Electroadhesive device holder

The electroadhesive device holder addresses the limitations of mechanical mounts by providing a portable, safe, and efficient means to attach electronic devices to various surfaces using a voltage-controlled electric field, ensuring secure and damage-free attachment.

JP7894809B2Active Publication Date: 2026-07-24SELFIE SNAPPER INC
View PDF 6 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
SELFIE SNAPPER INC
Filing Date
2020-07-07
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

Existing mechanical mounting systems for electronic devices are bulky, require time and effort to install, can damage devices and surfaces, and are not portable, while portable power-driven solutions are lacking.

Method used

An electroadhesive device holder using electrodes and a voltage converter to create an adjustable electric field for secure, hands-free attachment to various surfaces, with a digital switch controlling voltage based on surface properties to ensure safety and adhesion.

Benefits of technology

Enables quick, secure, and safe attachment of electronic devices to diverse surfaces, preventing damage and allowing hands-free use, with adjustable voltage ensuring compatibility and safety across different materials.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007894809000001
    Figure 0007894809000001
  • Figure 0007894809000002
    Figure 0007894809000002
  • Figure 0007894809000003
    Figure 0007894809000003
Patent Text Reader

Abstract

The disclosed embodiments include an electroadhesive device holder for securing a device to an external object and other target surface. In various embodiments, the electroadhesive device holder can be incorporated into a device case that is detachably attached to the device. The device case may include an integrated power supply for supplying power to the electroadhesive device. In various embodiments, the electroadhesive device holder can be attached directly to a device such as a smartphone or camera. By providing a power-driven, portable mechanism for securing a device to an external object, the electroadhesive device holder can provide a better viewpoint for viewing the device's screen and widen the camera's field of view.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] (Priority) This application claims the benefit of U.S. Provisional Application No. 62 / 871,160, filed Jul. 7, 2019, the entire content of which is incorporated herein by reference. This application also claims the benefit of U.S. Provisional Application No. 62 / 956,054, filed Dec. 31, 2019, the entire content of which is incorporated herein by reference.

[0002] (Technical Field) The present disclosure generally relates to the attachment and fixation of objects, and more particularly to devices for attaching electronic devices to external objects and other target surfaces.

Background Art

[0003] By attaching an electronic device to a wall, furniture, wood, mirror, window, and other external objects and / or target surfaces, the functions of existing devices can be optimized and new functions can be provided. Viewing content, taking photos, communicating with others, and other daily uses of electronic devices are typically personal activities and are difficult to share with others. Also, when using an electronic device, at least one hand is occupied by holding the electronic device, making it difficult to perform multitasking. Furthermore, millions of electronic devices fail each year by falling from unsafe locations. Therefore, there is a need to develop a device holder that can fix an electronic device at a fixed position on an external object and / or other target surface so that the device can be used hands-free and facilitate interaction among a group of electronic devices.

[0004] Conventional efforts have been made to address the problems of mounting and securing electronic devices to external objects and other target surfaces. However, mechanical mounting mechanisms are unreliable and bulky. Furthermore, mechanical mounting mechanisms require time and effort to assemble and install electronic devices. In some cases, the electronic device may be damaged during installation of the mounting mechanism, due to the screws, clamps, clips, and other components of the mounting mechanism making strong contact with the screen or other fragile components of the electronic device, potentially causing scratches, fractures, dents, or other damage. Many mechanical mounting systems are bulky and must be permanently or semi-permanently attached to external objects or other target surfaces. When the electronic device is not attached to or removed from the mounting system, the mounting system is exposed and unsightly. Mechanical mounting systems can also damage the external object to which the device is secured during mounting if the external object cannot support the weight of the mounting system and / or the electronic device. Portable, power-driven mounting systems for electronic devices have not been considered.

[0005] The various purposes, features, and advantages of the disclosed subject matter can be more fully understood by referring to the following detailed description when considering the following drawings in which the same reference numerals represent the same elements. [Brief explanation of the drawing]

[0006] [Figure 1] This figure shows an exemplary electrical bonding device for holding electronic devices. [Figure 2] This figure shows an electronic device attached to an external object using an exemplary electrobonding system as shown in Figure 1. [Figure 3] This is an exploded view of the electrical bonding device holder integrated into the case. [Figure 4] Figure 4 shows an exemplary processor included in an electrobonding device holder. [Figure 5]Figure 3 shows an exemplary wireless charging embodiment of an electroadhesive device holder. [Figure 6A] Figure 3 is a perspective view of an alternative electronic device holder. [Figure 6B] Figure 3 is a perspective view of an alternative electronic device holder. [Figure 7A] This figure shows an exemplary electro-adhesive device holder integrated into a smartphone. [Figure 7B] This figure shows an exemplary electro-adhesive device holder integrated into a smartphone. [Figure 8A] This figure shows an exemplary electro-adhesion device holder integrated into a camera. [Figure 8B] This figure shows an exemplary electro-adhesion device holder integrated into a camera. [Figure 9] This flowchart illustrates an exemplary method for adjusting the voltage generated by an electrobonding device using a digital switch. [Modes for carrying out the invention]

[0007] As used herein, the terms “device” and “apparatus” refer to any object and electrical component having a smartphone, computer, laptop, television, camera, or similar device.

[0008] As used herein, the terms “single content” and “multiple content” refer to images, videos, audio records, and audiovisual works that can be captured by an electronic device and viewed on an electronic device.

[0009] As used herein, the terms “external object” and “multiple external objects” refer to any other object and / or target surface having an exposed area for mounting an electronic device of any size, such as a wall, furniture, wood, mirror, window, and other such object. The mounting surface included in the external object may be rough or smooth, and the external object may be composed of one or more conductive and / or nonconductive materials.

[0010] (An exemplary embodiment of the system) Rev1-2 illustrates exemplary electro-adhesion devices and systems that can be incorporated into device holders for securing devices to external objects. Embodiments of device holders using electro-adhesion systems can be detachably attached and / or incorporated into the back of a device so that it can be quickly and securely attached to a variety of surfaces. Attaching a device to an external object using an electro-adhesion system allows multiple people to interact with the device, enables hands-free use of the device, and secures the device in a fixed position, preventing it from being dropped, misplaced, or damaged.

[0011] Figure 1 shows an electrobonding device 100 that may be included in a device holder. In various embodiments, the electrobonding device 100 may be implemented as a flexible film comprising one or more electrodes 104 and an insulating material 102 between the electrodes 104 and the case and / or device. The electrobonding film may include a chemical adhesive applied to the insulating material 102 and / or electrodes 104 to enable attachment of the electrobonding device 100 to the case and / or device. Additional mounting mechanisms used to secure the electrobonding device to the case and / or device may include mechanical fasteners, thermal fasteners (e.g., welding, spot welding, or spot melting), dry bonding, Velcro®, suction / vacuum bonding, magnetic or electromagnetic mounting, or tape (e.g., single-sided or double-sided). Depending on the degree of device portability desired or required in a given situation and the size of the electrobonding device, the mounting mechanism may provide permanent, temporary, or removable mounting configurations.

[0012] The insulator 102 can consist of multiple different layers of insulator. For illustrative purposes, the electrobonding device 100 is shown as having four electrodes in two pairs, but it will be readily apparent that more or fewer electrodes can be used in a given electrobonding device 100. If only a single electrode is used in a given electrobonding device 100, preferably a complementary electrobonding device 100 having at least one electrode of opposite polarity is used together. In terms of size, the electrobonding device 100 is substantially scale-invariant; that is, the size of the electrobonding device can range from a surface area of ​​less than one square centimeter to over several meters. Even larger or smaller surface areas are possible and can be sized to suit the requirements of a given device.

[0013] In various embodiments, the electrobonding device 100 can cover the entire rear surface of the device. One or more electrodes 104 can be connected to a power source 112 (e.g., a battery, AC power source, DC power source, and similar) using one or more known electrical connections 106. A power management integrated circuit 110 can manage the output of the power source 112, adjust the voltage, and control the power source 112's variable functions. To generate an electrobonding force that provides sufficient electrobonding force to support the device, low-voltage power from the power source 112 must be converted into high-voltage charges on one or more electrodes 104 using a voltage converter 108. The high voltage on one or more electrodes 104 forms an electric field, which interacts with external objects and / or other target surfaces in contact with and / or close to the electrobonding device 100. The electric field can locally polarize the target surface and / or induce charges on the target surface opposite to the charges on one or more electrodes 104. One or more electrodes 104 and opposite charges on the target surface attract each other, causing electrical adhesion between the electrodes 104 and the target surface. The induced charge can be a result of dielectric polarization or electrostatic induction of a weakly conductive material and charges. If the target surface contains a strongly conductive material, such as copper, the induced charge can completely cancel out the electric field. In this case, the internal electric field becomes zero, but an induced charge is still formed, giving the electrical adhesion device 100 an electrical adhesion force (i.e., a Lorentz force).

[0014] Thus, the adjustable voltage applied to one or more electrodes 104 provides an overall electroadhesive force between the electroadhesive device 100 and the material of an external object and / or other target surface. This electroadhesive force holds the electroadhesive device 100 to the target surface. The overall electroadhesive force can be sufficient to overcome the gravity of the electroadhesive device 100 and the consumer device or other object attached to it. Therefore, the force of the electroadhesive can be used to hold a consumer device attached to the electroadhesive device 100 high on the target surface. In various embodiments, multiple electroadhesive devices can be placed on the target surface to provide additional electroadhesive force to the target surface. The combination of electroadhesive forces can be sufficient to lift, move, pick and place, attach, or fix large objects on the target surface.

[0015] When the adjustable voltage is removed from one or more electrodes 104, the electrical adhesion between the electrical bonding device 100 and the target surface ceases. Thus, when there is no adjustable voltage between one or more electrodes 104, the electrical bonding device 100 can move more easily relative to the target surface. In this state, the electrical bonding device 100 can move before and after the adjustable voltage is applied. Well-controlled electrical activation and deactivation enable fast adhesion and detachment, for example, with relatively low power consumption and response times of less than approximately 50 milliseconds.

[0016] Applying excessive voltage to certain materials (e.g., metals and other conductors) can cause sparks, flames, electric shocks, and other hazardous situations. Applying too little voltage results in weak adhesion that is insufficient to securely attach the electrical bonding device 100 to the target surface. A digital switch 116 can autonomously control the voltage converter 108 to generate an appropriate adjustable voltage applied to the electrodes 104 to ensure sufficient electrical adhesion. The digital switch 116 can control the voltage output of the voltage converter 108 based on sensor data collected by one or more sensors 114 included in the electrical bonding device 100. The digital switch 116 may be a microcontroller or other integrated circuit containing programmable logic for receiving sensor data, determining one or more characteristics based on the sensor data, and controlling the voltage converter based on those characteristics. The digital switch 116 can operate the voltage converter 108 to generate, change, set, and / or maintain an adjustable output voltage used to attach the electrical bonding device 100 to the target surface.

[0017] For example, in response to the sensor 114 detecting a conductive target surface (e.g., metal), the digital switch 116 can operate the voltage converter 108 to generate an adjustable voltage sufficient to attach and secure the electrical adhesive device 100 to the conductive target surface. Furthermore, the adjustable voltage output can be made safe when applied to a conductive surface, eliminating sparks, hazards, or other dangerous conditions that may occur when the electrical adhesive device 100, which generates a high voltage, comes into contact with and / or close to the conductive target surface. Similarly, when the sensor 114 detects different surfaces with different properties, the digital switch 116 can control the voltage converter 108 to generate different adjustable voltages sufficient to attach and secure the electrical adhesive device 100 to those different surfaces. For example, in response to the sensor 114 detecting an organic target surface (e.g., wood, drywall, fabric, and similar), the digital switch 116 can cause the voltage converter 108 to generate an adjustable voltage that may be sufficient to adhere and secure the electrical adhesive device to the organic target surface without creating a dangerous condition. Furthermore, the adjustable voltage allows for minimizing the voltage output to avoid hazardous conditions that may arise if the electrical adhesive device 100 is accidentally moved. The digital switch 116, in response to the sensor 114 detecting a smooth target surface (e.g., glass) or an insulating target surface (e.g., plastic, stone, sheet rock, ceramic, and similar), can cause the voltage converter 108 to generate an adjustable voltage sufficient to attach and secure the electrical adhesive device 100 to the smooth and / or insulating target surface without creating a hazardous condition. Thus, the electrical adhesive device 100 has an adjustable voltage level that is adjusted based on the characteristics of the target surface determined by the sensor 114, resulting in an electrical adhesive device 100 that can be safely used to attach to a variety of target surfaces without safety issues.

[0018] The strength of the adjustable voltage (i.e., the amount of voltage) can vary depending on the material of the target surface. For example, the strength of the adjustable voltage required to attach the electro-adhesive device 100 to a conductive target surface (e.g., metal) can be made smaller than the adjustable voltage required to attach the electro-adhesive device 100 to an insulating target surface, a smooth target surface, and / or an organic target surface. The strength of the adjustable voltage required to attach the electro-adhesive device 100 to an organic target surface can be made larger than the adjustable voltage required to adhere the electro-adhesive device 100 to a conductive target surface and smaller than the adjustable voltage required to adhere the electro-adhesive device 100 to an insulating target surface. The strength of the adjustable voltage required to attach an electro-adhesive device to an insulating target surface can be made higher than the adjustable voltage required to attach an electro-adhesive device to an organic or conductive target surface. The electro-adhesive device 100 can be configured to attach to any type of surface (e.g., metal, organic, rough, smooth, undulating, insulating, conductive, and the like). In some embodiments, it can be considered preferable to attach the electro-adhesive device 100 to a smooth and flat surface.

[0019] To attach the electro-adhesive device 100 to some target surfaces, extremely high voltages are required. For example, to attach the electro-adhesive device 100 to a rough target surface, an extremely smooth target surface (e.g., glass), and / or an insulating target surface, an extremely high voltage output may be required. An electro-adhesive device that generates a high voltage output can generate sparks, disasters, electric shocks, and other dangerous conditions when placed in contact with and / or in proximity to a conductive surface. To avoid safety issues, in some embodiments of the electro-adhesive device 100, it is made not to generate a high voltage and can only generate an output adjustable voltage sufficient to attach the electro-adhesive device 100 to a conductive target surface, an organic target surface, and the like.

[0020] When the electro-adhesive device 100 is moved to a new target surface, the sensor 114 can automatically detect one or more characteristics of the new target surface and / or determine the material type, surface texture, surface morphology, or other characteristics of the new target surface. The digital switch 116 can modify and / or maintain the adjustable voltage output generated by the voltage converter 108 based on the type of material and / or the characteristics of the new target surface. To determine the adjustable voltage generated using the voltage converter 108, the digital switch 116 can include logic for determining the adjustable voltage based on the sensor data received from the sensor 114. For example, the digital switch 116 can include logic for determining an appropriate adjustable voltage based on the sensor data using a look-up table. Also, the logic incorporated in the digital switch 116 can include one or more algorithms for calculating an appropriate adjustable voltage based on the sensor data. Further, if the sensor 114 detects that the electro-adhesive device 100 has moved away from the target surface, the digital switch 116 can power down the voltage converter 108 and / or terminate the adjustable voltage output from the voltage converter 108 until a new target surface is detected by the sensor 114.

[0021] One or more sensors 114 may include a wide variety of sensors 114 for measuring the characteristics of a target surface. Each sensor 114 can be operated by a sensor control circuit 118. The sensor control circuit 118 may be included in the sensor 114 or may be a separate component. The sensor control circuit 118 may be a microcontroller or other integrated circuit having programmable logic for controlling the sensor 114. For example, the sensor control circuit 118 may start acquiring sensor data, stop acquiring sensor data, set the sample rate of the sensor, control the transmission of sensor data measured by the sensor 114, and the like. The sensor 114 may include conductivity sensors (e.g., electrode conductivity sensors, inductive conductivity sensors, and the like), Hall effect sensors and other magnetic field sensors, porosity sensors (e.g., time-domain reflectance (TDR) porosity sensors), waveform sensors (e.g., ultrasonic sensors, radar sensors, infrared sensors, dot-field projection depth sensors, time-of-flight depth sensors), motion sensors, surface texture sensors, surface profile sensors, surface morphology sensors, and the like. Sensor data measured by one or more sensors 114 can be used to determine one or more properties of the target surface. For example, the sensor data can be used to determine the conductivity and other electrical or magnetic properties of the target surface, the porosity, permeability, and surface morphology of the material, the hardness, smoothness, surface profile, and other surface properties of the material, the distance of the target surface from the sensor, and similar properties. The digital switch 116 can be directly controlled using one or more properties obtained from the sensor data. The sensor data can also be sent to the data analysis module 422 shown in Figure 4. The data analysis module 422 can examine the sensor data and use it to determine the properties and / or material type of the target surface (e.g., metal, wood, plastic, ceramic, concrete, drywall, glass, stone, and similar).Next, the digital switch 116 can control the voltage output from the voltage converter 108 based on the characteristics and / or material type of the target surface determined by the data analysis module 422.

[0022] The digital switch 116 can function as an essential safety feature of the electrical bonding device 100. The digital switch 116 can reduce the risk of sparks, stings, electric shocks, and other safety problems that may result from the application of high voltage to a conductive target surface. By autonomously controlling the voltage generated by the electrical bonding device 100, the digital switch 116 can also minimize human errors that may occur when a user manually sets the voltage output of the electrical bonding device 100. For example, human errors may include a user forgetting to change the voltage setting, a child playing with the electrical bonding device and not paying attention to the voltage setting, a user mistaking the conductive surface for the insulating surface, and similar. These errors can be eliminated by using the digital switch 116 to automatically adjust the voltage generated by the voltage converter 108 based on sensor data received from one or more sensors 114 and / or material classification performed by the data analysis module 422.

[0023] As shown in Figure 2, to enhance safety and improve the user experience, the electrobonding device 100 and / or the device 200 integrated with the electrobonding device 100 may include a mechanism (e.g., a button, mechanical switch, UI element, etc.) for activating the sensor 114 and / or the digital switch 116. The sensor 114 and the digital switch 116 may also be automatically turned on when the electrobonding device 100 and / or the device 200 is powered on. The electrobonding device 100 and / or the device 200 may also include a signaling mechanism (e.g., a status light, UI element, mechanical switch, etc.) for communicating the status of the sensor 114 and / or the digital switch 116 to the user of the electrobonding device 100. The signaling mechanism can be used to communicate that an appropriate adjustable voltage has been determined for a particular target surface.

[0024] In various embodiments, the signaling mechanism may include a status light that turns red when the sensor 114 and / or the digital switch 116 are powered on and sensing the target surface material or other properties, but have not yet determined the appropriate adjustable voltage for the target surface. The status light may then turn green when the digital switch 116 has received sensor data, determined the appropriate adjustable voltage for a particular target surface, and generated the appropriate adjustable voltage output, making the electrical bonding device 100 ready to be attached to the target surface. The status light may also flash red and / or yellow if there are any problems with determining the adjustable voltage for a particular target surface and / or generating the adjustable voltage output for a particular target surface. For example, if the sensor 114 cannot collect sensor data, if the data analysis module 422 cannot determine the material type or other properties of the target surface material, if the digital switch 116 cannot operate the voltage converter 108, if the voltage converter 108 cannot generate the correct adjustable voltage, and similar cases, the status light may flash red and / or light up yellow.

[0025] In this specification, the voltages generated by the voltage converter 108 are as follows: 250V to 10,000V, 500V to 10,000V, 1,000V to 10,000V, 1,500V to 10,000V, 2,000V to 10,000V, 3,000V to 10,000V, 4,000V to 10,000V, 5,000V to 10,000V, and 6,000V to 10,000V. The DC voltage range is defined as one or more of the following ranges: 7,000V to 10,000V, 250V to 1,000V, 250V to 2,000V, 250V to 4,000V, 500V to 1,000V, 500V to 2,000V, 500V to 4,000V, 1,000V to 2,000V, 1,000V to 4,000V, 1,000V to 6,000V, 2,000V to 4,000V, 2,000V to 6,000V, 4,000V to 6,000V, 4,000V to 10,000V, 6,000V to 8,000V, and 8,000V to 10,000V.

[0026] As described herein, the voltages generated by the voltage converter 108 are as follows: 250Vrms to 10,000Vrms; 500Vrms to 10,000Vrms; 1,000Vrms to 10,000Vrms; 1,500Vrms to 10,000Vrms; 2,000Vrms to 10,000Vrms; 3,000Vrms to 10,000Vrms; 4,000Vrms to 10,000Vrms; 5,000Vrms to 10,000Vrms; 6,000Vrms to 8,000Vrms; 7,000Vrms to 8,000Vrms; 8,000Vrms. From 00Vrms to 10,000Vrms, from 9,000Vrms to 10,000Vrms, from 250Vrms to 1,000Vrms, from 250Vrms to 2,000Vrms, from 250Vm to 4,000Vrms, from 500Vrms to 1,000Vrms, from 500Vm to 2,000Vrms, and from 500Vmls to 4,000Vrms. It is defined as an AC voltage range of one or more of the following: 1,000V to 2,000Vrms, 1,000Vrms to 4,000Vrms, 1,000V to 6,000Vrms, 2,000Vrms to 4,000Vrms, 2,000Vrms to 6,000Vrms, 4,000Vrms to 6,000Vrms, 4,000Vrms to 8,000Vrms, and 6,000Vrms to 8,000Vmns.

[0027] As described herein, the voltages generated by the voltage converter 108 are defined as any one or more of the following ranges of DC voltage: approximately 250V to approximately 10,000V; approximately 500V to approximately 10,000V; approximately 1,000V to approximately 10,000V; approximately 1,500V to approximately 10,000V; approximately 2,000V to approximately 10,000V; approximately 3,000V to approximately 10,000V; approximately 4,000V to approximately 10,000V; approximately 5,000V to approximately 10,000V; approximately 6,000V to approximately 8,000V; approximately 7,000V to approximately 8,000V; and approximately 250V to approximately 1,000V. Approximately 250V to 2,000V, approximately 250V to 4,000V, approximately 500V to 1,000V, approximately 500V to 2,000V, approximately 500V to 4,000V, approximately 1,000V to 2,000V, approximately 1,000V to 4,000V, and approximately 1,000V to 6,000V. It is defined as a DC voltage range of one or more of the following: approximately 2,000V to approximately 4,000V, approximately 2,000V to approximately 6,000V, approximately 4,000V to approximately 6,000V, approximately 4,000V to approximately 8,000V, approximately 6,000V to approximately 8,000V, approximately 8,000V to approximately 10,000V, and approximately 9,000V to approximately 10,000V.

[0028] As described herein, the voltages generated by the voltage converter 108 are as follows: approximately 250 Vrms to approximately 10,000 Vrms; approximately 500 Vrms to approximately 10,000 Vrms; approximately 1,000 Vrms to approximately 10,000 Vrms; approximately 1,500 Vrms to approximately 10,000 Vrms; approximately 2,000 Vrms to approximately 10,000 Vrms; approximately 3,000 Vrms to approximately 10,000 Vrms; approximately 4,000 Vrms to approximately 10,000 Vrms; approximately 5,000 Vrms to approximately 10,000 Vrms. Approximately 6,000Vrms to 8,000Vrms, approximately 7,000Vrms to 8,000Vrms, approximately 250Vrms to 1,000Vrms, approximately 250Vrms to 2,000Vrms, approximately 250Vrms to 4,000Vrms, approximately 500Vrms to 1,000Vrms, approximately 500Vrms to 2,000Vrms, approximately 500Vrms to 4,000Vrms, approximately 1,000Vrms to 2,000Vrms, approximately 1,000Vrms to 4,000Vrms, approximately 1,000Vrms to 6,000Vrms, and approximately 2,000Vrms to 4,000Vrms. It is defined as an AC voltage range of one or more of the following: approximately 2,000 Vrms to approximately 6,000 Vrms; approximately 4,000 Vrms to approximately 6,000 Vrms; approximately 4,000 Vrms to approximately 8,000 Vrms; approximately 6,000 Vrms to approximately 8,000 Vrms; approximately 8,000 Vrms to approximately 10,000 Vrms; and approximately 9,000 Vrms to approximately 10,000 Vrms.

[0029] As described herein, the voltage output from the power supply 112 is defined as a DC voltage range of one or more of the following: 2.0V to 249.99V; 2.0V to 150.0V; 2.0V to 100.0V; 2.0V to 50.0V, 5.0V to 249.99V, 5.0V to 150.0V, 5.0V to 100.0V, 5.0V to 50.0V, 50.0V to 150.0V, 100.0V to 249.99V, 100.0V to 130.0V, and 10.0V to 30.0V.

[0030] As described herein, the voltage output from power supply 112 is defined as one or more of the following AC voltage ranges: 2.0Vrms to 249.99Vrms; 2.0Vrms to 150.0V; 2.0Vrms to 100.0V; 2.0Vrms to 50.0Vrms to 249.99 Vrms; 5.0Vrms to 150.0Vrms; 5.0Vrms to 100.0Vrms; 5.0Vrms to 50.0Vrms; 50.0Vrms to 150.0Vrms; 100.0Vrms to 249.99 Vrms; 100.0Vrms to 130.0Vrms; and 10.0Vrms to 30.0Vrms.

[0031] As described herein, the voltage output from the power supply 112 is defined as one or more DC voltage ranges of the following: approximately 2.0V to approximately 249.99V; approximately 2.0V to approximately 150.0V; approximately 2.0V to approximately 100.0V; approximately 2.0V to approximately 50.0V; approximately 5.0V to approximately 50.0V, 0V to approximately 249.99V; approximately 5.0V to approximately 150.0V; approximately 5.0V to approximately 100.0V; approximately 5.0V to approximately 50.0V; approximately 50.0V to approximately 150.0V; approximately 100.0V to approximately 249.99V; approximately 100.0V to approximately 130.0V; and approximately 10.0V and approximately 30.0V.

[0032] As described herein, the voltages output from power supply 112 are as follows: approximately 2.0Vrms to approximately 249.99Vrms; approximately 2.0Vrms to approximately 150.0Vrms; approximately 2.0Vrms to approximately 100.0Vrms; approximately 2.0V to approximately 50.0Vrms; approximately 5.0Vrms to approximately 249.99Vrms; approximately 5.0Vrms to approximately 150.0Vrms; approximately 5.0Vrms to approximately 100.0Vrms; approximately 5.0Vrms to approximately 50.0Vrms; approximately 50. It is defined as an AC voltage range of one or more of the following: 0 Vrms to approximately 150.0 Vrms; approximately 100.0 Vrms to approximately 249.99 Vrms; approximately 100.0 Vrms to approximately 130.0 Vrms; and approximately 10.0 Vrms to approximately 30.0 Vrms.

[0033] Figure 2 shows a device 200 having a holder for the electrobonding device 100. In various embodiments, the electrobonding device 100 can be used to attach the device 200 to the surface of an external object 210, or to other target surfaces including walls, mirrors, wood, furniture, and the like. Figure 2 is a side view of the device 200 attached to an external object 210 using the electrobonding device 100. The electrobonding device 100 may include one or more sensors 114 for measuring one or more properties of the external object 210.

[0034] To attach device 200 to an external object 210, one or more sensors 114 determine the characteristics of the external object 210. Based on the sensor data, the electroadhesive device 100 applies an adjustable voltage to one or more electrodes 104, which induces a localized electric field 220 around the electrodes 104, causing countercharges from the inner portion 212 of the external object 210 to accumulate around the surface of the electrodes 104. This accumulation of countercharges creates an electroadhesive force between the electroadhesive device 100 attached to device 200 and the external object 210. The electroadhesive force is sufficient to fix device 200 to the target surface 214 of the external object 210 while the adjustable voltage is applied. It should be understood that the electroadhesive device 100 does not need to directly engage with the target surface 214 of the external object 210 to generate the electroadhesive force. Instead, the target surface 214 of the external object 210 must be in close proximity to the electrobonding device 100 in order to interact with the adjustable voltage on one or more electrodes 104. Thus, the electrobonding device 100 can be fixed not only to smooth and uniform surfaces but also to rough and uneven surfaces. Furthermore, portions of the electrobonding device 100 including one or more electrodes may have curved, flat, and / or adjustable surfaces to facilitate better contact with the target surface 214.

[0035] Figure 3 shows an exemplary electroadhesive device 100 integrated into case 310. When fixed to device 200, case 310 functions as a device holder that can use the electroadhesive device 100 to fix device 200 to an external object. To activate and deactivate the electroadhesive device 100, one or more electrical connections 106 can transmit an electrical signal from processor 300 to power supply 112. The electrical signal can indicate an adjustable voltage to be applied to one or more electrodes 104. The adjustable voltage indicated by the electrical signal can depend on one or more characteristics of the external object 210 measured by one or more sensors 114. Processor 300 can perform one or more functions of a voltage converter that converts a low voltage current to a high voltage current in order to generate an electroadhesive voltage on one or more electrodes 104. Case 310 can be any known device case, including smartphone protective cases, tablet protective cases, camera protective cases, and the like. The case 310 can be attached to the device in any known way, including, for example, extending to cover the edges of the device 200 and retracting to securely cover the device 200.

[0036] Figure 4 shows an exemplary board 400 for mounting one or more components of an electrical bonding device 100. The board 400 can be any known board, including one or more electrical circuits, such as circuit boards, printed circuit boards, and the like. The board 400 may include a processor 300 for executing commands and instructions for one or more of the components. A suitable processor 300 for programming instructions may include, for example, both general-purpose and application-specific microcontrollers or microprocessors of any type of computer, and one of a single processor or multiple processors or cores. Generally, the processor 300 can receive instructions and data from volatile memory 412 or non-volatile memory 414, or both. Suitable volatile memory 412 may include RAM, high-speed memory, double data rate memory, 4R memory, and the like. Suitable non-volatile memory 414 may include embedded MMC or eMMC, semiconductor drives, or SSDs, and the like.

[0037] To convert the voltage from the power supply 112 into an adjustable voltage output for electrical bonding, the processor 300 can execute instructions to the voltage converter 108. The operation of the voltage converter 108 can be controlled by a digital switch 116. By indicating the strength of the adjustable voltage output from the voltage converter 108, the digital switch 116 can be used to control the adjustable voltage output of the electrical bonding device 100. In various embodiments, the digital switch 116 can be used to adjust the strength of the adjustable voltage output generated by the voltage converter 108 based on the type and / or other characteristics of the material of the external object and / or other target surface interacting with the electrical bonding device 100.

[0038] Using a combination of one or more sensors 114, the type and / or other properties of the material of an external object and / or other target surface interacting with the electrical bonding device 100 can be determined. Sensor 114 can be a conductivity sensor that measures the conductivity of the material interacting with the electrical bonding device 110. The conductivity sensor may include one or more electrodes for measuring conductivity. To measure conductivity using one or more electrodes, the electrodes are placed in contact with the external object or other target surface. A voltage is then applied to one of the electrodes to generate a current. The current flowing through the target surface material is then measured using a second electrode. The larger the current measured by the second electrode, the higher the conductivity of the target surface material. Alternatively, the conductivity sensor may include a non-contact sensor (i.e., an induced conductivity sensor) that measures conductivity using two or more toroidal coils. To measure conductivity, one coil emits an electric field in the direction of the target surface. A second coil measures the magnitude of the minute current induced by the electric field emitted by the first coil. The strength of the induced current is proportional to the number of ions present in the target surface material.

[0039] Other sensors 114 may include Hall effect sensors or other magnetic field sensors that can determine the electrical properties of the target surface material based on the magnetic properties of the material. Alternatively, a porosity sensor can be used to determine the surface properties of the target surface material. The porosity sensor can measure water migration in unsaturated porous materials by applying time-domain reflectivity measurement (TDR). A TDR-based porosity sensor can emit wave pulses or other signals onto the target surface material. The TDR porosity sensor then detects the reflected signals bouncing back from the target surface material and determines the porosity and water content based on the analysis of the reflected waveform. Sensor 114 may also include ultrasonic sensors, radar sensors, infrared sensors, dot-field projection depth sensors, time-of-flight depth sensors, and other waveform-based sensors to detect the properties of the target surface material.

[0040] The sensor control circuit 118 can be used to control one or more aspects of one or more sensors 114. For example, the sensor control circuit 118 can control the sampling rate of sensor 114, the amount of voltage applied to the electrodes or coils of conductivity sensors, the strength of the signal emitted by TDR porosity sensors, and similar factors. The sensor control circuit 118 may include logic to ensure a high sampling rate for measuring sensor data. For example, using a sampling rate of 0.1 to 5 seconds, sufficient data can be obtained to accurately determine the properties of a target surface within the time it takes for a user to bring the electrical bonding device 100 into contact with a wall, door, mirror, or other target surface. The processor 300 can facilitate communication between one or more sensors 114 to correct measurements made by one sensor based on sensor data collected by a second sensor. For example, the conductivity of a certain material may depend on the temperature of that material. Therefore, the conductivity measurement obtained by the conductivity sensor can be adjusted using temperature data collected by a temperature sensor. To improve the accuracy and reliability of sensor data, the sensor control circuit 118 may also include logic to control the transmission of sensor data to the communication module 420 and / or the data analysis module 422. For example, the sensor control circuit 118 can ensure that the sensor data is collected by a properly functioning sensor and is error-free before it is provided to the data analysis module 422 or used to control the operation of the digital switch 116.

[0041] Measurement values ​​and other sensor data captured by one or more sensors 114 can be transmitted to the data analysis module 422. The data analysis module 422 can perform one or more operations to refine the sensor data. For example, the data analysis module 422 can systematize and improve the quality of the sensor data by performing other statistical operations such as timestamping sensor data points, averaging a series of sensor measurements, converting sensor data to another format or unit, and / or removing outlines, reducing variability, minimizing errors, and so on. The data analysis module 422 can also analyze the sensor data using any known technique, such as statistical analysis, algorithmic analysis, and / or heuristic analysis, to determine the type of target surface material.

[0042] Once the type of surface material is determined, the digital switch 116 can operate the voltage converter 108 to generate a voltage sufficient to bond the electrical bonding device 100 to the target surface. The digital switch 116 can dynamically adjust the voltage output by the voltage converter 108 based on the target surface material to ensure the safe operation of the electrical bonding device 100. The voltage required to attach the electrical bonding device 100 to the target surface depends on the properties of the target surface material, such as the material's conductivity and other electrical or magnetic properties, porosity, surface morphology, surface texture, surface profile, and other surface properties.

[0043] In various embodiments, the output from one or more sensors 114 can be combined with image data captured by one or more cameras 416. The combination of sensor data and image data can be used to determine the material type and / or other properties of the target surface material and / or to identify the user of the electrobonding device 100. The cameras 416 can be included in the electrobonding device 100 or in a device 200 integrated with the electrobonding device 100. A camera control circuit 418 can operate the cameras 416 to capture image data, including images of the target surface material and the user of the electrobonding device 100. The camera control circuit 418 can be included in the cameras 416 or can be a separate component of the electrobonding device 100.

[0044] To determine the material type and / or other properties of the target surface material, sensor data from one or more sensors 114 and image data from camera 416 can be transmitted to a data analysis module 422. The data analysis module 422 may include a machine learning system 424 that performs one or more image classification tasks. For example, the machine learning system 424 can generate a material prediction that predicts the type of material on the target surface. The machine learning system 424 may also generate a user prediction that predicts whether the user of the electrical bonding device 100 is an authorized user. The machine learning system 424 may include a data processing pipeline and a classification engine. The data processing pipeline can prepare training data, including image data and sensor data, to train one or more machine learning models. The classification engine can generate one or more machine learning models by processing the training data using one or more machine learning algorithms and / or neural networks or other deep learning systems.

[0045] To generate a material classification model that predicts the material type of a target surface, the machine learning system 424 can use a convolutional neural network (CNN) to process training data containing multiple images of different materials. The CNN can train the material classification model by extracting features from the images contained in the training data using one or more convolutional layers. The output from the convolutional layers is then fed into one or more classification layers (e.g., fully connected layers), such as a feedforward layer, deconvolutional layer, max pooling layer, and similar layers, to generate material predictions based on the features extracted by the convolutional layers.

[0046] During training, the convolutional layer can extract features from images of the training data. The trainable parameters of the classification layer can be initialized and updated to maximize model performance. Model performance can be approximated as the error of the objective function of the training task. Training tasks may include, for example, classifying images of woody materials, classifying images of conductive materials, and similar image classification tasks. One or more training cycles can be repeated using the updated hyperparameters, features, and / or model parameters to improve model performance and minimize the error of one or more training tasks. After training, the extracted feature set and trained weights and / or other parameters contained in the material classification model selected for deployment (e.g., a material classification model with at least 90% classification accuracy) are stored in a model file that can be inferred by the data analysis module 422 to generate material type predictions.

[0047] To improve the accuracy of material type prediction, the machine learning system 424 can incorporate data from one or more sensors 114. The data processing pipeline can incorporate sensor data into a training dataset used by the classification engine to generate predictions. For example, sensor data, including depth measurements, conductivity values, wave intensity, and similar information, collected by sensors such as infrared sensors, time-of-flight depth sensors, and conductivity sensors, can be processed by the classification engine. One or more machine learning algorithms and / or neural network layers can extract features from the sensor data. The features of the sensor data can then be added to a material classification model and used to make more accurate predictions. Furthermore, the classification engine can generate another material classification model using the sensor data. The classification engine can then ensemble the material classification model of the sensor data with the material classification model of the image data to generate material type predictions.

[0048] Furthermore, the machine learning system 424 can generate a user validation model that predicts whether the user of the electrical adhesive device 100 is an authorized user. To generate the user validation model, the machine learning system 424 can process training data containing multiple images of people, animals, and objects using a convolutional neural network (CNN). The CNN can train the user validation model by extracting features from the images contained in the training data using one or more convolutional layers. The output from the convolutional layers is then fed to one or more classification layers, such as a feedforward layer, an inverse convolutional layer, and the like, which can generate user predictions based on the features extracted by the convolutional layers.

[0049] A user verification model can be an additional safety feature of the electrical adhesion device 100. For example, the user verification model can be trained to recognize one or more images of authorized users of the electrical adhesion device 100, which are included in the training data. When the electrical adhesion device 100 is powered on or activated, the camera 416 can automatically capture an image of the user. This image can then be classified using the user verification model to generate a user prediction. The electrical adhesion device 100 can also verify the user using a face scanning app (e.g., iOS Face Scan) or other facial scanning technology built into a smartphone or other device 200 integrated with the electrical adhesion device 100. If an unauthorized user, such as a young child, attempts to use the electrical adhesion device 100, the user verification model can generate a user prediction classifying the child as an unauthorized user. In response to receiving an unauthorized user prediction, the data analysis module 422 can power down the voltage converter 108 to the digital switch 116. By powering down the voltage converter 108, the electrical adhesion device 100 is prevented from generating voltage, ensuring that unsupervised children or others are not harmed by the adjustable voltage generated by the electrical adhesion device 100.

[0050] Furthermore, the user verification model can prevent accidental use of the electrical bonding device 100. If the electrical bonding device 100 is accidentally activated, the image data captured by the camera 416 will not be of the user's face. Instead, the image data may capture the user's arm, bag or pocket, the user's pet, and similar items. This image data is then sent to the user verification model to generate a user prediction. Since the image data does not contain the user's face, the user verification model will generate a user prediction that classifies the image data as belonging to an unauthorized user. In response, the data analysis module 422 can power down the voltage converter 108 to the digital switch 116, thereby preventing the electrical bonding device 100 from generating the adjustable voltage. By automatically powering down the voltage converter 108 in response to detecting an unauthorized user, the user verification model can avoid the risks and dangerous situations that may arise from accidentally or unintentionally generating the adjustable voltage. The user verification model can also function as a security feature that ensures only authorized users can use the electrical bonding device 100.

[0051] The processor 300 can be coupled to a communication module 420 to facilitate communication with external devices. The communication module 420 may include a wireless communication module for sending data and / or messages to external devices (e.g., laptops, smartwatches, external hard drives, tablets, smartphones, and similar devices). For example, the communication module 420 may connect to device 200 via a wired and / or wireless connection path, enabling control of the electrical bonding device 100 using device 200. The wireless communication module may include a Wi-Fi chip, an integrated Bluetooth module, and similar devices. The communication module 420 may transmit data using any known wired or wireless communication protocol, such as Bluetooth, Wi-Fi, and similar devices. To speed up communication, the communication module 420 may have multiple pins for connecting multiple parts of the sensor control circuit 118, the digital switch 116, the camera control circuit 418, and / or the data analysis module 422.

[0052] The communication module 420 may include a notification system 426. The notification system 426 can connect via the communication module 420 to a device 200 attached to the electrical adhesive device 100 and / or to a remote device (e.g., a smartwatch, smartphone, computer, or other consumer device not attached to the electrical adhesive device 100). The notification system 426 can alert the user to prevent them from forgetting the electrical adhesive device 100 and / or the consumer device 200 that has been fixed to a target surface using the electrical adhesive device 100. The notification system 426 may include programmable logic that can be integrated with the device 200 and / or remote device to send a notification (e.g., an email message, a push notification, etc.) to the device 200 and / or remote device after the electrical adhesive device 100 has been turned on for a set period of time. For example, the notification system 426 may send a notification if the electrical adhesive device 100 has been turned on for a period of time of 3 minutes, 5 minutes, 10 minutes, or any other period set by the user. The notification system 426 can integrate with the GPS module, mapping application, or other location system of device 200 and / or the electrical bonding device 100 to include location information of the electrical bonding device 100 (e.g., current geolocation) in the notification.

[0053] Furthermore, the notification system 426 can send a notification to device 200 and / or a remote device if the electrical bonding device 100 is no longer able to establish a connection with device 200. For example, device 200 can connect to the electrical bonding device 100 via Bluetooth® and / or Wi-Fi connection. If device 200 loses connection with the electrical bonding device 100 and / or device 200 moves outside the connection range, the notification system 426 can send a notification to device 200 and / or a remote device. The notification may indicate that the connection between the electrical bonding device 100 and device 200 is lost and / or weak, and may provide the geographical location of the electrical bonding device 100 and / or device 200. The notification system 426 can also provide one or more electronic and / or mechanical notifications. For example, the notification system 426 can be programmed to emit a beep or other audio notification and / or generate a flashing light or other visual notification if the electrical bonding device 100 remains turned on for a set period of time and / or if it is unable to establish a connection with device 200.

[0054] To control the charging and discharging of power from the power supply 112, the processor 300 can execute instructions on the power management integrated circuit (PANIC) 110. The board 400 may include a built-in LiPoly charger that interacts with a USB controller to charge the power supply 112 by plugging a wall charger into a USB port coupled to the processor 300. The power supply 112 supplies electrical energy to power the electrical components of the electrical bonding device 100. The PMIC 110 can regulate power to one or more components to extend the time that the electrical device 100 can be used without charging the power supply 112. For example, the PMIC 110 can supply power only to the processor 300 and volatile memory 412 when the electrical bonding device 100 is not in use. The PMIC 110 can also power down one or more components of the electrical bonding device 100 when they are not in use. For example, the PMIC 110 can power down the camera 416 and camera control circuit 418 after the user of the electrobonding device 100 has been verified, and power down the sensor 114 and sensor control circuit 118 when the electrobonding device 100 is securely attached to the target surface, and so on.

[0055] Figure 5 shows an exemplary wireless charging embodiment of the electroadhesive device holder 500. As shown, the electroadhesive device holder 500 may include an integrated electroadhesive device 100 that includes one or more sensors 114. To wirelessly charge the power supply 112 housed in the case 310, a charging receiving coil 502 housed in the case 310 receives a wireless charging signal 506 (e.g., an alternating electromagnetic field or other known wireless charging signal) from an induction coil 504 housed in the device 200. The charging receiving coil 502 then converts the wireless charging signal 506 into power and supplies it to the power supply 112, thereby charging the power supply 112. By charging the power supply 112 of the electroadhesive device 100, a wired connection between the device 200 and the electroadhesive device holder 500 can be eliminated. Furthermore, by including a charge receiving coil 502 in the electrical adhesive device holder 500 of a device having an induction coil 504 for wireless charging, the need to provide the device holder with communication interactions (e.g., a USB charging port, a micro USB charging port, etc.) to support wired charging of the electrical adhesive device holder 500 can be eliminated. Also, as shown in Figure 5, device 200 can include a charge receiving coil 502 for receiving a wireless charging signal 506 of a wireless charging device including an induction coil 506. Thus, the power supply of device 200 can be wirelessly charged to power the induction coil 502 included in device 200, and the wireless charging signal 506 can be supplied to the receiving coil 502 of the electrical adhesive device holder 500, thereby wirelessly charging the power supply 112 included in the electrical adhesive device holder 500.

[0056] Figures 6A-B show a planar front view 600 and a planar rear view 602 of an exemplary electroadhesive device holder 500. As shown in Figure 6A, the electroadhesive device holder 500 can be implemented as a case for holding the device 200. In various embodiments, the device may include a front camera 604 and a screen 608 for viewing content. The electroadhesive device 100 can be incorporated into the rear portion of the electroadhesive device holder 500, as shown in Figure 6B. This orientation allows the device 200 to be attached to an external object using the electroadhesive device 100 with a visible screen and a functional front camera 604. To maximize the surface area of ​​the mounting surface, the electroadhesive device 100 can cover most of the rear portion of the electroadhesive device holder 500. In various embodiments, the electrobonding device 100 can cover the entire back portion of the electrobonding device holder 500, except for the area containing the rear camera and / or the hole 606 for passing light to the rear camera, and / or the speaker / microphone 610 or the hole for outputting sound from the speaker and / or to the microphone.

[0057] One or more sensors 114 can be attached to the electrical bonding device 100 and to a button 612, latch, or other mechanism for activating the electrical bonding device 100 and / or adjusting the voltage output. The button 612, latch, or other mechanism can be attached to the front of the electrical bonding device holder 500. In various embodiments, a removable cover can be provided to cover the button 612, latch, or other mechanism. The removable cover can be used to prevent accidental generation and / or adjustment of the voltage output. The removable cover can be used in combination with the sensors and digital switches, or as a safety mechanism instead.

[0058] Figures 7A-B show a planar front view 700 and a planar rear view 702 of a preferred embodiment of the electrobonding device 100 incorporated into device 200. As shown in Figure 7A, the electrobonding device 100 can be directly mounted to device 200 having a front camera 604 and a display screen 608. The display screen 608 can present one or more UI displays 704 that allow a user to input control commands to operate the electrobonding device 100. For example, the UI displays 704 may include digital UI elements 706 (e.g., selectable buttons) that the user can select or otherwise interact with to operate and / or adjust the voltage output of the electrobonding device 100. In various embodiments, device 200 may have an authentication mechanism for authenticating the user of device 200. For example, device 200 may have a fingerprint scan, facial scan, or other biometric authentication mechanism, a password authentication mechanism, a multi-factor authentication mechanism requiring access to another device, and similar. The authentication mechanism of device 200 is integrated with the UI display 704 and / or the electrical bonding device 100 to prevent unauthorized users from accessing the UI display 704 and / or the UI element 706, and / or inadvertently generating and / or adjusting voltage outputs. The authentication mechanism of device 200 can be used as a safety mechanism in combination with, or in place of, sensors and digital switches.

[0059] Figure 7B shows that the electrobonding device 100 is attached to the back portion of the device 200 so that the device 200 can be mounted on a target surface with the display screen 608 and the front camera 604 visible. In various embodiments, the device 200 can be mounted on a target surface at a distance of some distance and some distance from the ground using the electrobonding device 100. Mounting the device 200 on the target surface can improve the viewpoint for viewing the screen 608 and / or the field of view of the front camera 604. The electrobonding device 100 can be mounted to the device 200 using any known mounting mechanism, including chemical adhesives, mechanical fasteners, thermal fasteners (e.g., welding, spot welding, or spot melting), dry bonding, Velcro®, suction / vacuum bonding, magnetic or electromagnetic mounting, tape (e.g., single-sided or double-sided), and the like. The electrobonding device 100 may also include one or more sensors 114 for measuring one or more properties of the target surface. Depending on the degree of device portability desired or required in a given situation and the size of the electrical bonding device 100, the mounting mechanism can create a permanent, temporary, or removable mounting configuration.

[0060] Figures 8A-B show a planar front view 800 and a planar rear view 802 of a preferred embodiment of an electrobonding device 100 integrated with a camera device 812. As shown in Figure 8A, the electrobonding device 100 can be directly attached to a camera device 812 having a housing 804, an eye portion 808, an opening 810, and an LED light 806. The housing 804 can house a circuit board containing the electrical components of the camera device 812 (e.g., a processor, control circuit, power supply, image sensor, and the like). The housing 804 may include an eye portion 808 extending laterally from the surface of the housing 804. The eye portion 808 can house one or more camera components (e.g., a lens, an image sensor, etc.). One end of the eye portion 808 includes an opening 810 through which light can pass through the lens and reach an image sensor located inside the housing 804 and / or the eye portion 808. The LED light 806 can be embedded in the outer surface of the housing 804 to provide additional light (i.e., a flash) to enable the capture of selfie content in low-light conditions.

[0061] There is a button 612, latch, or other mechanism for activating the electrical bonding device 100 and / or adjusting the voltage output. The button 612, latch, or other mechanism can be mounted on the front of the camera device 812. In various embodiments, a removable cover can be placed over the button 612, latch, or other mechanism. The removable cover can be used to prevent accidental generation and / or adjustment of the voltage output. The removable cover can be used in combination with sensors and digital switches, or as a safety mechanism instead.

[0062] Figure 8B shows that the electrobonding device 100 is attached to the rear of the housing 804 so that the camera device 812 can be attached to the target surface without obstructing the opening 810 of the eye portion 808. In various embodiments, the camera device 812 can be attached to the target surface at a distance of some distance and at some distance from the ground using the electrobonding device 100. One or more sensors 114 can be attached to the electrobonding device 100 to measure one or more characteristics of the target surface. In response to the sensor data collected by one or more sensors 114, the voltage generated by the electrobonding device 100 can be modified to suit the target surface. By attaching the camera device 812 to the target surface, the viewpoint and / or field of view of the camera device 812 can be improved. The electrobonding device 100 can be attached to the camera device 812 using any known mounting mechanism, including chemical adhesives, mechanical fasteners, thermal fasteners (e.g., welding, spot welding, or spot melting), dry bonding, Velcro®, suction / vacuum bonding, magnetic or electromagnetic mounting, tape (e.g., single-sided or double-sided), and the like. Depending on the degree of portability of the camera device 812 desired or required in a given situation and the size of the electrobonding device 100, the mounting mechanism can be made permanent, temporary, or removable.

[0063] Figure 9 is a flowchart illustrating an exemplary method for regulating the voltage generated by the electroadhesive device 900. In 902, one or more sensors included in the electroadhesive device are initialized. In various embodiments, the sensors can be automatically initialized in response to any trigger event, such as when the electroadhesive device is powered on, directed at a target surface, moved, or otherwise. Alternatively, the sensors can be initialized in response to a user manually activating the sensors and / or the electroadhesive device by interacting with a mechanical (such as a button) or digital (such as a UI element) actuation mechanism.

[0064] Once one or more sensors are initialized, the sensors can collect sensor data. In 904, sensor data is received from one or more sensors. The sensors may include conductivity sensors (e.g., electrode conductivity sensors, inductive conductivity sensors, etc.), Hall effect sensors and other magnetic field sensors, porosity sensors (e.g., time-domain reflectance (TDR) porosity sensors), waveform sensors (e.g., ultrasonic sensors, radar sensors, infrared sensors, dot-field projection depth sensors, time-of-flight depth sensors), motion sensors, and similar. The sensor data may also include image data collected by cameras and other image sensors.

[0065] In 906, the sensor data can be used to verify that the user of the electroadhesive device is an authorized user. To determine whether a user is an authorized user, a camera included in the electroadhesive device can capture an image of the user. The image is transferred to a data analysis module, where it can be classified as an authorized user by a machine learning system trained to recognize images of people identified by the owner of the electroadhesive device as authorized users. To detect authorized users, the electroadhesive device can also be integrated with a face scanning app (e.g., iOS Face Scan) or other face scanning technology built into a smartphone or other consumer device integrated with the electroadhesive device. If the data analysis module identifies an authorized user in 906, then in 908, the sensor and / or the data analysis module will classify the target surface. If the data analysis module does not identify an authorized user in 906, the electroadhesive device terminates one or more processes and / or powers off and waits for the sensor to be initialized by an authorized user in 902.

[0066] In 908, the sensor and / or data analysis module can classify the target surface by using the sensor data to determine one or more properties of the target surface. For example, the sensor data can be used to determine the conductivity and other electrical or magnetic properties of the target surface, the porosity, permeability, surface morphology, hardness, smoothness, and other surface properties and the like of the material. Using one or more properties determined from the sensor data, the digital switch can be directly controlled to generate a voltage based on the target surface in 910. The sensor data can also be sent to the data analysis module. The data analysis module can examine the sensor data and use it to determine the properties and / or material type of the target surface (e.g., metal, wood, plastic, ceramic, concrete, drywall, glass, stone, and the like). The digital switch 116 can then control the voltage output from the voltage converter in 910 based on the properties and / or material type of the target surface determined by the data analysis module.

[0067] In the 910, the digital switch operates a voltage converter to generate a voltage based on the target surface. The digital switch can autonomously change the voltage output of the voltage converter depending on the target surface to eliminate sparks, stings, electric shocks, and other safety problems that may occur if an excessive voltage is applied to the target surface. If the sensor detects a conductive target surface (e.g., metal), the digital switch can operate the voltage converter to generate a low voltage. If the sensor detects a smooth surface (e.g., glass) or an insulating target surface (e.g., plastic, stone, sheet rock, ceramic, and similar), the digital switch can operate the voltage converter to generate a high voltage.

[0068] In 912, once the voltage converter generates a voltage output that is safe to apply to the target surface, the electroadhesive device can be attached to the target surface. To attach the electroadhesive device, it can be placed in contact with and / or close to the target surface. When the electroadhesive device moves to a new target surface, the sensor can automatically detect one or more characteristics of the new target surface and classify it. The digital switch can then change and / or maintain the voltage output generated by the voltage converter based on the material type and / or characteristics of the new target surface. Furthermore, if the sensor detects that the electroadhesive device has moved away from the target surface, the digital switch can turn off the power to the voltage converter and terminate the voltage output from the voltage converter until the sensor detects a new target surface.

[0069] The foregoing description is intended to convey a complete understanding of the described embodiments by providing several specific and exemplary embodiments and details relating to holders for electroadhesive devices. However, it should be understood that this disclosure is not limited to these specific embodiments and details, which are merely illustrative. Furthermore, in light of known systems and methods, those skilled in the art will understand the use of the present invention for the intended purposes and advantages in any number of alternative embodiments, depending on the specific design and other requirements.

[0070] The methods described herein can represent processes occurring within a device (e.g., the electrobonding device 100 in Figure 1). The subject matter described herein can be implemented in computer software, firmware, or hardware, or a combination thereof, including digital electronic circuits, or structural means and their structural equivalents disclosed herein. The subject matter described herein can be implemented as one or more computer program products, such as one or more computer programs tangibly embodied in an information carrier (e.g., a machine-readable storage device), or embodied in propagated signals for execution by a data processing device (e.g., a programmable processor, a computer, or multiple computers) or for controlling the operation of a data processing device. Computer programs (also called programs, software, software applications, or code) can be written in any form of programming language, including compiled or interpreted languages, and can be deployed in any form, including as standalone programs or as modules, components, subroutines, or other units suitable for use in a computing environment. Computer programs do not necessarily correspond to files. A program can be stored in part of a file that holds other programs or data, in a single file dedicated to that program, or in multiple collaborative files (for example, a file that stores one or more modules, subprograms, or parts of code). A computer program can be deployed to run on one computer or on multiple computers at one site, or to be distributed across multiple sites and interconnected by a communication network.

[0071] The processes and logic flows described herein, including the steps of the subject matter methods described herein, can be executed by one or more programmable processors running one or more computer programs, and can perform the functions of the subject matter described herein by manipulating input data and generating outputs. Furthermore, the processes and logic flows can be executed by application-specific logic circuits, such as FPGAs (Field Programmable Gate Arrays) or ASICs (Application Specific Integrated Circuits), and the devices of the subject matter described herein can be implemented in this manner.

[0072] Processors suitable for executing computer programs include, for example, general-purpose and dedicated microprocessors, and one or more processors of any type of digital computer. Generally, a processor will receive instructions and data from read-only memory, random-access memory, or both. Essential elements of a computer are a processor for executing instructions and one or more memory devices for storing instructions and data. Generally, a computer also includes one or more mass storage devices (e.g., magnetic disks, magneto-optical disks, or optical disks) for storing data, or is operablely coupled to receive data from or transfer data to them. Information carriers suitable for embodying computer program instructions and data include all forms of non-volatile memory, including, for example, semiconductor memory devices such as EPROMs, EEPROMs, flash memory devices, and magnetic disks. Processors and memory can be complemented by or incorporated into dedicated logic circuits.

[0073] It should be understood that the disclosed subject matter is not limited to the details of the configuration and arrangement of components described in the following description or illustrated in the drawings. Other embodiments of the disclosed subject matter are possible and can be performed and implemented in various ways. It should also be understood that the expressions and terms used herein are for illustrative purposes only and should not be considered limiting. For this reason, those skilled in the art will understand that the concepts based on this disclosure can be readily used as a basis for designing other structures, methods, and systems to perform some of the purposes of the disclosed subject matter. Accordingly, the claims should be considered to include such equivalent structures, as long as they do not deviate from the spirit and scope of the disclosed subject matter.

[0074] Where used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that the terms “includes” and / or “including” as used herein indicate the presence of the described features, integers, steps, actions, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, actions, elements, components, and / or groups thereof.

[0075] As used herein, the terms “and / or” and “at least one” include any one or more of the related listed items, and all combinations thereof.

[0076] To provide a complete understanding of the various embodiments of the present invention, certain details are described above and in Figures 1-9. However, to avoid unnecessarily obscuring the description of the various embodiments of the present invention, other details describing well-known structures and systems, such as electrobonding, mounting systems, user devices, and server devices, which are often related, are not described below.

[0077] While the disclosed subject matter has been described and illustrated in the exemplary embodiments described above, this disclosure is for illustrative purposes only, and it is understood that numerous modifications can be made to the details of the implementing configuration of the disclosed subject matter without departing from the spirit and scope of the disclosed subject matter. [Explanation of Symbols]

[0078] 100 Electrobonding Devices 102 Insulating materials 104 Electrode 106 Electrical connection 108 Voltage Converter 112 Power supply 114 sensors 116 Digital Switches 118 Sensor control circuit

Claims

1. An electrical bonding device holder, A device case having length, width, depth, a front surface configured to be attached to a computer device, and a flat back surface extending to the length and width, An electroadhesive device holder comprising: an electroadhesive device integrated on the flat back surface of the device case, the electroadhesive device covering most of the flat back surface of the device case; The aforementioned electrobonding device is A flexible film comprising one or more electrodes disposed within an insulating material, wherein the insulating material comprises a chemical adhesive applied to at least one side of the insulating material, A power supply connected to the one or more electrodes, A sensor incorporated into the electrical bonding device, configured to sense proximity to an external object and to collect sensor data measuring one or more characteristics of the external object, including the material type and insulation properties of the flat surface of the external object; A digital switch that communicates with the sensor, configured to generate, modify, set and maintain an adjustable voltage output used to attach the electrical adhesive device to the flat surface of the external object, based on the sensor data relating to the material type and insulating properties of the flat surface of the external object, An electroadhesive device holder wherein the adjustable voltage output of the one or more electrodes generates an electroadhesive force that fixes the electroadhesive device to the flat surface of the external object.

2. The electrical bonding device holder according to claim 1, wherein the digital switch controls the adjustable voltage output by operating a voltage converter to convert a low voltage from the power supply into the adjustable voltage output, thereby generating the adjustable voltage output.

3. The electrical bonding device holder according to claim 2, wherein the digital switch is configured to operate the voltage converter to change the adjustable voltage output based on one or more characteristics of the external object measured by the sensor.

4. The aforementioned electrical adhesion force is, The steps include generating the adjustable voltage output using the one or more electrodes, The steps include inducing an electric charge in the external object using the adjustable voltage output, The steps include: causing the charge on the external object to interact with the charge on the opposite side of the one or more electrodes to generate an electrical adhesion force; The electrical bonding device is fixed to the external object by this means. The electrical bonding device holder according to claim 1.

5. A sensor operating mechanism configured to activate the sensor in response to manual input received from a user, A status light configured to visually display the status of the aforementioned sensor, The electrical bonding device holder according to claim 1, further comprising the following:

6. The electrical bonding device holder according to claim 1, wherein the sensor includes an electrode conductivity sensor, a dielectric conductivity sensor, a Hall effect sensor, a magnetic field sensor, a porosity sensor, a time-domain reflectance (TDR) porosity sensor, a motion sensor, an ultrasonic sensor, a radar sensor, an infrared sensor, a dot-field projection depth sensor, or a time-of-flight depth sensor.

7. The electrical bonding device holder according to claim 1, wherein one or more properties of the external object include at least one of conductivity, electrical properties, magnetic properties, porosity, permeability, surface morphology, surface profile, or surface texture.

8. The electrical bonding device holder according to claim 1, wherein the external object is formed from at least one of metal, wood, plastic, ceramic, concrete, drywall, glass, or stone.

9. The electrical bonding device holder according to claim 1, wherein the electrical bonding device includes a smartphone.

10. The electrical adhesive device holder according to claim 1, wherein the length and width of the device case are both several times longer than the depth of the device case.

11. The electrical bonding device holder according to claim 1, further comprising a receiving coil that converts a wireless charging signal into electricity to charge a power supply.

12. A device comprising a smartphone case with a flat back having an integrated electro-adhesive device, The integrated electrical bonding device includes a flexible film comprising one or more electrodes disposed in an insulating material, wherein the insulating material comprises a chemical adhesive applied to at least one side of the insulating material. The integrated electrobonding device includes a power supply connected to the one or more electrodes. The integrated electrobonding device includes a sensor incorporated into the electrobonding device, which is configured to collect sensor data measuring one or more properties of the flat surface of an external object, including the material type of the external object. The electrical bonding device includes a signal status light configured to switch to red when the sensor detects the external object and an appropriate adjustable voltage has not been determined, and a signal status light configured to switch to green when the sensor detects the external object and an appropriate adjustable voltage for the external object has been determined. The integrated electrobonding device includes a digital switch that communicates with the sensor and is configured to generate, modify, set, and maintain an adjustable voltage output used to attach the electrobonding device to the flat surface of the external object, based on the sensor data relating to the material type and insulating properties of the flat surface of the external object. A device wherein the adjustable voltage output of one or more electrodes generates an electroadhesive force that fixes the electroadhesive device to the flat surface of the external object.

13. The device according to claim 12, wherein the digital switch controls the adjustable voltage output by operating a voltage converter to generate the adjustable voltage output by converting a low voltage from the power supply into the adjustable voltage output.

14. The device according to claim 13, wherein the digital switch is configured to operate the voltage converter to change the adjustable voltage output based on one or more characteristics of the external object measured by the sensor.

15. The electrical adhesion strength is, The steps include generating an adjustable voltage using the one or more electrodes, The steps include inducing an electric charge in the external object using the adjustable voltage output, The steps include: causing the charge on the external object to interact with the charge on the opposite side of the one or more electrodes to generate an electrical adhesion force; The electrical bonding device is fixed to the external object by this means. The device according to claim 12.

16. The device according to claim 12, wherein the electrobonding device is integrated with the device using at least one of chemical adhesives, mechanical fasteners, thermal fasteners, dry adhesives, Velcro, suction adhesives, vacuum adhesives, magnetic tapes, and electromagnetic tapes.

17. The device according to claim 12, wherein the electrical bonding device is detachably attached to the surface of the device.

18. The device according to claim 12, wherein the device is a smartphone, camera, personal computer, laptop, tablet computer, or television.

19. A method for adjusting the voltage generated by an electroadhesive device holder, The steps include receiving sensor data from one or more sensors of an electroadhesive device incorporated into an electroadhesive computer device holder having a back surface with a flat back surface and a front surface configured to fix the device, A step of determining one or more properties of the material and insulating properties of the flat surface of an external object based on the aforementioned sensor data, The steps include determining the distance from the flat surface of an external object to the electrical bonding device based on the aforementioned sensor data, Steps include generating, modifying, setting, and maintaining an adjustable voltage applied to one or more electrodes of the electrical bonding device by a voltage converter of the electrical bonding device, wherein the adjustable voltage is controlled by a digital switch of the electrical bonding device based on one or more characteristics of the flat surface of the external object, including insulation properties, material type, and a determined distance; To attach the electroadhesive computer device holder to the flat surface of the external object, the steps include generating an electroadhesive force by interaction between the charges on the one or more electrodes and the charges on the opposite side of the flat surface of the external object induced by the adjustable voltage, Methods that include...

20. The steps include determining that the external object is conductive based on the sensor data, In response to the determination that the external object is conductive, the step of generating a low voltage that can safely interact with the conductive external object, The method according to claim 19, further comprising:

21. The steps include determining that the external object is insulating based on the sensor data, In response to the determination that the external object is insulating, the steps include generating a high voltage that can safely interact with the insulating external object, The method according to claim 19, further comprising: