3D modeling device

The three-dimensional molding apparatus addresses the challenge of larger processing areas by using a reduction and enlargement projection optical system with a diffraction-type optical modulator, ensuring sufficient light intensity and shape accuracy.

JP7894292B2Active Publication Date: 2026-07-23SCREEN HOLDINGS CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
SCREEN HOLDINGS CO LTD
Filing Date
2022-09-21
Publication Date
2026-07-23

AI Technical Summary

Technical Problem

Existing 3D printing technologies face challenges in achieving larger processing areas with sufficient light intensity and shape accuracy due to the need for a long working distance, which often results in decreased productivity and reduced molding resolution.

Method used

A three-dimensional molding apparatus with a first projection optical system having a reduction magnification and a second projection optical system with an enlargement magnification, utilizing a diffraction-type optical modulator to maintain light intensity and secure a long working distance.

Benefits of technology

The solution allows for a long working distance while preserving light intensity, preventing decreases in productivity and maintaining shape accuracy in 3D fabrication.

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Patent Text Reader

Abstract

To obtain a long working distance while suppressing a decrease in light intensity over the processing area in a three-dimensional modeling machine that utilizes a diffraction-type optical modulator.SOLUTION: A three-dimensional modeling machine 1 is equipped with a laser light source 21, a diffraction-type optical modulator 23 with multiple modulation elements, an illumination optical system 22, a first projection optical system 241 that forms an intermediate image of the optical modulator 23, a second projection optical system 242 that forms a projection image of the intermediate image on a projection plane 95 of modeling material 91 that is a processing area, and a layer forming mechanism 12. The second projection optical system 242 scans the projected image on the projection surface 95. The layer formation mechanism 12 forms a new projection plane 95 by forming a new material layer 92 on the projection plane 95 on which the projection image has been scanned. The projection magnification of the first projection optical system 241 is smaller than that of the second projection optical system 242. This allows for a long working distance while suppressing the decrease in light intensity over the processing area.SELECTED DRAWING: Figure 1
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