Work equipment

Abstract

A work machine according to the present invention comprises: a first mounting machine for executing first mounting work for mounting a component on a substrate; and a second mounting machine that, concurrent with the first mounting work by the first mounting machine, executes second mounting work for mounting a component on a substrate that is the same as the substrate where the component was mounted by the first mounting machine. When the first mounting work by the first mounting machine is completed faster than the second mounting work by the second mounting machine, the first mounting machine executes, on said same substrate, specified work other than the work for mounting the component.

Description

Technical Field

[0001] This specification relates to a working machine including a mounting machine for mounting components on a substrate.

Background Art

[0002] Patent Document 1 discloses two adjacent mounting machines. In the technology of Patent Document 1, one substrate is arranged across two adjacent mounting machines, and the two mounting machines cooperate to mount components on one substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a configuration including two mounting machines as in Patent Document 1, when the mounting operation of one mounting machine ends, the one mounting machine waits without operating until the mounting operation of the other mounting machine ends. Therefore, this specification provides a technology that can effectively utilize a mounting machine that has completed the mounting operation.

Means for Solving the Problems

[0005] The working machine disclosed in this specification includes a first mounting machine that executes a first mounting operation for mounting components on a substrate, and a second mounting machine that executes a second mounting operation for mounting components on the same substrate as the substrate on which the first mounting machine mounts components, in parallel with the first mounting operation by the first mounting machine. When the first mounting operation by the first mounting machine ends earlier than the second mounting operation by the second mounting machine, the first mounting machine executes a specific operation other than the operation of mounting components on the same substrate.

[0006] This configuration prevents the first implementation machine from entering a standby state after the completion of the first implementation work, allowing for effective utilization of the first implementation machine after it has finished its first implementation work. [Brief explanation of the drawing]

[0007] [Figure 1] A schematic diagram showing the implementation line of the embodiment. [Figure 2] A schematic plan view showing the circuit board of the embodiment. [Figure 3] A schematic diagram showing the first mounting device of the embodiment (section III-III in Figure 1). [Figure 4] A schematic diagram showing the first mounting device of the embodiment (section IV-IV in Figure 3). [Figure 5] Block diagram of the first mounting device of the embodiment. [Figure 6] A flowchart of the specific sequence setting process in the embodiment. [Figure 7] A time chart showing the implementation work and specific tasks for each example. [Figure 8] A schematic diagram showing the first implementation device of a modified example. [Figure 9] A schematic diagram (cross-sectional view XI-XI in Figure 8) shows a modified example of the first mounting device. [Figure 10] A flowchart of the process for generating specific sequence information in the example. [Modes for carrying out the invention]

[0008] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0009] In one embodiment of this technology, the substrate may include a first mounting area and a second mounting area. The first mounting machine may perform a first mounting operation in the first mounting area. The second mounting machine may perform a second mounting operation in the second mounting area. The first mounting machine may perform a specific operation in the second mounting area if such an area exists in the second mounting area that can perform the specific operation without interfering with the second mounting operation performed by the second mounting machine.

[0010] In one embodiment of this technology, the specific operation may be an inspection operation that inspects components mounted on the same substrate. The first mounting machine may perform the inspection operation if there is an area in the second mounting area where the specific operation can be performed without interfering with the second mounting operation by the second mounting machine, and if the component to be inspected is present in that area.

[0011] In one embodiment of this technology, the first mounting machine may determine the end time when the second mounting operation by the second mounting machine is completed, and if it is performing the specified operation, it may complete the specified operation before the end time of the second mounting operation.

[0012] (Examples) The assembly line 100 equipped with the work machine 1 of the embodiment will be described with reference to the drawings. As shown in Figure 1, the assembly line 100 is equipped with a plurality of work machines 1 (first work machine 1a, second work machine 1b, third work machine 1c, and fourth work machine 1d) arranged side by side. The first work machine 1a, second work machine 1b, third work machine 1c, and fourth work machine 1d are arranged in order from the upstream side to the downstream side of the assembly line 100.

[0013] The first to fourth work machines 1a to 1d are each equipped with a first mounting machine 10a and a second mounting machine 10b. The first mounting machine 10a and the second mounting machine 10b are arranged side by side and adjacent to each other. The first mounting machine 10a and the second mounting machine 10b are devices that mount electronic components 4 (for example, IC chips) onto circuit boards 2 such as printed circuit boards. The first mounting machine 10a and the second mounting machine 10b cooperate to mount multiple electronic components 4 onto a single circuit board 2.

[0014] As shown in FIG. 2, the circuit board 2 on which the electronic component 4 is mounted includes a first mounting area 2a and a second mounting area 2b. The first mounting machine 10a mounts the electronic component 4 in the first mounting area 2a, and the second mounting machine 10b mounts the electronic component 4 in the second mounting area 2b. Hereinafter, the operation of the first mounting machine 10a mounting the electronic component 4 is referred to as the first mounting operation, and the operation of the second mounting machine 10b mounting the electronic component 4 is referred to as the second mounting operation. The first mounting machine 10a and the second mounting machine 10b execute the first mounting operation and the second mounting operation in parallel.

[0015] In the mounting line 100 shown in FIG. 1, the first mounting operation and the second mounting operation are executed at each of the first working machine 1a to the fourth working machine 1d. At each of the first working machine 1a to the fourth working machine 1d, the electronic component 4 is mounted on the circuit board 2. The circuit board 2 is conveyed from the upstream side to the downstream side. That is, the circuit board 2 on which the electronic component 4 is mounted by the upstream working machine 1 (for example, the first working machine 1a) is conveyed to the downstream working machine 1 (for example, the second working machine 1b). Hereinafter, among the plurality of working machines 1a-1d, the first working machine 1a will be described as a representative. Also, among the two mounting machines 10a and 10b in the working machine 1, the first mounting machine 10a will be described as a representative.

[0016] As shown in FIGS. 3 and 4, the first mounting machine 10a of the first working machine 1a includes a substrate conveyor 20, a plurality of component feeders 12, a feeder holding unit 14, a mounting head 16, a camera 22, a head moving device 18, and a control unit 50. Outside the first mounting machine 10a, a management device 8 configured to be communicable with the first mounting machine 10a is arranged.

[0017] The substrate conveyor 20 carries in, positions, and carries out the circuit board 2. Although it is an example, the substrate conveyor 20 has a pair of belt conveyors and a support device (not shown) that supports the circuit board 2 from below. The substrate conveyor 20 of the first mounting machine 10a cooperates with the substrate conveyor (not shown) of the second mounting machine 10b to convey the circuit board 2. The substrate conveyor 20 conveys the circuit board 2 such that the first mounting area 2a (see FIG. 2) of the circuit board 2 is positioned within the first mounting machine 10a and the second mounting area 2b (see FIG. 2) of the circuit board 2 is positioned within the second mounting machine 10b. One circuit board 2 is arranged across the first mounting machine 10a and the second mounting machine 10b (see FIG. 1).

[0018] As shown in FIGS. 3 and 4, each component feeder 12 houses a plurality of electronic components 4. Each component feeder 12 is detachably attached to the feeder holding portion 14 and supplies the electronic components 4 to the mounting head 16. The specific configuration of the component feeder 12 is not particularly limited. Each component feeder 12 may be, for example, a tape feeder that supplies a plurality of electronic components 4 housed on a tape, a tray feeder that supplies a plurality of electronic components 4 housed on a tray, or a bulk feeder that supplies a plurality of electronic components 4 randomly housed in a container.

[0019] The feeder holding portion 14 has a plurality of slots, and the component feeder 12 can be detachably installed in each of the plurality of slots. The feeder holding portion 14 may be fixed to the first mounting machine 10a or may be detachable from the first mounting machine 10a.

[0020] The mounting head 16 has a nozzle 6 for attracting electronic components 4. The nozzle 6 is detachably attached to the mounting head 16. The mounting head 16 is capable of moving the nozzle 6 in the Z direction (here, the vertical direction), bringing the nozzle 6 closer to and further away from the component feeder 12 and the circuit board 2. The mounting head 16 can attract electronic components 4 from the component feeder 12 using the nozzle 6 and mount the electronic components 4 attracted by the nozzle 6 onto the circuit board 2. Note that the mounting head 16 is not limited to having a single nozzle 6, but may have multiple nozzles 6.

[0021] The camera 22 is fixed to the mounting head 16. The camera 22 images the electronic components 4 mounted on the circuit board 2 from above. For example, a CCD camera is used for the camera 22. The image data captured by the camera 22 is transmitted to the control unit 50.

[0022] The head moving device 18 moves the mounting head 16 between the parts feeder 12 and the circuit board 2. In this embodiment, the head moving device 18 is an XY robot that moves the moving base 19 in the X and Y directions, and the mounting head 16 is fixed to the moving base 19. However, the mounting head 16 is not limited to being fixed to the moving base 19, and may be detachably attached to the moving base 19.

[0023] As shown in Figure 5, the control unit 50 is electrically connected to the parts feeder 12, mounting head 16, head moving device 18, substrate conveyor 20, and camera 22, and controls each of these components. The control unit 50 includes a CPU (not shown) and a storage unit 52 (e.g., ROM or RAM). A predetermined program is stored in the storage unit 52. The control unit 50 performs various controls and processes according to the program stored in the storage unit 52. The controls and processes performed by the control unit 50 will be described later. The storage unit 52 also stores first sequence information for performing the first mounting operation. The first sequence information includes, for example, information indicating the procedure of the first mounting operation and information indicating the lead time of the first mounting operation.

[0024] (Specific sequence setting process; Figure 6) Next, the specific sequence setting process executed by the control unit 50 of the first mounting machine 10a will be described. The specific sequence setting process starts, for example, when the power to the first work machine 1a is turned on. The specific sequence setting process is executed, for example, before or during the execution of the first mounting work.

[0025] As shown in Figure 6, in S10 of the specific sequence setting process, the control unit 50 transmits and receives sequence information. The control unit 50 transmits the first sequence information stored in the storage unit 52 to the control unit of the second mounting machine 10b (not shown). The control unit 50 also receives second sequence information from the control unit of the second mounting machine 10b. The second sequence information is information for the second mounting machine 10b to perform the second mounting work. The second sequence information includes, for example, information indicating the procedure of the second mounting work, information indicating the lead time of the second mounting work, etc. The control unit 50 stores the received second sequence information in the storage unit 52.

[0026] In the subsequent S12, the control unit 50 determines the end time of the first implementation work and the end time of the second implementation work based on the first sequence information and the second sequence information.

[0027] In the following step S14, the control unit 50 compares the completion time of the first implementation work with the completion time of the second implementation work to determine whether its own implementation work (first implementation work) will be completed earlier than the other implementation work (second implementation work). If the first implementation work is completed earlier than the second implementation work (YES), the process proceeds to S16. If the first implementation work is not completed earlier than the second implementation work (NO), the specific sequence setting process is terminated.

[0028] In S16, following the YES response in S14, the control unit 50 generates specific sequence information for executing a specific task after completing its own mounting work (first mounting work). The specific task is a task other than mounting electronic components 4 onto the circuit board 2, and is, for example, an inspection task to inspect the appearance of the electronic components 4 mounted on the first mounting area 2a of the circuit board 2. The inspection task is, for example, an inspection task in which the camera 22 fixed to the mounting head 16 takes an image of the electronic components 4 and determines the quality of the placement position and placement angle of the electronic components 4 based on the image. The specific sequence information includes, for example, information indicating the procedure of the inspection task and information indicating the lead time of the inspection task.

[0029] If the control unit 50 generates specific sequence information in S16 above, it executes a specific task (for example, an inspection task) after the completion of the first mounting task, as shown in Figure 7, based on that specific sequence information. When the control unit 50 executes a specific task, it completes the specific task before the completion time of the second mounting task by the second mounting machine 10b, based on the specific sequence information. The control unit 50 may also make the completion time of the specific task coincide with the completion time of the second mounting task.

[0030] (effect) The assembly machine 1 of the embodiment has been described above. As described above, the assembly machine 1 of the embodiment includes a first mounting machine 10a that performs a first mounting operation to mount electronic components 4 onto a circuit board 2, and a second mounting machine 10b that performs a second mounting operation to mount electronic components 4 onto the same circuit board 2 in parallel with the first mounting operation. If the first mounting operation by the first mounting machine 10a is completed earlier than the second mounting operation by the second mounting machine 10b, the first mounting machine 10a performs a specific operation other than mounting electronic components 4 on the same circuit board 2 (see Figure 7).

[0031] This configuration makes it possible to prevent the first mounting machine 10a from entering a standby state after the completion of the first mounting operation, and to make effective use of the first mounting machine 10a after it has completed the first mounting operation.

[0032] Furthermore, the first mounting machine 10a identifies the completion time for the second mounting work performed by the second mounting machine 10b (see S12 in Figure 6), and if it is to perform the identified task, it completes the task before the completion time of the second mounting work (see Figure 7). This configuration makes it possible to prevent the second mounting machine 10b from entering a standby state after the completion of the second mounting work.

[0033] (modified version) In the above embodiment, the first mounting machine 10a and the second mounting machine 10b were arranged side by side, forming a so-called pair robot type work machine 1, but the configuration is not limited to this. In a modified example, the first mounting machine 10a and the second mounting machine 10b may be arranged vertically opposite each other, forming a so-called opposing robot type work machine 1. This will be described below. In the following description, components similar to those described above will be denoted by the same reference numerals and their description will be omitted.

[0034] As shown in Figures 8 and 9, the opposing robot-type first work machine 1a includes a first mounting machine 10a and a second mounting machine 10b arranged opposite each other. The first mounting machine 10a and the second mounting machine 10b cooperate to mount multiple electronic components 4 onto a single circuit board 2. The first mounting machine 10a and the second mounting machine 10b perform the first mounting work and the second mounting work in parallel. The first mounting machine 10a has the same configuration as the first mounting machine 10a in the above embodiment. The second mounting machine 10b has a configuration that is a left-right inversion of the first mounting machine 10a, and otherwise has the same configuration as the first mounting machine 10a. The second mounting machine 10b will be described by denoting the reference numeral "b" in the configuration shown in Figures 8 and 9.

[0035] In the modified first work machine 1a, the mounting head 16 of the first mounting machine 10a and the mounting head 16b of the second mounting machine 10b can mutually enter each other's mounting areas on the circuit board 2. That is, the mounting head 16 of the first mounting machine 10a can enter the second mounting area 2b of the circuit board 2, and the mounting head 16b of the second mounting machine 10b can enter the first mounting area 2a of the circuit board 2.

[0036] (Specific sequence information generation process; Figures 6 and 10) Next, the specific sequence information generation process executed by the control unit 50 of the modified first implementation machine 10a will be described. In the modified example, when the control unit 50 generates specific sequence information in S16 of the specific sequence setting process (see Figure 6), it executes the specific sequence information generation process shown in Figure 10.

[0037] As shown in Figure 10, in S20 of the specific sequence information generation process, the control unit 50 determines whether there is an area that can be accessed in the other mounting area (second mounting area 2b) without interfering with the other mounting work (second mounting work). Based on the first sequence information and second sequence information stored in the memory unit 52 (see S10 in Figures 5 and 6), the control unit 50 determines whether there is an area that can be accessed in the second mounting area 2b without interfering with the second mounting work. For example, as shown in Figure 9, if the second mounting machine 10b performs the second mounting work only in a portion of the second mounting area 2b of the circuit board 2 on the second mounting machine 10b side 2y, and does not perform the second mounting work in the other area 2x on the first mounting machine 10a side, then that area 2x (the area 2x where the second mounting work is not performed) becomes an accessible area. The other area 2x is, for example, an area where the mounting of electronic components 4 has already been completed. In such an area 2x, the mounting head 16 of the first mounting machine 10a can enter without interfering with the second mounting operation.

[0038] If, in S20, there is an area that can be accessed in the second implementation area 2b without interfering with the second implementation work (YES), the process proceeds to S22. On the other hand, if there is no area that can be accessed (NO), the process proceeds to S26.

[0039] In S22, following a YES response in S20, the control unit 50 determines whether or not the electronic component 4 to be inspected exists in an accessible area (e.g., area 2x) within the second mounting area 2b. The control unit 50 determines whether or not the electronic component 4 to be inspected exists based, for example, on the second sequence information stored in the memory unit 52 (see S10 in Figure 6). If the electronic component 4 to be inspected exists (YES), the process proceeds to S24. If the electronic component 4 to be inspected does not exist (NO), the process proceeds to S26.

[0040] In S24, following the YES response in S22, the control unit 50 sets up an inspection operation in an intrudeable area (e.g., area 2x) in the second implementation area 2b. When generating specific sequence information, the control unit 50 generates specific sequence information that includes information indicating the procedure for performing the inspection operation in the intrudeable area.

[0041] In S20 and S22 above, in S26 after NO, the control unit 50 sets up the inspection work in its own mounting area (first mounting area 2a). When generating specific sequence information, the control unit 50 generates specific sequence information that includes information indicating the procedure for performing the inspection work in the first mounting area 2a.

[0042] Based on the generated specific sequence information, the control unit 50 executes a specific operation (inspection operation) after the completion of the first implementation operation. If the control unit 50 sets an inspection operation in an accessible area (for example, area 2x) in S24 above, it executes the inspection operation in the accessible area after the completion of the first implementation operation. On the other hand, if the control unit 50 sets an inspection operation in the first implementation area 2a in S26 above, it executes the inspection operation in the first implementation area 2a after the completion of the first implementation operation.

[0043] (effect) The modified configuration has been described above. As described above, in the modified configuration, if there is an area (e.g., area 2x) in the second mounting area 2b where a specific operation (e.g., inspection operation) can be performed without interfering with the second mounting operation by the second mounting machine 10b, the first mounting machine 10a will perform the specific operation in that area. If there is a component to be inspected in that area (e.g., area 2x), the first mounting machine 10a will perform the inspection operation. With this configuration, the first mounting machine 10a can be effectively utilized in the second mounting area 2b. Furthermore, even if the second mounting operation is not yet completed, the components mounted in the second mounting area 2b can be inspected. This makes it possible to improve the quality of the product.

[0044] (Other variations) The specified task is not limited to inspection work. The specified task may also be maintenance work on the work machine 1, for example, cleaning work such as cleaning the nozzle 6.

[0045] The specific examples of the technologies disclosed herein have been described in detail above, but these are merely illustrative and do not limit the scope of the claims. The technologies described in the claims include various modifications and changes to the specific examples described above. Furthermore, the technical elements described herein or in the drawings exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technologies illustrated herein or in the drawings achieve multiple objectives simultaneously, and achieving even one of these objectives constitutes technical usefulness in itself.

Claims

1. A first mounting machine that performs the first mounting operation of mounting components onto a circuit board, The system comprises a second mounting machine that performs a second mounting operation in parallel with the first mounting operation performed by the first mounting machine, in which the second mounting machine mounts components on the same board on which the first mounting machine mounts components, The first mounting machine stores first sequence information, which is information indicating the lead time of the first mounting operation, and second sequence information, which is information indicating the lead time of the second mounting operation. Based on the first sequence information and the second sequence information, it identifies the end time of the first mounting operation and the end time of the second mounting operation. If the first mounting operation is completed earlier than the second mounting operation, it generates specific sequence information, which includes information indicating the procedure for an inspection operation to inspect components mounted on the same substrate, and information indicating the lead time of the inspection operation. If the first mounting operation by the first mounting machine is completed earlier than the second mounting operation by the second mounting machine, the first mounting machine shall perform the inspection operation, which is a specific operation other than the operation of mounting components, on the same board based on the specific sequence information. When the first mounting machine performs the specific operation, it does so based on the specific sequence information, To complete the specified task before the completion time of the second implementation task, or A work machine that synchronizes the end time of the specified work with the end time of the second implementation work.

2. The substrate comprises a first mounting area and a second mounting area. The first mounting machine performs the first mounting operation in the first mounting area. The second mounting machine performs the second mounting operation in the second mounting area. The work machine according to claim 1, wherein the first mounting machine performs the specific work in the second mounting area if such an area exists in the second mounting area where the specific work can be performed without interfering with the second mounting work performed by the second mounting machine.

3. The work machine according to claim 2, wherein the first mounting machine performs the inspection work when there is a region in the second mounting region in which the specific work can be performed without interfering with the second mounting work performed by the second mounting machine, and a component to be inspected is present in that region.

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