Work head

Abstract

Provided is a work head that performs work on a substrate in a substrate working machine, the work head comprising an LED package that is used in an imaging device, wherein the LED package is selectively lit in a first mode in which the LED package is lit when image capture is performed by the imaging device, and a second mode in which the LED package is lit when image capture is not performed by the imaging device.

Description

Technical Field

[0001] The present invention relates to a working head that performs operations on a substrate in a substrate-facing working machine.

Background Art

[0002] The following patent document describes that when the brightness of an LED package decreases due to gas that has entered the encapsulating resin of the LED package, the LED package is lit in a predetermined environment to restore the brightness of the LED package.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] This specification aims to restore the brightness of an LED package in a working head having the LED package.

Means for Solving the Problems

[0005] To solve the above problems, this specification provides a working head that performs operations on a substrate in a substrate-facing working machine, has an LED package used in an imaging device, and selectively lights the LED package in a first mode in which the LED package lights up when imaging is performed by the imaging device and a second mode in which the LED package lights up when imaging is not performed by the imaging device. Furthermore, the LED package lights up in the first mode when the work head is installed in the board-to-board work machine, and lights up in the second mode when the work head is removed from the board-to-board work machine. A working head that lights is disclosed.

Effects of the Invention

[0006] In this disclosure, the work head has an LED package used in an imaging device, and the LED package is selectively illuminated in a first mode in which imaging is performed by the imaging device, and a second mode in which the LED package is illuminated when imaging is not performed by the imaging device. As a result, imaging is performed by illuminating the LED package in the first mode, and the brightness of the LED package can be restored by illuminating the LED package in the second mode. [Brief explanation of the drawing]

[0007] [Figure 1] This is a perspective view showing a circuit board work system. [Figure 2] This is a perspective view showing the mounting device. [Figure 3] This is a schematic diagram showing the mounting head. [Figure 4] This is a perspective view showing an LED package. [Figure 5] Control device branch. [Figure 6] This is a schematic diagram showing the mounting head of the second embodiment. [Modes for carrying out the invention]

[0008] Hereinafter, embodiments of the present invention will be described in detail with reference to the figures, as embodiments for carrying out the present invention.

[0009] Figure 1 shows the board-to-board assembly system 10. The board-to-board assembly system 10 shown in Figure 1 is a system for producing circuit boards with mounted electronic components. The board-to-board assembly system 10 consists of three electronic component mounting devices (hereinafter sometimes abbreviated as "mounting devices") 12 arranged adjacent to each other, and a reflow oven 16.

[0010] The mounting device 12 consists of one system base 20 and two electronic component mounting machines (hereinafter sometimes abbreviated as "mounting machines") 22 arranged adjacent to each other on the system base 20. In other words, six mounting machines 22 are arranged in a row. When distinguishing between the six mounting machines 22, they may be referred to as the 1st to 6th mounting machines 22, starting from the mounting machine 22 located furthest upstream and moving towards the mounting machine 22 located furthest downstream.

[0011] Furthermore, the reflow oven 16 is located downstream of the sixth mounting machine 22, which is the mounting machine 22 located furthest downstream of the six mounting machines 22. Incidentally, in the following explanation, the direction in which the mounting machines 22 and the reflow oven 16 are aligned will be referred to as the X-axis direction, and the horizontal direction perpendicular to that direction will be referred to as the Y-axis direction.

[0012] First, let's describe the mounting device 12. Since the three mounting devices 12 have substantially the same configuration, we will describe one of the three mounting devices 12 as a representative example. As shown in Figure 2, the mounting device 12 has one system base 20 and two mounting machines 22 adjacent to each other on the system base 20. Each mounting machine 22 mainly consists of a mounting machine body 24, a conveying device 26, a mounting head moving device (hereinafter sometimes abbreviated as "moving device") 28, a mounting head 30, and a supply device 32.

[0013] The mounting unit body 24 consists of a frame 36 and a beam 38 mounted on the frame 36.

[0014] The conveying device 26 comprises two conveyor devices 40 and 42. These two conveyor devices 40 and 42 are arranged on the frame 36 so as to be parallel to each other and extending in the X-axis direction. Each of the two conveyor devices 40 and 42 conveys the circuit boards supported by each conveyor device 40 and 42 in the X-axis direction by an electromagnetic motor (see Figure 5) 44. The circuit boards conveyed by each conveyor device 40 and 42 are then held in a predetermined position by a board holding device (see Figure 5) 46.

[0015] The mobile device 28 is an XY robot type mobile device. The mobile device 28 is equipped with an electromagnetic motor (see Figure 5) 52 that slides the slider 50 in the X-axis direction and an electromagnetic motor (see Figure 5) 54 that slides it in the Y-axis direction. A mounting head 30 is attached to the slider 50, and the mounting head 30 moves to any position on the frame 36 by the operation of the two electromagnetic motors 52 and 54. The mounting head 30 can be attached to and detached from the slider 50 with a single touch by the operator without the use of tools.

[0016] The mounting head 30 is used to mount electronic components onto a circuit board. As shown in Figure 3, the mounting head 30 has a suction nozzle 60 located in the center of its lower end surface. The suction nozzle 60 is connected to a positive / negative pressure supply device (see Figure 5) 62 via negative pressure air and positive pressure air passages. The suction nozzle 60 attracts and holds electronic components using negative pressure and releases the held electronic components using positive pressure. The mounting head 30 also has a nozzle lifting device (see Figure 5) 64 that raises and lowers the suction nozzle 60. The nozzle lifting device 64 allows the mounting head 30 to change the vertical position of the held electronic components. Furthermore, the mounting head 30 has an illumination device 66 and an imaging device 68 arranged on its lower end surface, sandwiching the suction nozzle 60. The illumination device 66 has a built-in LED package 70, which is positioned on the lower end surface of the mounting head 30 with the LED package 70 facing the tip of the suction nozzle 60. Furthermore, the imaging device 68 is positioned opposite the illumination device 66, with the suction nozzle 60 at its center. As a result, the electronic components held by the suction nozzle 60 are illuminated by the LED package 70 of the illumination device 66 and then imaged by the imaging device 68. The mounting head 30 has a control device (see Figure 5) 72, which controls the operation of the nozzle lifting device 64, the illumination device 66, and the imaging device 68.

[0017] Incidentally, as shown in FIG. 4, the LED package 70 is composed of a package substrate 74, a pair of lead frames 76 and 78, an LED element 80, and a sealing resin 82. The package substrate 74 generally has a longitudinal shape, and a pair of lead frames 76 and 78 are disposed at both longitudinal ends of the package substrate 74. The LED element 80 is fixed to one of the pair of lead frames 76, and the other lead frame 78 and the LED element 80 are connected by a wire 84. Then, the LED element 80 fixed to the lead frame 76 and the wire 84 connecting the lead frame 78 and the LED element 80 are covered with the sealing resin 82.

[0018] Also, as shown in FIG. 2, the supply device 32 is a feeder-type supply device and is disposed at the end of the frame 36. The supply device 32 has a plurality of tape feeders 86. The tape feeder 86 accommodates the taped parts in a wound state. The taped parts are those in which electronic components are taped on a carrier tape. Then, the tape feeder 86 feeds out the taped parts by a feeding device (see FIG. 5) 88. Thereby, the feeder-type supply device 32 supplies the electronic components at the supply position by feeding out the taped parts.

[0019] The reflow furnace 16 is a device that heats the circuit board with the electronic components mounted thereon to melt the cream solder and then fixes the electronic components on the circuit board. The reflow furnace 16 is connected to the mounting machine 22 disposed at the most downstream of the six mounting machines 22, that is, the sixth mounting machine 22. The reflow furnace 16 includes conveyor devices 90 and 92 having the same structure as the conveyor devices 40 and 42 of the mounting machine 22. The conveyor device 90 of the reflow furnace 16 is connected to the conveyor device 40 of the sixth mounting machine 22, and the conveyor device 92 of the reflow furnace 16 is connected to the conveyor device 42 of the sixth mounting machine 22. Further, the reflow furnace 16 includes a heater (see FIG. 5) 96 that heats the circuit board conveyed by each of the conveyor devices 90 and 92.

[0020] In addition, as shown in FIG. 5, the substrate processing system 10 includes a control device 100. The control device 100 includes a controller 102, and the controller 102 is connected to the transport device 26, the moving device 28, the mounting head 30, the tape feeder 86, and the reflow furnace 16 of the mounter 22. The controller 102 includes a CPU, a ROM, a RAM, etc., and is mainly a computer. Thus, the operations of the transport device 26, the moving device 28, the mounting head 30, the tape feeder 86, and the reflow furnace 16 of the mounter 22 are controlled by the controller 102. Note that a production program 110 is stored in the controller 102, and the controller 102 produces a circuit board by controlling the operations of the mounter 22 and the reflow furnace 16 according to the production program 110.

[0021] Specifically, first, when the circuit board is loaded into the first mounting machine 22, the controller 102 outputs a command according to the production program 110, causing the transport device 26 of the first mounting machine 22 to transport the circuit board to the work position and hold it there in a fixed position. The tape feeder 86 also feeds out tape-formed components according to a command from the controller 102 in accordance with the production program 110, supplying electronic components to the supply position. Then, the mounting head 30 moves above the supply position of the electronic components according to a command from the controller 102 in accordance with the production program 110, and the suction nozzle 60 picks up and holds the electronic components. Subsequently, the mounting head 30 lights up the LED package 70 according to a command from the controller 102 in accordance with the production program 110, and images the electronic components held by the suction nozzle 60. The controller 102 then calculates the holding position, holding orientation, etc., of the electronic components based on the image data. Next, the mounting head 30 moves above the circuit board in accordance with the production program 110, as instructed by the controller 102, and mounts the electronic components it is holding onto the circuit board. At this time, the orientation and posture of the electronic components held by the suction nozzle 60 are corrected based on the calculated holding position and posture of the electronic components, and the electronic components are mounted onto the circuit board. When the mounting of electronic components onto the circuit board is completed in the first mounting machine 22, the transport device 26 transports the circuit board downstream in accordance with the production program 110, as instructed by the controller 102. The circuit board is then transported to the second mounting machine 22.

[0022] Subsequently, the same operations as those performed in the first mounting machine described above are carried out sequentially in the second to sixth mounting machines, completing the mounting of electronic components onto the circuit board. When the mounted circuit board is brought into the reflow oven 16, the conveyor devices 90 and 92 of the reflow oven 16 transport the circuit board to the work position and hold it there in place, according to a command from the controller 102 in accordance with the production program 110. Next, according to a command from the controller 102 in accordance with the production program 110, the heater 96 heats the circuit board and melts the solder paste, fixing the electronic components onto the circuit board. Then, according to a command from the controller 102 in accordance with the production program 110, the conveyor devices 90 and 92 transport the circuit board downstream. As a result, the circuit board is removed from the reflow oven 16, and the circuit board is produced.

[0023] In this way, the circuit board is produced in the board assembly system 10 by mounting electronic components in the mounting machine 22 and heating solder paste in the reflow oven 16. However, when the solder paste is heated in the reflow oven 16, VOCs (Volatile Organic Compounds) are generated, and there is a risk that the brightness of the LED package 70 on the mounting head 30 in the mounting machine 22 will decrease due to the VOCs. Specifically, silicone resin is used as the sealing resin 82 of the LED package 70, and since silicone resin is permeable to gases, VOCs penetrate into the sealing resin 82 of the LED package 70. When the LED package 70 is lit with VOCs inside the sealing resin 82, the VOCs inside the sealing resin 82 change and change color. As a result, the transmittance of the sealing resin 82 decreases, and the brightness of the LED package 70 decreases.

[0024] In light of these circumstances, the controller 102 of the control device 100 stores a brightness recovery program 120, and the controller 102 recovers the brightness of the LED package 70 according to the brightness recovery program 120. Specifically, when the LED package 70 is lit in an environment with low VOCs, the components that caused the discoloration of the encapsulating resin 82 are released from the encapsulating resin 82, and the brightness of the LED package 70 is recovered. Furthermore, during mounting operations in the substrate work system 10, the reflow oven 16 is in operation, and the concentration of VOCs in the substrate work system 10 is considered to be high. For this reason, when non-mounting operations are not being performed in the substrate work system 10, that is, when no work is being performed on the circuit board, the brightness recovery operation of the LED package 70 is performed according to the brightness recovery program 120.

[0025] In detail, the brightness recovery program 120 outputs a lighting command to the mounting head 30 for the LED package 70 when no work is being performed on the circuit board. Of the six mounting machines 22, the fifth and sixth mounting machines, located closer to the reflow oven 16, have high VOC concentrations, resulting in a significant decrease in the brightness of the LED package 70. Therefore, the brightness recovery program 120 outputs lighting commands to the mounting heads 30 of the fifth and sixth mounting machines. Upon receiving the lighting command, the mounting head 30's control device 72 controls the operation of the LED package 70, thereby lighting it up. In this way, by lighting the LED package 70 on the mounting heads 30 of the fifth and sixth mounting machines, which are adjacent to the reflow oven 16, when no work is being performed on the circuit board, it is possible to recover from the decrease in the brightness of the LED package 70 caused by VOCs emitted from the reflow oven 16.

[0026] When the LED package 70 is lit when no work is being performed on the circuit board, the suction nozzle 60 naturally does not hold the electronic components. Therefore, even if the LED package 70 is lit when no work is being performed on the circuit board, imaging by the imaging device 68 will not be performed. In other words, when the LED package 70 is lit for the purpose of restoring its brightness, the LED package 70 lights up in the mode in which the LED package 70 lights up when imaging by the imaging device 68 is not being performed. On the other hand, when the LED package 70 is lit when work is being performed on the circuit board, the suction nozzle 60 holds the electronic components, and imaging by the imaging device 68 is performed. In other words, when the LED package 70 is lit for the purpose of imaging the electronic components, the LED package 70 lights up in the mode in which the LED package 70 lights up when imaging by the imaging device 68 is being performed. Thus, the LED package 70 selectively lights up in a first mode in which the LED package 70 lights up when imaging is being performed, and a second mode in which the LED package 70 lights up when imaging is not being performed. In other words, the LED package 70 selectively lights up in two modes: a first mode in which the LED package 70 lights up when a component is held by the suction nozzle 60, and a second mode in which the LED package 70 lights up when the electronic component is not held by the suction nozzle 60. In yet another way, the LED package 70 selectively lights up in two modes: a first mode in which the LED package 70 lights up for the purpose of imaging the electronic component, and a second mode in which the LED package 70 lights up for the purpose of restoring the brightness of the LED package 70. In this way, by selectively lighting up the LED package 70 in the first and second modes, it becomes possible to restore the brightness of the LED package 70 used for imaging.

[0027] The LED package 70 may be lit continuously or intermittently. Intermittent lighting involves repeated cycles of lighting and extinguishing, which is known as blinking. Intermittent lighting of the LED package 70 can reduce damage to the LED package 70 due to high temperatures. The timing at which a lighting command for the LED package 70 is output when no work is being performed on the circuit board is when the circuit board being produced is changed, for example, during setup changes, or when the factory where the circuit board work system 10 is installed is not in operation, for example, at night. The lighting command may also be output at a predetermined interval, for example, daily, or when a decrease in the brightness of the LED package 70 is detected. A method for checking the decrease in the brightness of the LED package 70 is to light up the LED package 70 when no work is being performed on the circuit board and take an image using the imaging device 68. At this time, since the electronic components are not held by the suction nozzle 60, the light irradiated by the LED package 70 is captured by the imaging device 68. Next, brightness, saturation, etc., are calculated based on the imaging data obtained from the imaging, and the luminance of the LED package 70 is estimated. If the estimated luminance is below a threshold, it is determined that the luminance of the LED package 70 has decreased, and a command to turn on the LED package 70 is output. However, if the luminance recovery operation of the LED package 70 is performed after the luminance of the LED package 70 has decreased below the threshold, the time required for the luminance recovery operation may be considerably long. Therefore, by outputting a turning-on command at a predetermined interval, it is possible to prevent the decrease in the luminance of the LED package 70.

[0028] Furthermore, the brightness recovery program 120 can also output a command to turn on the LED package 70 at a pre-booked time. In other words, the operator sets a time in the brightness recovery program 120 when it is assumed that no work is being performed on the circuit board. The brightness recovery program 120 then outputs a command to turn on the LED package 70 at the set time. This allows the brightness recovery work on the LED package 70 to be performed at the time desired by the operator.

[0029] Furthermore, solder paste and silver paste used in the production of circuit boards are also cited as sources of VOCs. In other words, the solvents contained in solder paste and silver paste volatilize, becoming VOCs. Therefore, if a large amount of solder paste or silver paste is used in the circuit board being produced, as mentioned above, the lighting command for the LED package 70 will be output not only to the 5th and 6th mounting machines, but to all of the 1st through 6th mounting machines.

[0030] More specifically, the brightness recovery program 120 identifies the type of circuit board to be produced based on the production program 110. The circuit board to be produced is the circuit board produced by the board-to-board work system 10 in the mode in which the LED package 70 lights up when imaging is performed by the imaging device 68, that is, in the first mode when the LED package 70 lights up. As mentioned above, the production program 110 is a program for producing circuit boards, so the brightness recovery program 120 can identify the type of circuit board to be produced based on the production program 110. The brightness recovery program 120 then determines whether or not paste solder, silver paste, etc. are used in large quantities in the identified type of circuit board. In this case, for example, information indicating the type of circuit board that uses paste solder, silver paste, etc. in large quantities may be programmed into the brightness recovery program 120, and the brightness recovery program 120 may determine whether or not the type of circuit board to be produced uses paste solder, silver paste, etc. in large quantities based on that information. Furthermore, if the amount of solder paste, silver paste, etc. used in the circuit board identified based on the production program 110 can be estimated, the type of circuit board to be produced may be determined to be a circuit board that uses a large amount of solder paste, silver paste, etc. if the estimated amount of use is above a threshold. If it is determined that the type of circuit board to be produced is a circuit board that uses a large amount of solder paste, silver paste, etc., the brightness recovery program 120 outputs a lighting command for the LED package 70 to all of the 1st to 6th mounting machines. This makes it possible to recover the brightness reduction of the LED package 70 caused by VOCs generated from the solder paste, silver paste, etc. by performing brightness recovery work after the work on the circuit board that uses a large amount of solder paste, silver paste, etc. has been performed. In particular, the lighting device 66 including the LED package 70 is located on the lower end surface of the mounting head 30, and the LED package 70 comes close to the upper surface of the circuit board during the mounting work, so the impact of VOCs generated from the solder paste, silver paste, etc. on the LED package 70 is significant.Considering this, performing brightness restoration work after work has been done on circuit boards that use a large amount of solder paste, silver paste, etc., makes it possible to restore the brightness of the LED package 70 at an appropriate timing.

[0031] Furthermore, the brightness recovery operation is initiated based on a lighting command for the LED package 70, but ends when the brightness of the LED package 70 is restored. Specifically, the LED package 70 lights up when the suction nozzle 60 is not holding any electronic components, and at that time, the light from the LED package 70 is captured by the imaging device 68, allowing the brightness of the LED package 70 to be estimated based on the captured data. For this reason, while the brightness recovery operation is being performed, imaging is performed by the imaging device 68 at predetermined intervals. Note that the imaging by the imaging device 68 during the brightness recovery operation is for the purpose of estimating the brightness, not for the purpose of capturing electronic components. Each time imaging is performed by the imaging device 68, the brightness is estimated based on the captured data, and it is determined whether the estimated brightness exceeds a threshold. If it is determined that the estimated brightness exceeds the threshold, the brightness recovery operation ends. Note that the brightness recovery operation may also end after being performed for a predetermined time, regardless of whether the brightness of the LED package 70 has been restored.

[0032] Furthermore, in the first embodiment described above, the brightness recovery operation is performed when the mounting head 30 is mounted inside the mounting machine 22, whereas in the second embodiment, the brightness recovery operation is performed when the mounting head 30 is removed from the mounting machine 22. Specifically, as described above, the mounting head 30 is detachable from the slider 50 of the moving device 28. Therefore, it is possible to remove the mounting head 30 from the slider 50 and take the mounting head 30 outside the mounting machine 22. Also, outside the mounting machine 22, the VOC concentration is usually low unless it is close to the substrate work system 10. Therefore, the brightness recovery operation is performed when the mounting head 30 is removed from the mounting machine 22. As shown in Figure 6, the mounting head 30 in which the brightness recovery operation is performed when it is removed from the mounting machine 22 has a brightness recovery program 150 stored in the control device 72 of the mounting head 30. Also, since the mounting head 30 does not have a built-in battery, the mounting head 30 that has been removed from the mounting machine 22 is connected to the power supply 160.

[0033] In this manner, with the mounting head 30 removed from the mounting machine 22 and connected to the power supply 160, the brightness recovery operation is performed according to the brightness recovery program 150. Specifically, when the brightness recovery program 150 detects the removal of the mounting head 30 from the slider 50 and power is supplied to the mounting head 30 by connecting it to the power supply 160, the brightness recovery program 150 outputs a lighting command to the LED package 70. Naturally, outside the mounting machine 22, the suction nozzle 60 does not hold any components, and the imaging device 68 does not image any components when the LED package 70 is lit. Therefore, the LED package 70 lights up in the second mode, and the imaging device 68 does not image. In this way, with the mounting head 30 removed from the mounting machine 22, the brightness of the LED package 70 can be suitably recovered by lighting up in the second mode. Furthermore, since the brightness recovery operation is performed outside the mounting machine 22, it is possible to recover the brightness of the LED package 70 without stopping the mounting operation in the substrate work system 10.

[0034] Note that the mounting machine 22 is an example of a substrate work machine. The mounting head 30 is an example of a work head. The imaging device 68 is an example of an imaging device. The LED package 70 is an example of an LED package. The production program 110 is an example of a program.

[0035] Furthermore, the present invention is not limited to the above embodiments, and can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiments, the brightness recovery operation is performed according to the brightness recovery programs 120 and 150, but the brightness recovery operation may also be performed by user operation. For example, operation buttons may be provided on the operation panel of the mounting machine 22, the mounting head 30, the control device 100, etc., and the brightness recovery operation may be performed by operating these operation buttons. Moreover, the operation is not limited to operation buttons, and the brightness recovery operation may also be performed by an operator inputting a lighting command for the LED package. It is desirable that, if an operation button is operated or a lighting command is input by an operator while work is being performed on the circuit board, the operation or input should be canceled and the brightness recovery operation should not be performed.

[0036] Furthermore, in the above embodiment, the LED package 70 shines light toward the tip of the suction nozzle 60 that is the object to be imaged. However, the object to be imaged is not limited to electronic components held by the suction nozzle 60, and various objects can be used as the object to be imaged. For example, if a circuit board is the object to be imaged, the LED package 70 shines light toward the circuit board.

[0037] Furthermore, although the present invention is applied to the mounting head 30 in the above embodiment, the present invention may also be applied to various work heads such as inspection heads and discharge heads.

[0038] Furthermore, in the first embodiment described above, the brightness recovery program 120 identifies the type of circuit board to be produced based on the production program 110, but the type of circuit board to be produced may be obtained from a host computer, cloud, or the like.

[0039] Furthermore, in the first embodiment described above, the brightness restoration work is performed when the type of circuit board to be produced is a circuit board that uses a lot of solder paste, silver paste, etc. However, the brightness restoration work may also be performed when the type of circuit board to be produced is a specific other type of circuit board. Examples of other specific types of circuit boards include circuit boards that are processed using materials containing VOCs.

[0040] Furthermore, in the first embodiment described above, the brightness restoration work is performed by a mounting machine 22 installed near the reflow oven 16. However, the brightness restoration work may also be performed by a mounting machine 22 installed near a work machine other than the reflow oven 16, for example, a solder printing machine.

[0041] Furthermore, in the first embodiment described above, the brightness recovery program 120 is stored in the control device 100, but the brightness recovery program 120 may also be stored in the mounting head 30.

[0042] Furthermore, in the second embodiment described above, the mounting head 30 removed from the mounting machine 22 is connected to the power supply 160 to perform the brightness recovery operation. However, it may also be connected to a maintenance unit, cleaner unit, etc., to perform the brightness recovery operation. This allows the brightness recovery operation to be performed along with maintenance or cleaning of the mounting head 30. Also, when the mounting head 30 is connected to a maintenance unit, cleaner unit, etc., to perform the brightness recovery operation, the brightness recovery program 150 may be stored in the maintenance unit, etc., rather than in the mounting head 30. [Explanation of symbols]

[0043] 22: Mounting machine (machine for working on substrates) 30: Mounting head (working head) 68: Imaging device 70: LED package 110: Production program (program)

Claims

[Claim 1] A work head for performing work on a circuit board in a circuit board work machine, The LED package is used in an imaging device, and the LED package is selectively illuminated in a first mode in which the LED package lights up when imaging is performed by the imaging device, and in a second mode in which the LED package lights up when imaging is not performed by the imaging device. A work head in which the LED package lights up in the first mode when the work head is installed in the board-to-board work machine, and the LED package lights up in the second mode when the work head is removed from the board-to-board work machine.

Images