Rotary heat treatment chamber

Abstract

The present disclosure relates to heating a substrate in a rapid thermal processing (RTP) chamber. The chamber may include a rotating assembly configured to accommodate and rotate a substrate while a heat source in the RTP chamber applies heat to the substrate. The rotating assembly is disposed partially outside the RTP chamber. A seal is formed around the rotating assembly to maintain a vacuum within the RTP chamber while the rotating assembly rotates. The rotating assembly may be configured to accommodate substrates of various sizes.

Description

Technical Field

[0001]

[0001] Embodiments of the present disclosure generally relate to an apparatus and method for annealing a substrate suitable for semiconductor processing. More particularly, embodiments of the present disclosure relate to rotating a substrate during annealing.

Background Art

[0002]

[0002] A heat treatment chamber generally exposes a substrate to radiation from a heat source to raise the temperature of the substrate, either the entire substrate or a portion or surface region of the substrate. The radiation used to heat the substrate can create a strong background radiation environment within the chamber. As a result, in a heat treatment chamber, the substrate may be heated non-uniformly during an annealing process.

[0003]

[0003] Therefore, what is needed in the art is an apparatus and method for solving the above problems.

Summary of the Invention

[0004]

[0004] Embodiments of the present disclosure generally relate to an apparatus and method for annealing a substrate suitable for semiconductor processing. More particularly, embodiments of the present disclosure relate to rotating a substrate during annealing.

[0005]

[0005] A particular embodiment provides a heat treatment chamber. The chamber includes a rotary assembly configured to rotate about an axis of the heat treatment chamber. The rotary assembly includes a rotary pedestal having a pedestal shaft and a pedestal plate. The pedestal plate is coupled to the end of the pedestal shaft, and the pedestal shaft extends outside the heat treatment chamber. The pedestal shaft is housed in a pedestal housing coupled to the heat treatment chamber. The rotary pedestal further includes a substrate support plate detachably coupled to the pedestal plate. The chamber further includes a magnetic fluid seal positioned between the pedestal shaft and the pedestal housing. The magnetic fluid seal is configured to maintain a vacuum within the heat treatment chamber.

[0006]

[0006] Another embodiment provides a rotary assembly configured to rotate about an axis of a heat treatment chamber. The rotary assembly includes a pedestal having a pedestal shaft and a pedestal plate. The pedestal shaft is located within a pedestal housing. The rotary assembly further includes a reflector plate coupled to the pedestal plate. The reflector plate has a first plurality of features formed therein. The rotary assembly further includes a substrate support plate detachably coupled to the reflector plate. The substrate support plate has a second plurality of features formed therein. The substrate support plate further includes a third plurality of features formed therein. The third plurality of features is configured to be coupled to at least some of the first plurality of features. The rotary assembly further includes a magnetic fluid seal located between the pedestal shaft and the pedestal housing.

[0007]

[0007] Another embodiment provides a heat treatment chamber. The chamber includes a rotary assembly configured to rotate about a central axis of the heat treatment chamber. The rotary assembly includes a pedestal having a pedestal shaft and a pedestal plate. The pedestal shaft is located within a pedestal housing. The rotary assembly further includes a reflector plate coupled to the pedestal plate, the reflector plate having a first plurality of features formed therein. The rotary assembly further includes a substrate support plate detachably coupled to the reflector plate. The substrate support plate includes a second plurality of features formed therein. The substrate support plate further includes a third plurality of features formed therein. The third plurality of features are configured to couple with at least some of the first plurality of features. The substrate support plate further includes an edge ring detachably coupled to the substrate support plate. The edge ring includes at least one tab configured to couple with at least some of the second plurality of grooves. The edge ring further includes a lip configured to support a substrate. The chamber further includes a magnetic seal configured to be positioned between the pedestal shaft and the pedestal housing. The chamber further includes a plurality of lift pins positioned in a first plurality of openings formed by the heat treatment chamber. The lift pins are configured to be positioned in a second plurality of openings formed by the reflector plate and a third plurality of openings formed by the substrate support plate when the rotary assembly is in a first position about the central axis. The lift pins are configured to lift the reflector plate when the rotary assembly is in a second position about the central axis.

[0008]

[0008] Other embodiments include a method for rotating a rotary assembly in a heat treatment chamber. This method includes placing a substrate on the edge ring of the rotary assembly. This method further includes rotating the rotary assembly about the axis of the heat treatment chamber from a first position about the axis to a second position about the axis. The rotary assembly includes a pedestal having a pedestal shaft and a pedestal plate. The pedestal plate is coupled to the end of the pedestal shaft, which extends outside the heat treatment chamber. The rotary assembly includes a substrate support plate that is detachably coupled to the pedestal plate. The substrate support plate rotates with the pedestal as part of the rotary assembly. A magnetic fluid seal is formed to maintain a vacuum inside the heat treatment chamber. This method further includes heating the substrate.

[0009]

[0009] In order to provide a detailed understanding of the features of the present disclosure described above, the present disclosure summarized above will be described more specifically with reference to embodiments illustrated in part in the accompanying drawings. However, it should be noted that the accompanying drawings are merely illustrative embodiments and should not be considered to limit the scope of the present disclosure, and that the present disclosure may also permit other equally valid embodiments. [Brief explanation of the drawing]

[0010] [Figure 1] This is a cross-sectional view showing a rapid heat treatment (RTP) chamber according to several embodiments. [Figure 2A] This is a cross-sectional view showing a rotary assembly according to several embodiments. [Figure 2B] This is an enlarged view showing different cross-sections of the rotary assembly of Figure 2A according to several embodiments. [Figure 2C] This is an enlarged view showing different cross-sections of the rotary assembly of Figure 2A according to several embodiments. [Figure 2D] This is an enlarged view showing different cross-sections of the rotary assembly of Figure 2A according to several embodiments. [Figure 3]This is an exploded third-view drawing showing a rotary assembly according to several embodiments. [Figure 4A] This is a cross-sectional view showing a rotary assembly according to several embodiments. [Figure 4B] This is a cross-sectional view showing a rotary assembly according to several embodiments. [Figure 5] This is a block diagram showing a control system for a rotary assembly of an RTP chamber according to one embodiment. [Figure 6] This is a flowchart illustrating a method for using a rotary assembly in an RTP chamber according to one embodiment. [Modes for carrying out the invention]

[0011]

[0017] For ease of understanding, the same reference numerals are used to indicate identical elements common to all drawings whenever possible. It is assumed that elements and features of one embodiment can be usefully incorporated into other embodiments without further detail.

[0012]

[0018] The following description includes numerous specific details to provide a more complete understanding of the disclosure. However, it will be apparent to those skilled in the art that some embodiments of the disclosure may be carried out without one or more of these specific details. In other examples, well-known features are omitted to avoid ambiguity regarding one or more embodiments of the disclosure.

[0013]

[0019] This disclosure relates to heating a substrate in a rapid heat treatment (RTP) chamber. The chamber may include a rotating assembly configured to house and rotate the substrate while a heat source within the RTP chamber heats the substrate. The rotating assembly is positioned partially outside the RTP chamber. A seal can be formed around the rotating assembly to maintain a vacuum within the RTP chamber while the rotating assembly is rotating. The rotating assembly can be configured to accommodate substrates of various sizes.

[0014]

[0020] The methods and systems disclosed herein include, for example, novel features for heating a substrate during annealing. The rotary assembly embodiment consequently allows for uniform heating of the substrate without minimizing or eliminating any increase in the size of the RTP processing chamber. Minimizing moving parts is beneficial, as it reduces system maintenance and wear, resulting in higher reliability. The seals around the rotary assembly can reduce or eliminate friction surfaces, beneficially reducing particles and debris generated during the process.

[0015]

[0021] The methods and systems disclosed herein may offer features that overcome many of the drawbacks associated with the conventional RTP processing chambers described above.

[0016] Example of a heat treatment chamber

[0022] Figure 1 is a cross-sectional view showing an RTP chamber 110 (referred to as the chamber 110) according to an embodiment of the present disclosure. The chamber 110 includes a chamber body 20, an upper part 23, and a window 22 located in the upper part 23. A lamp assembly 16 is located in the window 22. The lamp assembly 16 includes a housing 54 and a first set of multiple openings 52 formed in the housing 54. In some embodiments, a second set of multiple openings (not shown) may be formed in the housing 54. A set of lamps 46 are located in the housing 54, each lamp 46 located in a corresponding opening 52. The lamps 46 are connected to a power controller 12 via a set of electrical sockets 48. During the process, the lamps 46 emit radiation through the window 22 toward a substrate 32 located in the chamber 110, heating the substrate 32 to a predetermined temperature. The predetermined temperature may be in the range of about 20°C to about 1500°C. In some embodiments, the substrate is heated to a relatively low temperature, such as about 20°C to about 350°C. In some embodiments, the substrate is heated to a relatively high temperature, such as from about 350°C to about 1500°C. The window 22 is generally made of any material that is resistant to the processing environment and transmits the desired radiation. For example, quartz is transparent to infrared light, so quartz is usually used for the window 22. Other suitable materials include, but are not limited to, sapphire. In further embodiments, one or both sides of the window 22 are optionally coated with an anti-reflective coating or any other suitable filter. For example, if the lamp 46 has a considerable UV output, an ultraviolet (UV) filter is optionally used to avoid the generation of ions and radicals in the chamber or damage to the UV-sensitive structure on the substrate 32. As another example, an optional notch filter is used to accept narrowband radiation. In some embodiments, as shown in Figure 1, a filter 19 is coated on the inner surface of the window 22. The filter 19 blocks radiation having wavelengths within a specific range, such as from about 780 nm to about 880 nm, and transmits radiation having wavelengths outside that range. The filter 19 may be a plurality of alternating layers, such as oxide layers. In one embodiment, the filter 19 alternately comprises silicon dioxide layers and titanium dioxide layers, with the silicon dioxide layers located at opposing ends of the filter.In one embodiment, the filter 19 includes a total of 30 to 50 alternating layers. The filter 19 can be coated on the outer surface of the window 22 (facing the lamp assembly 16), the inner surface of the window 22 (facing the substrate support), or can be embedded in the window 22.

[0017]

[0023] The radiation source 100 is connected to the lamp assembly 16 via a radiation source manifold 102. For clarity, the radiation source 100 located outside the chamber 110 is illustrated, but it is also contemplated that the radiation source 100 can be located within the chamber 110. The radiation source 100 generally includes one or more radiation emitting devices different from the lamp 46.

[0018]

[0024] The chamber 110 optionally includes a beam splitter 115 that optically communicates with the radiation emitted by the radiation source 100. During the process, the beam splitter 115 directs the radiation from the radiation source 100 to a sampling detector 116 used to directly detect the source modulation from the radiation source 100. The sampling detector 116 helps to correct for any inter-pulse modulation or other amplitude modulation. The beam splitter 115 typically has a low reflectivity, for example, less than about 30 percent, about 20 percent, etc., to avoid excessive attenuation of the radiation from the radiation source 100. In one example, the beam splitter 115 is a fiber-coupled splitter and is connected to the sampling detector 116 via a fiber. In FIG. 1, the beam splitter 115 is illustrated outside the chamber body 20, but the beam splitter 115 can be positioned within the chamber 110, for example, in the processing area, to detect the radiation emitted from the radiation source 100 and may not be fiber-coupled to the radiation source 100.

[0019]

[0025] An inlet port 80 and an outlet port 82 are formed in the chamber body 20. During the process, before introducing the process gas through the inlet port 80, the pressure inside the chamber 110 can be reduced to less than atmospheric pressure. The vacuum pump 84 evacuates the chamber 110 by pumping through an exhaust port 86 formed in the chamber body 20. A valve 88 disposed between the exhaust port 86 and the vacuum pump 84 is utilized to control the pressure inside the chamber 110. A second vacuum pump 90 is connected to the lamp assembly 16 and, in particular, reduces the pressure inside the lamp assembly 16 when pumping the pressure inside the chamber 110 to a low pressure to reduce the pressure difference across the entire window 22. The pressure inside the lamp assembly 16 is controlled by a valve 94.

[0020]

[0026] A rotary assembly 30 is disposed within the chamber 110 and rotates about the central axis 133 of the chamber 110. As shown, the rotary assembly 30 is disposed at least partially through the reflector plate 62 and the central opening 132 in the bottom 25 of the chamber body 20. As shown, the central axis 133 is aligned with the center of the central opening 132. The substrate 32 can be disposed on the rotary assembly 30 such that the substrate 32 rotates with the rotary assembly 30 and the remaining portion of the chamber 110 including the reflector plate ensures that the substrate 32 does not rotate. The lamp 46 heats the substrate 32 as described above. Rotating the substrate 32 during heating can result in the beneficial effect of uniform heating of the substrate 32. In some embodiments, the reflector plate 62 and / or the pedestal plate 260A absorb heat transferred from the substrate 32 and radiate the heat back towards the substrate 32. In some embodiments, the reflector plate 62 and / or the pedestal plate 260A reflect the heat from the substrate 32 and direct the reflected heat towards the substrate 32. In some embodiments as described in connection with FIG. 2A, the reflector plate 62 includes at least one resistive heater 265 for radiating heat towards the substrate 32. In some embodiments, the pedestal plate 260A may include at least one resistive heater.

[0021]

[0027] The chamber body 20 and the reflector plate 62 each include a first set of openings 134 (e.g., openings 134A and 134B in Figure 2B). A set of lift pins 136 (e.g., three lift pins centered equally on the radius of the central axis 133) are positioned to extend through the first set of openings 134. A seal (not shown), such as an O-ring, ceramic tight fit, or bellows, can form a seal between the lift pins 136 and the opening 134A to maintain pressure within the chamber 110. In some embodiments, at least one actuator (not shown) can move the lift pins 136 in and out of the chamber 110, and a seal can be formed between at least one actuator and the chamber 110. The rotary assembly 30 includes a second set of openings 138. Each of the second set of openings 138 may be aligned with the corresponding opening 134 of the first set of openings 134 so that the lift pins 136 can extend through the second set of openings 138 and lift the substrate 32. The system controller 199 can control the rotation of the rotary assembly 30, as will be further described in reference to Figures 2A and 7. The system controller 199 may interface with a rotation sensor (e.g., the encoder 269 in Figure 2A) to measure the angular position of the rotary assembly 30 about the central axis 133 relative to the chamber body 20. The system controller 199 may further align the openings 134 and 138 before the lift pins 136 extend through the openings 138 to lift the substrate 32.

[0022]

[0028] The lift pins can be positioned relative to the substrate 32. In some embodiments, the nominal radial distance of the lift pin 136 from the central axis 133 is 6 inches. In some embodiments, the nominal radial distance of the lift pin 136 from the central axis 133 is 4 inches. In some embodiments, the nominal radial distance of the lift pin from the central axis 133 is 3 inches. The lift pin 136 can be positioned based on the diameter of the substrate 32 to be lifted.

[0023]

[0029] In some embodiments, at least one thermal detector (not shown), such as a pyrometer or temperature sensor, including a transmission pyrometry detector, may be used to evaluate the thermal state of the substrate 32. For example, at least one pyrometer may measure the radiation spectrum of the substrate 32 over a wavelength range (beyond one or two dominant wavelengths) to estimate the temperature of the substrate 32.

[0024] Example of a rotary assembly

[0030] Figure 2A is a cross-sectional view showing a rotary assembly 30 according to several embodiments. In particular, Figure 2A shows a rotary assembly 30 positioned on a chamber body 20 and a pedestal housing 280 coupled to the bottom 25 of the chamber body 20.

[0025]

[0031] In the embodiment shown in Figure 2A, the rotary assembly 30 includes a pedestal 260 having a pedestal plate 260A and a pedestal shaft 260B. The pedestal shaft 260B is positioned in the central opening 132 of the chamber body 20, and a motor 268 rotates the pedestal 260 around a central axis 133. In the illustrated embodiment, the pedestal shaft 260B is positioned in a pedestal sleeve 270, and the motor 268 rotates the pedestal sleeve 270, causing the pedestal shaft 260B and the pedestal 260 to rotate. A system controller 199 controls the position of the pedestal plate 260A using the motor 268 and an encoder 269. The encoder 269 and the motor 268 may be integrated within the system controller 199 as input and output, respectively, as will be further described with respect to Figure 5. In a further embodiment, the system controller 199 may calculate the rotational speed of the pedestal 260 using the encoder 269. The pedestal shaft 260B and pedestal sleeve 270 are arranged in the pedestal housing 280, as will be further described with reference to Figure 2D. The pedestal 260 can be removed from the pedestal sleeve 270, which is advantageous as it allows the chamber 110 (Figure 1) to use different pedestals 260. For example, a pedestal 260 having a different pedestal plate 260A can be used, such as a pedestal plate 260A including a reflector plate 62.

[0026]

[0032] The pedestal plate 260A transmits the rotation of the pedestal 260 to the substrate support plate 240 (referred to as the support plate 240). The support plate 240 can shield the reflector plate 62 and the pedestal plate 260A from being coated by the material of the venting substrate 32. In the illustrated embodiment, a plurality of transfer pins 266 are located in a third plurality of openings 260C of the pedestal plate 260A. A fourth plurality of openings 241A are located in the support plate 240. Each of the fourth plurality of openings 241A is aligned with the corresponding opening in the third plurality of openings 260C so that when the support plate 240 is placed on the pedestal 260, the transfer pins 266 are further positioned in the fourth plurality of openings 241A.

[0027]

[0033] The adapter ring 242 allows the edge ring 244 to be removably attached to the support plate 240, which is advantageous as it allows for easy adjustment or replacement of the edge ring 244. The edge ring 244 may be sized to accommodate the substrate 32 so that the substrate 32 is positioned on the edge ring 244 during the process. The adapter ring 242 may also be sized to adjust the distance between the substrate 32 and the reflector plate 62, as described with respect to Figure 2B. The substrate 32 may be a high-resistance silicon substrate. In some embodiments, the edge ring 244 is set to accommodate substrates 32 of different sizes. In some embodiments, different edge rings 244 are used, each edge ring 244 corresponding to a substrate 32 of a different size, and the adapter ring 242 fits each edge ring 244 to the support plate 240. For example, the edge ring 244 may be sized to accommodate a 675 mm substrate, or a 450 mm substrate, or a 300 mm substrate, or a 200 mm substrate, or a 150 mm substrate. In some embodiments where the pedestal housing 280 may be smaller, the edge ring 244 may be sized to accommodate a 125 mm substrate, or a 100 mm substrate, or a 76 mm substrate, or a 51 mm substrate, or a smaller substrate. In some embodiments, the adapter ring 242 may also be referred to as an interface ring. The edge ring 244, the adapter ring 242, and the support plate 240 will be further described with reference to Figure 2B.

[0028]

[0034] The reflector plate 62 surrounds the pedestal plate 260A and can radiate or reflect heat toward the substrate 32, as described above with respect to Figure 1. In the above embodiments, the support plate 240 may be optically transparent so that heat can pass through to the substrate 32. In some embodiments, the support plate 240 is optically transparent so that a pyrometer can take measurements and evaluate the thermal state of the substrate 32. In some embodiments, the support plate 240 is made of the same material as the window 22 (Figure 1). For example, the support plate 240 may contain quartz and may be referred to as a quartz plate in the above embodiments. In some embodiments, the support plate 240 contains a thermally conductive material such as a metal, for example, aluminum, to absorb heat and radiate the absorbed heat toward the substrate 32.

[0029]

[0035] The pedestal shaft 260B includes a coolant inlet 261A and a coolant outlet 261B for flowing the first coolant from the first cooling device 214A. The pedestal plate 260A includes a channel 261C formed therein, which is fluidly connected to the inlet 261A and outlet 261B so that the first coolant flows through it. In the illustrated embodiment, the coolant inlet 261A is located within the coolant outlet 261B, and the inlet 261A and outlet 261B are located on the central axis 133, which advantageously allows the pedestal 260 to rotate while the first cooling device 214A cools the pedestal 260. Rotating inlet 261A and outlet 261B can be sealed from non-rotating lines connected to the first cooling device 214A using a rotating joint or seal such as a mechanical seal, bearing, bushing, or packing (not shown). The reflector plate 62 includes a channel 263 formed therein, through which a second coolant can flow. The second coolant flows from the second cooling device 214B. The first coolant may be the same as or different from the second coolant. In some embodiments, the first and / or second coolant is water, such as tap water, deionized water, distilled water, or reverse osmosis water. In some embodiments, the first and / or second coolant contains glycol.

[0030]

[0036] In the illustrated embodiment, the chamber 110 (Figure 1) has a double-sided heating configuration in which both sides of the substrate 32 are heated. A lamp 46 (Figure 1) heats a first surface of the substrate 32, and a reflector plate 62 heats a second surface of the substrate 32. The reflector plate 62 optionally includes one or more resistance heaters 265 embedded therein. The resistance heaters 265 are used to raise the temperature of the reflector plate 62 and radiate heat toward the substrate 32 positioned on the edge ring 244. The resistance heaters 265 are coupled to a heater power supply (not shown). In some embodiments, the heater power supply may be a power controller 12 (Figure 1). In some embodiments, a system controller 199 controls the heater power supply and / or the resistance heaters 265. In some embodiments, the resistance heaters 265 are not used because the reflector plate 62 and pedestal plate 260A radiate or reflect heat from the substrate 32.

[0031]

[0037] In some embodiments, the cooling channels 263 are present only in the outermost region of the reflector plate 62 (e.g., the region furthest from the central axis 133), thereby advantageously cooling the adapter ring 242 and the edge ring 244. For example, during some processes, the edge ring 244 may retain heat that causes the temperature of the corresponding edge of the substrate 32 (e.g., the edge furthest from the central axis 133) to be higher than the temperature of the center of the substrate 32 (e.g., the region around or near the central axis).

[0032]

[0038] In some embodiments, the pedestal 260 and / or reflector plate 62 do not have a cooling system having cooling channels 261C or 263.

[0033]

[0039] In some embodiments, the pedestal plate 260A and the reflector plate 62 are each made from a material with high thermal conductivity, such as a metal like aluminum.

[0034]

[0040] In some embodiments, the inside of the pedestal sleeve 270 may be tapered toward the central axis 133 at the end closest to the motor 268. The pedestal shaft 260B may similarly be tapered so that the weight of the pedestal 260 causes the pedestal shaft 260B to connect to the pedestal sleeve 270 during rotation. The tapered shape of the pedestal sleeve 270 has the advantage that the pedestal 260 can be easily installed and removed from the pedestal sleeve 270 without additional hardware.

[0035]

[0041] Figures 2B to 2D are enlarged views showing different cross-sections of the rotary assembly 30 of Figure 2A according to several embodiments. The substrate 32 is omitted in Figures 2B to 2D to more clearly show the components of the rotary assembly 30.

[0036]

[0042] In particular, Figure 2B shows the stacked configuration of the rotary assembly 30 including the lift pin 136. In the illustrated embodiment, the support plate 240 includes a plurality of tabs 241B on or near the edge of the support plate 240 (for example, furthest from the central axis 133 in Figure 2A). The adapter ring 242 forms a plurality of notches 243A that engage with the tabs 241B of the support plate 240. As illustrated, one of the tabs 241B is positioned in one of the notches 243A formed by the adapter ring 242. The tabs 241B operably engage with the notches 243A as the support plate 240 rotates, causing the adapter ring 242 to rotate together with the support plate 240. The tabs 241B and notches 243A will be further described with reference to Figure 3. A gap 259 is formed between the reflector plate 62 and the support plate 240. The edge ring 244 rests on the adapter ring 242, and the substrate 32 (Figure 2A) rests on the lip 245 of the edge ring 244. The adapter ring 242 positions the substrate 32 (Figure 2A) at a distance (D) from the reflector plate 62. The adapter ring 242, edge ring 244, and substrate 32 move together with the support plate 240 and the pedestal 260. In the illustrated embodiment, the edge ring 244 protrudes over the edge 221 of the chamber body 20. This protrusion is advantageous because it blocks light from the lamp 46 (Figure 1), thereby improving the accuracy of the pyrometer. In some embodiments, the edge ring 244 does not protrude over the edge 221 of the chamber body 20, and light from the lamp 46 can be corrected using other means such as a filter.

[0037]

[0043] In the illustrated embodiment, the adapter ring 242 includes a feature 243B formed on or near the edge of the adapter ring 242 (for example, furthest from the central axis 133 in Figure 2A). The feature 243B may be a fin. In some embodiments, the feature 243B provides extra thermal mass. The feature 243B may be continuous or discontinuous. In some embodiments, the feature 243B is cylindrical. In some embodiments, the feature 243B is a plurality of discontinuous fins. As illustrated, the feature 243B is formed on the surface of the adapter ring 242 facing the reflector plate 62. In some embodiments, the feature 243B directs the heat emitted or reflected by the reflector plate 62 toward the substrate 32 (Figure 2A), thereby preventing heat from being lost to the surrounding chamber body 20. In some embodiments, the feature 243B shields the reflector plate 62 from the heat generated by the lamp 46 (Figure 1).

[0038]

[0044] The chamber body 20 forms an opening 134A extending from the bottom 25 of the chamber body 20 (Figure 2A) to the reflector plate 62. The reflector plate 62 forms an opening 134B aligned with the opening 134A. The lift pin 136 extends through the opening 134, as previously described with respect to Figure 1. In some embodiments, the lift pin 136 is located inside the chamber 110, so the opening 134A does not need to exist in the chamber body 20. In some embodiments, the lift pin is located between the reflector plate 62 and the rotary assembly 30, so the opening 134A or 134B does not need to exist. The lift pin 136 can be moved by an actuator (not shown) or by vertical movement of the rotary assembly 30 (as shown on the page).

[0039]

[0045] In some embodiments, a system controller 199 (Figure 2A) may rotate the pedestal 260 to align the opening 138 of the support plate 240 with the opening 134. The lift pins 136 can then be raised to receive the substrate 32 and lowered to place the substrate 32 on the edge ring 244. The lift pins 136 can also be raised to lift the substrate 32 for inspection or subsequent processing. The system controller 199 may position the pedestal 260 so that the openings 134 and 138 are not aligned. The support plate 240 can then be lifted using the lift pins 136, which is advantageous as it facilitates the removal of the support plate 240 for cleaning or replacement with another support plate 240.

[0040]

[0046] Figure 2C shows how the transport pin 266 removably connects the support plate 240 to the pedestal plate 260A. A single transport pin 266 is shown. The body 266A of the transport pin 266 is positioned in the opening 260C of the pedestal plate 260A. The peg 266B of the transport pin 266 is positioned in the opening 241A of the support plate 240. The support plate 240 rests on the lip 266C of the transport pin 266, which is formed between the body 266A and the peg 266B. A gap 259 is further formed between the pedestal plate 260A and the support plate 240. In the illustrated embodiment, the gap 259 advantageously allows for the adjustment of the pedestal 260 and / or reflector plate 62 so that the pedestal plate 260A and the reflector plate 62 are at the same height and form a flat surface 264. Therefore, the adapter ring 242 can adjust the distance (D) between the substrate 32 (Figure 2A) and the flat surface 264. In some embodiments, the gap 259 can advantageously insulate the substrate from unintended heating from the lamp 46 (Figure 1). In some embodiments, it may be desirable to minimize the gap 259 to heat the substrate 32.

[0041]

[0047] Figure 2D shows the magnetic fluid seal 279 between the pedestal shaft 260B and the pedestal housing 280. In particular, Figure 2D shows the magnetic fluid seal 279 between the pedestal sleeve 270 and the pedestal housing 280. The magnetic fluid seal 279 may also be referred to as a ferromagnetic fluid seal.

[0042]

[0048] A magnetic fluid seal 279 may be used to maintain a vacuum in the chamber 110 (Figure 1) while the pedestal 260 (Figure 2A) rotates. The magnetic fluid seal 279 includes magnets 272 nested within pole pieces 274 (shown as two pole pieces). An O-ring 275 forms a seal between the pole pieces 274 and the pedestal housing 280. The pedestal sleeve 270 includes a number of ridges 271. A gap 276 is formed between the pedestal sleeve 270, including the ridges 271, and the pole pieces 274. Magnetic fluid 278 is placed in the gap 276. The magnets 272 form magnetic field lines (not shown) through the pole pieces 274 and the ridges 271 of the pedestal sleeve 270. The magnetic field lines attract the magnetic fluid 278, forming a magnetic fluid seal 279 between the rotating pedestal sleeve 270 and the fixed pole pieces 274. Specifically, as the pedestal sleeve 270 rotates, the magnetic fluid 278 forms multiple magnetic fluid seals 279 between each ridge 271 of the ridge 271 and the corresponding pole piece 274.

[0043]

[0049] In some embodiments, the rotary assembly 30 does not include the pedestal sleeve 270. For example, the pedestal shaft 260B may include a ridge 271, and a magnetic seal may form a seal between the ridge 271 of the rotary pedestal shaft 260B and the fixed pole piece 274.

[0044]

[0050] In some embodiments, an O-ring can be used instead of the seal formed by the magnetic fluid 278.

[0045]

[0051] Figure 3 is an exploded third-dimensional view showing a chamber body 20 and a rotary assembly 30 according to several embodiments. As shown, the support plate 240 is removably engaged with the pedestal plate 260A via a transfer pin 266 that passes through the opening 241A of the support plate 240 and the opening 260C of the pedestal plate 260A. Also shown and described above with respect to Figure 2B, the notch 243A of the adapter ring 242 is removably engaged with the tab 241B of the support plate 240.

[0046]

[0052] Figures 4A and 4B are different cross-sectional views showing a rotary assembly 430 according to several embodiments. The substrate 432 is not shown in Figure 4B in order to clearly show the components of the rotary assembly 430.

[0047]

[0053] The rotary assembly 430 includes a pedestal 460 having a pedestal plate 460A and a pedestal shaft 460B. In the illustrated embodiment, a reflector plate 462 is coupled to the pedestal plate 460A and rotates with the pedestal plate 460A to form a support surface 464 that supports a support plate 440. The reflector plate 462 has a plurality of grooves 463 formed therein. The support plate 440 may have a plurality of tabs 441B formed thereon to engage with the grooves 463 of the reflector plate 462, and the support plate 440 can be removably coupled to the reflector plate 462. The grooves 463 may be continuous or discontinuous, as may the corresponding tabs 441B. The grooves 463 are useful for allowing different support plates 440 to be used with the reflector plate 462. In some embodiments, the grooves 463 are discontinuous and can be used to orient or "clock" the position of the support plate 440 relative to the reflector plate 462.

[0048]

[0054] The rotary assembly 430 further includes an edge ring 444 having at least one tab 445B. The tab 445B corresponds to and can engage with at least some of the grooves 441A of the support plate 440, enabling the edge ring 444 to be removably coupled to the support plate 440. The grooves 441A and tab 445B may be continuous or discontinuous, as previously stated. The grooves 441A are useful for allowing different edge rings 444 to be used with the support plate 440. The substrate 432 can be placed on the lip 445A of the edge ring 444.

[0049]

[0055] The rotary assembly 430 includes a number of openings 438 (e.g., openings 438A and 438B) through which lift pins 136 can be aligned and inserted to raise and lower the substrate. For example, the reflector plate 462 may include opening 438A, and the support plate 440 may include opening 438B. The system controller 199 (Figure 2A) can align the openings 438 of the rotary assembly 430 with the opening 134A of the chamber body 20, as described with respect to Figures 1, 2A, and 2B.

[0050]

[0056] While grooves and tabs have been described in relation to specific components, embodiments may also have the opposite configuration. For example, tabs on the reflector plate 462 allow the reflector plate 462 to be removably coupled to grooves on the support plate 440. Tabs on the adapter ring 242 (Figure 3) allow the adapter ring 242 to be removably coupled to notches on the support plate 240 (Figure 3).

[0051]

[0057] In some embodiments, the rotary assembly 430 may include an adapter ring (not shown) similar to the adapter ring 242 in Figure 2B, having tabs and / or grooves corresponding to grooves 463 and / or tabs 445B.

[0052]

[0058] In some embodiments, the reflector plate 462 is bonded to the pedestal plate 460A by friction. In some embodiments, the reflector plate 462 can be bonded to the pedestal plate 460A using an adhesive. In some embodiments, the reflector plate 462 and the pedestal plate 460A can be bonded using fitting features such as tabs 445B and grooves 441A.

[0053]

[0059] In some embodiments, the configuration of the rotary assembly 430 can be applied to the rotary assembly 30 described in Figures 2A to 2D. For example, the support plate 240 may have grooves 441A for receiving tabs (not shown) of the adapter ring 242 or edge ring 244.

[0054] Example of a controller for rotary assemblies

[0060] Figure 5 is a functional block diagram showing a system controller 199 for a rotary assembly (e.g., rotary assembly 30 or 430 in Figures 2A-2D and 4A-4B) of an RTP chamber (e.g., chamber 110 in Figure 1) according to one embodiment.

[0055]

[0061] The system controller 199 includes a processor 504 (e.g., a central processing unit (CPU)) that communicates data with the memory 502, the input device 506, and the output device 508. Although described separately, it should be understood that the functional blocks described with respect to the system controller 199 do not need to be separate structural elements. For example, the processor 504 and the memory 502 can be embodied on a single chip. The processor 504 may be a general-purpose processor, a digital signal processor ("DSP"), an application-specific integrated circuit ("ASIC"), a field-programmable gate array ("FPGA") or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any suitable combination thereof designed to perform the functions described herein. The processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors combined with a DSP core, or any other of the above configurations.

[0056]

[0062] The processor 504 may be coupled to read information from or write information to the memory 502 via one or more buses. The processor may additionally or alternatively include memory such as processor registers. Memory 502 may include a processor cache, which may include a multi-level hierarchical cache with different levels having different capacities and access speeds. Memory 502 may include random access memory (RAM), other volatile storage devices, or non-volatile storage devices. Storage may include hard drives, flash memory, etc. Memory 502 may also include a rotation control application 503 used to control the position of the rotating assembly 30 or 430, as shown in Figures 1, 2A-2D, and 4A-4B. The rotation control application 503 may be code that can be executed by the processor 504. In various cases, memory is referred to as a computer-readable storage medium. A computer-readable storage medium is a non-transient device that can store information and is distinguished from computer-readable transmission media such as transient electronic signals that can carry information from one place to another. A non-transient computer-readable medium, when executed by a processing system, includes a computer-executable instruction causing the processing system to perform a method including, as described with reference to Figure 6, placing a substrate on the edge ring of a rotary assembly; rotating the rotary assembly around the central axis of the heat treatment chamber from a first position around the central axis to a second position around the central axis; rotating the substrate plate together with the pedestal; forming a magnetic seal to maintain a vacuum in the heat treatment chamber; and heating the substrate. The computer-readable medium described herein may generally refer to a computer-readable storage medium or a computer-readable transmission medium.

[0057]

[0063] The processor 504 may also be coupled to an input device 506 and an output device 508, respectively, for receiving input from the user of the system controller 199 and providing output to the user. Suitable input devices include, but are not limited to, keyboards, buttons, keys, switches, pointing devices, mice, joysticks, remote controls, infrared detectors, barcode readers, scanners, video cameras (which may be coupled with video processing software to detect hand or facial gestures, for example), motion detectors, or microphones (which may be coupled with voice processing software to detect voice commands, for example). The input device 506 includes position sensors as described with respect to Figures 1 and 2A to 2D. Suitable output devices include, but are not limited to, a motor 268 as described with respect to Figure 2A, as well as visual output devices including displays and printers, audio output devices including speakers, headphones, earphones, and alarms, additive manufacturing machines, and tactile output devices.

[0058] Examples of how to use rotary assemblies

[0064] Figure 6 is a flowchart illustrating a method 600 for using a rotary assembly in an RTP chamber according to one embodiment. Method 600 can be performed in any suitable processing chamber, such as the chamber 110 described with respect to Figures 1 to 2. Chamber 110 includes the rotary assembly 30 or 430 shown in Figures 1 to 4.

[0059]

[0065] In step 602, method 600 includes placing a substrate on the edge ring of a rotary assembly, as described above with respect to Figures 1 to 4. In some embodiments of method 600, the rotary assembly includes an edge ring that is removably coupled to a substrate support plate through an adapter ring. The edge ring is configured to support the substrate.

[0060]

[0066] In step 604, method 600 includes rotating a rotary assembly around the axis of the heat treatment chamber from a first position around the axis to a second position around the axis, as described above with respect to Figures 1, 2A, 2D, and 4A. In some embodiments of method 600, the rotary assembly includes a pedestal having a pedestal shaft and a pedestal plate. The pedestal plate is coupled to the end of the pedestal shaft, and the pedestal shaft extends outside the heat treatment chamber. In some embodiments of method 600, the rotary assembly includes a substrate support plate detachably coupled to the pedestal plate. The substrate support plate rotates with the pedestal as part of the rotary assembly. In some embodiments of method 600, a magnetic fluid seal is formed to maintain a vacuum inside the heat treatment chamber.

[0061]

[0067] In step 606, method 600 includes heating the substrate as described above with respect to Figures 1 to 4. Heating the substrate may be performed before, during, or after the rotation of the rotary assembly in step 604.

[0062]

[0068] In some embodiments, the lamp assembly heats a first surface of the substrate. In some embodiments, a reflector plate absorbs heat from the lamp assembly and radiates heat toward a second surface of the substrate. Some embodiments further include lifting the substrate using a plurality of lift pins when the rotary assembly is in a first position. Some embodiments further include lifting the substrate support plate using a plurality of lift pins when the rotary assembly is in a third position about an axis.

[0063]

[0069] Figure 6 is merely one example of a method, and it should be noted that other methods, including fewer, additional, or alternative blocks, are possible in accordance with this disclosure.

[0064]

[0070] Embodiments of this disclosure have been described above with reference to specific embodiments. However, those skilled in the art will understand that various modifications and changes can be made to them without departing from the broader spirit and scope of the invention as set forth in the appended claims. Accordingly, the foregoing description and drawings should be interpreted as illustrative rather than restrictive.

Claims

1. A heat treatment chamber, A rotary assembly configured to rotate around the axis of the heat treatment chamber, A rotary pedestal comprising a pedestal shaft and a pedestal plate, wherein the pedestal plate is coupled to the end of the pedestal shaft, the pedestal shaft extends outside the heat treatment chamber, and the pedestal shaft is located in a pedestal housing coupled to the heat treatment chamber; A substrate support plate is removably coupled to the pedestal plate. A rotary assembly including, A magnetic fluid seal disposed between the pedestal shaft and the pedestal housing, configured to maintain a vacuum in the heat treatment chamber. A heat treatment chamber equipped with the following features.

2. The heat treatment chamber according to claim 1, further comprising a plurality of lift pins configured to lift a substrate when the rotary assembly is in a first position about a central axis.

3. The substrate support plate has a first plurality of openings, The plurality of lift pins are configured to extend through the first plurality of openings when the plurality of lift pins lift the substrate. The heat treatment chamber according to claim 2.

4. The heat treatment chamber according to claim 3, wherein the plurality of lift pins are configured to lift the substrate support plate when the rotary assembly is in a second position about the central axis.

5. The heat treatment chamber according to claim 4, further comprising a system controller configured to control the rotation of the rotary assembly about the central axis, wherein the system controller is configured to move the rotary assembly from a third position about the central axis to a first position.

6. The heat treatment chamber according to claim 5, wherein the system controller is configured to receive data from a rotation sensor.

7. The heat treatment chamber according to claim 1, wherein the pedestal shaft is positioned in a pedestal sleeve configured to rotate the pedestal.

8. The heat treatment chamber according to claim 1, further comprising a motor configured to rotate the pedestal shaft.

9. The heat treatment chamber according to claim 8, wherein the motor is configured to rotate the pedestal sleeve.

10. The heat treatment chamber according to claim 7, wherein the magnetic fluid seal is formed around the pedestal sleeve.

11. The heat treatment chamber according to claim 1, further comprising a reflector plate disposed within the heat treatment chamber, wherein the reflector plate surrounds the pedestal shaft.

12. The heat treatment chamber according to claim 11, wherein the reflector plate has a channel formed therein, and the channel is configured to be connected to a cooling device.

13. The heat treatment chamber according to claim 11, wherein the reflector plate includes a plurality of resistance heating heaters disposed therein, the resistance heating heaters being configured to heat a substrate.

14. The heat treatment chamber according to claim 1, wherein the pedestal plate has a channel formed therein, and the channel is configured to be connected to a cooling device.

15. The heat treatment chamber according to claim 1, wherein a plurality of transfer pins detachably connect the substrate support plate to the pedestal plate.

16. The heat treatment chamber according to claim 1, further comprising an edge ring detachably coupled to the substrate support plate via an adapter ring, wherein the edge ring is configured to support the substrate.

17. A rotary assembly configured to rotate around the axis of a heat treatment chamber, A pedestal comprising a pedestal shaft and a pedestal plate, wherein the pedestal shaft is located within a pedestal housing, A reflector plate coupled to the pedestal plate, the reflector plate having a first set of features formed therein, A substrate support plate that is detachably coupled to the reflector plate, The second set of features formed within it, A third plurality of features formed therein and configured to be coupled to at least a portion of the first plurality of features, A substrate support plate including, A magnetic fluid seal is disposed between the pedestal shaft and the pedestal housing. A rotary assembly equipped with a rotary assembly.

18. The substrate support plate further comprises an edge ring that is detachably coupled to the substrate support plate, and the edge ring is At least one tab configured to be coupled with at least a portion of the second plurality of features, Lip configured to support the substrate and The rotary assembly according to claim 17, including the following:

19. The rotary assembly according to claim 17, further comprising a motor configured to rotate the pedestal shaft.

20. A heat treatment chamber, A rotary assembly configured to rotate about the central axis of the heat treatment chamber, A pedestal comprising a pedestal shaft and a pedestal plate, wherein the pedestal shaft is located within a pedestal housing, A reflector plate coupled to the pedestal plate, the reflector plate having a first set of features formed therein, A substrate support plate that is detachably coupled to the reflector plate, The second set of features formed within it, A third plurality of features formed therein and configured to be coupled to at least a portion of the first plurality of features, A substrate support plate including, An edge ring removably coupled to the substrate support plate, the edge ring comprising at least one tab configured to couple with at least a portion of the second plurality of features, and a lip configured to support the substrate. Rotary assemblies including, A magnetic fluid seal configured to be positioned between the pedestal shaft and the pedestal housing, A plurality of lift pins arranged in a first plurality of openings formed by the heat treatment chamber, The rotary assembly is configured to be positioned in a second plurality of openings formed by the reflector plate and a third plurality of openings formed by the substrate support plate when the rotary assembly is in a first position about the central axis, A lift pin is configured to lift the substrate support plate when the rotary assembly is in a second position about the central axis. A heat treatment chamber equipped with the following features.

Images