Laser-based quartz transmittance analyzer for semiconductors

Abstract

The present invention relates to a semiconductor quartz transmittance analyzer using a multi-wavelength laser, which comprises an upper laser output upper stage, which comprises an upper base plate, a first upper stage mounting table provided on one side of the upper base plate, a laser fiber provided on the first upper stage mounting table and irradiating a laser beam downward, a second upper stage mounting table provided on the other side of the upper base plate, an aperture provided on the second upper stage mounting table and adjusting the size of the laser beam irradiated from the laser fiber, and an upper convex lens provided on the second upper stage mounting table and adjusting the focus of the laser beam whose size has been adjusted; a quartz plate stage moving unit consisting of a moving block movable in the X and Y directions and a quartz plate fixing frame coupled to the moving block for fixing the quartz plate; and a lower laser receiving unit consisting of a lower base plate provided below the upper base plate, a first lower placement stage provided on one side of the lower base plate, a lower convex lens provided on the first lower placement stage for adjusting the focus of the laser beam transmitted through the quartz plate, a second lower placement stage provided on the other side of the lower base plate, and a laser detector provided on the second lower placement stage for detecting the laser beam transmitted through the lower convex lens.

Description

Technical Field

[0001] The present invention relates to a quartz transmittance analyzer for semiconductors using a multi-wavelength laser.

Background Art

[0002] Generally, in the semiconductor manufacturing process, a quartz plate is used to prevent contamination of a silicon wafer during a high-temperature heat process and to support the silicon wafer. However, when the high-temperature heat process is repeated multiple times, the quartz plate is contaminated. As a result, the transmittance of high-temperature radiant energy changes, and the distribution of the surface resistance value (Rs) of the silicon wafer may change.

[0003] Therefore, in order to prevent process defects due to excessive contamination of the quartz plate (for example, a yield reduction due to a transmittance of 50% or less), the quartz plate is washed and reused at regular intervals. However, since there is no objective data regarding the reusability of the quartz plate and it relies on subjective judgment, it frequently occurs that the quartz plate is arbitrarily discarded regardless of its condition, resulting in an increase in semiconductor manufacturing costs and environmental pollution.

[0004] The above information disclosed in the technology that is the background of such an invention is for deepening the understanding of the background of the present invention and may include information that does not constitute the prior art.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The problem to be solved by the present invention is to provide a quartz transmittance analyzer for semiconductors using a multi-wavelength laser.

[0006] As an example, the problem that the present invention aims to solve is to provide a semiconductor quartz transmittance analyzer using a multi-wavelength laser that can objectively analyze whether a quartz plate can be reused by measuring the transmittance of the quartz plate using a laser in order to determine whether or not the quartz plate is contaminated during a high-temperature thermal process and whether or not it is in a cleaned state. [Means for solving the problem]

[0007] The semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention comprises: an upper base plate; an upper first placement stage provided on one side of the upper base plate; a laser fiber provided on the upper first placement stage that irradiates a laser beam downward; an upper second placement stage provided on the other side of the upper base plate; an aperture provided on the upper second placement stage that adjusts the size of the laser beam irradiated from the laser fiber; and an upper convex lens provided on the upper second placement stage that adjusts the focus of the size-adjusted laser beam; an upper laser output stage comprising: an upper base plate provided below the upper base plate; and a stage base plate provided below the upper base plate; A quartz plate stage moving section comprising: a movable block provided on the stage base plate so as to be movable in the X and Y directions; and a quartz plate fixing frame coupled to the movable block for fixing a quartz plate; and a laser light receiving lower section comprising: a lower base plate provided below the upper base plate; a lower first placement platform provided on one side of the lower base plate; a lower convex lens provided on the lower first placement platform for adjusting the focus of the laser beam that has passed through the quartz plate; a lower second placement platform provided on the other side of the lower base plate; and a laser detector provided on the lower second placement platform for detecting the laser beam that has passed through the lower convex lens.

[0008] In some examples, the upper opaque windows provided on at least three surfaces of the upper base plate of the laser output upper section to prevent external light from being transmitted to the interior may further include; and stage opaque windows provided on at least three surfaces of the stage base plate of the quartz plate stage moving section to prevent external light from being transmitted to the interior.

[0009] In some examples, the upper base plate of the upper laser output section may further include an upper through-hole so that the laser beam can pass through, and the stage base plate of the quartz plate stage moving section may further include a stage through-hole so that the laser beam can pass through.

[0010] In some examples, the quartz plate fixing frame may include a first fixing frame coupled to the movable block, a second fixing frame tiltably coupled to the first fixing frame, a third fixing frame coupled to the second fixing frame on which the quartz plate is secured, and tilt bolts provided between the first and second fixing frames for adjusting the tilt angle of the second fixing frame relative to the first fixing frame.

[0011] In some examples, the laser fiber in the upper part of the laser output can irradiate the quartz plate with a laser beam in a spiral pattern from the center to 100 to 500 points. In some examples, the upper laser output section may further include a HEPA filter provided for filtering out fine dust from the outside. In some examples, the position of the quartz plate may be located within the Rayleigh range.

[0012] In some examples, the stage base plate of the quartz plate stage movement section may further include a load cell provided for sensing the weight of the quartz plate.

[0013] In some examples, the quartz plate fixing frame may include a circular ring formed in an annular shape, a plurality of connecting bars extending outward from the circular ring, and a square ring formed in a square annular shape connected to the plurality of connecting bars.

[0014] In some examples, the stage base plate of the quartz plate stage movement section may further include a confocal laser scanning microscope provided for measuring the surface roughness of the quartz plate. [Effects of the Invention]

[0015] This invention provides a quartz transmittance analyzer for semiconductors using a multi-wavelength laser.

[0016] As an example, the present invention provides a semiconductor quartz transmittance analyzer using a multi-wavelength laser that can objectively analyze whether a quartz plate can be reused by measuring the transmittance of the quartz plate using a laser in order to determine whether or not the quartz plate is contaminated during a high-temperature thermal process and whether or not it is in a cleaned state. [Brief explanation of the drawing]

[0017] [Figure 1] These are perspective views, front views, top views, and side views illustrating an exemplary quartz transmittance analyzer for semiconductors using a multi-wavelength laser according to the present invention. [Figure 2] These are perspective views, front views, top views, and side views illustrating an exemplary quartz transmittance analyzer for semiconductors using a multi-wavelength laser according to the present invention. [Figure 3] These are perspective views, front views, top views, and side views illustrating an exemplary quartz transmittance analyzer for semiconductors using a multi-wavelength laser according to the present invention. [Figure 4] These are perspective views, front views, top views, and side views illustrating an exemplary quartz transmittance analyzer for semiconductors using a multi-wavelength laser according to the present invention. [Figure 5] These are perspective views, front views, top views, and side views illustrating an exemplary quartz transmittance analyzer for semiconductors using a multi-wavelength laser according to the present invention. [Figure 6] Perspective view, front view, plan view, and side view showing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 7] Perspective view, front view, plan view, and side view showing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 8] Perspective view and front view showing the upper laser output part of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 9] Perspective view and front view showing the upper laser output part of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 10] Perspective view showing the lower laser light receiving part of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 11] Perspective view showing the lower laser light receiving part of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 12] Perspective view showing the window closed state, window open state, and disassembled state of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 13] Perspective view showing the window closed state, window open state, and disassembled state of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 14] Perspective view showing the window closed state, window open state, and disassembled state of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 15] Perspective view and exploded perspective view showing the quartz fixing frame of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 16] Perspective view and exploded perspective view showing the quartz fixing frame of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 17] Perspective view and exploded perspective view showing the quartz fixing frame of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 18] This figure shows an exemplary quartz plate and transmission coordinate setting state used in a semiconductor quartz transmittance analyzer using an exemplary multi-wavelength laser according to the present invention. [Figure 19] This is a perspective view showing a semiconductor quartz transmittance analyzer using an exemplary multi-wavelength laser according to the present invention, installed in a darkroom. [Figure 20] This figure shows an exemplary HEPA filter that can be further attached to a semiconductor quartz transmittance analyzer using an exemplary multi-wavelength laser according to the present invention. [Figure 21] This figure shows an example of how to improve the reliability of a quartz transmittance analyzer for semiconductors using an exemplary multi-wavelength laser according to the present invention. [Figure 22] This figure shows an example of the placement position of the quartz plate in a quartz transmittance analyzer for semiconductors using an exemplary multi-wavelength laser according to the present invention. [Figure 23] This figure shows an exemplary sensing unit, control unit, and display unit to be further attached to an exemplary multi-wavelength laser-based quartz transmittance analyzer for semiconductors according to the present invention. [Figure 24] This figure shows the installation position and elevation position of a load cell further attached to an exemplary multi-wavelength laser-based quartz transmittance analyzer for semiconductors according to the present invention. [Figure 25] This figure shows the installation position and elevation position of a load cell further attached to an exemplary multi-wavelength laser-based quartz transmittance analyzer for semiconductors according to the present invention. [Figure 26] This figure shows an exemplary mounting frame to be attached to a quartz transmittance analyzer for semiconductors using an exemplary multi-wavelength laser according to the present invention. [Figure 27] This figure shows an exemplary confocal laser scanning microscope that can be further attached to a semiconductor quartz transmittance analyzer using an exemplary multi-wavelength laser according to the present invention. [Modes for carrying out the invention]

[0018] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0019] This invention is provided to more fully explain the invention to those who are ordinary skill in the art, and the following embodiments can be modified in various ways, and the scope of the invention is not limited to these embodiments. Rather, these embodiments are provided to further enrich and complete this disclosure and to fully convey the idea of ​​the invention to those skilled in the art.

[0020] Furthermore, the thicknesses and dimensions of each layer in the following drawings are exaggerated for illustrative purposes and clarity, and the same reference numerals in the drawings refer to the same element. As used herein, the term "and / or" includes any one or all combinations of any one or more of the listed items. Also herein, "connected" means not only when member A and member B are directly connected, but also when member A and member B are indirectly connected by member C interposed between them.

[0021] The terms used herein are used to describe specific embodiments and are not intended to limit the invention. As used herein, a singular form can include multiple forms unless the context expressly specifies otherwise. Also, as used herein, “comprise, include and / or comprising, including” specifies the presence of the shape, figure, step, action, member, element and / or group thereof mentioned, and does not exclude the presence or addition of one or more other shapes, figures, actions, members, elements and / or groups thereof.

[0022] In this specification, terms such as "first," "second," etc., are used to describe various members, parts, regions, layers, and / or parts, but it is clear that these members, parts, regions, layers, and / or parts should not be limited by these terms. These terms are used solely to distinguish one member, part, region, layer, or part from another region, layer, or part. Accordingly, the first member, part, region, layer, or part described below may refer to the second member, part, region, layer, or part without departing from the teachings of the present invention.

[0023] Space-related terms such as "beneath," "below," "lower," "above," and "upper" can be used to facilitate understanding of one element or feature shown in the drawings in relation to other elements or features. Such space-related terms are intended to facilitate understanding of the invention in relation to various process states or uses of the invention, and are not intended to limit the invention. For example, if an element or feature in a drawing is reversed, an element or feature described as "beneath" or "below" becomes "above" or "upper." Therefore, "below" is a concept that encompasses "above" or "below."

[0024] Furthermore, the control unit (controller) and / or other related equipment or components according to the present invention can be implemented using any suitable hardware, firmware (e.g., application-specific semiconductors), software, or a suitable combination of software, firmware, and hardware. For example, various components of the control unit (controller) and / or other related equipment or components according to the present invention may be formed on a single integrated circuit chip or on separate integrated circuit chips. Also, various components of the control unit (controller) may be implemented on a flexible printed circuit film, or formed on a tape carrier package, a printed circuit board, or on the same substrate as the control unit (controller). Also, various components of the control unit (controller) may be processes or threads executed by one or more processors in one or more computing devices, which can execute computer program instructions and interact with other components in order to perform the various functions described below. Computer program instructions are stored in memory executable in a computing device using a standard memory device such as random access memory. Also, computer program instructions may be stored in other non-transitory computer readable media such as a CD-ROM or flash drive. Furthermore, those skilled in the art will be able to combine the functions of various computing devices, integrate them into a single computing device, or distribute the functions of a particular computing device across one or more other computing devices without departing from the exemplary embodiments of the present invention.

[0025] As an example, the control unit (controller) according to the present invention can be operated using a typical commercial computer consisting of a central processing unit, a mass storage device such as a hard disk or solid-state disk, a volatile memory device, an input device such as a keyboard or mouse, and an output device such as a monitor or printer.

[0026] Figures 1 to 7 are perspective views, front views, plan views, and side views of an exemplary semiconductor quartz transmittance analyzer 100 using a multi-wavelength laser according to the present invention; Figures 8 and 9 are perspective views and front views of the upper laser output section 110 of the exemplary semiconductor quartz transmittance analyzer 100 using a multi-wavelength laser according to the present invention; Figures 10 and 11 are perspective views of the lower laser receiving section 130 of the exemplary semiconductor quartz transmittance analyzer 100 using a multi-wavelength laser according to the present invention; and Figures 12 to 14 are perspective views showing the window closed, window open, and disassembled state of the exemplary semiconductor quartz transmittance analyzer 100 using a multi-wavelength laser according to the present invention.

[0027] As shown in Figures 1 to 14, an exemplary multi-wavelength laser-based quartz transmittance analyzer 100 for semiconductors according to the present invention may include an upper laser output unit 110, a quartz plate stage moving unit 120, and a lower laser light receiving unit 130. In some examples, the quartz transmittance analyzer 100 may further include a computer for controlling the device, the computer may be connected to a keyboard and / or mouse as input devices and a monitor for displaying information.

[0028] The upper laser output section 110 may include an upper base plate 111, an upper first placement platform 112, a laser fiber 113, an upper second placement platform 115, an aperture 116, and an upper convex lens 117.

[0029] The upper base plate 111 is substantially flat and may include an upper through-hole to allow the laser beam to pass through to the lower part. The upper first mounting base 112 may be provided on one side of the upper base plate 111, for example on one side of the through-hole, in a form that extends and protrudes upward. The laser fiber 113 is provided on the upper first mounting base 112 and can irradiate the laser beam through the through-hole. In some examples, a laser module and a laser power supply may be further connected to the laser fiber 113. The upper second mounting base 115 may be provided on the other side of the upper base plate 111, for example on the other side of the through-hole, in a form that extends and protrudes upward. The aperture 116 is provided on the upper second mounting base 115 and can adjust the size of the laser beam irradiated from the laser fiber 113. The upper convex lens 117 is mounted on the upper second mounting base 115 and adjusts the focus of the size-adjusted laser beam to irradiate the lower part of the through-hole. The quartz plate stage moving section 120 may include a stage base plate 121, a moving block 122, and a quartz plate fixing frame 123.

[0030] The stage base plate 121 is substantially flat and may include a large stage through-hole to allow the laser beam to pass through to the bottom. In some examples, the size of the stage through-hole may be larger than the size of the upper through-hole. In some examples, a number of columns of a certain length may be provided between the stage base plate 121 and the upper base plate 111.

[0031] The movable block 122 may be provided on the stage base plate 121 so as to be movable in the X and Y directions. In some examples, the movable block 122 may include an X block for moving the quartz plate fixing frame 123 in the X direction, and a Y block for moving the quartz plate fixing frame 123 in the Y direction. As is well known, the movable block 122 may include blocks, rails, balls, belts, electric motors, etc.

[0032] The quartz plate fixing frame 123 is coupled onto the movable block 122 to fix the quartz plate, and may also include through holes so that the laser beam passes through the quartz plate and is irradiated to the bottom. As described above, the quartz plate fixing frame 123 is coupled onto the movable block 122 and can move in the X and Y directions.

[0033] The lower laser receiving section 130 may include a lower section base plate 131, a lower first placement stage 132, a lower convex lens 133, a lower second placement stage 134, and a laser detector 135.

[0034] The lower base plate 131 may be substantially flat and may be connected to the lower part of the stage base plate 121 through a plurality of columns. In some examples, a support plate may be further connected to the lower part of the lower base plate 131 through a plurality of columns. The lower first placement platform 132 may be connected to one side of the lower base plate 131 in a form that extends and protrudes upward. The lower convex lens 133 is provided on the lower first placement platform 132 and serves to adjust the focus of the laser beam that has passed through the quartz plate. The lower second placement platform 134 may be connected to the other side of the lower base plate 131 in a form that extends and protrudes upward. The laser detector 135 is provided on the lower second placement platform 134 and can detect the laser beam that has passed through the lower convex lens 133 (i.e., the laser beam that has passed through the quartz plate). In some examples, the exemplary quartz transmittance analyzer 100 according to the present invention may further include an upper opaque window 118 and / or a stage opaque window 128.

[0035] The upper opaque windows 118 are provided on at least three sides of the upper base plate 111 of the upper laser output section 110. They prevent dust from entering and also prevent external light from being transmitted to the interior, thereby preventing external light noise from being mixed into the laser beam irradiated via the laser fiber 113. In some examples, the upper opaque windows 118 are installed to be openable and closable, which allows for smooth maintenance of internal components.

[0036] The stage opaque windows 128 are provided on at least three sides of the stage base plate 121 of the quartz plate stage moving section 120, preventing dust from entering and preventing external light from being transmitted to the interior, thereby preventing external light noise from interfering with the laser beam irradiated via the laser fiber 113. In some examples, the stage opaque windows 128 are installed to be openable and closable, which allows for smooth loading and unloading of quartz plates and smooth maintenance of internal components.

[0037] Figures 15 to 17 are perspective views and exploded perspective views showing the quartz plate fixing frame 123 of a quartz transmittance analyzer 100 for semiconductors using an exemplary multi-wavelength laser according to the present invention.

[0038] As shown in Figures 15 and 16, the quartz plate fixing frame 123 of the exemplary quartz transmittance analyzer 100 according to the present invention may include a first fixing frame 1231, a second fixing frame 1232, a third fixing frame 1233, a tilt bolt 1234, and a tilt indicator 1235.

[0039] The first fixed frame 1231 is coupled to the movable block 122 and may be configured in the shape of a substantially rectangular flat plate. Of course, the first fixed frame 1231 has a through hole in the center so that the laser beam can pass through the quartz plate.

[0040] The second fixed frame 1232 is tiltably coupled onto the first fixed frame 1231 and may be configured as a substantially rectangular flat plate. Similarly, the second fixed frame 1232 also has a through hole in the center so that the laser beam can pass through the quartz plate. In some examples, the second fixed frame 1232 may be coupled to the first fixed frame 1231 so that one side is always in contact with the first fixed frame 1231 and it moves substantially hinge-like. Alternatively, the other side of the second fixed frame 1232 may be coupled to the other side of the first fixed frame 1231 so as to be in contact with or separated by a certain distance, thereby allowing the second fixed frame 1232 to tilt to a predetermined angle relative to the first fixed frame 1231. The third fixed frame 1233 is joined to the second fixed frame 1232, and a quartz plate can be secured to the upper part of the third fixed frame 1233.

[0041] Multiple tilt bolts 1234 are provided between the first fixed frame 1231 and the second fixed frame 1232, allowing adjustment of the tilt angle of the second fixed frame 1232 relative to the first fixed frame 1231. For example, two tilt bolts 1234 may be provided, which are connected to the other side of the first fixed frame 1231 and the second fixed frame 1232. For example, loosening the two tilt bolts 1234 increases the tilt angle of the second fixed frame 1232 from the first fixed frame 1231, and tightening the two tilt bolts 1234 decreases the tilt angle of the second fixed frame 1232 from the first fixed frame 1231.

[0042] On the other hand, the tilt indicator 1235 is provided between the first fixed frame 1231 and the second fixed frame 1232 and can mechanically display the tilt angle of the second fixed frame 1232 relative to the first fixed frame 1231. In some examples, the tilt angle is approximately 0° to approximately 8°. In some examples, the tilt indicator 1235 may include a vertical plate erected from the first fixed frame 1231, displaying the tilt angle and having a vertical through hole, and a horizontal projection protruding from the second fixed frame 1232 and passing through the vertical through hole. Thus, the user can adjust the tilt angle of the second fixed frame 1232 by looking at the position of the horizontal projection passing through the vertical through hole in the vertical plate.

[0043] On the other hand, in the present invention, the second fixing frame 1232, the tilt bolt 1234, and the tilt indicator 1235 may be omitted. That is, as shown in Figure 17, the third fixing frame 1233 may be directly fixed on the first fixing frame 1231, and the first fixing frame 1231 may be fixed on the movable block 122 by bolts or the like.

[0044] Figure 18 shows an exemplary quartz plate and transmission coordinate setting state used in a semiconductor quartz transmittance analyzer 100 using an exemplary multi-wavelength laser according to the present invention. As shown in Figure 18, the transmittance of a quartz plate (non-porous quartz) decreases due to contamination as it is introduced into the semiconductor heat treatment process. To measure the transmittance of the entire region of such a quartz plate, the coordinates can be set to irradiate the laser beam to approximately 100 to 500 points in a spiral pattern, for example. As a result, the laser fiber 113 of the laser output upper section 110 can irradiate the quartz plate with a laser beam according to the coordinates set as described above.

[0045] Figure 19 is a perspective view showing a semiconductor quartz transmittance analyzer 100 using an exemplary multi-wavelength laser according to the present invention, installed in a darkroom. Generally, a transmittance analyzer 100 using a laser beam may be affected by external light wavelengths, potentially reducing the accuracy of the transmittance analysis value. Therefore, as shown in Figure 19, the present invention allows the quartz transmittance analyzer 100 to be installed in a darkroom. In some examples, the darkroom is provided with both a front door and a rear door that can be opened and closed, thereby facilitating the laser alignment setup process.

[0046] Figure 20 shows an exemplary HEPA filter that can be further attached to a semiconductor quartz transmittance analyzer 100 using an exemplary multi-wavelength laser according to the present invention. As shown in Figure 19, the transmittance analyzer 100 may experience a decrease in the quality of the laser beam due to the effects of dust and other factors inside the device over time, which can lead to a decrease in the accuracy of the transmittance. Therefore, the present invention makes it possible to prevent dust from accumulating inside the device and maintain optimal laser beam quality at all times by further installing a HEPA filter in the transmittance analyzer 100.

[0047] Figure 21 shows an example of how to improve the reliability of a semiconductor quartz transmittance analyzer 100 using an exemplary multi-wavelength laser according to the present invention. Generally, when minute external vibrations are applied to the lens, the rate of change in the transmittance measurement can increase. Therefore, by reducing the number of lenses if possible, the number of variables can be reduced, and the laser alignment setting time and shift period can also be reduced. In addition, by making the distance between the laser beam and the detector as short as possible, the vibration interval can be reduced and the quality of the laser beam can be maintained.

[0048] Figure 22 shows an example of the placement position of a quartz plate in a semiconductor quartz transmittance analyzer 100 using an exemplary multi-wavelength laser according to the present invention. Generally, when using lenses, it is necessary to specify the position where an image is actually formed for each specifically defined focal length. In the quartz transmittance analyzer 100 according to the present invention, by removing the lower convex lens 133 provided in the lower laser receiving section 130, the position of the light receiving section can be positioned at the position where an image is actually formed. In particular, as shown in Figure 22, in the case of perforated quartz, it is necessary to ensure that the size of the laser beam does not come close to the perforation (hole), so it is preferable to keep the position of the sample (i.e., quartz) as close to the Rayleigh range as possible.

[0049] Figure 23 shows an exemplary sensing unit, control unit, and display unit that may be further attached to an exemplary multi-wavelength laser-based quartz transmittance analyzer 100 for semiconductors according to the present invention. Generally, contaminated quartz undergoes a cleaning process in which the entire surface is etched. As a result, the difference in weight of the quartz before and after cleaning can change the thickness of the quartz, which is the path through which the laser beam penetrates, potentially affecting the transmittance. Therefore, in the present invention, the accuracy of the disposal criteria can be further improved by confirming the weight of the quartz using a load cell. Here, external influences (e.g., vibration) may necessitate further stability in the weight measurement of the load cell. As shown in Figure 23, the exemplary quartz transmittance analyzer 100 of the present invention may further include a sensor unit including a load cell, a control unit including a load cell voltage amplification amplifier and a microcontroller, and a display unit including a PC monitor. In this invention, an insertion sort algorithm is used to sort various weight measurements in order of magnitude. In the first stage, the minimum and maximum values ​​of excessively fluctuating amplitudes are excluded, and only values ​​within a set amplitude range are selected and sorted. In the second stage, a stable weight value can be derived by averaging only the remaining measurements, after further excluding a portion of the minimum and maximum values ​​from the data values ​​remaining after the processing in the first stage.

[0050] Figures 24 and 25 show the installation and elevation positions of a load cell further attached to an exemplary multi-wavelength laser-based quartz transmittance analyzer 100 for semiconductors according to the present invention. As shown in Figures 24 and 25, in the present invention, as an example, a single-point load cell is used, in which the load cell is initially located away from the quartz plate, and then rises to the quartz plate to sense the weight of the quartz plate. Here, the single-point load cell has the advantage of having relatively accurate measurements and excellent resolution even when the weight of the quartz plate is not uniformly distributed. Furthermore, as described above, since the load cell rises after moving to near the center of gravity of the quartz plate, the weight can be measured in a relatively stable state.

[0051] Figure 26 shows an exemplary fixing frame 223 attached to a semiconductor quartz transmittance analyzer 100 using an exemplary multi-wavelength laser according to the present invention. As shown in Figure 26, the exemplary fixing frame to which the quartz plate is fixed may include a circular ring 2231 formed in an annular shape, a plurality (four) of connecting bars 2232 extending outside the circular ring 2231, and a square ring 2233 formed in a square annular shape connected to the plurality of connecting bars 2232. In this way, the exemplary fixing frame 223 according to the present invention can irradiate a laser beam of a constant size by maintaining a constant measurement height for each quartz, and in particular, in the case of perforated quartz, it can overcome the limitations of structural changes due to the laser beam size.

[0052] Figure 27 shows an exemplary confocal laser scanning microscope further attached to a semiconductor quartz transmittance analyzer 100 using an exemplary multi-wavelength laser according to the present invention. Generally, it is preferable to use a non-contact confocal laser scanning microscope because contact surface roughness measuring equipment may damage the surface of the quartz. Here, surface roughness can be measured by irradiating the surface of the quartz with a laser and detecting the reflected light. As an example, by comparing the degree of surface roughness and transmittance data at a specific location, the criteria for discarding quartz can be clearly determined. As shown in Figure 27, the present invention may further include a confocal laser scanning microscope provided on the stage base plate 121 of the quartz plate stage moving unit 120 for measuring the surface roughness of a quartz plate.

[0053] Thus, in this invention, when measuring surface roughness, the confocal microscope positioned on the rear surface can be moved to the center point of the quartz plate before measurement. At this time, in order to extract roughness results that are close to circular, similar to transmittance, 32 points may be set as an example. On the other hand, in order to prevent deviations in laser alignment, the confocal laser scanning microscope may be provided separately as a measuring device.

[0054] On the other hand, as described above, the upper laser output section 110, the quartz plate stage moving section 120, and the lower laser receiving section 130 that constitute the exemplary quartz transmittance analyzer 100 according to the present invention may each be connected and joined by multiple columns. In some examples, when measuring the transmittance of quartz, the movement of the moving block 122 of the quartz plate stage moving section 120 may cause misalignment of each column. Therefore, in the present invention, instead of reducing the number of columns used, the configuration of the upper laser output section 110, the quartz plate stage moving section 120, and the lower laser receiving section 130 can be integrated to reduce the possibility of delay in laser alignment.

[0055] The above description is merely one embodiment for realizing an exemplary multi-wavelength laser-based quartz transmittance analyzer for semiconductors according to the present invention. The present invention is not limited to the above embodiment, and the technical spirit of the present invention is such that, as claimed in the following claims, anyone with ordinary skill in the art to which the invention belongs can make various modifications without departing from the spirit of the invention.

Claims

1. The laser output upper section comprises an upper base plate, an upper first mounting platform provided on one side of the upper base plate, a laser fiber provided on the upper first mounting platform that irradiates a laser beam downward, an upper second mounting platform provided on the other side of the upper base plate, an aperture provided on the upper second mounting platform that adjusts the size of the laser beam irradiated from the laser fiber, and an upper convex lens provided on the upper second mounting platform that adjusts the focus of the size-adjusted laser beam. A quartz plate stage moving section comprises a stage base plate provided at the lower part of the upper base plate, a movable block provided on the stage base plate so as to be movable in the X and Y directions, and a quartz plate fixing frame coupled to the movable block for fixing a quartz plate. The laser light receiving lower section includes: a lower base plate provided below the upper base plate; a lower first placement platform provided on one side of the lower base plate; a lower convex lens provided on the lower first placement platform for adjusting the focus of the laser beam that has passed through the quartz plate; a lower second placement platform provided on the other side of the lower base plate; and a laser detector provided on the lower second placement platform for detecting the laser beam that has passed through the lower convex lens. A laser-based quartz transmittance analyzer for semiconductors, characterized by the following features.

2. An upper opaque window is provided on at least three sides of the upper base plate of the laser output upper section to prevent external light from being transmitted to the interior, The stage base plate of the quartz plate stage moving section is provided on at least three sides of the stage opaque windows that prevent external light from being transmitted to the interior. A quartz transmittance analyzer for semiconductors using the laser described in claim 1.

3. The upper base plate of the laser output upper section further includes an upper through hole so that the laser beam can pass through it. The stage base plate of the quartz plate stage moving section further includes a stage through-hole so that the laser beam can pass through it. A quartz transmittance analyzer for semiconductors using the laser described in claim 1.

4. The quartz plate fixing frame includes a first fixing frame coupled to the movable block, a second fixing frame tiltably coupled to the first fixing frame, a third fixing frame coupled to the second fixing frame on which the quartz plate is secured, and a tilt bolt provided between the first and second fixing frames for adjusting the tilt angle of the second fixing frame relative to the first fixing frame. A quartz transmittance analyzer for semiconductors using the laser described in claim 1.

5. The laser fiber in the upper section of the laser output irradiates the quartz plate with a laser beam in a spiral pattern from the center to 100 to 500 points. A quartz transmittance analyzer for semiconductors using the laser described in claim 1.

6. The laser output upper section further includes a HEPA filter provided for filtering out fine dust from the outside. A quartz transmittance analyzer for semiconductors using the laser described in claim 1.

7. The semiconductor quartz transmittance analyzer using a laser according to claim 1, wherein the position of the quartz plate is located within the Rayleigh range.

8. The stage base plate of the quartz plate stage movement section further includes a load cell provided for sensing the weight of the quartz plate. A quartz transmittance analyzer for semiconductors using the laser described in claim 1.

9. The quartz plate fixing frame includes a circular ring formed in an annular shape, a plurality of connecting bars extending outward from the circular ring, and a square ring formed in a square annular shape connected to the plurality of connecting bars. A quartz transmittance analyzer for semiconductors using the laser described in claim 1.

10. The stage base plate of the quartz plate stage movement section further includes a confocal laser scanning microscope provided for measuring the surface roughness of the quartz plate. A quartz transmittance analyzer for semiconductors using the laser described in claim 1.

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