devices and power supply cables is provided on the bottom surface of the smartphone 100. Inserting and removing cables from the USB terminal 11 is performed, for example, in the insertion and removal direction shown in Figure 1. Note that in Figure 1, the upper side facing the paper is assumed to be the upper side of the housing 110, and the lower side facing the paper is assumed to be the lower side of the housing 110. Hereinafter in this specification, the vertical direction of the housing 110 is also referred to as the Y direction, the width direction of the housing 110 perpendicular to the Y direction is also referred to as the X direction, and the thickness direction of the housing 110 is also referred to as the Z direction.

[0010] Figure 2 shows an example of the hardware configuration of a smartphone 100 according to an embodiment. The smartphone 100 includes a CPU 101, a main memory unit 102, an auxiliary memory unit 103, a communication unit 104, a speaker 111, a microphone 112, a display 113, and a USB connector device 1. The CPU 101, main memory unit 102, auxiliary memory unit 103, communication unit 104, speaker 111, microphone 112, display 113, and USB connector device 1 are interconnected by a connection bus B1.

[0011] The CPU 101 is also called a microprocessor unit (MPU) or processor. The CPU 101 is not limited to a single processor and may be in a multiprocessor configuration. Furthermore, a single CPU 101 connected via a single socket may have a multicore configuration. At least a portion of the processing performed by the CPU 101 may be performed by other processors, such as dedicated processors like a Digital Signal Processor (DSP), Graphics Processing Unit (GPU), numerical processor, vector processor, or image processing processor. Also, at least a portion of the processing performed by the CPU 101 may be performed by integrated circuits (ICs) or other digital circuits. Furthermore, at least a portion of the CPU 101 may include analog circuits. Integrated circuits include Large Scale Integrated Circuits (LSIs), Application Specific Integrated Circuits (ASICs), and Programmable Logic Devices (PLDs). PLDs include, for example, Field-Programmable Gate Arrays (FPGAs). The CPU 101 may be a combination of a processor and integrated circuits. The combination is called, for example, a microcontroller unit (MCU), system-on-a-chip (SoC), system LSI, or chipset. In the smartphone 100, the CPU 101 loads the program stored in the auxiliary storage unit 103 into the working area of ​​the main memory unit 102 and controls peripheral devices through program execution. This allows the smartphone 100 to perform processing that matches a predetermined purpose. The main memory unit 102 and the auxiliary storage unit 103 are recording media that the smartphone 100 can read.

[0012] The main memory unit 102 is exemplified as a memory unit that is directly accessed by the CPU 101. The main memory unit 102 includes Random Access Memory (RAM) and Read Only Memory (ROM).

[0013] The auxiliary storage unit 103 reads and writes various programs and various data to and from a recording medium. The auxiliary storage unit 103 is also called an external storage device. The auxiliary storage unit 103 stores an operating system (OS), various programs, various tables, etc. The OS includes a communication interface program for transferring data with external devices connected via the communication unit 104. External devices include, for example, other information processing devices and external storage devices connected via a computer network or the like. included.

[0014] The auxiliary storage unit 103 is, for example, an Erasable Programmable ROM (EPROM), a Solid State Drive (SSD), a Hard Disk Drive (HDD), etc. Also, the auxiliary storage unit 103 is, for example, a Compact Disc (CD) drive device, a Digital Versatile Disc (DVD) drive device, a Blu-ray (registered trademark) Disc (BD) drive device, etc.

[0015] The communication unit 104 is an interface with communication networks such as, for example, the 4th generation mobile communication network (4G), the 5th generation mobile communication network (5G), and Wireless LAN. The communication unit 104 communicates with external devices via the communication network.

[0016] The speaker 111 is a sound source that outputs sound. The speaker 111 outputs sound such as the voice of the person on the other end of a call when using the smartphone 100 for a call. The microphone 112 is a microphone used for acquiring sound during a call or video.

[0017] The display 113 displays the data processed by the CPU 101 and the data stored in the main memory unit 102. The display 113 is, for example, a Liquid Crystal Display (LCD), a Plasma Display Panel (PDP), an inorganic Electroluminescence (EL) panel, or an organic EL panel. A touch panel for detecting a touch operation by, for example, a user's finger may be superimposed on the display 113. By providing the touch panel superimposed on the display 113, the smartphone 100 can provide an intuitive operation environment for the user.

[0018] The USB connector device 1 includes a USB terminal 11 and accepts the connection of a cable conforming to the USB standard. Details of the USB connector device 1 will be described later.

[0019] Figures 3 to 6 are diagrams showing an example of the USB connector device 1 according to the embodiment. FIG. 3 illustrates a cross-sectional view of the USB connector device 1 in the X direction. FIG. 4 illustrates the appearance of the USB connector device 1 as viewed from the -Z direction. FIG. 5 illustrates the appearance of the USB connector device 1 as viewed from the +Z direction. FIG. 6 illustrates the appearance of the USB connector device 1 as viewed from the -Z direction with the internal insulating layer 153A removed. In FIGS. 4 to 6, the illustration of the ground plate 13 is omitted. The USB connector device 1 includes a USB terminal 11, a shield cover 12, a ground plate 13, a screw 14, a multilayer substrate 15, a first ground 16 (first ground layer 16), and a second ground 17 (second ground layer 17).

[0020] The USB terminal 11 is a connection terminal conforming to the USB standard. The USB terminal 11 accepts the connection of a cable conforming to the USB standard. The USB terminal 11 is grounded, for example, by a ground layer 161 described later.

[0021] The multilayer substrate 15 is a substrate in which multiple internal insulating layers 153 are laminated on a lower insulating layer 151. The lower insulating layer 151 and the internal insulating layers 153 are formed of an insulator such as paper or glass. The multilayer substrate 15 is screwed onto the ground plate 13 by screws 14 with the lower insulating layer 151 facing the ground plate 13. The screws 14 are formed of a conductor such as metal.

[0022] The ground plate 13 is a component formed from a conductor such as metal. The ground plate 13 may, for example, be part of the housing 110 of a smartphone 100 equipped with a USB connector device 1. stomach.

[0023] The internal insulating layer 153 has a ground layer 161, a through-hole 162, a ground layer 171, and another through-hole 172 formed on it. The ground layers 161 and 171 are metal layers formed on the internal insulating layer 153 by copper foil or the like. The potential of the ground layers 161 and 171 is the ground potential. The ground layers 161 and 171 are provided on the internal insulating layer 153, separated from each other. Note that the ground layers such as the ground layers 161 and 171 indicate the ground in the surface or inner layers of the multilayer substrate, and may be a ground or ground pattern created in at least a part of the surface or inner layer.

[0024] Through-holes 162 and 172 are through-holes that penetrate the internal insulating layer 153 in the thickness direction. Conductors are provided on the inner surfaces of through-holes 162 and 172. The ground layer 161 provided in each internal insulating layer 153 is electrically connected by the through-hole 162. The ground layer 171 provided in each internal insulating layer 153 is electrically connected by the through-hole 172.

[0025] Of the internal insulating layers 153, the uppermost internal insulating layer 153A has ground layers 171A, 171B, and 161 on its upper surface. Ground layers 171A, 171B, and 161 are spaced apart from each other. A capacitor 18 is provided between ground layer 171A and ground layer 171B. Capacitive coupling by the capacitor 18 connects ground layer 171A and ground layer 171B. As a result, AC current flows between ground layer 171A and ground layer 171B, but DC current does not. The capacitance of the capacitor 18 can be determined as appropriate. The screw 14 is in contact with ground layer 171B, but not with ground layer 171A, ground layer 161, or the shield cover 12. Capacitor 18 is an example of a "capacitive coupling section".

[0026] The shield cover 12 is a cover that suppresses the influence of noise from the USB terminal 11 on the outside. The shield cover 12 is made of a conductor such as metal. The shield cover 12 is provided so as to cover the USB terminal 11 from the +Z direction side and is connected to the ground layer 171.

[0027] As can be seen by referring to Figures 4 to 6, the ground layer 171 is positioned to surround the USB terminal 11 when viewed in the Z direction. The through-holes 172 are positioned on the ground layer 171 to surround the USB terminal 11. Alternatively, the through-holes 172 can be positioned on the ground layer 171 with the USB terminal 11 in between.

[0028] In a USB connector device 1 with this configuration, high-frequency current flowing through the shield cover 12 due to noise from the USB terminal 11 flows to the ground layer 171A via the ground layer 171 and through-hole 172. The current flowing to the ground layer 171A then flows to the screw 14 via capacitive coupling by the capacitor 18, and further flows to the ground plate 13.

[0029] <Comparative Example> Figure 7 shows an example of a USB connector device 500 according to a comparative example. In the USB connector device 500, the USB terminals 11 and shield cover 12 are provided on the surface layer 556 on the ground plate 13 side of the multilayer substrate 555. A predetermined gap adjusted to distance D is formed between the shield cover 12 and the ground plate 13. In the USB connector device 500, the distance D is appropriate By making this determination, the capacitance between the shield cover 12 and the ground plate 13 is adjusted. In the USB connector device 500, noise flowing through the shield cover 12 flows to the ground plate 13 due to capacitive coupling through the gap between the shield cover 12 and the ground plate 13.

[0030] In the USB connector device 500, in order to channel noise flowing through the shield cover 12 to the ground plate 13, the distance D of the gap between the shield cover 12 and the ground plate 13 must be determined with high precision. Controlling the gap to a distance D that achieves the desired capacitance is extremely difficult in terms of product manufacturing.

[0031] On the other hand, in the USB connector device 1 according to this embodiment, the capacitance between the ground layer 171A and the ground layer 171B is determined by the capacitance of the capacitor 18. Therefore, it is sufficient to select a capacitor 18 with the desired capacitance, and the USB connector device 1 can be manufactured more easily than the USB connector device 500. As explained with reference to Figure 4, in a view in the Z direction, the through-holes 172 are arranged to surround the USB terminal 11. By arranging the through-holes 172 that connect the ground layers 171 provided in each internal insulating layer 153 in this manner, high-frequency current in the shield cover 12 can be suitably passed to the ground plate 13. In other words, according to this embodiment, high-frequency noise from the USB terminal 11 can be suppressed with a simpler configuration. Furthermore, in this embodiment, capacitive coupling is interposed in the path through which the current flows from the shield cover 12 to the ground plate 13. Therefore, even if the shield cover 12 and the USB terminal 11 are short-circuited, heat generation is suppressed.

[0032] <First variation> In the embodiments described above, a capacitor 18 is provided between the ground layer 171A and the ground layer 171B, allowing high-frequency noise to flow from the ground layer 171A to the ground layer 171B. In the first modification, a configuration is described in which high-frequency current flows from the shield cover 12 to the ground plate 13 via capacitive coupling through the ground layer 161.

[0033] Figure 8 shows an example of a USB connector device 1A according to the first modification. USB connector device 1A differs from USB connector device 1 in that the shield cover 12 is provided so as to cover the USB terminal 11 from the -Z direction side, a multilayer substrate 15A is used instead of the multilayer substrate 15, and a capacitor 18 is not provided.

[0034] The multilayer substrate 15A is a substrate in which multiple internal insulating layers 153 are laminated between a lower insulating layer 151 and an upper insulating layer 152. The shield cover 12 is provided to cover the USB terminal 11 from the -Z direction and is connected to the ground layer 171. Of the ground layers 171 arranged on each internal insulating layer 153, the lower insulating layer 151 is interposed between the ground layer 171 located closest to the ground plate 13 and the ground plate 13. The ground layer 171 and the ground plate 13 are coupled capacitively. Therefore, while DC current does not flow between the ground layer 171 and the ground plate 13, AC current does. The lower insulating layer 151 is an example of an "insulating substrate".

[0035] In other words, the high-frequency current flowing through the shield cover 12 due to noise from the USB terminal 11 flows to the ground plate 13 via the ground layer 171, the through-hole 172, and the capacitive coupling between the ground layer 171 and the ground plate 13. The capacitance in the capacitive coupling between the ground layer 171 and the ground plate 13 can be appropriately determined by the material and thickness of the lower insulating layer 151 (insulating substrate). High-frequency noise from the USB terminal 11 can also be suppressed with a simpler configuration using the first comparative example.

[0036] <Other variations> In the embodiment described above, a capacitor 18 is placed between the ground layer 171A and the ground layer 171B. However, instead of the capacitor 18, the ground layers 171A and 171B may be placed in a positional relationship (distance) such that they capacitively couple with a desired capacitance. Here, both the ground layer 171A and the ground layer 171B are formed on the internal insulating layer 153 using copper foil or the like. Therefore, it is easier to set the gap between the ground layer 171A and the ground layer 171B to a predetermined positional relationship than to set the gap between the shield cover 12 and the ground plate 13 in the USB connector device 500 to distance D. Therefore, even when the ground layer 171A and the ground layer 171B are capacitively coupled in the USB connector device 1 instead of the capacitor 18, high-frequency noise from the USB terminal 11 can be suppressed with a simpler configuration.

[0037] In the embodiments and modifications described above, a USB terminal 11 was used as the terminal for accepting connections of various external devices. However, the technology described in these embodiments and modifications may also be applied to terminals of standards other than USB. Other terminal standards that can be applied include, for example, terminals of various standards such as High-Definition Multimedia Interface (HDMI, registered trademark), DisplayPort, and IEEE1394.

[0038] In the embodiments and modifications described above, multilayer substrates such as multilayer substrate 15 and multilayer substrate 15A were used, but the application of these embodiments and modifications is not limited to multilayer substrates. The technology described in these embodiments and modifications may also be applied to single-sided substrates, for example.

[0039] In the embodiments and modifications described above, a smartphone 100 was used, but the application of these embodiments and modifications is not limited to the smartphone 100. In addition to the smartphone 100, various other electronic devices such as personal computers, tablet terminals, wearable computers, feature phones, and audio-visual (AV) equipment can also be applied to these embodiments and modifications.

[0040] The embodiments and variations disclosed above can be combined in any way. [Explanation of symbols]

[0041] 1. USB connector device 1A USB connector device 11. USB port 12··Shield cover 13. Groundboard 14 screws 15...Multilayer board 15A...Multilayer board 16. First Ground 17. Second Ground 18. Capacitor 100... Smartphone 101··CPU 102...Main memory 103...Auxiliary storage section 104 Communications Department 110··Cabinet 111 ·· Speaker 112. Microphone 113 ··Display 151. Lower insulating layer 152. Upper insulating layer 153. Internal insulating layer 161 ··Ground Layer 162 ··Through-hole 171 ··Ground Layer 171A ··Ground layer 171B ··Ground layer 172 ··Through-hole 500 USB connector device 555...Multilayer board 556...surface layer

Claims

1. Ground member and A first substrate having a ground formed on one side and a plurality of through-holes electrically connected to the ground formed thereon, A capacitive coupling unit that capacitively couples the ground member and the ground, A connector that accepts the connection of an external terminal, The system includes a shield cover made of a conductor that covers the connection terminal from a direction different from the insertion / removal direction of the connection terminal, and is connected to the plurality of through-holes, The plurality of through-holes are arranged so as to sandwich the connection terminal between them. Connector device.

2. The capacitive coupling portion includes an insulating substrate disposed between the first substrate and the ground member. The connector device according to claim 1.

3. The capacitive coupling section includes a capacitor disposed between the ground and the ground member. The connector device according to claim 1.

4. A connector device comprising the one described in any one of claims 1 to 3, electronic equipment.

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