Sample holder

Abstract

This sample holder comprises a ceramic substrate, a base plate, and a cylindrical member. The ceramic substrate has a first surface, which is a sample holding surface, and a second surface positioned opposite to the first surface. The base plate is positioned on the second surface of the ceramic substrate and includes: a third surface, which is a surface facing the second surface; a fourth surface positioned opposite to the third surface; and a through-hole penetrating through the third surface and the fourth surface. The cylindrical member is positioned in the through-hole and is joined to the second surface. This sample holder has a sealing member between the inner peripheral surface of the through-hole and the outer peripheral surface of the cylindrical member.

Description

Technical Field

[0001] The disclosed embodiments relate to a sample holder.

Background Art

[0002] Conventionally, as a sample holder used in a semiconductor integrated circuit manufacturing apparatus or the like, a sample holder in which a ceramic substrate and a base plate provided below the ceramic substrate are joined by an adhesive is known. A through hole reaching the lower surface of the ceramic substrate is formed in the base plate, and a terminal connected to an internal electrode of the ceramic substrate, for example, is inserted into such a through hole (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document

Summary of the Invention

[0004] The sample holder according to one aspect of the embodiment includes a ceramic substrate, a base plate, and a cylindrical member. The ceramic substrate has a first surface that is a sample holding surface and a second surface that is located opposite to the first surface. The base plate is located on the second surface of the ceramic substrate and has a third surface that is a surface facing the second surface, a fourth surface that is located opposite to the third surface, and a through hole that penetrates the third surface and the fourth surface. The cylindrical member is located in the through hole and is joined to the second surface. The sample holder according to one aspect of the embodiment has a sealing member between the inner peripheral surface of the through hole and the outer peripheral surface of the cylindrical member.

Brief Description of the Drawings

[0005] [Figure 1] FIG. 1 is a schematic cross-sectional view showing a configuration example of a semiconductor manufacturing apparatus using the sample holder according to the first embodiment. [Figure 2] FIG. 2 is a schematic cross-sectional view showing a configuration example of the sample holder according to the first embodiment. [Figure 3] Figure 3 is a schematic cross-sectional view showing an example of the configuration of a sample holder according to the second embodiment. [Figure 4] Figure 4 is a schematic enlarged view of one end of a cylindrical member. [Figure 5] Figure 5 is a schematic cross-sectional view showing an example of the configuration of a sample holder according to the third embodiment. [Figure 6] Figure 6 is a schematic cross-sectional view showing an example of the groove configuration. [Figure 7] Figure 7 is a schematic cross-sectional view showing an example of the groove configuration. [Figure 8] Figure 8 is a schematic cross-sectional view showing an example of the groove configuration. [Figure 9] Figure 9 is a schematic cross-sectional view showing an example of the groove configuration. [Figure 10] Figure 10 is a schematic cross-sectional view showing an example of the configuration of a sample holder according to the fourth embodiment. [Figure 11] Figure 11 is a schematic cross-sectional view showing an example of the configuration of a sample holder according to the fifth embodiment. [Figure 12] Figure 12 is a schematic cross-sectional view showing an example of the configuration of a sample holder according to the sixth embodiment. [Figure 13] Figure 13 is a schematic cross-sectional view showing an example of the configuration of a sample holder according to the seventh embodiment. [Figure 14] Figure 14 is a schematic cross-sectional view showing an example of the configuration of a sample holder according to the eighth embodiment. [Figure 15] Figure 15 is a schematic cross-sectional view showing an example of the configuration of a sample holder according to the eighth embodiment. [Figure 16] Figure 16 is a schematic cross-sectional view showing an example of the configuration of a sample holder according to the ninth embodiment. [Figure 17] Figure 17 is a schematic cross-sectional view showing an example of the configuration of a sample holder according to the 10th embodiment. [Figure 18] Figure 18 is a schematic cross-sectional view showing an example of the configuration of a sample holder according to the 11th embodiment. [Figure 19] Figure 19 is a schematic cross-sectional view showing an example of the configuration of a sample holder according to the 12th embodiment.

Best Mode for Carrying Out the Invention

[0006] Hereinafter, embodiments of the sample holder disclosed in the present application will be described in detail with reference to the accompanying drawings. Note that the invention according to the present application is not limited by the embodiments described below.

[0007] Hereinafter, an example in which the sample holder according to the present disclosure is used in a semiconductor manufacturing apparatus for processing a semiconductor wafer will be described. However, the sample holder according to the present disclosure may be used for applications that hold samples other than semiconductor wafers.

[0008] In recent years, the usage environment of sample holders has become hotter, and there is a demand for sample holders that can withstand use at higher temperatures. Since the adhesive that joins the ceramic substrate and the base plate has a relatively low heat resistance temperature, it is difficult to use in a high-temperature environment. Therefore, instead of joining with an adhesive, it is conceivable to mechanically join the ceramic substrate and the base plate.

[0009] However, when the ceramic substrate and the base plate are mechanically joined, it becomes difficult to ensure the sealing performance between the ceramic substrate and the base plate. For this reason, for example, when the sample holder is used in a vacuum environment, there is a possibility of vacuum leakage in the gap between the ceramic substrate and the base plate.

[0010] Therefore, there is an expectation to provide a sample holder that can easily ensure the sealing performance in a high-temperature environment.

[0011] (First Embodiment) (Configuration of Semiconductor Manufacturing Apparatus) FIG. 1 is a schematic cross-sectional view showing a configuration example of a semiconductor manufacturing apparatus using the sample holder according to the first embodiment.

[0012] In addition, in FIG. 1, among the components included in the semiconductor manufacturing apparatus, the components mainly necessary for the description of the sample holder are shown, and other components are omitted as appropriate. For example, the semiconductor manufacturing apparatus may be a plasma processing apparatus that processes a semiconductor wafer using plasma. In this case, the semiconductor manufacturing apparatus may include a shower head that functions as an electrode for plasma generation.

[0013] As shown in FIG. 1, the semiconductor manufacturing apparatus 100 according to the first embodiment includes a sample holder 1, a processing container 2, a first sealing member 3, and an exhaust mechanism 4.

[0014] The sample holder 1 mounts a sample to be processed (here, a semiconductor wafer). The specific configuration of the sample holder 1 will be described later.

[0015] The processing container 2 houses the sample holder 1. An opening 21 is located at the bottom of the processing container 2. A terminal 16 described later is inserted through the opening 21. In other words, the terminal 16 is drawn out to the outside of the processing container 2 through the opening 21.

[0016] The first sealing member 3 is, for example, an O-ring made of rubber. The first sealing member 3 is positioned so as to surround the opening 21 of the processing container 2. The first sealing member 3 is located between the lower surface of the sample holder 1 and the bottom surface of the processing container 2, and by being crushed against the sample holder 1 from above, it seals the gap between the sample holder 1 and the processing container 2. Thereby, the inside of the processing container 2 is sealed.

[0017] The exhaust mechanism 4 is connected to an exhaust port (not shown) of the processing container 2 via an exhaust pipe 41. The exhaust mechanism 4 includes a vacuum pump, a pressure control valve, etc., and evacuates the inside of the processing container 2 via the exhaust pipe 41. Thereby, the inside of the processing container 2 is depressurized.

[0018] (Configuration of the sample holder) Next, the configuration of the sample holder 1 will be further described with reference to FIG. 2. FIG. 2 is a schematic cross-sectional view showing a configuration example of the sample holder 1 according to the first embodiment.

[0019] As shown in Figures 1 and 2, the sample holder 1 includes a ceramic substrate 11, a base plate 12, a cylindrical member 13, a plurality of fixing parts 14, a second sealing member 15, and a terminal 16.

[0020] The ceramic substrate 11 has, for example, a disc shape. One of the main surfaces (in this case, the top surface), which is the first surface 111 of the ceramic substrate 11, is the surface for holding the semiconductor wafer.

[0021] The ceramic substrate 11 may mainly contain aluminum oxide (Al2O3), aluminum nitride (AlN), yttria (Y2O3), cordierite, silicon carbide (SiC), or silicon nitride (Si3N4). The ceramic substrate 11 can be obtained, for example, by stacking and firing multiple green sheets.

[0022] A heating resistor 113 is located inside the ceramic substrate 11. The heating resistor 113 is a component that generates heat when an electric current flows through it. The heating resistor 113 is provided to heat the semiconductor wafer held on the first surface 111. The heating resistor 113 may have a linear pattern (meander pattern) with multiple folded portions.

[0023] The heat-generating resistor 113 is composed of, for example, a metallic material. Examples of metallic materials that constitute the heat-generating resistor 113 include tungsten, molybdenum, rhenium, their alloys, or platinum. The heat-generating resistor 113 may also contain glass components such as oxides of silicon dioxide.

[0024] Note that conductive members other than the heating resistor 113 may be located inside the ceramic substrate 11. For example, electrodes for electrostatic adsorption or high-frequency electrodes to which high-frequency power for plasma generation is applied may be located inside the ceramic substrate 11. Examples of metal materials that constitute the electrodes for electrostatic adsorption and high-frequency electrodes include tungsten, molybdenum, rhenium, their alloys, or platinum.

[0025] On the second surface 112 (in this case, the bottom surface), which is the surface opposite the first surface 111 of the ceramic substrate 11, there is a recess 114 that reaches the heating resistor 113.

[0026] The base plate 12 has, for example, a disc shape with a larger diameter than the ceramic substrate 11. The base plate 12 is located on the second surface 112 of the ceramic substrate 11. Specifically, the base plate 12 has a third surface 121 (here, the top surface) which is opposite to the second surface 112, and a fourth surface 122 (here, the bottom surface) which is opposite to the third surface 121.

[0027] The base plate 12 has through holes 123 that penetrate the third surface 121 and the fourth surface 122. The heating resistor 113 embedded in the ceramic substrate 11 is exposed to the outside through the opening 21 of the processing container 2, the through holes 123 of the base plate 12, and the recesses 114 of the ceramic substrate 11.

[0028] The base plate 12 may be made of metal, for example. Examples of metal materials that can form the base plate 12 include aluminum, stainless steel, titanium, and aluminum matrix composite materials such as AlSiC. A metal base plate 12 functions as a cooling member for cooling the ceramic substrate 11 heated by the heating resistor 113. As a cooling member, the base plate 12 may have internal channels for circulating a cooling medium such as cooling water or cooling gas. Furthermore, the metal base plate 12 may be used as a high-frequency electrode to which high-frequency power for plasma generation is applied.

[0029] The cylindrical member 13 has, for example, a cylindrical shape. The cylindrical member 13 is inserted through the through hole 123 of the base plate 12. In other words, the cylindrical member 13 is located in the through hole 123. One of the end faces of the cylindrical member 13 (in this case, the upper end face), the fifth face 131, is joined to the second face 112 of the ceramic substrate 11 via a joining member 115. The joining member 115 is, for example, glass or solder.

[0030] The outer diameter of the cylindrical member 13 is smaller than the inner diameter of the through hole 123 of the processing container 2. That is, the inner circumferential surface 125 of the through hole 123 and the outer circumferential surface 133 of the cylindrical member 13 are separated, and there is a gap (space) between the outer circumferential surface 133 of the cylindrical member 13 and the inner circumferential surface 125 of the through hole 123.

[0031] Furthermore, the sixth surface 132, which is the other end surface of the cylindrical member 13 (in this case, the lower end surface), may protrude from the opening 21 of the processing container 2 to the outside of the processing container 2.

[0032] A terminal 16 is inserted through the cylindrical member 13. The terminal 16 is connected to the heating resistor 113 via the cylindrical member 13 and the recess 114 of the ceramic substrate 11.

[0033] The fixing part 14 mechanically joins the ceramic substrate 11 and the base plate 12 by sandwiching the ceramic substrate 11 and the base plate 12.

[0034] As an example, the fixing part 14 includes a support member 141, a claw member 142, and a fastening member 143. The support member 141 is a member that extends vertically. The support member 141 is inserted through an insertion hole 124 provided in the base plate 12 and extends upward from the base plate 12 through this insertion hole 124. The claw member 142 extends horizontally from the tip of the support member 141 and abuts against the outer periphery of the first surface 111 of the ceramic substrate 11. The fastening member 143 is, for example, a nut. The fastening member 143 is provided at the base end of the support member 141 and abuts against a step provided inside the insertion hole 124. The fixing part 14 moves the support member 141 and the claw member 142 downward by tightening the fastening member 143 to the support member 141. As a result, the ceramic substrate 11 and the base plate 12 are pressed against each other, thereby joining them together.

[0035] Note that the configuration of the fixing part 14 shown in Figure 1 is just one example, and any configuration is acceptable as long as it mechanically joins the ceramic substrate 11 and the base plate 12.

[0036] If the ceramic substrate 11 and the base plate 12 are to be mechanically joined, it becomes unnecessary to join the ceramic substrate 11 and the base plate 12 with an adhesive. This makes it easier to use the sample holder 1 in a high-temperature environment. On the other hand, when the ceramic substrate 11 and the base plate 12 are mechanically joined, it becomes more difficult to ensure a seal between the ceramic substrate 11 and the base plate 12 compared to when they are joined with an adhesive. This may cause vacuum leakage in the gap between the ceramic substrate 11 and the base plate 12, making it difficult to maintain a reduced pressure state in the processing container 2.

[0037] Therefore, in the sample holder 1 according to this embodiment, the gap between the inner circumferential surface 125 of the through hole 123 and the outer circumferential surface 133 of the cylindrical member 13 is sealed by the second sealing member 15.

[0038] The second sealing member 15 is, for example, a rubber-like material such as silicone resin. The second sealing member 15 is located between the inner circumferential surface 125 of the through hole 123 and the outer circumferential surface 133 of the cylindrical member 13, and seals the gap between the through hole 123 and the cylindrical member 13.

[0039] In this way, by sealing the gap between the inner circumferential surface 125 of the through hole 123 communicating with the gap between the ceramic substrate 11 and the base plate 12 and the outer circumferential surface 133 of the cylindrical member 13 with the second sealing member 15, the occurrence of vacuum leakage can be reduced even if sufficient sealing performance is not ensured between the ceramic substrate 11 and the base plate 12. The gap between the inner circumferential surface 125 of the through hole 123 where the second sealing member 15 is located and the outer circumferential surface 133 of the cylindrical member 13 is further away from the ceramic substrate 11, which is a heat source, compared to the gap between the ceramic substrate 11 and the base plate 12, and is therefore less affected by heat from the ceramic substrate 11. Accordingly, according to the sample holder 1 of this embodiment, it is easy to ensure sealing performance in high-temperature environments.

[0040] The second sealing member 15 is located on the fourth surface 122 side of the base plate 12, rather than on the center C in the thickness direction of the base plate 12. In other words, the second sealing member 15 is located between the center C in the thickness direction of the base plate 12 and the fourth surface 122 of the base plate 12. This configuration makes it less susceptible to the influence of heat from the ceramic substrate 11.

[0041] Furthermore, on the third surface 121 side of the center C in the thickness direction of the base plate 12, the space between the inner circumferential surface 125 of the through hole 123 and the outer circumferential surface 133 of the cylindrical member 13 functions as an insulating layer, which further reduces the thermal influence on the second sealing member 15.

[0042] Furthermore, the second sealing member 15 only needs to be positioned at least partially between the center C in the thickness direction of the base plate 12 and the fourth surface 122 of the base plate 12. That is, a portion of the second sealing member 15 may protrude onto the fourth surface 122 of the base plate 12, or it may be positioned between the center C in the thickness direction of the base plate 12 and the third surface 121 of the base plate 12. Alternatively, the second sealing member 15 may be provided flush with the fourth surface 122 of the base plate 12.

[0043] The thermal expansion coefficient of the cylindrical member 13 may be smaller than that of the ceramic substrate 11. By using a cylindrical member 13 with a relatively small thermal expansion coefficient, thermal expansion and contraction of the cylindrical member 13 in the longitudinal direction (the thickness direction of the ceramic substrate 11 and the base plate 12) can be reduced. This reduces the stress on the joint surface between the cylindrical member 13 and the second sealing member 15. Therefore, reliability in high-temperature environments can be further improved.

[0044] Furthermore, as the material for the cylindrical member 13 having a thermal expansion coefficient smaller than that of the ceramic substrate 11, for example, mullite can be used.

[0045] (Second Embodiment) Figure 3 is a schematic cross-sectional view showing an example of the configuration of the sample holder 1 according to the second embodiment. As shown in Figure 3, the area of ​​the fifth surface 131, which is the bonding surface with the second surface 112 of the ceramic substrate 11, may be larger than the area of ​​the sixth surface 132, which is located opposite the fifth surface 131. For example, the cylindrical member 13 may have a flange shape at one end 134 located on the ceramic substrate 11 side of both ends in the longitudinal direction. In this case, the area of ​​the fifth surface 131, which is the upper surface of the one end 134, will be larger than the area of ​​the sixth surface 132, which is the lower surface of the other end.

[0046] This configuration increases the contact area between the ceramic substrate 11 and the cylindrical member 13, thereby effectively reducing vacuum leakage from the gap between the ceramic substrate 11 and the cylindrical member 13. Furthermore, by thickening only one end 134 of the cylindrical member 13 rather than the entire cylindrical member 13, the increase in the heat capacity of the cylindrical member 13 can be reduced. This reduces the thermal influence on the second sealing member 15 due to heat conduction from the ceramic substrate 11.

[0047] Figure 4 is a schematic enlarged view of one end 134 of the cylindrical member 13. As shown in Figure 4, the corner 135a of the end 134 of the cylindrical member 13 may be curved in an R shape. Similarly, the corner 135b of the end 134 of the cylindrical member 13 may be curved in an R shape.

[0048] This configuration reduces the concentration of thermal stress due to temperature cycling at the corner 135a and corner 135b of one end portion 134. Therefore, the occurrence of cracks in the cylindrical member 13 can be reduced.

[0049] Although Figure 4 shows an example where both the corner 135a and the corner 135b are curved, one end 134 of the cylindrical member 13 is curved at least between the corner 135a and the corner 135b On the other hand It just needs to be curved.

[0050] (Third embodiment) Figure 5 is a schematic cross-sectional view showing an example of the configuration of the sample holder 1 according to the third embodiment. As shown in Figure 5, in the sample holder 1 according to the third embodiment, the cylindrical member 13 may have a groove 136 on the fifth surface 131, which is the upper surface of one flange-shaped end 134.

[0051] The presence of the groove 136 on the fifth surface 131 increases the contact area between the fifth surface 131 and the joining member 115, thereby enabling a stronger bond between the ceramic substrate 11 and the cylindrical member 13.

[0052] Figures 6 to 9 are schematic cross-sectional views showing examples of the configuration of the groove 136. Specifically, Figures 6 to 9 show plan cross-sectional views when one end 134 of the cylindrical member 13 is cut at a position above the bottom surface of the groove 136 and below the fifth surface 131 of the cylindrical member 13.

[0053] As shown in Figures 6 and 7, the cylindrical member 13 may have grooves 136 extending in the circumferential direction. Figure 6 shows an example in which the cylindrical member 13 has multiple grooves 136 arranged in the circumferential direction. Figure 7 shows an example in which the cylindrical member 13 has an annular groove 136.

[0054] Furthermore, as shown in Figures 8 and 9, the cylindrical member 13 may have a groove 136 extending in the radial direction. Figure 8 shows an example in which the cylindrical member 13 has a groove 136 extending across the inner and outer periphery of the cylindrical member 13. Figure 9 shows an example in which the cylindrical member 13 has a groove 136 whose length does not reach the inner and outer periphery of the cylindrical member 13 at one end and the other end, respectively.

[0055] (Fourth Embodiment) Figure 10 is a schematic cross-sectional view showing an example of the configuration of the sample holder 1 according to the fourth embodiment. The shape of the cylindrical member 13 in which the area of ​​the fifth surface 131 is larger than the area of ​​the sixth surface 132 is not limited to the shape shown in Figure 3.

[0056] For example, as shown in Figure 10, the cylindrical member 13 may have a tapered shape that gradually narrows from the fifth surface 131 to the sixth surface 132. In this configuration as well, the bonding area between the ceramic substrate 11 and the cylindrical member 13 is increased, which effectively reduces vacuum leakage from the gap between the ceramic substrate 11 and the cylindrical member 13. Furthermore, by making the cylindrical member 13 tapered, the increase in the heat capacity of the cylindrical member 13 can be reduced compared to the case where the cylindrical member 13 is uniformly thick. This reduces the thermal influence on the second sealing member 15 due to heat conduction from the ceramic substrate 11.

[0057] (Fifth embodiment) Figure 11 is a schematic cross-sectional view showing an example of the configuration of the sample holder 1 according to the fifth embodiment. As shown in Figure 11, the base plate 12 may have a counterbore 126 recessed in the thickness direction of the base plate 12 at the opening of the fourth surface 122 in the through hole 123.

[0058] The counterbore portion 126 has a larger diameter than the through hole 123 of the base plate 12. Specifically, the counterbore portion 126 has a side surface 126a located in the radial direction of the cylindrical member 13, further away from the outer surface 133 of the cylindrical member 13 than the inner surface 125 of the through hole 123. The counterbore portion 126 also has a stepped surface 126b between the side surface 126a and the inner surface 125 of the through hole 123. The second sealing member 15 according to the fifth embodiment is located on such a counterbore portion 126.

[0059] This configuration makes it easier to control the position and thickness of the second sealing member 15. Therefore, it is possible to reduce the likelihood of the second sealing member 15 being too close to the ceramic substrate 11 or the second sealing member 15 being too thin. Furthermore, the position of the base plate 12 between the second sealing member 15 and the ceramic substrate 11 reduces the radiant heat transmitted from the ceramic substrate 11 to the second sealing member 15. Consequently, reliability in high-temperature environments can be improved.

[0060] (Sixth Embodiment) Figure 12 is a schematic cross-sectional view showing an example of the configuration of the sample holder 1 according to the sixth embodiment. As shown in Figure 12, the base plate 12 may have a protrusion 127 (corresponding to an example of the first protrusion) in the middle of the through hole 123, projecting inward from the inner circumferential surface 125 of the through hole 123, that is, toward the outer circumferential surface 133 of the cylindrical member 13. The inner circumferential surface of the protrusion 127 has a smaller diameter than the inner circumferential surface 125 of the through hole 123 and a larger diameter than the outer circumferential surface 133 of the cylindrical member 13.

[0061] In this configuration, the lower side of the protrusion 127 performs the same function as the counterbored portion 126 (see Figure 11) described above. That is, by positioning the second sealing member 15 below the protrusion 127, it becomes easier to control the position and thickness of the second sealing member 15. Furthermore, by positioning the protrusion 127 between the second sealing member 15 and the ceramic substrate 11, the radiant heat transmitted from the ceramic substrate 11 to the second sealing member 15 can be reduced by the protrusion 127.

[0062] Furthermore, the base plate 12 having the protrusion 127 can secure a larger heat insulating space above the protrusion 127 compared to the base plate 12 having the counterbore 126. This reduces the thermal impact on the second sealing member 15.

[0063] (Seventh Embodiment) Figure 13 is a schematic cross-sectional view showing an example of the configuration of the sample holder 1 according to the seventh embodiment. As shown in Figure 13, the cylindrical member 13 may have a protrusion 137 (corresponding to an example of a second protrusion) projecting outward from the outer circumferential surface 133 of the cylindrical member 13, that is, toward the inner circumferential surface 125 of the through hole 123 of the base plate 12, in the middle of the thickness direction of the base plate 12. The outer circumferential surface of the protrusion 137 has a larger diameter than the outer circumferential surface 133 of the cylindrical member 13 and a smaller diameter than the inner circumferential surface 125 of the through hole 123 of the base plate 12.

[0064] In this configuration, the lower side of the protrusion 137 performs the same function as the counterbored portion 126 (see Figure 11) described above. That is, by positioning the second sealing member 15 below the protrusion 137, it becomes easier to control the position and thickness of the second sealing member 15. Furthermore, by positioning the protrusion 137 between the second sealing member 15 and the ceramic substrate 11, the radiant heat transmitted from the ceramic substrate 11 to the second sealing member 15 can be reduced by the protrusion 137. In addition, by forming an insulating space above the protrusion 137, the thermal impact on the second sealing member 15 can be reduced.

[0065] The sample holder 1 may also be configured to include a cylindrical member 13 having a protrusion 137 (see Figure 13) and a base plate 12 having a counterbore 126 (see Figure 11). Alternatively, the sample holder 1 may be configured to include a cylindrical member 13 having a protrusion 137 (see Figure 13) and a base plate 12 having a protrusion 127 (see Figure 12).

[0066] (Eighth embodiment) Figures 14 and 15 are schematic cross-sectional views showing an example of the configuration of the sample holder 1 according to the eighth embodiment.

[0067] As shown in Figures 14 and 15, the sample holder 1 is positioned between the cylindrical member 13 and the base plate 12. Specifically, it may have an annular member 17 that fits into the gap between the cylindrical member 13 and the base plate 12. The annular member 17 may be made of, for example, metal.

[0068] Figure 14 shows an example where the annular member 17 is positioned in the gap between the outer circumferential surface 133 of the tapered cylindrical member 13 and the inner circumferential surface 125 of the through hole 123. In this case, the annular member 17 is positioned by contacting the outer circumferential surface 133 of the cylindrical member 13. Figure 15 also shows an example where the annular member 17 is positioned on the stepped surface 126b of the counterbore 126 provided on the base plate 12. In this case, the annular member 17 is positioned by contacting the stepped surface 126b. The inner diameter of the annular member 17 is larger than the outer circumferential surface 133 of the cylindrical member 13 and smaller than the inner circumferential surface 125 of the through hole 123. The outer diameter of the annular member 17 is larger than the inner circumferential surface 125 of the through hole 123 and smaller than the side surface 126a of the counterbore 126.

[0069] In the eighth embodiment, the second sealing member 15 is located in the region surrounded by the base plate 12, the cylindrical member 13, and the annular member 17.

[0070] In this way, by providing the annular member 17 in the gap between the inner circumferential surface 125 of the through hole 123 and the outer circumferential surface 133 of the cylindrical member 13, or on the stepped surface 126b of the counterbore portion 126, it becomes easier to control the position and thickness of the second sealing member 15. Furthermore, the annular member 17 can reduce the radiant heat transmitted from the ceramic substrate 11 to the second sealing member 15.

[0071] (Ninth Embodiment) Figure 16 is a schematic cross-sectional view showing an example of the configuration of the sample holder 1 according to the ninth embodiment. As shown in Figure 16, the base plate 12 may be composed of a cooling member 128, a heat-resistant member 129, and an adhesive G. The base plate 12, composed of the cooling member 128, the heat-resistant member 129, and the adhesive G, has a disc shape as a whole that is larger in diameter than the ceramic substrate 11.

[0072] The cooling member 128 has a fourth surface 122. The cooling member 128 may be made of metal, for example. As the metal material forming the cooling member 128, for example, aluminum, stainless steel, titanium, or aluminum matrix composite materials such as AlSiC can be used. A metal cooling member 128 can cool the ceramic substrate 11 heated by the heating resistor 113. The cooling member 128 may have an internal channel for circulating a cooling medium such as cooling water or cooling gas. The cooling member 128 may also be used as a high-frequency electrode to which high-frequency power for plasma generation is applied.

[0073] The heat-resistant member 129 has a third surface 121 and is located between the ceramic substrate 11 and the cooling member 128. The heat-resistant member 129 is made of a material with relatively low thermal conductivity. Furthermore, the heat-resistant member 129 has lower thermal conductivity than the base plate 12. As the material for forming the heat-resistant member 129, for example, cordierite or glass can be used.

[0074] The adhesive G is positioned between the cooling member 128 and the heat-resistant member 129, and joins the cooling member 128 and the heat-resistant member 129 together.

[0075] In this way, by providing a heat-resistant member 129 between the cooling member 128 and the ceramic substrate 11, heat conduction from the ceramic substrate 11 to the second sealing member 15 via the base plate 12 can be reduced.

[0076] Furthermore, since a heat-resistant member 129 is interposed between the adhesive G and the ceramic substrate 11, the effect of heat generated by the ceramic substrate 11 on the adhesive G is less compared to the conventional method where the adhesive is placed between the ceramic substrate and the base plate. For this reason, it can withstand use in high-temperature environments compared to conventional sample holders.

[0077] (Tenth embodiment) Figure 17 is a schematic cross-sectional view showing an example of the configuration of the sample holder 1 according to the 10th embodiment. As shown in Figure 17, the adhesive G that joins the cooling member 128 and the heat-resistant member 129 may be located not only between the cooling member 128 and the heat-resistant member 129, but also between the cooling member 128 and the cylindrical member 13 in the through hole 123, thereby joining the cooling member 128 and the cylindrical member 13. The adhesive G located between the cooling member 128 and the cylindrical member 13 corresponds to an example of a "sealing member".

[0078] This configuration allows for more reliable sealing of the gap between the base plate 12 and the cylindrical member 13.

[0079] (11th embodiment) Figure 18 is a schematic cross-sectional view showing an example of the configuration of the sample holder 1 according to the 11th embodiment. As shown in Figure 18, the adhesive G may also be located between the heat-resistant member 129 and the cylindrical member 13 in the through hole 123, and may join the heat-resistant member 129 and the cylindrical member 13.

[0080] This configuration allows for even more reliable sealing of the gap between the base plate 12 and the cylindrical member 13.

[0081] (12th embodiment) Figure 19 is a schematic cross-sectional view showing an example of the configuration of the sample holder 1 according to the twelfth embodiment. As shown in Figure 19, the heat-resistant member 129 may have a plurality of protrusions 18 (corresponding to an example of the third protrusion) that contact the ceramic substrate 11 and spaces 19 located around each protrusion 18 on the third surface 121, which is the surface facing the ceramic substrate 11. The plurality of protrusions 18 and spaces 19 can be formed, for example, by blasting the third surface 121 of the heat-resistant member 129.

[0082] The heat-resistant member 129 has multiple protrusions 18 and spaces 19, which reduces the contact area between the heat-resistant member 129 and the ceramic substrate 11. This makes the ceramic substrate 11 more slippery against the heat-resistant member 129, thereby mitigating the stress generated by the difference in expansion and contraction between the heat-resistant member 129 and the ceramic substrate 11 due to thermal cycling.

[0083] The space 19 is located around each protrusion 18 and between the ceramic substrate 11 and the heat-resistant member 129. The space 19 has a depth corresponding to the height of each protrusion 18. A heat transfer gas, such as helium, may be introduced into such a space 19. In other words, the space 19 may be a passage for the heat transfer gas. By introducing the heat transfer gas into the space 19, the heat transfer gas can be delivered to the second surface 112 of the ceramic substrate 11, improving the heat transfer between the heat-resistant member 129 and the ceramic substrate 11 through the space 19.

[0084] The sides of each protrusion 18 may be tapered, becoming narrower towards the ceramic substrate 11. In other words, each protrusion 18 may be formed in a tapered shape, becoming narrower as it approaches the top of the protrusion 18. By forming each protrusion 18 in a tapered shape, the surface area of ​​the end face of each protrusion 18 that contacts the ceramic substrate 11 can be reduced, thereby reducing the contact area between the heat-resistant member 129 and the ceramic substrate 11. As a result, the ceramic substrate 11 becomes more slippery against the heat-resistant member 129, and the stress generated by the difference in expansion and contraction between the heat-resistant member 129 and the ceramic substrate 11 due to thermal cycling can be further relieved.

[0085] Furthermore, the surface roughness Ra of the end face of each protrusion 18 that contacts the ceramic substrate 11 may be smaller than the surface roughness Ra of the bottom surface of the space 19. This allows the end face of each protrusion 18 to contact the ceramic substrate 11 uniformly in the in-plane direction, thereby equalizing heat transfer from the ceramic substrate 11 to the multiple protrusions 18. Also, if the surface roughness Ra of the end face of each protrusion 18 that contacts the ceramic substrate 11 is small, the ceramic substrate 11 becomes more slippery against the heat-resistant member 129, which can further alleviate the stress generated by the difference in expansion and contraction between the heat-resistant member 129 and the ceramic substrate 11 due to the thermal cycle. In addition, if the surface roughness Ra of the bottom surface of the space 19 is large, the surface area of ​​the bottom surface of the space 19 can be increased. This allows, for example, when a heat transfer gas is introduced into the space 19, to promote heat exchange between the heat transfer gas and the heat-resistant member 129.

[0086] As described above, the sample holder according to the embodiment (for example, sample holder 1) comprises a ceramic substrate (for example, ceramic substrate 11), a base plate (for example, base plate 12), and a cylindrical member (for example, cylindrical member 13). The ceramic substrate has a first surface (for example, first surface 111) which is the sample holding surface, and a second surface (for example, second surface 112) located opposite the first surface. The base plate has a third surface (for example, third surface 121) located on the second surface of the ceramic substrate and facing the second surface, a fourth surface (for example, fourth surface 122) located opposite the third surface, and a through hole (for example, through hole 123) that penetrates the third and fourth surfaces. The cylindrical member is located in the through hole and is joined to the second surface. The sample holder according to this embodiment has a sealing member (for example, a second sealing member 15, adhesive G) between the inner circumferential surface of the through hole (for example, the inner circumferential surface 125) and the outer circumferential surface of the cylindrical member (for example, the outer circumferential surface 133).

[0087] Therefore, according to the sample holder of this embodiment, it is easy to ensure sealing performance in high-temperature environments.

[0088] Characteristic embodiments have been described in order to fully and clearly disclose the technology relating to the attached claims. However, the attached claims should not be limited to the embodiments described above, but should be embodied by all modifications and alternative configurations that a person skilled in the art may create within the scope of the fundamental matters presented herein. [Explanation of symbols]

[0089] 1. Sample holder 2 Processing container 3 First sealing member 4. Exhaust mechanism 11 Ceramic substrate 12 base plate 13. Cylindrical member 14 Fixed part 15 Second sealing member 16 terminals 17 Annular member 21 Aperture 41 Exhaust pipe 100 Semiconductor manufacturing equipment 113 Heat-generating resistor 114 recess 115 Joining member 123 Through hole 124 Through hole 125 Inner surface 126 Counterbore section 126a side 126b Step surface 127 Convex part 128 Cooling components 129 Heat-resistant material 133 Outer surface 134 One end 135a Corner 135b corner 136 Groove 137 Convex part G Adhesive

Claims

1. Ceramic substrate and base plate and It comprises a cylindrical member, The ceramic substrate has a first surface which is a sample holding surface and a second surface located opposite the first surface. The base plate has a third surface located on the second surface of the ceramic substrate and facing the second surface, a fourth surface located opposite the third surface, and through holes penetrating the third surface and the fourth surface. Furthermore, it includes a fixing part for mechanically fixing the ceramic substrate and the base plate, The cylindrical member is a member through which a terminal connected to the heating resistor is inserted, and is located in the through hole and joined to the second surface. A sealing member is provided between the inner circumferential surface of the through hole and the outer circumferential surface of the cylindrical member. The sealing member is a sample holder located on the fourth surface side of the center in the thickness direction of the base plate.

2. A ceramic substrate and base plate and It comprises a cylindrical member, The ceramic substrate has a first surface which is a sample holding surface and a second surface located opposite the first surface. The base plate has a third surface located on the second surface of the ceramic substrate and facing the second surface, a fourth surface located opposite the third surface, and through holes penetrating the third surface and the fourth surface. Furthermore, it includes a fixing part for mechanically fixing the ceramic substrate and the base plate, The cylindrical member is a member through which a terminal connected to the heating resistor is inserted, and is located in the through hole and joined to the second surface. A sealing member is provided between the inner circumferential surface of the through hole and the outer circumferential surface of the cylindrical member. A sample holder having a space between the inner circumferential surface of the through hole and the outer circumferential surface of the cylindrical member, and on the second surface side of the sealing member.

3. The sample holder according to claim 1, wherein the thermal expansion coefficient of the cylindrical member is smaller than that of the ceramic substrate.

4. The sample holder according to claim 1, wherein the area of ​​the fifth surface, which is the joining surface with the second surface, is larger than the area of ​​the sixth surface located opposite the fifth surface.

5. The sample holder according to claim 4, wherein the cylindrical member has a flange shape at one end having the fifth surface.

6. The sample holder according to claim 5, wherein one end has a curved corner or edge.

7. The sample holder according to claim 4, wherein the cylindrical member has a groove on the fifth surface.

8. The base plate has a counterbore portion recessed in the thickness direction of the base plate at the opening on the fourth surface side of the through hole. The sealing member is located in the counterbore portion, as described in claim 1.

9. A ceramic substrate and base plate and It comprises a cylindrical member, The ceramic substrate has a first surface which is a sample holding surface and a second surface located opposite the first surface. The base plate has a third surface located on the second surface of the ceramic substrate and facing the second surface, a fourth surface located opposite the third surface, and through holes penetrating the third surface and the fourth surface. Furthermore, it includes a fixing part for mechanically fixing the ceramic substrate and the base plate, The cylindrical member is a member through which a terminal connected to the heating resistor is inserted, and is located in the through hole and joined to the second surface. A sealing member is provided between the inner circumferential surface of the through hole and the outer circumferential surface of the cylindrical member. The base plate is a sample holder having a first protrusion in the middle of the through hole that projects inward from the through hole.

10. A ceramic substrate and base plate and It comprises a cylindrical member, The ceramic substrate has a first surface which is a sample holding surface and a second surface located opposite the first surface. The base plate has a third surface located on the second surface of the ceramic substrate and facing the second surface, a fourth surface located opposite the third surface, and through holes penetrating the third surface and the fourth surface. Furthermore, it includes a fixing part for mechanically fixing the ceramic substrate and the base plate, The cylindrical member is a member through which a terminal connected to the heating resistor is inserted, and is located in the through hole and joined to the second surface. A sealing member is provided between the inner circumferential surface of the through hole and the outer circumferential surface of the cylindrical member. The cylindrical member is a sample holder having a second protrusion projecting toward the base plate at an intermediate point in the thickness direction of the base plate.

11. A ceramic substrate and base plate and It comprises a cylindrical member, The ceramic substrate has a first surface which is a sample holding surface and a second surface located opposite the first surface. The base plate has a third surface located on the second surface of the ceramic substrate and facing the second surface, a fourth surface located opposite the third surface, and through holes penetrating the third surface and the fourth surface. Furthermore, it includes a fixing part for mechanically fixing the ceramic substrate and the base plate, The cylindrical member is a member through which a terminal connected to the heating resistor is inserted, and is located in the through hole and joined to the second surface. A sealing member is provided between the inner circumferential surface of the through hole and the outer circumferential surface of the cylindrical member. An annular member made of metal, located between the cylindrical member and the base plate. It has, The sealing member is a sample holder located in the region surrounded by the base plate, the cylindrical member, and the annular member.

12. The aforementioned base plate is A sample holder according to any one of claims 1 to 11, comprising a heat-resistant member, a cooling member, and an adhesive for joining the heat-resistant member and the cooling member, wherein the heat-resistant member has the third surface and the cooling member has the fourth surface.

13. Ceramic substrate and base plate and It comprises a cylindrical member, The ceramic substrate has a first surface which is a sample holding surface and a second surface located opposite the first surface. The base plate has a third surface located on the second surface of the ceramic substrate and facing the second surface, a fourth surface located opposite the third surface, and through holes penetrating the third surface and the fourth surface. The cylindrical member is located in the through hole and is joined to the second surface. A sealing member is provided between the inner circumferential surface of the through hole and the outer circumferential surface of the cylindrical member. The aforementioned base plate is The device comprises a heat-resistant member, a cooling member, and an adhesive for joining the heat-resistant member and the cooling member, wherein the heat-resistant member has the third surface and the cooling member has the fourth surface. The adhesive is also located between the cooling member and the cylindrical member in the through hole, and the sample holder joins the cooling member and the cylindrical member.

14. Ceramic substrate and base plate and It comprises a cylindrical member, The ceramic substrate has a first surface which is a sample holding surface and a second surface located opposite the first surface. The base plate has a third surface located on the second surface of the ceramic substrate and facing the second surface, a fourth surface located opposite the third surface, and through holes penetrating the third surface and the fourth surface. The cylindrical member is located in the through hole and is joined to the second surface. A sealing member is provided between the inner circumferential surface of the through hole and the outer circumferential surface of the cylindrical member. The aforementioned base plate is The device comprises a heat-resistant member, a cooling member, and an adhesive for joining the heat-resistant member and the cooling member, wherein the heat-resistant member has the third surface and the cooling member has the fourth surface. The adhesive is also located between the heat-resistant member and the cylindrical member in the through hole, and the sample holder joins the heat-resistant member and the cylindrical member.

15. Ceramic substrate and base plate and It comprises a cylindrical member, The ceramic substrate has a first surface which is a sample holding surface and a second surface located opposite the first surface. The base plate has a third surface located on the second surface of the ceramic substrate and facing the second surface, a fourth surface located opposite the third surface, and through holes penetrating the third surface and the fourth surface. The cylindrical member is located in the through hole and is joined to the second surface. A sealing member is provided between the inner circumferential surface of the through hole and the outer circumferential surface of the cylindrical member. The aforementioned base plate is The device comprises a heat-resistant member, a cooling member, and an adhesive for joining the heat-resistant member and the cooling member, wherein the heat-resistant member has the third surface and the cooling member has the fourth surface. The heat-resistant member is a sample holder having a plurality of third protrusions that contact the ceramic substrate and a space located around the third protrusions.

16. The sample holder according to claim 15, wherein the side surface of the third protrusion has a tapered shape that narrows in width toward the ceramic substrate.

17. The sample holder according to claim 15, wherein the surface roughness of the end face of the third protrusion that contacts the ceramic substrate is smaller than the roughness of the bottom surface of the space.

18. The sample holder according to claim 3, wherein the cylindrical member is made of mullite.

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