Mounting plate for attaching a turbopump to the processing module
The introduction of a mounting plate with stronger bolts and an annular liner addresses the challenge of turbopump removal complexity in semiconductor processing systems, enhancing maintenance by preventing bolt deformation and chamber damage during failures.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- LAM RES CORP
- Filing Date
- 2025-04-30
- Publication Date
- 2026-07-23
AI Technical Summary
In semiconductor processing systems, turbopumps mounted directly to processing modules are difficult to remove due to high rotational inertia, leading to bent bolts and potential damage to the module during failures, complicating maintenance and repair.
A mounting plate is introduced between the turbopump and the processing module, with stronger bolts securing it to the module, and an annular liner to protect the chamber from debris, allowing easy removal and replacement of the turbopump.
The mounting plate design prevents bolt deformation and chamber damage during turbopump failures, facilitating easy repair and maintenance by allowing separate removal of the turbopump from the module, thus protecting the processing module and improving maintainability.
Smart Images
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Abstract
Description
Technical Field
[0001] (Cross - Reference to Related Applications) This application claims the benefit of U.S. Provisional Patent Application No. 62 / 983,839, filed on Mar. 2, 2020. The entire disclosure of the application referenced above is incorporated herein by reference.
[0002] This disclosure relates generally to semiconductor processing systems, and more particularly to a mounting plate for attaching a turbopump to a processing module of a substrate processing system.
Background Art
[0003] The background description provided here is for the purpose of generally presenting the context of the present disclosure. Within the scope of the description of this background art, not only the works of the inventors named herein, but also descriptions in other respects that may not be considered prior art at the time of filing are not admitted as prior art to the present disclosure, either explicitly or implicitly.
[0004] A substrate processing system typically includes one or more processing chambers (also called processing modules) for performing deposition, etching, and other processes on a substrate such as a semiconductor wafer. During processing, the substrate is arranged on a substrate support such as a pedestal within the processing chamber of the substrate processing system. During deposition, a gas mixture containing one or more precursors is introduced into the processing chamber, and plasma is applied to activate a chemical reaction. During etching, a gas mixture containing an etching gas is introduced into the processing chamber, and plasma is applied to activate a chemical reaction. A computer - controlled robot typically transfers the substrate from one processing chamber to another in a sequence for processing the substrate.
[0005] Many semiconductor processes are performed in a vacuum. A turbopump may be used to maintain the chamber in a vacuum. In some processes, a pendulum valve is arranged between the turbopump and the bottommost opening leading to the chamber. The turbopump is mounted on the pendulum valve, and the pendulum valve is mounted on the chamber. [Overview of the project]
[0006] The system comprises a processing module, a pump, and a mounting plate. The processing module is configured to process a semiconductor substrate. The processing module has an opening at its lower end and includes a poppet valve arranged within the processing module above the opening. The pump is configured to operate in conjunction with the poppet valve to exhaust gas from the processing module. The mounting plate is arranged above the pump and below the opening at the lower end of the processing module. The mounting plate includes an internal cavity that coincides with the opening and an outer circumference smaller than the lower end of the processing module. The mounting plate includes a first set of holes arranged around the internal cavity and a second set of holes arranged along the outer circumference. A first fastener fastens the pump to the mounting plate through the first set of holes. A second fastener fastens the mounting plate to the processing module through the second set of holes.
[0007] Other features include the system further comprising multiple notches arranged along the outer circumference of the mounting plate. The notches engage with corresponding alignment structures on the lower end of the processing module.
[0008] Another feature of the system is that it further includes an annular liner that lines up the openings at the lower end of the processing module and the internal cavities of the mounting plate.
[0009] In another feature, the mounting plate further includes a notch on its inner surface. The notch extends from the upper surface of the mounting plate to a position above the lower surface of the mounting plate. The notch extends radially outward by a first distance from the inner surface.
[0010] Another feature is that the notch is in fluid communication with an exhaust channel located above the opening at the lower end of the processing module.
[0011] In another feature, the mounting plate further includes a groove for an O-ring, located within the upper surface of the mounting plate and close to the internal cavity, to form a seal between the mounting plate and the processing module.
[0012] Other features include a circular internal cavity and a polygonal outer perimeter.
[0013] Other features include a circular internal cavity and outer perimeter.
[0014] Another characteristic is that the first set of holes has a smaller diameter than the second set of holes.
[0015] Another characteristic is that the second set of holes has fewer holes than the first set of holes.
[0016] Another feature is that at least one of the first set of holes and the second set of holes is threaded.
[0017] Another feature is that the first set of holes are arranged along a circle.
[0018] In other features, the first set of holes are arranged along a first circle having a first diameter. The second set of holes are arranged along a second circle having a second diameter larger than the first diameter. The first and second circles are concentric.
[0019] Another feature is that the outer perimeter is polygonal, and multiple notches are arranged along a single edge of the outer perimeter.
[0020] Other features include a polygonal outer perimeter and multiple notches arranged along multiple edges of the outer perimeter.
[0021] Further features include a mounting plate comprising an upper surface, a lower surface, and an internal cavity. The upper surface of the mounting plate is removablely mountable to a processing module of the substrate processing system. The lower surface of the mounting plate faces the upper surface and is removablely mountable to a pump of the substrate processing system. The internal cavity within the mounting plate extends from the upper surface to the lower surface. The outer surface of the mounting plate extends between the upper and lower surfaces, defining the outer perimeter of the mounting plate. The inner surface of the mounting plate extends between the upper and lower surfaces, within the internal cavity. A first set of holes extends between the upper and lower surfaces. The first set of holes is arranged around the internal cavity. The lower surface of the mounting plate is removablely mountable to the pump by a first fastener that passes through the first set of holes. A second set of holes extends between the upper and lower surfaces. The second set of holes is arranged along the outer perimeter. The upper surface of the mounting plate can be removably attached to the processing module by a second fastener that passes through a second set of holes.
[0022] Other features include the mounting plate further comprising multiple notches arranged along its outer circumference. The notches extend between the upper and lower surfaces.
[0023] In another feature, the mounting plate further includes notches within its inner surface. The notches extend vertically from the upper surface to a first distance up to a maximum above the lower surface. The notches extend radially outward from the inner surface for a second distance.
[0024] In another feature, the mounting plate further includes a groove for an O-ring, located within its upper surface and close to the internal cavity, to form a seal between the mounting plate and the processing module.
[0025] Other features include a circular internal cavity and a polygonal outer perimeter.
[0026] Other features include a circular internal cavity and outer perimeter.
[0027] Another characteristic is that the first set of holes has a smaller diameter than the second set of holes.
[0028] In another feature, the second set of holes has fewer holes than the first set of holes.
[0029] In another feature, at least one of the first set of holes and the second set of holes is threaded.
[0030] In another feature, the first set of holes is arranged along a circle.
[0031] In another feature, the first set of holes is arranged along a first circle having a first diameter. The second set of holes is arranged along a second circle having a second diameter greater than the first diameter. The first circle and the second circle are concentric.
[0032] In another feature, the mounting plate further includes a plurality of notches arranged along an outer outer periphery. The outer outer periphery is polygonal. The plurality of notches are arranged along a single edge of the outer outer periphery.
[0033] In another feature, the mounting plate further includes a plurality of notches arranged along an outer outer periphery. The outer outer periphery is polygonal. The plurality of notches are arranged along a plurality of edges of the outer outer periphery.
[0034] In another feature, the system includes a mounting plate, a first fastener and a second fastener, a pump, and a processing module. The pump is mounted on a lower surface of the mounting plate by the first fastener. The upper surface of the mounting plate is mounted on a lower end portion of the processing module by the second fastener.
[0035] In another feature, the lower end portion of the processing module has an outer periphery larger than the outer outer periphery of the mounting plate and has an opening that coincides with an internal cavity within the mounting plate. The system further includes an annular liner that aligns the opening and the internal cavity in a row.
[0036] Other features include a notch on the inner surface of the mounting plate. The notch extends from the upper surface to a position above the lower surface. The notch extends radially outward by a distance of 1 from the inner surface. The notch is in fluid communication with an exhaust channel located above an opening at the lower end of the processing module.
[0037] The areas to which this disclosure may apply will become further apparent from the detailed description, claims, and drawings. The detailed description and specific examples are intended for illustrative purposes only and are not intended to limit the scope of this disclosure.
[0038] This disclosure will be better understood from the detailed description and accompanying drawings. [Brief explanation of the drawing]
[0039] [Figure 1] This is a cross-sectional view of the lower portion of the processing module, including the internal poppet valve and turbopump (internal components omitted) that are directly mounted on the processing module.
[0040] [Figure 2] This is a cross-sectional view of the internal poppet valve and turbopump (internal components omitted) mounted on the mounting plate according to this disclosure, as well as the lower portion of the processing module with the mounting plate mounted on the processing module.
[0041] [Figure 3] This is a perspective view of an example of a mounting plate according to this disclosure.
[0042] [Figure 4] This is a bottom view of the turbopump, mounting plate, and processing module according to the present disclosure.
[0043] [Figure 5]This is a cross-sectional view of the lower portion of a processing module, including a poppet valve and liner, with a turbopump (internal components omitted) mounted at the bottom of the processing module using the mounting plate shown in Figure 3, according to the present disclosure.
[0044] [Figure 6] This is a cross-sectional view of a portion of a processing module showing a partial notch on a mounting plate communicating with the exhaust channel of the processing module, as disclosed herein. [Modes for carrying out the invention]
[0045] In drawings, reference numbers are sometimes reused to identify similar and / or identical elements.
[0046] A turbopump is used to exhaust process gas from the process module (PM). The turbopump rotates at high speed (e.g., 28,000 RPM) and has high rotational inertia. The turbopump may fail if debris from the process module becomes trapped in its rotor. When the turbopump fails, its high rotational inertia can bend the bolts that attach the turbopump to the process module. As a result, the bolts cannot be easily removed. Depending on the severity of the turbopump failure, the bottom of the process module may also be damaged.
[0047] In circuit board processing systems using pendulum valves, the bolts between the turbopump and the pendulum valve can bend when a failure occurs. However, the turbopump and pendulum valve can usually still be removed using the bolts between the pendulum valve and the processing module.
[0048] In other substrate processing systems that use poppet valves, the turbopump is mounted directly to the bottom of the processing module, and the poppet valves are nested between the turbopump and the processing module. When the turbopump fails in these substrate processing systems, it is difficult to remove the turbopump from the processing module.
[0049] To protect the processing module and improve the maintainability of the turbopump, a mounting plate according to this disclosure is arranged between the turbopump and the bottom of the processing module. The turbopump is mounted on the mounting plate, and the mounting plate is mounted on the processing module. When the turbopump fails, the bolts that attach the turbopump to the mounting plate may bend, but the bolts that attach the mounting plate to the bottom of the processing module will not bend. Accordingly, the mounting plate protects the bottom of the processing module from damage caused by the turbopump failure. Furthermore, the mounting plate is easily removable from the processing module. Accordingly, after a failure, the turbopump can be repaired by first removing the mounting plate from the processing module, and then removing the turbopump from the mounting plate. After repair, the turbopump can be coupled to the bottom of the processing module using the same mounting plate, or using a different mounting plate if the mounting plate is damaged.
[0050] In addition, the Disclosure provides an annular liner that aligns a row of openings at the bottom of the processing module through which a turbopump exhausts process gases from the processing module. When the turbopump fails, chunks or fragments of metal debris originating from a broken rotor may damage a portion of the chamber wall near the openings at the bottom of the processing module. In the event of a turbopump failure, the annular liner protects the chamber wall near the openings at the bottom of the processing module by preventing debris from striking the chamber wall near the openings at the bottom of the processing module. These and other features of the Disclosure are described in detail below.
[0051] Figure 1 shows a turbopump 102 directly connected to the processing module 100. Internal components of the turbopump 102, such as the stator and rotor, are omitted in all figures. A poppet valve 110 is nested between the processing module 100 and the turbopump 102. The poppet valve 110 includes a plate moved by an actuator 112 to alter the gas flow between the processing module 100 and the turbopump 102. Opening the poppet valve 110 allows the turbopump 102 to control the pressure and / or exhaust the processing gas from the processing module 100.
[0052] The O-rings are arranged in a groove 111 located in the upper interior portion of the bottom wall of the processing module 100. The O-rings in the groove 111 surround the opening at the bottom of the processing module 100. When the poppet valve 110 is closed, the plate of the poppet valve 110 firmly presses against the O-rings in the groove 111, thereby sealing the processing module 100.
[0053] In this design, the turbopump 102 is bolted directly to the bottom of the processing module 100 by bolts 114. O-rings are arranged in grooves 115 provided within the flange of the turbopump 102 to seal the top of the turbopump 102 against an opening at the bottom of the processing module 100. When the turbopump 102 fails while rotating, the bolts 114 may bend due to the relatively high rotational inertia of the turbopump 102. The bolts 114 are difficult to access and remove. Furthermore, depending on the severity of the turbopump 102 failure, the bending of the bolts 114 may further damage the bottom of the processing module 100.
[0054] Figure 2 shows a turbopump 102 connected to a processing module 100 by a mounting plate 120 according to this disclosure. A poppet valve 110 is nested between the turbopump 102 and the processing module 100. When closed, the poppet valve 110 and the O-ring in the groove 111 seal the processing module 100. The turbopump 102 is mounted on the lower surface of the mounting plate 120 by bolts 122. The O-ring in the groove 115 seals the uppermost part of the turbopump 102 against the lower surface of the mounting plate 120.
[0055] The mounting plate 120 (specifically, the upper surface of the mounting plate 120) is directly mounted to the bottom of the processing module 100 by bolts 124. The bolts 124 can be larger in size than the bolts 122 (and therefore heavier and stronger to withstand shear forces). There can be more bolts 124 than bolts 122.
[0056] The O-rings are arranged in grooves 121 located on the upper surface of a mounting plate 120 mounted on the bottom wall of the processing module 100. The grooves 121 are close to the inner diameter of the mounting plate 120 (or the internal cavity within the mounting plate 120) (as shown in Figure 3). When the mounting plate is mounted on the bottom wall of the processing module 100, the O-rings in the grooves 121 pass through and surround the opening at the bottom of the processing module 100, providing a seal between the mounting plate 120 and the opening at the bottom of the processing module 100.
[0057] In this design, when the turbopump 102 fails, bolt 122 may bend due to the relatively high rotational inertia of the turbopump 102. However, bolt 124 does not bend. Accordingly, when the turbopump 102 fails, the mounting plate 120 is removed from the processing module 100 by removing bolt 124. The turbopump 102 can then be removed from the mounting plate 120 by removing bolt 122. The turbopump 102 can be repaired. After repair, the turbopump 102 can be mounted on the same mounting plate 120 or a different mounting plate 120 using new bolt 122. The mounting plate 120 with the turbopump 102 can be mounted at the bottom of the processing module 100 by bolt 124.
[0058] Figure 3 shows the mounting plate 120 in more detail. The specific geometry of the mounting plate 120 is shown and described below, but other geometries can be used. For example, the mounting plate 120 includes an outer circumference 152 and an internal cavity 148 defining an inner diameter 150. The inner diameter 150 is slightly larger than, or substantially equal to, the diameter of the opening at the bottom of the processing module 100 (see Figure 5). As a mere example, the outer circumference 152 (i.e., the outer shape) of the mounting plate 120 is shown as octagonal. However, the outer circumference 152 of the mounting plate 120 can have different shapes for different processing modules and may be determined by the arrangement of other components located on the bottom of the processing module 100. For example, in some applications, the outer circumference 152 of the mounting plate 120 may be polygonal (e.g., pentagon, hexagon, heptagon, triangle, rectangle, square, etc.). In some applications, the outer circumference 152 of the mounting plate 120 may be oval or circular. In some applications, the outer circumference 152 of the mounting plate 120 may have an irregular shape.
[0059] The outer perimeter 152 of the mounting plate 120 includes multiple notches 154 to allow alignment of the mounting plate 120 with the corresponding component located at the bottom of the processing module 100 (see Figure 4). In some examples, the notches 154 are asymmetrical, allowing installation in only one orientation. As a result, the notches 154 help ensure that the mounting plate 120 is correctly installed in a specific orientation relative to the surrounding components.
[0060] As a mere example, the notch 154 is shown on one edge of the outer perimeter 152 of the mounting plate 120. In some applications, additional notches may be located on other edges of the outer perimeter 152 of the mounting plate 120. Furthermore, the size and shape of the notch 154 may vary. For example, in some applications, the notch 154 does not need to extend the entire vertical thickness (i.e., height) of the mounting plate 120 from edge to edge. Rather, the notch 154 can partially extend through the vertical thickness (i.e., height) of the mounting plate 120 from the turbopump side and / or the processing module side.
[0061] The mounting plate 120 includes a first set of threaded holes 160 arranged in close proximity to the inner diameter 150 of the mounting plate 120. For example, the first set of threaded holes 160 are arranged in close proximity to the groove 121. In some examples, the first set of threaded holes 160 are arranged within a first circle having a first diameter. The first set of threaded holes 160 receive bolts 122 for fastening the turbopump 102 to the mounting plate 120 (see Figures 2 and 4). In some examples, the number of holes in the first set of threaded holes 160 is equal to the number of mounting holes on the turbopump 102.
[0062] Although not shown, a second (reserve) set of threaded holes can be provided that are similar to the first set of threaded holes 160, concentric with respect to the first set of threaded holes 160, and rotated and offset from the first set of threaded holes 160. The second (reserve) set of threaded holes can serve as a substitute for the first set of threaded holes 160 if one or more of the first set of threaded holes 160 are deformed or damaged when the turbopump 102 fails. In some embodiments, the first set of threaded holes 160 and the second (reserve) set of threaded holes can be arranged in different configurations to adapt to different mounting geometry of different turbopumps.
[0063] The mounting plate 120 includes a second set of holes 162 arranged close to the outer circumference 152 of the mounting plate 120. In some examples, the second set of holes 162 are arranged within a second circle having a second diameter larger than the first diameter. For example, the first and second circles can be concentric. Bolts 124 pass through the second set of holes 162 (see Figures 2 and 4) and fasten the mounting plate 120 into threaded holes at the bottom of the processing module 100.
[0064] The second set of holes 162 are positioned further from the center of the mounting plate 120 than the first set of threaded holes 160. As a mere example, the second set of holes 162 are shown to be positioned at the intersection of the edges of the outer circumference 152. However, the second set of holes 162 can be positioned anywhere along the outer circumference 152. Furthermore, although the second set of holes 162 are shown to be symmetrically distributed along the edges of the outer circumference 152, the arrangement of the second set of holes 162 can be asymmetrical along the edges of the outer circumference 152. In some embodiments, the second set of holes 162 can also be arranged in different configurations to suit different mounting geometry of different processing modules.
[0065] Accordingly, the mounting plate 120 generally includes an upper surface 140, a lower surface 142, an outer surface 144 extending between the upper surface 140 and the lower surface 142 and defining an outer circumference 152, and an inner surface 146 extending between the upper surface 140 and the lower surface 142 and defining an internal cavity 148 of the mounting plate 120. A first set of threaded holes 160 extend between the upper surface 140 and the lower surface 142 and are arranged in a circle around the internal cavity 148. A second set of holes 162 extend between the upper surface 140 and the lower surface 142 and are arranged along the outer circumference 152. Notches 154 are arranged along the outer circumference 152. The mounting plate 120 can be made from a metal or alloy having relatively high mechanical strength.
[0066] When used in a conductive etching module, the mounting plate 120 (shown as mounting plate 123 in Figure 6) differs from the mounting plate 120 described above in having two features suitable for use in a dielectric etching module, for the purpose of exhausting inert gas. First, the mounting plate 123 has a larger inner diameter than the inner diameter 150 of the mounting plate 120 used in a dielectric etching module. Second, the mounting plate 123 includes an additional partial notch 166. As will be explained below with reference to Figure 6, these features (i.e., the larger inner diameter and the additional partial notch 166), along with a shorter liner than the liner used in a dielectric etching module, help to exhaust inert gas in the conductive etching module.
[0067] Figure 4 shows a bottom view of the turbopump 102, mounting plate 120, and processing module 100. The upper end of the turbopump 102 includes a radial flange 170. The radial flange 170 includes a circumferentially elongated hole 172 that provides a variation in rotational alignment. The hole 172 aligns with a first set of threaded holes 160 in the mounting plate 120. Bolts 122 fasten the turbopump 102 to the mounting plate 120 by passing through the radial flange 170, the hole 172, and the first set of threaded holes 160. Bolts 124 fasten the mounting plate 120 to the bottom of the processing module 100 by passing through a second set of holes 162. Thus, bolt 122 may deform when the turbopump 102 fails and is difficult to access and remove, whereas bolt 124 does not deform when the turbopump 102 fails and is easier to access and remove, thereby making it easier to repair the turbopump 102.
[0068] Figure 5 shows a cross-sectional view of the lower portion of the processing module 100. The turbopump 102 is mounted to the bottom of the processing module 100 by a mounting plate 120. The poppet valve 110 is shown in the closed position. The liner 180 lines up the bottom opening of the processing module 100. The liner 180 is annular and includes a flange 182. The flange 182 extends radially outward and rests on an annular recess 184 formed on the upper portion of the opening of the processing module 100. The liner 180 extends downward from the flange 182, through the opening, past the bottom of the processing module 100, to the top of the turbopump 102. The liner 180 extends to the point where the turbopump 102 is mounted to the mounting plate 120. When the turbopump 102 fails, the liner 180 prevents any debris from the turbopump 102 from striking the chamber wall 186 near the opening at the bottom of the processing module 100. As a result, when the turbopump 102 fails, the liner 180 protects the chamber wall 186 near the opening at the bottom of the processing module 100 from airborne debris.
[0069] The outer circumference of the liner 180 (excluding flange 182) is slightly shorter than, or substantially equal to, the diameter of the opening at the bottom of the processing module 100. The outer diameter of the liner 180 (excluding flange 182) is slightly shorter than, or substantially equal to, the inner diameter 150 of the mounting plate 120. The inner diameter of the liner 180 is shorter than the diameter of the opening at the bottom of the processing module 100. The inner diameter of the liner 180 is shorter than the inner diameter 150 of the mounting plate 120. The outer diameter of flange 182 is larger than the diameter of the opening at the bottom of the processing module 100. The outer diameter of flange 182 is larger than the inner diameter 150 of the mounting plate 120. The liner 180 is removable. The inner diameter 150 of the mounting plate 120 and the length (or height) of the liner 180 shown in Figure 5 are suitable for use in various etching processing modules. Furthermore, the inner diameter 150 of the mounting plate 120 may be suitable for use with different mounting geometry of different turbopumps, and similarly, the outer circumference 152 of the mounting plate 120 may be suitable for use with different mounting geometry of different processing modules.
[0070] Figure 6 shows a partial cross-sectional view of a processing module 101 with an example of a mounting plate 123 suitable for use in a conductor etching processing module. The mounting plate 123 includes a partial notch 166. In this example, the processing module 101 performs the conductor etching process and includes a liner 181 and an exhaust channel 190 of the processing module 101. The exhaust channel 190 is used for inert gas exhaust. The inner diameter of the mounting plate 123 is larger than the inner diameter 150 of the mounting plate 120 shown in Figure 5. Furthermore, the liner 181 is shorter (in height or length) than the liner 180 shown in Figure 5 (difference in height or length). diff (Indicated by a dotted line).
[0071] The partial notch 166 is so named because the bottom portion of the mounting plate 123 (on the turbopump 102 side) is not notched from end to end. That is, the partial notch 166 does not extend through the lower surface 142 of the mounting plate 123. Rather, the partial notch 166 extends vertically downward along the inner surface 146 from the upper surface 140 to a short distance above the lower surface 142, and then extends radially outward for a relatively short distance from the inner surface 146. Accordingly, the height of the partial notch 166 from the upper surface 140 to a short distance above the lower surface 142 is shorter than the vertical thickness or height of the mounting plate 123. The depth or width of the partial notch 166 (i.e., the distance the partial notch extends radially outward from the inner surface 146) is much shorter than the height of the partial notch 166. The partial notch 166 aligns with the notch 192 within the chamber wall 186 of the processing module 101.
[0072] The larger the inner diameter of the mounting plate 123, the shorter the liner 181 becomes (compared to the corresponding parameters shown in Figure 5), and the additional partial notches 166 within the mounting plate 123 allow for inert gas exhaust through the exhaust channels 190 during the conductor etching process performed by the processing module 101.
[0073] The foregoing descriptions are merely illustrative and not intended to limit the disclosure, its uses, or its applications. The broad teachings of this disclosure can be implemented in various forms. Therefore, although this disclosure includes certain examples, the true scope of this disclosure should not be limited to these examples, as other modifications become apparent upon study of the drawings, specification, and the claims below. It should be understood that one or more steps within the framework of the method may be performed in different orders (or simultaneously) without altering the principles of this disclosure. Furthermore, while each embodiment is described above as having certain features, any one or more of those features described with respect to any embodiment of this disclosure can be implemented in any feature of any other embodiment, and / or combined with any feature of any other embodiment, even if such combination is not explicitly described. In other words, the embodiments described are not mutually exclusive, and the substitution of one or more embodiments with another is also within the scope of this disclosure.
[0074] Spatial and functional relationships between elements (for example, between modules, circuit elements, semiconductor layers, etc.) are described using a variety of terms, including “connected,” “engaged,” “joined,” “adjacent,” “next to,” “on top of,” “above,” “below,” and “located.” Unless explicitly stated as “direct,” when the above disclosure describes a relationship between a first element and a second element, that relationship may be a direct relationship in which no other intervening elements exist between the first and second elements, or it may be an indirect relationship in which one or more intervening elements exist (spatially or functionally) between the first and second elements. When used herein, the phrase “at least one of A, B, and C” should be interpreted as meaning the logic using the non-exclusive logic OR (A OR B OR C, A or B or C), and not as “at least one of A, at least one of B, and at least one of C.”
Claims
1. It is a mounting plate, The upper surface of the mounting plate, which is removablely attached to the processing module of the substrate processing system, The lower surface of the mounting plate, which is opposite to the upper surface and can be removably attached to the pump of the substrate processing system, The inner diameter of the mounting plate extending from the upper surface to the lower surface, The outer surface of the mounting plate extends between the upper surface and the lower surface and defines the outer circumference of the mounting plate, The inner surface of the mounting plate extending along the inner diameter between the upper surface and the lower surface, A first set of holes arranged around the inner diameter and extending between the upper surface and the lower surface, wherein the lower surface of the mounting plate has a first set of holes through which it can be detachably attached to the pump by a first fastener passing through the first set of holes, A second set of holes, arranged along the outer circumference, extending between the upper surface and the lower surface, wherein the upper surface of the mounting plate is removablely attached to the processing module by a second fastener passing through the second set of holes. A mounting plate equipped with the following features.
2. A mounting plate according to claim 1, further comprising a plurality of notches arranged along the outer circumference extending between the upper surface and the lower surface.
3. A mounting plate according to claim 1, further comprising a notch within the inner surface, wherein the notch extends vertically upward from the lower surface by a maximum distance of a first distance from the upper surface and extends radially outward by a distance of a second distance from the inner surface.
4. A mounting plate according to claim 1, further comprising a groove for an O-ring, located within the upper surface and close to the inner diameter, which forms a seal between the mounting plate and the processing module.
5. A mounting plate according to claim 1, The aforementioned mounting plate has a polygonal outer circumference.
6. A mounting plate according to claim 1, wherein the outer circumference of the mounting plate is circular.
7. A mounting plate according to claim 1, wherein the first set of holes has a smaller diameter than the second set of holes.
8. A mounting plate according to claim 1, wherein the second set of holes includes fewer holes than the first set of holes.
9. A mounting plate according to claim 1, wherein at least one of the holes in the first set of holes and the second set of holes is threaded.
10. A mounting plate according to claim 1, wherein the first set of holes are arranged along a circle.
11. A mounting plate according to claim 1, The first set of holes are arranged along a first circle having a first diameter, The second set of holes are arranged along a second circle having a second diameter larger than the first diameter. A mounting plate in which the first circle and the second circle are concentric.
12. A mounting plate according to claim 1, further comprising a plurality of notches arranged along the outer circumference, The outer perimeter is a polygon, The plurality of notches are arranged along a single edge of the outer circumference of the mounting plate.
13. A mounting plate according to claim 1, further comprising a plurality of notches arranged along the outer circumference, The outer perimeter is a polygon, The aforementioned multiple notches are arranged along multiple edges of the outer circumference of the mounting plate.
14. It is a system, The mounting plate described in claim 1, A first fastener and a second fastener, The pump mounted on the lower surface of the mounting plate by the first fastener, A system comprising a processing module, wherein the upper surface of the mounting plate is mounted on the lower end of the processing module by the second fastener.
15. The system according to claim 14, wherein the lower end of the processing module has an outer circumference larger than the outer outer circumference of the mounting plate and has an opening that matches the inner diameter of the mounting plate, and the system further comprises an annular liner that aligns the opening and the inner diameter in a line.
16. The system according to claim 15, wherein the mounting plate includes a notch on its inner surface, the notch extending from the upper surface to a location above the lower surface, extending radially outward by a first distance from the inner surface, and the notch being in fluid communication with an exhaust channel located above the opening at the lower end of the processing module.