Probe device
The probe device addresses miniaturization challenges by using insulating members to cover and space conductive wires, enhancing resistance to external forces and improving manufacturing efficiency.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- NIHON KOHDEN CORP
- Filing Date
- 2025-07-07
- Publication Date
- 2026-07-22
AI Technical Summary
Existing probe devices face challenges in miniaturization while maintaining resistance to external forces, particularly due to close proximity of conductive wires caused by environmental forces.
The probe device incorporates an insulating member to cover conductive wires closer to the tip, preventing contact between adjacent wires, and arranges wires with wider spacing towards the tip, enhancing resistance to external forces.
This configuration achieves miniaturization while increasing resistance to environmental forces, reducing material costs, and improving manufacturing efficiency by integrating the insulating member with the covering material.
Smart Images

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Abstract
Description
Technical Field
[0001] The present invention relates to a probe device provided with a sensor including at least one element. The present invention also relates to a method for manufacturing the probe device.
Background Art
[0002] Patent Document 1 discloses a probe device for acquiring biological information. The probe device includes a sensor including a light-emitting element and a light-receiving element. The light emitted from the light-emitting element is detected by the light-receiving element after interacting with a living body. Biological information is acquired based on the received light intensity. The probe device includes a plurality of conductive pads electrically connected to the sensor and a plurality of conductive lines through which signals used for the sensor flow. Each of the plurality of conductive lines is connected to a corresponding one of the plurality of conductive pads.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] An object of the present invention is to meet the demand for miniaturization of the probe device while enhancing the resistance to external forces applied from the environment.
Means for Solving the Problems
[0005] One aspect for achieving the above object is a probe device, comprising: a sensor including at least one element; a plurality of conductive lines each having a connection portion electrically connected to the sensor and through which signals used for the sensor flow; An insulating member, which is electrically insulating, covers at least one of the plurality of conductive wires at a position closer to the tip than the connection portion, It is equipped with.
[0006] To meet the demand for miniaturization of probe devices, the diameter of conductive wires tends to be thin, and the spacing between adjacent conductive wires tends to be narrow. In such situations, external forces applied to the probe device from the environment may cause adjacent conductive wires to come into unexpected close proximity. With the above configuration, contact between conductive wires is prevented by the insulating material, thus meeting the demand for miniaturization of the probe device while increasing resistance to external forces applied from the environment.
[0007] One embodiment for achieving the above objective is a probe device, A sensor including at least one element, Each has a connection part through which an electrical connection is made with the sensor, and a plurality of conductive wires through which signals used in the sensor flow, It is equipped with, The adjacent plurality of conductive wires are arranged such that the spacing between them at a position closer to the tip than the connection point is wider than the spacing between them at a position further from the tip than the connection point.
[0008] To meet the demand for miniaturization of probe devices, there is a tendency to use cables with narrower spacing between adjacent conductive wires. However, with the above-described configuration, where the spacing between adjacent conductive wires widens towards the tip of each wire, contact between conductive wires caused by external forces from the environment can be suppressed even when using such cables. Therefore, it is possible to meet the demand for miniaturization of probe devices while increasing their resistance to external forces from the environment.
[0009] One embodiment for achieving the above objective is a method for manufacturing a probe device, Prepare a number of conductive wires, each covered with an electrically insulating covering material. By leaving the first portion of the covering member closer to the tip of at least one of the plurality of conductive wires, and removing the second portion of the covering member further away from the tip, an exposed portion is formed in which the at least one conductive wire is exposed. The exposed portion is electrically connected to a sensor that includes at least one element.
[0010] When a probe device according to each of the above embodiments is manufactured using a conductive wire covered with a covering member, a step is required to remove a portion of the covering member to form an exposed portion where the conductive wire is exposed for electrical connection. Through this step, another portion of the covering member remaining is used as an insulating member, thus reducing waste material. Furthermore, since the step of preparing an insulating member as a separate component and attaching it to the conductive wire is eliminated, not only is an increase in material costs suppressed, but the manufacturing efficiency of the probe device can also be improved. [Brief explanation of the drawing]
[0011] [Figure 1] The appearance of a probe device according to one embodiment is shown. [Figure 2] Figure 1 illustrates the probe device attached to the subject's fingertip. [Figure 3] Figure 1 illustrates the electrical connection between the optical sensor and the cable in the probe device. [Figure 4] Figure 3 illustrates a method for electrically connecting the optical sensor and cable. [Figure 5] Figure 3 illustrates the detailed configuration of the parts where electrical connections are made. [Modes for carrying out the invention]
[0012] An example of an embodiment will be described in detail below with reference to the attached drawings.
[0013] FIG. 1 illustrates the appearance of a probe device 10 according to an embodiment. The probe device 10 includes an optical sensor 11, a cable 12, and a support 13. The optical sensor 11 and the cable 12 are electrically connected. The optical sensor 11 includes a light emitting part 111 and a light receiving part 112. The support 13 supports the light emitting part 111 and the light receiving part 112.
[0014] As illustrated in FIG. 2, the probe device 10 is configured to be attached to the fingertip 20 of a subject in order to acquire the biological information of the subject through the optical sensor 11. The fingertip 20 is an example of a living body. Specifically, the support 13 is wound around the fingertip 20 such that the light emitting part 111 and the light receiving part 112 are disposed at positions facing each other with the fingertip 20 interposed therebetween. The other end of the cable 12 is connected to a biological information acquisition device (not shown). In this example, the biological information acquisition device acquires transcutaneous arterial oxygen saturation (SpO2) and pulse rate as biological information.
[0015] As illustrated in FIG. 3, the light emitting part 111 includes a first light emitting element 111a and a second light emitting element 111b. The first light emitting element 111a is a semiconductor light emitting element that emits red light. The second light emitting element 111b is a semiconductor light emitting element that emits infrared light. Examples of the semiconductor light emitting element include a light emitting diode (LED), a laser diode (LD), an EL element, and the like.
[0016] The light receiving part 112 includes a light receiving element 112a. The light receiving element 112a outputs a light receiving signal according to the amount of light received on the light receiving surface. Examples of the light receiving element include a photodiode, a phototransistor, a photore resistor, and the like.
[0017] As illustrated in FIGS. 1 and 3, the probe device 10 includes a circuit board 14. A circuit is formed on the circuit board 14 for providing an electrical connection between the optical sensor 11 and the cable 12. The circuit includes a first contact 141, a second contact 142, a third contact 143, a fourth contact 144, a fifth contact 145, and a sixth contact 146. Each of the first contact 141, the second contact 142, the third contact 143, the fourth contact 144, the fifth contact 145, and the sixth contact 146 is formed of a conductive material.
[0018] The first contact 141 is electrically connected to the first light-emitting element 111a. The second contact 142 is electrically connected to the second light-emitting element 111b. The third contact 143 is electrically connected to both the first light-emitting element 111a and the second light-emitting element 111b. The fourth contact 144 and the fifth contact 145 are electrically connected to the light-receiving element 112a.
[0019] The cable 12 includes a first conductive wire 121, a second conductive wire 122, a third conductive wire 123, a fourth conductive wire 124, a fifth conductive wire 125, and a sixth conductive wire 126. Each of the first conductive wire 121, the second conductive wire 122, the third conductive wire 123, the fourth conductive wire 124, the fifth conductive wire 125, and the sixth conductive wire 126 is formed of a conductive material.
[0020] The first conductive wire 121 has a first connection portion 121a. The first connection portion 121a is a portion where an electrical connection between the first conductive wire 121 and the first light-emitting element 111a is made. The electrical connection between the first conductive wire 121 and the first light-emitting element 111a is made by soldering the first connection portion 121a to the first contact 141.
[0021] The first conductive wire 121 has a portion covered by a first covering member 151. The first covering member 151 is formed of an electrically insulating material.
[0022] The second conductive wire 122 has a second connection portion 122a. The second connection portion 122a is the part where the second conductive wire 122 and the second light-emitting element 111b are electrically connected. The electrical connection between the second conductive wire 122 and the second light-emitting element 111b is made by soldering the second connection portion 122a to the second contact 142.
[0023] The second conductive wire 122 has a portion covered by the second covering member 152. The second covering member 152 is made of an electrically insulating material.
[0024] The third conductive wire 123 has a third connection portion 123a. The third connection portion 123a is the part where the third conductive wire 123 is electrically connected to the first light-emitting element 111a and the second light-emitting element 111b. The electrical connection between the third conductive wire 123 and the first light-emitting element 111a and the second light-emitting element 111b is made by soldering the third connection portion 123a to the third contact 143.
[0025] The third conductive wire 123 has a portion covered by the third covering member 153. The third covering member 153 is made of an electrically insulating material.
[0026] The fourth conductive wire 124 has a fourth connecting portion 124a. The fourth connecting portion 124a is the part where the fourth conductive wire 124 and the light-receiving element 112a are electrically connected. The electrical connection between the fourth conductive wire 124 and the light-receiving element 112a is made by soldering the fourth connecting portion 124a to the fourth contact 144.
[0027] The fourth conductive wire 124 has a portion covered by the fourth covering member 154. The fourth covering member 154 is made of an electrically insulating material.
[0028] The fifth conductive wire 125 has a fifth connection portion 125a. The fifth connection portion 125a is the part where the fifth conductive wire 125 and the light-receiving element 112a are electrically connected. The electrical connection between the fifth conductive wire 125 and the light-receiving element 112a is made by soldering the fifth connection portion 125a to the fifth contact 145.
[0029] The fifth conductive wire 125 has a portion covered by the fifth covering member 155. The fifth covering member 155 is made of an electrically insulating material.
[0030] With the above configuration, the signal used by the light sensor 11 flows through the first conductive wire 121, the second conductive wire 122, the third conductive wire 123, the fourth conductive wire 124, and the fifth conductive wire 125, respectively.
[0031] Specifically, a signal flowing from the first conductive wire 121 to the third conductive wire 123 causes the first light-emitting element 111a to emit red light. Similarly, a signal flowing from the second conductive wire 122 to the third conductive wire 123 causes the second light-emitting element 111b to emit infrared light. The emission of red light by the first light-emitting element 111a and the emission of infrared light by the second light-emitting element 111b occur alternately.
[0032] The red light and infrared light, after interacting with the tissue of the subject's fingertip 20, reach the light-receiving surface of the photodetector 112a. Signals corresponding to the intensity of the red light and infrared light at the light-receiving surface flow through the fourth conductive wire 124 and the fifth conductive wire 125.
[0033] The subject's transcutaneous arterial oxygen saturation can be calculated based on the ratio of the intensity of red light emitted from the first light-emitting element 111a to the intensity of red light incident on the light-receiving surface of the photodetector 112a, and the ratio of the intensity of infrared light emitted from the second light-emitting element 111b to the intensity of infrared light incident on the light-receiving surface of the photodetector 112a. Furthermore, the subject's pulse rate can be calculated based on the change over time of at least one of the two ratios.
[0034] Cable 12 includes a shielding layer 127. The shielding layer 127 is made of a conductive material. Each of the fourth covering member 154 and the fifth covering member 155 has a portion covered by the shielding layer 127. The shielding layer 127 is electrically connected to the sixth conductive wire 126.
[0035] The sixth conductive wire 126 has a sixth connection portion 126a. The sixth connection portion 126a is the part where an electrical connection is made between the sixth conductive wire 126 and a protection circuit that protects the fourth conductive wire 124 and the fifth conductive wire 125 from electrostatic noise. The electrical connection between the protection circuit and the sixth conductive wire 126 is made by soldering the sixth connection portion 126a to the sixth contact 146.
[0036] The probe device 10 includes a first insulating member 161. The first insulating member 161 is made of an electrically insulating material. The first insulating member 161 covers the first conductive wire 121 at a position closer to the tip 121b of the first conductive wire 121 than to the first connection portion 121a.
[0037] As a result, even if the first conductive wire 121 unexpectedly comes close to the adjacent second conductive wire 122 during or after the connection work between the first contact 141 and the first connection part 121a, the first insulating member 161 acts as a spacer, thus preventing contact between the first conductive wire 121 and the second conductive wire 122.
[0038] The probe device 10 includes a second insulating member 162. The second insulating member 162 is made of an electrically insulating material. The second insulating member 162 covers the second conductive wire 122 at a position closer to the tip 122b of the second conductive wire 122 than to the second connection portion 122a.
[0039] As a result, even if the second conductive wire 122 unexpectedly comes close to the adjacent first conductive wire 121 or third conductive wire 123 during or after the connection work between the second contact 142 and the second connection part 122a, the second insulating member 162 acts as a spacer, thus preventing contact between the second conductive wire 122 and the first conductive wire 121 or third conductive wire 123.
[0040] The probe device 10 includes a third insulating member 163. The third insulating member 163 is made of an electrically insulating material. The third insulating member 163 covers the third conductive wire 123 at a position closer to the tip 123b of the third conductive wire 123 than to the third connection portion 123a.
[0041] As a result, even if the third conductive wire 123 unexpectedly comes close to the adjacent second conductive wire 122 during or after the connection work between the third contact 143 and the third connection part 123a, the third insulating member 163 acts as a spacer, thus preventing contact between the third conductive wire 123 and the second conductive wire 122.
[0042] The probe device 10 includes a fourth insulating member 164. The fourth insulating member 164 is made of an electrically insulating material. The fourth insulating member 164 covers the fourth conductive wire 124 at a position closer to the tip 124b of the fourth conductive wire 124 than to the fourth connection portion 124a.
[0043] As a result, even if the fourth conductive wire 124 unexpectedly comes close to the adjacent fifth conductive wire 125 during or after the connection work between the fourth contact 144 and the fourth connection part 124a, the fourth insulating member 164 acts as a spacer, thus preventing contact between the fourth conductive wire 124 and the fifth conductive wire 125.
[0044] The probe device 10 includes a fifth insulating member 165. The fifth insulating member 165 is made of an electrically insulating material. The fifth insulating member 165 covers the fifth conductive wire 125 at a position closer to the tip 125b of the fifth conductive wire 125 than to the fifth connection portion 125a.
[0045] As a result, even if the fifth conductive wire 125 unexpectedly comes close to the adjacent fourth conductive wire 124 or sixth conductive wire 126 during or after the connection work between the fifth contact 145 and the fifth connection part 125a, the fifth insulating member 165 acts as a spacer, thus preventing contact between the fifth conductive wire 125 and the fourth conductive wire 124 or sixth conductive wire 126.
[0046] To meet the demand for miniaturization of probe devices, the diameter of conductive wires tends to be thin, and the spacing between adjacent conductive wires tends to be narrow. In such situations, external forces applied to the probe device from the environment may cause adjacent conductive wires to come into unexpected close proximity. With the above configuration, contact between conductive wires is prevented by the insulating material, thus meeting the demand for miniaturization of the probe device while increasing resistance to external forces applied from the environment.
[0047] The first insulating member 161 can be fitted from the tip 121b side of the first conductive wire 121 before the connection work between the first contact 141 and the first connection part 121a. However, it is preferable that the first insulating member 161 is part of the first covering member 151.
[0048] In this case, as illustrated in steps ST1 to ST2 in Figure 4, the first insulating member 161 is formed by removing a portion of the first covering member 151. In other words, the first insulating member 161 is another portion of the first covering member 151. Specifically, the first portion 151a of the first covering member 151 is left closer to the tip 121b of the first conductive wire 121, while the second portion 151b of the first covering member 151, which is further from the tip 121b, is removed. This creates an exposed portion where the first conductive wire 121 is exposed.
[0049] In the configuration where the first conductive wire 121 is covered by the first covering member 151, a step is required to remove a portion of the first covering member 151 to expose the first connection portion 121a in order to connect it to the first contact 141. Through this step, another portion of the first covering member 151 that remains is used as the first insulating member 161, thus reducing waste material. Furthermore, since the step of preparing the first insulating member 161 as a separate component and fitting it onto the first conductive wire 121 is eliminated, not only is an increase in material costs suppressed, but the manufacturing efficiency of the probe device 10 can also be improved.
[0050] In this embodiment, the first conductive wire 121 is a stranded wire in which multiple conductive thin wires are twisted together. When the first insulating member 161 is fitted as a separate component, it becomes necessary to work carefully to prevent the stranded wire from unraveling. On the other hand, when a part of the first covering member 151 that bundles the stranded wire from the beginning is used as the first insulating member 161, it is possible to prevent the stranded wire from unraveling without taking any special measures.
[0051] Similarly, the second insulating member 162 can be fitted from the tip 122b side of the second conductive wire 122 before the connection work between the second contact 142 and the second connection part 122a. However, it is preferable that the second insulating member 162 is part of the second covering member 152.
[0052] Similarly, the third insulating member 163 can be fitted from the tip 123b side of the third conductive wire 123 before the connection work between the third contact 143 and the third connection part 123a. However, it is preferable that the third insulating member 163 is part of the third covering member 153.
[0053] Similarly, the fourth insulating member 164 can be fitted from the tip 124b side of the fourth conductive wire 124 before the connection work between the fourth contact 144 and the fourth connection part 124a. However, it is preferable that the fourth insulating member 164 is part of the fourth covering member 154.
[0054] Similarly, the fifth insulating member 165 can be fitted from the tip 125b side of the fifth conductive wire 125 before the connection work between the fifth contact 145 and the fifth connection part 125a. However, it is preferable that the fifth insulating member 165 is part of the fifth covering member 155.
[0055] As illustrated in step ST3 of Figure 4, the automatic soldering device 30 solders the exposed portion of the first conductive wire 121 to the first contact 141.
[0056] As a result, as illustrated in step ST4, the first conductive wire 121 has a flat portion 121c and an inclined portion 121d when viewed from a direction that crosses the multiple conductive wires of the cable 12. The flat portion 121c extends along the circuit board 14. The inclined portion 121d extends at an angle α with respect to the flat portion 121c.
[0057] The distance between the first insulating member 161 and the first covering member 151, the outer diameter of the first insulating member 161, the outer diameter of the first covering member 151, etc., are predetermined so that the angle α is less than 60°. The angle α is preferably less than 30°, and more preferably less than 15°.
[0058] With this configuration, the stress that would cause the first connection portion 121a of the soldered first conductive wire 121 to detach from the first contact 141 can be suppressed. Therefore, it is possible to prevent the first connection portion 121a from unexpectedly detaching from the first contact 141 due to external forces applied from the environment.
[0059] The above explanation regarding the flat and inclined portions can also be applied to each of the second conductive wire 122, the third conductive wire 123, the fourth conductive wire 124, and the fifth conductive wire 125.
[0060] The first insulating member 161 may be formed from a heat-shrinkable material. If the first insulating member 161 is part of the first covering member 151, then the first covering member 151 is formed from a heat-shrinkable material.
[0061] With this configuration, when the first conductive wire 121 is soldered to the first contact 141, the first insulating member 161 shrinks due to heat in at least one of the radial and axial directions of the first conductive wire 121. Therefore, the increase in the angle α of the inclined portion 121d relative to the flat portion 121c can be suppressed.
[0062] In particular, when the first conductive wire 121 is a stranded wire, the occurrence of the first conductive wire 121 unraveling due to the heat and stress applied by soldering can be suppressed by the thermal contraction of the first insulating member 161.
[0063] As illustrated in Figure 5, the adjacent first conductive wire 121 and second conductive wire 122 are arranged such that the distance between them closer to the tips 121b and 122b is greater than the distance between them further from the tips 121b and 122b than the distance between them closer to
[0064] Similarly, the adjacent second conductive wire 122 and third conductive wire 123 are arranged such that the spacing between them closer to the tips 122b and 123b than the spacing between them further away from the tips 122b and 123b than the spacing between them closer to the tips 122b and 123b than the spacing between them.
[0065] Similarly, the adjacent fourth conductive wire 124 and fifth conductive wire 125 are arranged such that the spacing between them closer to the tips 124b and 125b than to the fourth and fifth connection parts 124a and 125a is greater than the spacing between them further from the tips 124b and 125b than to the fourth and fifth connection parts 124a and 125a.
[0066] Similarly, the adjacent fifth conductive wire 125 and sixth conductive wire 126 are arranged such that the spacing between them closer to the tips 125b and 126b than the fifth connection portion 125a and the sixth connection portion 126a is greater than the spacing between them further from the tips 125b and 126b than the fifth connection portion 125a and the sixth connection portion 126a.
[0067] The above configuration can be obtained by displacing at least one end of two adjacent conductive wires in a direction intersecting the axial direction of the conductive wires to a region of plastic deformation using an appropriate jig.
[0068] To meet the demand for miniaturization of probe devices, there is a tendency to use cables with narrower spacing between adjacent conductive wires. However, with the above-described configuration, where the spacing between adjacent conductive wires widens towards the tip of each wire, contact between conductive wires caused by external forces from the environment can be suppressed even when using such cables.
[0069] If the distance between the ends of adjacent conductive wires is sufficiently widened to suppress contact between them, the insulating member that acts as a spacer may be omitted.
[0070] In this embodiment, the first contact 141, second contact 142, third contact 143, fourth contact 144, fifth contact 145, and sixth contact 146 are arranged at equal intervals in a direction that crosses the multiple conductive wires of the cable 12. The distance D1 between two adjacent contacts is set to be greater than the diameter D2 of each conductive wire. In this example, the diameter D2 is 0.3 mm, and the distance D1 is 0.7 mm. Therefore, the distance between the connection points of two adjacent conductive wires in the same direction is also greater than the diameter D2 of each conductive wire.
[0071] To meet the demand for miniaturization of probe devices, there is a tendency to use conductive wires with thinner diameters. By defining the dimensions as described above, it is possible to suppress contact between conductive wires caused by external forces from the environment, even when using such wires.
[0072] The first contact 141, second contact 142, third contact 143, fourth contact 144, fifth contact 145, and sixth contact 146 do not necessarily need to be arranged at equal intervals. As long as the distance between two adjacent conductive wires in a direction that crosses multiple conductive wires is greater than the diameter D2 of each conductive wire, the distance between any two adjacent contacts in the same direction can be determined as appropriate.
[0073] As illustrated in Figure 5, when the automatic soldering device 30 described with reference to Figure 4 is used, the first solder mark 31 remains on the first conductive wire 121 and the first contact 141. That is, the first solder mark 31 defines the area of the first connection portion 121a. Each of the ends of the first connection portion 121a in the direction in which the first conductive wire 121 extends has a shape that follows a straight line L that extends in a direction that crosses the multiple conductive wires provided by the cable 12.
[0074] Similarly, the second solder mark 32 remains on the second conductive wire 122 and the second contact 142. That is, the second solder mark 32 defines the area of the second connection portion 122a. Each of the ends of the second connection portion 122a in the direction in which the second conductive wire 122 extends has a shape that follows a straight line L that extends in a direction that crosses the multiple conductive wires of the cable 12.
[0075] Similarly, the third solder mark 33 remains on the third conductive wire 123 and the third contact 143. That is, the third solder mark 33 defines the extent of the third connection portion 123a. Each of the ends of the third connection portion 123a in the direction in which the third conductive wire 123 extends has a shape that follows a straight line L that extends in a direction that crosses the multiple conductive wires provided by the cable 12.
[0076] Similarly, the fourth solder mark 34 remains on the fourth conductive wire 124 and the fourth contact 144. That is, the fourth solder mark 34 defines the extent of the fourth connection portion 124a. Each of the ends of the fourth connection portion 124a in the direction in which the fourth conductive wire 124 extends has a shape that follows a straight line L that extends in a direction that crosses the multiple conductive wires of the cable 12.
[0077] Similarly, the fifth solder mark 35 remains on the fifth conductive wire 125 and the fifth contact 145. That is, the fifth solder mark 35 defines the extent of the fifth connection 125a. Each of the ends of the fifth connection 125a in the direction in which the fifth conductive wire 125 extends has a shape that follows a straight line L that extends in a direction that crosses the multiple conductive wires of the cable 12.
[0078] Similarly, the sixth solder mark 36 remains on the sixth conductive wire 126 and the sixth contact 146. That is, the sixth solder mark 36 defines the extent of the sixth connection 126a. Each of the ends of the sixth connection 126a in the direction in which the sixth conductive wire 126 extends has a shape that follows a straight line L that extends in a direction that crosses the multiple conductive wires of the cable 12.
[0079] The straight line L is an example of a geometric shape. The fact that the shape of the solder mark follows such a geometric shape indicates that an automatic soldering device 30 was used rather than manual soldering. The geometric shape can also take forms other than a straight line, depending on the shape of the automatic soldering device 30 pressed against the conductive wire. Examples of such forms include two straight lines that form a bending point, or a curve with one inflection point.
[0080] In the example shown in Figure 5, the end of the first connection part 121a closer to the tip 121b and the end further from the tip 121b are configured to follow the same geometric shape. However, the geometric shape followed by the end closer to the tip 121b and the geometric shape followed by the end further from the tip 121b may be different. The same applies to the second connection part 122a, the third connection part 123a, the fourth connection part 124a, the fifth connection part 125a, and the sixth connection part 126a.
[0081] The embodiments described above are merely illustrative examples to facilitate understanding of the present invention. The configurations of the above embodiments may be modified or improved as appropriate without departing from the spirit of the present invention.
[0082] In the above embodiment, the light sensor 11 includes a first light-emitting element 111a that emits red light and a second light-emitting element 111b that emits infrared light. However, if transcutaneous arterial oxygen saturation (SpO2) can be obtained, the wavelengths of light emitted from the first light-emitting element 111a and the wavelengths of light emitted from the second light-emitting element 111b can be appropriately determined. Specifically, multiple wavelengths are selected in which the absorbance by oxygenated hemoglobin in arterial blood corresponding to SpO2 is substantially different.
[0083] The blood light-absorbing substances related to the concentration information acquired using the light sensor 11 are not limited to oxygenated hemoglobin. Other blood light-absorbing substances include deoxygenated hemoglobin, carboxyhemoglobin, methemoglobin, and dyes. The number and wavelength of light-emitting elements can be appropriately selected according to the concentration of the blood light-absorbing substance to be acquired.
[0084] In the above embodiment, the circuit board 14 is built into the support body 13 that supports the light sensor 11. However, a configuration in which the cable 12 is connected to a connector that is detachably configured to be attached to the support body 13, and the circuit board 14 is installed inside the connector, can also be adopted.
[0085] The electrical connection between each of the multiple conductive wires of the cable 12 and the optical sensor 11 may be made by means other than soldering to contacts on the circuit board 14. For example, methods such as welding, bonding, screwing, etc., may be employed.
[0086] The sensors provided by the probe device 10 are not limited to the optical sensor 11. The probe device 10 may be equipped with various sensors that detect information using signals flowing through multiple conductive wires provided by the cable 12. The number of elements provided by the sensor can be appropriately determined depending on the information to be detected. The number of multiple conductive wires can be appropriately determined depending on the application of the sensor. All of the multiple conductive wires may have portions covered by a covering material, or not all of the multiple conductive wires may be covered by a covering material.
[0087] The probe device 10 does not necessarily have to be attached to the subject's fingertip 20. Depending on the biological information acquired by the sensor, it can be attached to an appropriate part of the subject's body.
[0088] Depending on the information acquired by the sensor, the probe device 10 does not necessarily need to be attached to a living organism. [Explanation of symbols]
[0089] 10: Probe device, 11: Optical sensor, 111a: First light-emitting element, 111b: Second light-emitting element, 112a: Photodetector, 121: First conductive wire, 121a: First connection part, 121b: Tip, 121c: Flat part, 121d: Inclined part, 122: Second conductive wire, 122a: Second connection part, 122b: Tip, 123: Third conductive wire, 123a: Third connection part, 123b: Tip, 124: Fourth conductive wire, 124a: Fourth connection part, 124b: Tip, 125: Fifth conductive wire, 125a: Fifth connection part, 125b: Tip, 126: Sixth conductive wire, 126a: Sixth connection part, 126b: Tip, 151: First covering member, 151a: First part, 151b: Second part, 152: Second covering member, 153: Third covering member, 154: Fourth covering member, 155: Fifth covering member, 161: First insulating member, 162: Second insulating member, 163: Third insulating member, 164: Fourth insulating member, 165: Fifth insulating member, 20: Fingertip, D1: Distance between adjacent contacts, D2: Diameter of conductive wire, L: Straight line, α: Angle
Claims
1. A sensor including at least one element, Each has a connection part through which an electrical connection is made with the sensor, and a plurality of conductive wires through which signals used in the sensor flow, It is equipped with, The adjacent plurality of conductive wires are arranged such that the spacing between them at a position closer to the tip than the connection point is wider than the spacing between them at a position further from the tip than the connection point. Probe device.
2. Each of the aforementioned multiple conductive wires is a stranded wire in which multiple conductive thin wires are twisted together. The probe device according to claim 1.
3. When viewed from a direction along a straight line crossing the plurality of conductive wires, each of the plurality of conductive wires has a flat portion extending along the substrate on which the connection portion is located, and an inclined portion extending at an angle of less than 60 degrees with respect to the flat portion. The probe device according to claim 1 or 2.
4. The distance between the connection points of the adjacent plurality of conductive wires is greater than the diameter of the conductive wire. The probe device according to any one of claims 1 to 3.
5. The diameter is 0.3 mm or less, and the spacing is 0.7 mm or less. The probe device according to claim 4.
6. Each of the ends of the connection portion in the direction in which each of the plurality of conductive wires extends has a shape that conforms to the geometric shape that crosses the plurality of conductive wires. The aforementioned geometric shape is a single straight line or a curve with one inflection point. The probe device according to any one of claims 1 to 5.